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市场调查报告书
商品编码
1685832

先进封装：市场占有率分析、产业趋势与统计、成长预测（2025-2030）

Advanced Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 126 Pages | 商品交期: 2-3个工作天内

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简介目录

先进封装市场规模预计在 2025 年为 348 亿美元，预计到 2030 年将达到 479.8 亿美元，预测期内（2025-2030 年）的复合年增长率为 6.63%。

先进封装市场-IMG1

主要亮点

  • 先进封装是指在传统积体电路封装之前对元件进行整合和互连。它允许整合多个设备，包括电气、机械和半导体元件，并将它们封装到单一电子设备中。与传统的积体电路封装不同，先进封装采用在半导体製造设备中执行的製程和技术。它介于製造和传统封装之间，包括 3D IC、2.5D IC、扇出型晶圆级封装和系统级封装等多种技术。
  • 先进封装可以透过在一个封装内整合多个晶片来实现更高的性能。透过使用穿透硅通孔、内插器、桥接器和简单电线等技术连接这些晶片，我们可以提高讯号速度并减少驱动这些讯号所需的能量。此外，先进的封装允许混合在不同製程节点上开发的组件。
  • 三维整合、异质整合等先进封装技术可显着提高积体电路和记忆体晶片的效能。这些技术可以提高功能密度、互连密度以及针对特定应用的记忆体客製化。例如，记忆体集成设备製造商（IDM）可以使用3D堆迭技术来提高记忆体晶片的效能，并为特定客户客製化记忆体。
  • 此外，先进的封装技术可以使电子元件小型化，而不会影响效能。在先进封装中，类比工具和多物理方法来评估和确保设计的热可靠性和讯号完整性。在设计阶段早期识别潜在的封装问题，可以让积体电路设计人员在原型设计之前进行修正，以提高可靠性。
  • 在全球金融危机之后，法规结构的变化和后危机市场环境对先进封装市场产生了重大影响。为了保持市场竞争力，OSAT 正在活性化其併购活动。预计这一趋势将在未来几年持续下去，主要企业之间将出现不同程度的整合。
  • 由于晶片製造商已经在努力应对日益增长的复杂性、摩尔定律变得更加困难和昂贵而导致的未来设计蓝图的丢失，以及标准不断发展和规则集不同的新市场的涌入，整合可能会继续下去。收购可能会对我们现有技术的产品支援和服务产生重大影响。对于预计设备使用寿命为 10 至 20 年左右的市场来说，这尤其令人不安。预计这将抑制市场成长。

先进封装市场趋势

嵌入式晶粒呈现强劲成长率

  • 全球嵌入式晶粒封装技术的成长主要受到5G网路技术和家用电子电器需求不断增长的推动。许多家用电子电器，如智慧型手机、笔记型电脑、平板电脑和掌上游戏机，都包含多个嵌入式晶片，以提供更好的使用者介面和增强的整体效能。在智慧型手机、穿戴式装置和其他家用电子电器中，这些晶片主要用于DC-DC转换器、电力电子电路和摄影机电路。
  • 此外，由于其架构内建了 5G，汽车智慧视讯监控系统中使用的嵌入式设备的响应时间变得更快。此外，微电子设备中的电路也迫切需要小型化。嵌入式晶粒封装因其在高频下的优异电气性能而成为新兴微波应用的一种很有前途的技术。随着电子设备体积越来越小以便于使用，对紧凑型电子电路的需求也日益增加。嵌入式晶粒封装技术满足了这一需求，该技术具有许多优势，例如增强了电子电路的功能和效率，减小了尺寸、降低了讯号电感和功率电感，提高了可靠性，并增加了讯号密度。
  • 5G网路的日益普及将推动市场发展。例如，爱立信预计，2019年至2028年期间，全球5G用户数将大幅成长，从1,200万多成长至45亿多万。按地区划分，东南亚、东北亚、尼泊尔、印度和不丹预计订阅量将出现最大增幅。
  • 此外，5G 技术的推出需要紧凑高效的设备来支援复杂的通讯系统。晶圆级晶片规模封装 (WLCSP) 和扇出型封装等先进封装解决方案可实现更小的外形规格、低耗电量和更好的温度控管，使其适用于 5G 设备。
  • 此外，嵌入式晶粒解决方案的 3D 封装作为下一代设备的整合工具正在引起消费者的关注，并可能成为未来几年的主要趋势。因此，预计它将在预测期内推动市场发展。

预计亚太地区将出现显着成长

  • 由于主要半导体製造商的存在、快速的工业化以及庞大的消费性电子市场，亚太地区有望成为半导体封装市场的主导者。该地区以半导体的大量生产和在消费性电子、汽车和通讯等不同行业采用先进的封装技术而闻名。预计这些因素将推动亚太半导体封装市场的成长，并为市场相关人员提供有利可图的机会。
  • 中国制定了非常雄心勃勃的半导体计划，并获得了 1500 亿美元的巨额预算支持。该国正在发展国内积体电路产业，以提高晶片产量。大中华区由中国香港和台湾组成，是重要的地缘政治热点。美国之间正在进行的贸易战进一步加剧了该地区的紧张局势，该地区是所有主要工艺技术的发源地，促使多家中国公司投资半导体产业。
  • 例如，2023 年 9 月，中国宣布计划推出一项新的国家支持的投资基金，为半导体产业筹集约 400 亿美元。 2022年12月，中国宣布将投入超过1兆元（1,430亿美元）支持其半导体产业。该倡议是朝着实现晶片生产自给自足迈出的重要一步，也是对美国阻碍中国技术进步的行动的回应。预计预测期内包装服务的需求将大幅成长。
  • 在私营部门投资方面，中国在许多此类声明中一直处于领先地位，特别是在封装技术的发展方面，使其成为所有寻求扩大半导体产业的经济体的主要竞争对手。例如，2023年8月，中国国家自然科学基金委员会（NSFC）宣布将向30个Chiplet计划投资640万美元。
  • 此外，2023年8月，台湾半导体製造公司（TSMC）宣布，将投资900亿新台币在台湾建造一座先进的晶片封装工厂，以满足全球不断增长的需求。此外，儘管中国政府认为美光公司的产品存在安全风险，美光公司仍于2023年6月承诺投资数百万美元在中国建厂。美光公司表示，未来几年将投资总计 43 亿元人民币（略高于 6 亿美元）升级其西安晶片封装工厂。

先进封装市场概览

先进封装市场处于半固体状态，主要企业包括日月光半导体製造股份有限公司、台湾半导体製造股份有限公司、安靠科技、英特尔公司和 JCIVE 集团。

  • 2023 年 7 月，安靠科技展示了在使用台积电先进的低 k 製程技术製造的设备进行引线键合和覆晶构装的开发和检验方面的广泛倡议和成就。 Amkor 已与多家客户合作以验证其低 k 产品，并计划在今年稍后大幅增加其低 k 封装的产量。
  • 2022年11月，英特尔公司在槟城破土动工建造新的半导体组装和测试工厂。该工厂由两栋建筑（4号工厂和5号工厂）组成，位于峇六拜自由工业区内，总面积为 982,000 平方英尺，预计于 2025 年竣工，预计将为当地市场创造 2,700 个就业机会。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3个月的分析师支持

目录

第一章 引言

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场洞察

  • 市场概览
  • 产业价值链分析
  • 产业吸引力－波特五力分析
    • 新进入者的威胁
    • 买家的议价能力
    • 供应商的议价能力
    • 替代品的威胁
    • 竞争对手之间的竞争强度
  • 评估新冠疫情和宏观经济趋势对产业的影响

第五章市场动态

  • 市场驱动因素
    • 电子产品向先进架构发展的趋势
    • 新兴国家有利的政府法规和政策
  • 市场限制
    • 市场整合影响整体盈利

第六章市场区隔

  • 按包装平台
    • 覆晶
    • 嵌入式晶粒
    • Fi-WLP
    • Fo-WLP
    • 2.5D/3D
  • 按地区
    • 北美洲
    • 欧洲
    • 亚洲
    • 澳洲和纽西兰
    • 拉丁美洲
    • 中东和非洲

第七章竞争格局

  • 公司简介
    • Amkor Technology Inc.
    • Taiwan Semiconductor Manufacturing Company Limited
    • Advanced Semiconductor Engineering Inc.
    • Intel Corporation
    • JCET Group Co. Ltd
    • Chipbond Technology Corporation
    • Samsung Electronics Co. Ltd
    • Universal Instruments Corporation
    • ChipMOS Technologies Inc.
    • Brewer Science Inc.

第八章投资分析

第九章 市场机会与未来趋势

简介目录
Product Code: 48278

The Advanced Packaging Market size is estimated at USD 34.80 billion in 2025, and is expected to reach USD 47.98 billion by 2030, at a CAGR of 6.63% during the forecast period (2025-2030).

Advanced Packaging - Market - IMG1

Key Highlights

  • Advanced packaging refers to the aggregation and interconnection of components before traditional integrated circuit packaging. It allows multiple devices, such as electrical, mechanical, or semiconductor components, to be merged and packaged as a single electronic device. Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques that are performed at semiconductor fabrication facilities. It sits in between fabrication and traditional packaging, and it includes various technologies like 3D ICs, 2.5D ICs, fan-out wafer-level packaging, system-in-package, etc.
  • Advanced packaging can achieve performance gains through the integration of multiple chips in a package. By connecting these chips using fatter, such as through-silicon vias, interposers, bridges, or simple wires, the speed of signals can be increased, and the amount of energy required to drive those signals can be reduced. Additionally, advanced packaging allows for the mixing of components developed at different process nodes.
  • Advanced packaging techniques, such as 3D integration and heterogenous integration, can significantly improve the performance of integrated circuits and memory chips. These techniques allow for increased feature density, interconnect density, and customization of memory for specific applications. For instance, memory-integrated device manufacturers (IDMs) can use 3D stacking technology to enhance performance in memory chips and customize memory for specific clients.
  • Advanced packaging techniques also enable the reduction of the size of electronic components without compromising their performance. Simulation tools and Multiphysics approaches are used in advanced packaging to assess and ensure the thermal reliability and signal integrity of designs. By identifying potential packaging problems early in the design phase, integrated circuit designers can make modifications to improve reliability before prototyping.
  • The experience of the global financial crisis changes to regulatory frameworks and the post-crisis market environment has had a significant impact on the advanced packaging market. To remain competitive in the market, OSATs are increasing their M&A activities. This will continue throughout the coming years, with various levels of consolidation among the major players.
  • The consolidation will increase as chipmakers are already grappling with the increasing complexity, the loss of a roadmap for future designs as Moore's Law is becoming more difficult and expensive to sustain, and a flood of new markets with evolving standards and different sets of rules. Acquisitions can have a big impact on product support and servicing of the existing technology. This is particularly troublesome for markets in which the devices are expected to function for about 10 to 20 years. This is expected to restrain the growth of the market..

Advanced Packaging Market Trends

Embedded Die to Witness Significant Growth Rate

  • The growth of global embedded die packaging technology is majorly driven by the increasing demand for 5G network technology and consumer electronics. Numerous consumer electronic devices, such as smartphones, laptops, tablets, and portable gaming consoles, incorporate several embedded chips to provide a better user interface and enhanced overall performance. In smartphones, wearable devices, and other consumer electronic appliances, these chips are used primarily in DC-DC converters, power electronic circuitry, and camera circuits.
  • Moreover, due to the incorporation of 5G into their architecture, embedded devices used in smart video surveillance systems of automobiles give rapid response times. There is also a critical need for circuit miniaturization in microelectronic devices. Embedded die packaging is a promising technology for emerging microwave applications, owing to its excellent electrical performance at high frequencies. With the reduction in size of electronic devices for ease of access for users, the demand for compact electronic circuitry is on the rise. This demand is met by embedded die packaging technology, which offers advantages such as increased functionality and efficiency of the electronic circuit; reduced size, signal inductance, and power inductance; improved reliability; and higher signal density.
  • The increasing adoption of 5G networks would augment the development of the studied market. For instance, according to Ericsson, 5G subscriptions are forecasted to increase drastically worldwide from 2019 to 2028, from over 12 million to over 4.5 billion subscriptions, respectively. Southeast Asia, Northeast Asia, Nepal, India, and Bhutan are expected to have the most subscriptions by region.
  • Also, the rollout of 5G technology requires compact and efficient devices to accommodate complex communication systems. Advanced packaging solutions like Wafer Level Chip Scale Package (WLCSP) and fan-out packaging enable smaller form factors, lower power consumption, and enhanced thermal management, making them suitable for 5G devices.
  • Furthermore, 3D packaging with embedded die solutions is gaining attention among consumers as an integration tool for next-generation devices, which is likely to become a key trend in the future. Hence, it is anticipated to drive the market over the forecast period.

Asia Pacific is Expected to Witness Significant Growth Rate

  • The Asia Pacific region is anticipated to emerge as a dominant player in the semiconductor packaging market, owing to the presence of major semiconductor manufacturers, rapid industrialization, and a vast consumer electronics market. The region is renowned for its high-volume production of semiconductors and the adoption of advanced packaging technologies across diverse industries, such as consumer electronics, automotive, and telecommunications. These factors are expected to fuel the growth of the semiconductor packaging market in the Asia Pacific region, thereby presenting lucrative opportunities for market players.
  • China has a highly ambitious semiconductor agenda, supported by a substantial funding of USD 150 billion. The nation is developing its domestic IC industry to increase its chip production. The Greater China region, comprising Hong Kong, China, and Taiwan, is a significant geopolitical hotspot. The ongoing US-China trade war has further intensified tensions in this area, which houses all the leading process technology, prompting several Chinese firms to invest in their semiconductor industry.
  • For instance, in September 2023, China announced its plans to launch a new state-backed investment fund to raise about USD 40 billion for its semiconductor sector. In December 2022, China announced its commitment to a support package exceeding YUAN 1 trillion (USD 143 billion) for its semiconductor industry. This initiative is a crucial step towards achieving self-sufficiency in chip production and is a response to U.S. actions aimed at hindering China's technological progress. The demand for packaging services is anticipated to rise considerably over the forecasted period, owing to the region's intensified efforts to enhance domestic chip manufacturing.
  • Regarding investments from private players, the country has been at the forefront for many such announcements, especially toward evolving packaging technologies, thus presenting it as a major competitor for all national geographies working towards expanding its semiconductor industry. For instance, in August 2023, the National Natural Science Foundation of China (NSFC) announced an investment of USD 6.4 million in 30 Chiplet projects, now considered the next big advanced packaging technology.
  • Moreover, in August 2023, Taiwan Semiconductor Manufacturing Company (TSMC) announced investing 90 billion New Taiwan dollars to build an advanced chip packaging plant in Taiwan amid booming global demand. Additionally, Micron stated in June 2023 that it would spend millions of dollars on a factory in China despite the Chinese government having just deemed its goods a security risk. Over the coming years, Micron stated it will upgrade its chip packaging factory in Xi'an with investments totaling YUAN 4.3 billion (slightly over USD 600 million).

Advanced Packaging Market Overview

The Advanced Packaging Market had a semi-consolidated landscape with key players like Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, Amkor Technology, Intel Corporation, and JCET Group Co. Ltd. A significant shift was noted as numerous IC manufacturers transitioned to sub-advanced packaging, spurring market demand and heightening competition.

  • In July 2023 - Amkor Technology extensively detailed its efforts and achievements in developing and validating wire bond and flip chip packaging for devices manufactured using TSMC's advanced low-k process technologies. Collaborating with multiple clients on low-k product qualification, Amkor aimed for a substantial volume ramp-up in low-k packages during the latter half of the year.
  • In November 2022 - Intel Corporation commenced work on a new semiconductor assembly and testing facility in Penang. Comprising two buildings (Plants 4 and 5) totaling 982,000 square feet within the Bayan Lepas Free Industrial Zone, this facility, expected to be finalized by 2025, was anticipated to generate 2,700 job opportunities within the local market.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Threat of New Entrants
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Bargaining Power of Suppliers
    • 4.3.4 Threat of Substitute Products
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Assessment of the Impact of COVID-19 and Macro Economic Trends on the Industry

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Trend of Advanced Architecture in Electronic Products
    • 5.1.2 Favorable Government Policies and Regulations in Developing Countries
  • 5.2 Market Restraints
    • 5.2.1 Market Consolidation affecting Overall Profitability

6 MARKET SEGMENTATION

  • 6.1 By Packaging Platform
    • 6.1.1 Flip Chip
    • 6.1.2 Embedded Die
    • 6.1.3 Fi-WLP
    • 6.1.4 Fo-WLP
    • 6.1.5 2.5D/3D
  • 6.2 By Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia
    • 6.2.4 Australia and New Zealand
    • 6.2.5 Latin America
    • 6.2.6 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Amkor Technology Inc.
    • 7.1.2 Taiwan Semiconductor Manufacturing Company Limited
    • 7.1.3 Advanced Semiconductor Engineering Inc.
    • 7.1.4 Intel Corporation
    • 7.1.5 JCET Group Co. Ltd
    • 7.1.6 Chipbond Technology Corporation
    • 7.1.7 Samsung Electronics Co. Ltd
    • 7.1.8 Universal Instruments Corporation
    • 7.1.9 ChipMOS Technologies Inc.
    • 7.1.10 Brewer Science Inc.

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS