查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1644562

标准逻辑 IC：市场占有率分析、产业趋势与统计、成长预测（2025-2030 年）

Standard Logic IC - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 90 Pages | 商品交期: 2-3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

预计预测期内标准逻辑 IC 市场复合年增长率将超过 3.2%。

标准逻辑 IC-市场-IMG1

主要亮点

  • 标准逻辑IC是积体电路形式的逻辑闸。此 IC 采用带引脚封装，以便在电路中进一步使用。由于BiPolar技术与CMOS技术的製造流程和架构差异，导致工作电压、反应时间和输出形式有所不同。逻辑闸在电子设计和功率最佳化中的贡献至关重要。
  • 透过改进陶瓷和塑胶来实现封装解决方案的小型化对于根据特定用途选择正确的逻辑 IC 起着至关重要的作用。 7400 和 4000 系列是最广泛使用的标准逻辑 IC 之一。对设备小型化的不懈关注，特别是在家用电子电器领域，已经塑造了整个产业。
  • 製造商正在强调使用具有更好的温度监控和适应性的新型改进逻辑IC，确保在汽车等行业提供全方位服务。例如，2021年11月，三星电子宣布了三种针对下一代汽车的全新逻辑解决方案：Exynos Auto T5123、Exynos V7、S2VPS01。 S2VPS01 是一款电源管理积体电路 (PMIC)，可调节和整流车载资讯娱乐系统的电源输入。此 IC 捆绑了各种功能以防止恶劣的热条件，包括过压保护 (OVP) 和热感关断 (TSD)。
  • 在新冠疫情期间，半导体装置的需求转向消费性电子产品和医疗设备中的计算设备。这影响了逻辑积体电路製造业客自订生产的正常需求週期。除了这种转变之外，对标准 IC 解决方案的需求仍然保持中等至强劲，受影响的工业应用被家用电子电器产品线所抵消。后疫情时代，随着各行各业復苏，半导体需求将大幅成长，逻辑IC市场也将迎来加速发展。

标准逻辑IC市场趋势

汽车产业需求最大

  • 汽车产业经常期待大规模的电气化和发展。智慧互联技术和自动驾驶功能的引入正在推动对半导体封装的需求。这导致了电路、MPU、感测器的使用增加，以及用于电源调节和整流的标准逻辑IC的部署日益增多。
  • 致力于提高安全性和乘坐舒适度的新时代技术正在大力增加半导体在乘用车中的使用。为了满足安全气囊、自动驾驶功能、电子稳定控制 (ESC) 程序等的安全标准，公司遵守电路级的严格规定，并使用一些市场上最好的逻辑 IC。例如，德克萨斯(TI) 等公司提供通过 AEC-Q100 认证的汽车逻辑设备。该IC支援5V至1.2V的宽电源电压范围，以满足所有汽车系统的要求，包括资讯娱乐系统、车身控制模组、汽车照明和ADAS（高级驾驶辅助系统）。
  • 物联网服务和远端存取功能（例如地理围栏、远端资讯处理、车队管理系统、自动驾驶和半自动驾驶辅助、车载资讯娱乐和其他基于 SIM 卡的实用公共事业）正在推动汽车行业走向通讯密集型应用。这推动了通讯模组和感测器的引入，为进一步处理提供详细和概要的输入参数。特别是在电动车中，模组和感测器大量使用逻辑IC来维持电气安全标准和电源效率。
  • 随着世界向电动车 (EV) 迈进，需要对电气参数进行广泛的监管，从而使用逻辑闸 IC 来实现更安全的充电和放电技术。汽车公司正在整个车辆、最终部署和充电基础设施中利用逻辑积体电路的潜力及其广泛的电压处理能力。这些因素正在推动标准逻辑积体电路产业的创新和进步，以优化功耗、工作电压和缩放特性。

亚太地区推动市场成长

  • 亚洲最大的製造地包括中国大陆、台湾、韩国和日本。廉价的技术劳动力、有利的气候条件、政府的激励措施、强大的电力和水利基础设施、运输和物流以及诱人的投资条件有助于半导体製造业蓬勃发展。这些行业对逻辑积体电路和储存设备的标准化製造做出了重大贡献。
  • 根据美国半导体产业协会（SIA）的《2021年美国半导体产业状况》，全球约75%的半导体製造产能位于东亚。目前运作的製造设备已具备7纳米及以下尖端能力。鑑于当前的市场状况，该地区的整体主导地位预计在预测期内将继续上升。如此高的发展率的主要原因是政府的激励措施，与其他地区相比，显着降低了总营运成本（TCO）。
  • 据SIA称，台湾公司在1980年代末和1990年代建立了代工模式。这些单位专门生产由其他地区的公司设计的晶片。如今，台湾拥有全球五大晶圆代工厂中的两家，占全球整体总产能的20%。台积电是另外三家能够生产先进节点（10 奈米或更低）逻辑晶片的公司之一，另外两家是英特尔（美国）和三星（韩国）。这些尖端的逻辑晶片将安装在个人电脑、资料中心/AI伺服器和智慧型手机等运算密集型设备中。全球大部分最先进节点（5奈米和7奈米）产能位于台湾。
  • 半导体製造所需的材料浓度很高，包括光阻剂、硅晶圆、构装基板、化学品和特殊气体，这也决定了逻辑积体电路的製造地点。例如，蚀刻过程需要 C4F6，它可以比最接近的替代品快 30% 完成该过程。亚洲国家，特别是台湾，意识到了这些因素。其他地区可能需要投入大量的时间和精力来聚集这样的资源，以削弱亚洲的主导地位。

标准逻辑 IC 产业概况

标准逻辑IC市场竞争适中。在这个市场中，製造商和客户公司定期合作进行系统开发。该行业正在共用专业知识并利用新的先进逻辑闸积体电路来提高运作和电源效率。改善温度控管、系统回应时间和最佳化功耗是一些关键目标。

  • 2022 年 3 月-恩智浦半导体和日立能源联手加速碳化硅 (SiC) 功率半导体模组在电动车领域的应用。此次合作旨在提供基于 SiC MOSFET 的更有效率、更可靠、功能更安全的解决方案。这些解决方案将利用恩智浦先进的高性能隔离高压闸极驱动器GD3160和日立能源的RoadPak汽车SiC MOSFET功率模组，并部署在动力传动系统逆变器中。
  • 2021 年 5 月-三星电子宣布到 2030 年分配 171 兆韩元的逻辑晶片价值。该计画比2019年4月宣布的计画增加了38兆韩元。该公司还宣布将在韩国平泽建造一条新的生产线。该设施将有助于提供采用极紫外线 (EUV)微影术技术的 5 奈米逻辑半导体和 14 奈米 DRAM 製造製程。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场动态

  • 市场概况
  • 产业吸引力－波特五力分析
    • 新进入者的威胁
    • 买家的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争对手之间的竞争
  • 市场驱动因素
    • 工业 4.0 推动逻辑 IC 的广泛应用
    • 应用驱动的半导体和电路需求
  • 市场限制
    • 製造过程高度依赖代工厂

第五章 市场区隔

  • 按类型
    • 数字双极
    • CMOS
    • MOS闸阵列
    • MOS 通用逻辑
    • MOS标准单元
    • MOS显示驱动器
    • MOS触控萤幕控制器
  • 按应用
    • 通讯
    • 车
    • 消费性电子产品
    • 工业的
    • 卫生保健
    • 其他用途
  • 按地区
    • 北美洲
    • 欧洲
    • 亚太地区
    • 世界其他地区

第六章 竞争格局

  • 公司简介
    • Diodes Incorporated
    • Texas Instruments Incorporated
    • Xilinx, Inc.
    • STMicroelectronics NV
    • Toshiba Electronic Devices and Storage Corporation
    • ROHM Co., Ltd.
    • Microchip Technology Incorporated
    • NXP Semiconductors NV
    • ON Semiconductor Corporation
    • Samsung Electronics Company Ltd.
    • Intel Corporation

第七章 市场机会与未来趋势

简介目录
Product Code: 90671

The Standard Logic IC Market is expected to register a CAGR of greater than 3.2% during the forecast period.

Standard Logic IC - Market - IMG1

Key Highlights

  • Standard logic ICs are logic gates in the form of integrated circuits. The ICs are packaged with pins meant for further use in circuitry. The different manufacturing processes and architectures of BiPolar and CMOS technologies provide the difference in operational voltages, response time, and output form. The contributions of logic gates in electronic design and power optimization are essential.
  • The scaling down of packaging solutions driven by improvements in ceramics and plastics has played an integral role in choosing the appropriate logic IC for specific purposes. 7400 and 4000 series are among the most broadly used standard logic ICs. The constant focus on scaling down devices, especially consumer electronics, has shaped the industry.
  • Manufacturers highlight the use of new and improved logic ICs with better temperature monitoring and adaptability, promising full service in industries like the automotive industry. For instance, in November 2021, Samsung Electronics introduced three new Logic solutions for the next generation of automobiles, including Exynos Auto T5123, Exynos V7, and S2VPS01. The S2VPS01 is a power management IC (PMIC) that regulates and rectifies electrical power input to in-vehicle infotainment performance. The IC is bundled with various features for protection from harsh thermal conditions, including over-voltage protection (OVP) and thermal shut down (TSD).
  • The demand for semiconductor devices during the COVID-19 pandemic shifted towards consumer electronics and computing devices for healthcare equipment. This affected the regular demand cycle in the logic IC manufacturing industry for custom builds. Apart from the shift, the demand for standard IC solutions was moderate to steady, with the affected industrial applications compensated by the consumer electronics product lines. In the post-pandemic world, as several industries revive, the demand for semiconductors spikes, accelerating the logic IC market.

Standard Logic IC Market Trends

Automotive Industry to Generate the Maximum Demand

  • The automotive industry is looking forward to wide-scale electrification and advancements regularly. The introduction of smart connected tech and autonomous features is driving the demand for the implementation of semiconductors. Hence, the increased use of circuitry, MPUs, and sensors directs the increased deployment of standard logic ICs for power regulation and rectification.
  • The new-age technology catering to safety and modification of ride dynamics is aggressively increasing the use of semiconductors in passenger vehicles. To meet safety norms like airbags, autonomous features, electronic stability control (ESC) programs, and others, companies follow strict regulations on circuit level and use one of the best logic ICs available. For instance, companies like Texas Instruments (TI) offers automotive logic devices compliant with the AEC-Q100 standard. The ICs support a wide range of supply voltages, ranging between 5V and 1.2V, to meet the requirements of any automotive system, including infotainment systems, body control modules, automotive lighting, and advanced driver assistance systems (ADAS).
  • IoT Services and remote access features like geofencing, telematics, fleet management systems, autonomous and semiautonomous driving assists, in-vehicle infotainment, and other SIM-based utilities are taking the automotive sector towards dense application of communication. This encourages the deployment of communication modules and more sensors to provide detailed schematic input parameters for further processing. The modules and sensors are extensively using logic ICs to maintain electrical safety standards and power efficiency, especially in electric vehicles.
  • As the world is shifting toward Electric Vehicles (EVs), the requirement of extensive regulation of electrical parameters invites logic gate ICs for safer implementation of the charging and discharging technologies. Automotive companies utilize the potential and wide range of voltage handling capabilities of logic ICs through the vehicles' and final deployment stages and charging infrastructure. These factors drive the innovation and advancement in the standard logic IC industry to optimize power consumption, operating voltages, and scaling properties.

Asia Pacific Region to Drive the Market Growth

  • Some of Asia's biggest manufacturing hubs include China, Taiwan, South Korea, and Japan. The availability of a cheaper skilled workforce, favorable weather conditions, government incentives, robust power, and water infrastructure, transportation and logistics, and attractive investment conditions help the semiconductor fabrication industries flourish. These industries contribute significantly to standard manufacturing logic ICs and storage devices.
  • According to the 2021 State of the U.S. Semiconductor industry provided by the Semiconductor Industry Association (SIA), about 75% of the world's total semiconductor manufacturing capacity lies in East Asia. The currently operating manufacturing units have 7 nm and below leading-edge capabilities. The current market conditions promise the region's overall domination to continue rising over the forecast period. Major credit for this high rate of development goes to the significant government incentives that significantly bring down the Total Cost of Operation (TCO) compared to the alternate locations.
  • According to SIA, Taiwanese firms founded the foundry model in the late 1980s and 1990s. These units specialized in manufacturing the chips designed by firms from other regions. Today Taiwan comprises two of the five largest foundries globally, hosting 20% of the total global capacity. TSMC is one of the three firms, along with Intel (US) and Samsung (South Korea), that can produce logic chips in advanced nodes (10 nanometers or below). These advanced logic chips are deployed in compute-intensive devices like PCs, data center/AI servers, and smartphones. Most of the world's capacity in the top nodes (5 and 7 nanometers) is located in Taiwan.
  • The high concentration of the materials required for semiconductor manufacturing like photoresists, silicon wafers, chemicals including packaging substrates, or specialty gases also defines the location of manufacturing logic ICs. For instance, C4F6 is required for the etching process, enabling the process completion 30% faster than the closest alternative. Asian countries, especially Taiwan, have figured out such factors. It would take a notable amount of investment and time for the other regions to align such resources to disrupt the Asian dominance.

Standard Logic IC Industry Overview

The standard logic IC market is moderately competitive. The market witnesses regular collaboration among manufacturers and client companies to venture into developing systems. The industry observes sharing expertise, leveraging new advanced logic gate ICs, and boosting operational and power efficiency. Improved heat management, system response time, and power consumption optimization are some of the critical goals.'

  • March 2022 - NXP Semiconductors and Hitachi Energy collaborated to fasten the adoption of silicon carbide (SiC) power semiconductor modules in e-mobility. The partnership aims to provide SiC MOSFET-based, more efficient, reliable, and functionally safe solutions. These solutions will be deployed for powertrain inverters, leveraging NXP's advanced, high-performance GD3160 isolated HV Gate Drivers and Hitachi Energy's RoadPak automotive SiC MOSFET power modules.
  • May 2021 - Samsung electronics announced the allocation of KRW 171 Trillion in Logic Chip Buniesses by 2030. The plan displays an increase of KRW 38 Trillion compared to the one conveyed in April 2019. The company has also declared constructing a new production line in Pyeongtaek, Korea, expected to be completed by the 2022 second half. The plant will contribute to carrying out 5-nanometer logic semiconductors and 14-nanometer DRAM manufacturing processes, featuring Extreme Ultraviolet (EUV) lithography technology.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumption & Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Threat of New Entrants
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Bargaining Power of Suppliers
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Market Drivers
    • 4.3.1 Industry 4.0 Driving the Deployment of Logic ICs
    • 4.3.2 Application-Centric Demands for Semiconductor and Circuitry
  • 4.4 Market Restraints
    • 4.4.1 High Dependence on Foundries for Manufacturing

5 MARKET SEGMENTATION

  • 5.1 By Type
    • 5.1.1 Digital Bipolar
    • 5.1.2 CMOS
    • 5.1.3 MOS Gate Arrays
    • 5.1.4 MOS General Purpose Logic
    • 5.1.5 MOS Standard Cells
    • 5.1.6 MOS Display Drives
    • 5.1.7 MOS Touch Screen Controllers
  • 5.2 By Application
    • 5.2.1 Communication
    • 5.2.2 Automotive
    • 5.2.3 Consumer Electronics
    • 5.2.4 Industrial
    • 5.2.5 Healthcare
    • 5.2.6 Other Applications
  • 5.3 By Geography
    • 5.3.1 North America
    • 5.3.2 Europe
    • 5.3.3 Asia-Pacific
    • 5.3.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Diodes Incorporated
    • 6.1.2 Texas Instruments Incorporated
    • 6.1.3 Xilinx, Inc.
    • 6.1.4 STMicroelectronics N.V
    • 6.1.5 Toshiba Electronic Devices and Storage Corporation
    • 6.1.6 ROHM Co., Ltd.
    • 6.1.7 Microchip Technology Incorporated
    • 6.1.8 NXP Semiconductors N.V.
    • 6.1.9 ON Semiconductor Corporation
    • 6.1.10 Samsung Electronics Company Ltd.
    • 6.1.11 Intel Corporation

7 MARKET OPPORTUNITIES AND FUTURE TRENDS