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市场调查报告书
商品编码
1687141

覆晶技术-市场占有率分析、产业趋势与统计、成长预测（2025-2030 年）

Flip Chip Technology - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

预计覆晶技术市场在预测期内的复合年增长率将达到 5.91%

倒装晶片技术-市场-IMG1

关键亮点

  • 覆晶在可靠性、尺寸、灵活性、性能和成本方面比其他封装方法更具优势。与其他包装手法相比，可靠性、尺寸、灵活性、效能和成本等关键优势是推动覆晶市场成长的因素。此外，预计在预测期内，覆晶原料、设备和服务的供应将有利地推动市场发展。
  • 此外，与竞争方法相比，市场成长受到许多优势的推动，包括更小的尺寸、更高的性能和更大的 I/O 灵活性。预计行动、无线、消费性应用、网路、伺服器和资料中心等高效能应用领域对覆晶的需求将会成长。除了 3D 整合和摩尔方法之外，覆晶还是关键推动因素之一，有助于实现先进的 SoC（系统晶片）。
  • MMIC（单晶微波积体电路）的强劲成长正在推动市场不断扩大，因为 MMIC 是在微波频率（300 MHz 至 300 GHz）下工作的设备。这些设备通常执行微波混频、功率放大、低杂讯放大和高频开关等功能。
  • 晶圆级封装和嵌入式晶粒是覆晶市场中发展最快的技术。此外，一些知名供应商正在增加对这些技术的投资，以扩大其影响力。
  • 例如，2021 年 3 月，三星电子与 Marvell 合作开发了一种新的系统晶片，可提供增强的 5G 网路效能。新发布的晶片将用于三星的Massive MIMO，预计到2021年第二季将在Tier 1通讯业者中占有一席之地。同样，联发科公司于2020年11月签署了一项协议，以约8,500万美元的价格收购英特尔Enpirion的电源管理晶片资产。
  • COVID-19 对市场成长产生了严重影响。这是由于消费者购买行为从家用电子电器产品和汽车等奢侈品转向食品等必需品。供应链也受到影响，导致市场成长放缓。

覆晶技术市场趋势

军事和国防工业推动市场成长

  • 现代军事和国防环境需要成熟、可靠且可扩展的技术。感测器是一项关键技术，因为它们为整个国防生态系统提供解决方案，包括复杂的控制、测量、监控和执行。
  • 军事要求将组件冷却至 50 K，因此开发了一种基于铟微泵的技术。军事系统中感测器数量的不断增加推动了军事运算平台对覆晶技术的需求。
  • 对于任何雷达来说，包装和组装都是成功实施的关键。随着雷达应用变得越来越普遍，成本变得非常重要。毫米波汽车雷达和无人机正在解决成本和封装问题。单晶片雷达和多通道T/R模组正在变得可行。
  • 例如，已经开发出用于 76-84 GHz 范围的汽车雷达应用的 SiGe 发射/接收相位阵列晶片。此晶片采用可控崩坏晶片连接 (C4) 凸点製程覆晶到低成本印刷电路基板，在发射和接收链之间提供 50 dB 的隔离。这项成就代表了能够同时进行发射和接收操作的毫米波段高性能 FMCW 雷达的复杂性的最新水平。
  • 由于军事应用对复杂性、性能、引脚数、功耗和成本的要求不断提高，随着 GPS 和雷达应用的部署，封装产业正向高性能封装发展，如用于军事和国防应用的覆晶和晶圆级扇出型封装。在这些类型的应用中使用覆晶技术已被许多应用证明是一种可靠的封装技术，可实现高密度电子产品。
  • 近日，领先的创新射频解决方案提供商 Qorvo 获得了一份为期三年的额外合同，以进一步开发其 GaN 上铜柱覆晶技术。美国国防部 (DoD) 的这个项目将建立一个高产量比率的国内代工厂，以完善铜倒装组装工艺，从而能够在空间受限的相位阵列雷达系统和其他国防电子设备中进行垂直晶粒堆迭。

中国占有很大的市场占有率

  • 预计预测期内中国包装产业将实现潜在成长。对 IC 元件的强劲需求正在推动具有更高整合度和 I/O 连接的先进封装解决方案的扩展。
  • 中国政府的「中国製造2025」倡议旨在2030年将半导体产业产值提升至3,050亿美元，满足80%的国内需求。随着技术战争的激烈进行，中国正在加强其晶片产业。美国贸易战以及中国企业可能被切断与美国技术的联繫（包括华为等大公司）的威胁正在推动中国半导体产业的发展。
  • 覆晶市场包括凸块加工和组装，中国参与企业正在加大凸块加工产能，尤其是 12' 铜柱的产能。超过90%的先进封装公司都具备对300mm晶圆进行凸块加工的能力。 2019年，中国电子企业江苏长电科技股份有限公司（JCET）开始晶圆凸块大量生产。该公司新的 12 吋晶圆凸块生产线已投入量产。目前，该产品已批量出货给长电科技在中国的客户，另有几家设备製造商也具备出货该生产线的资格。
  • 由于新冠疫情爆发，中国所有製造业和地区都因长期停工而受到影响，覆晶技术市场也因此受到影响。此外，中国测试和封装公司继续获得高端封装技术（例如覆晶和凸块）和更先进（例如扇入、扇出、2.5D内插器、SiP）处理方面的能力。
  • 在技​​术发展和併购的推动下，长电科技、天盛科技和通富微电子等中国服务供应商预计今年将以两位数的成长率超越行业平均水平。

覆晶技术产业概况

由于汽车、工业和家用电子电器领域的终端用户数量不断增加，覆晶技术市场变得分散。预计预测期内市场将经历中等至稳定的成长。市场现有参与企业正试图透过适应 5G通讯、高性能资料中心和小型电子设备等新技术来保持竞争力。近期市场发展趋势如下：

  • 2021 年 11 月－领先的半导体封装和测试服务供应商 Amkor Technology Inc (NASDAQ: AMKR) 计划在越南北宁建造一座最先进的智慧工厂。新工厂的第一阶段将专注于为全球领先的半导体和电子产品製造商提供先进封装（SiP）组装和测试解决方案。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3个月的分析师支持

目录

第一章 引言

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场洞察

  • 市场概览
  • 产业吸引力-波特五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争强度
  • 产业价值链分析

第五章市场动态

  • 市场驱动因素
    • 穿戴式装置需求不断成长
    • MMIC（单晶微波积体电路）应用强劲成长
  • 市场问题
    • 技术成本上升

第六章 技术简介

第七章市场区隔

  • 透过晶圆凸块工艺
    • 铜柱
    • 锡铅共晶焊料
    • 无铅焊料
    • 金钉凸点
  • 依封装技术
    • BGA（2.1D/2.5D/3D）
    • CSP
  • 副产品（仅定性分析）
    • 记忆
    • 发光二极体
    • CMOS影像感测器
    • SoC
    • GPU
    • CPU
  • 按最终用户
    • 军事和国防
    • 医疗保健
    • 工业领域
    • 车
    • 消费性电子产品
    • 通讯部分
  • 按地区
    • 中国
    • 台湾
    • 美国
    • 韩国
    • 马来西亚
    • 新加坡
    • 日本

第八章竞争格局

  • 公司简介
    • Amkor Technology Inc.
    • UTAC Holdings Ltd
    • Taiwan Semiconductor Manufacturing Company Limited
    • Chipbond Technology Corporation
    • TF AMD Microlectronics Sdn Bhd
    • Jiangsu Changjiang Electronics Technology Co. Ltd
    • Powertech Technology Inc.
    • ASE Industrial Holding Ltd（Siliconware Precision Industries Co. Ltd）

第九章投资分析

第十章：市场的未来

简介目录
Product Code: 55573

The Flip Chip Technology Market is expected to register a CAGR of 5.91% during the forecast period.

Flip Chip Technology - Market - IMG1

Key Highlights

  • This leads to rapid growth in this industry among raw material suppliers. Its primary advantages over other packaging methods, namely, reliability, size, flexibility, performance, and cost, are the factors driving the growth of the flip-chip market. The availability of flip-chip raw materials, equipment, and services is further expected to drive the market lucratively during the forecast period.
  • Moreover, the growth of the market is attributed to its numerous advantages, such as smaller size, higher- performance, and enhanced I/O flexibility over its competitive methodologies. The demand for flip-chip is expected to rise in mobile and wireless, consumer applications, and other high-performance applications such as networks, servers, and data centers. In terms of 3D integration and more than the Moore approach, the flip-chip is one of the key driving factors and helps enable sophisticated SoC (system on chip).
  • Due to the strong growth in MMIC (monolithic microwave IC), the market is growing, as MMICs are devices that operate at microwave frequencies (300 MHz to 300 GHz). These devices typically perform functions such as microwave mixing, power amplification, low-noise amplification, and high-frequency switching.
  • Fan-out wafer-level packaging and embedded die are some of the fastest emerging technologies for the flip-chip market. Also, some of the prominent vendors are increasing their investment in these technologies, thereby expanding their scope.
  • For instance, in March 2021, Samsung Electronics partnered with Marvell to jointly develop a novel system-on-a-chip to offer enhanced 5G network performance. The newly launched chip finds usage in Samsung's massive MIMO and is anticipated to see its presence among Tier One operators by Q2 2021. Similarly, Mediatek, Inc., in November 2020, inked an acquisition deal of approximately USD 85 million to purchase the power management chip assets of Intel Enpirion.
  • COVID-19 has severely affected the market growth. This is due to the shifting of consumer purchasing behavior towards essential goods such as groceries from luxury goods such as consumer electronics and vehicles. The supply chain was also affected, thus slowing down the market growth.

Flip Chip Technology Market Trends

The Military and Defense Industry to Drive the Market Growth

  • Modern military and defense environments require proven, reliable, and scalable technologies. Sensors are a critical part of the technologies, as these provide solutions to the whole defense ecosystem, including complex controls, measurements, monitoring, and execution.
  • For military requirements, the need to cool components down to 50 K has led to the development of a technology based on indium micropumps. The sensor content of military systems continues to grow, thereby driving requirements for flip chip technology in military computing platforms.
  • For any radar, packaging and assembly are the keys to a successful implementation. As radar applications proliferate, cost becomes critical. For millimeter-wave automotive and UAV, cost and packaging are being addressed. Single-chip radars and multi-channel T/R modules are becoming feasible.
  • For example, a SiGe transmit-receive phased-array chip for automotive radar applications at 76 to 84 GHz has been developed. The chip uses a controlled collapse chip connection (C4) bumping process and is flip-chipped onto a low-cost printed circuit board, achieving 50 dB isolation between the transmit and receive chains. This work represents state-of-the-art complexity for a high-performance FMCW radar at millimeter-wave frequencies, with simultaneous transmit and receive operation.
  • Due to the increasing complexities and higher performance, pin count, power, and cost requirements of military applications, the packaging industry is moving toward high-performance packages, such as flip-chip or wafer-level fan-out packaging, for military and defense by deploying GPS and radar applications. The use of flip-chip technology for this type of application has proven itself, in many applications, to be a reliable packaging technology to achieve high-density electronics.
  • Recently, Qorvo, a leading provider of innovative RF solutions, was awarded a three-year contract further to advance the development of copper-pillar-on-GaN flip-chip technology. This Department of Defense (DoD) program will create a high-yield domestic foundry to mature the copper flip assembly process, which enables vertical die stacking in space-constrained phased array radar systems and other defense electronics.

China Occupies the Significant Market Share

  • The packaging industry in China is expected to register potential growth during the forecast period. There is a strong demand for IC components, which has expanded the deployment of advanced packaging solutions that offer higher levels of integration and higher numbers of I/O connections.
  • The Chinese government's initiative of 'Made in China 2025' aims to make its semiconductor industry reach USD 305 billion in output by 2030 and meet 80% of domestic demand. China is ramping up its chip industry amid a brewing tech war. The United States-China trade war and the threat that Chinese firms could be cut off from American technology(as major firms like Huawei) are boosting China's push for its semiconductor industry.
  • The flip-chip market includes bumping and assembly, and there is enormous ramping of bumping capacity by Chinese players, particularly in the 12' Cu pillar. More than 90% of advanced packaging players have 300 mm wafer bumping capability. In 2019, Chinese electronics company Jiangsu Changjiang Electronics Technology (JCET) started high-volume wafer bumping. The company has moved into volume production with its new 12-inch wafer bumping line. Production volumes are already being shipped to China-based JCET customers, with several additional device manufacturers qualifying the line for shipments.
  • Due to the COVID-19 pandemic, all the manufacturing industries and bases are affected in China due to the long-lasting shutdown in the country, thereby affecting the flip-chip technology market. Moreover, the Chinese testing and packaging companies continue to gain processing capacity for high-end packaging technologies (e.g., flip-chip and bumping) and more advanced (e.g., fan-in, fan-out, 2.5D interposer, and SiP).
  • Owing to the progress in both technology development and merger and acquisitions, Chinese service providers, such as JCET, TSHT, and TFME, are projected to rise above the industry's average in their revenue performances this year with double-digit growth rates.

Flip Chip Technology Industry Overview

The flip chip technology market is fragmented due to the growing number of end users in automotive, industrial, and consumer electronics. The market is expected to grow at a fair steady rate over the forecast period. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies, such as 5G telecommunication, high-performance data centers, compact electronic devices, etc. Some of the recent developments in the market are -

  • November 2021 - Amkor Technology Inc. (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, planned to build a state-of-the-art smart factory in Bac Ninh, Vietnam. The first phase of the new factory would focus on providing advanced system in package (SiP) assembly and test solutions to the leading global semiconductor and electronic manufacturing companies.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Demand for Wearable Devices
    • 5.1.2 Strong Growth in MMIC (Monolithic Microwave IC) Applications
  • 5.2 Market Challenge
    • 5.2.1 Higher Costs Associated with the Technology

6 TECHNOLOGY SNAPSHOT

7 MARKET SEGMENTATION

  • 7.1 By Wafer Bumping Process
    • 7.1.1 Copper Pillar
    • 7.1.2 Tin-Lead Eutectic Solder
    • 7.1.3 Lead Free Solder
    • 7.1.4 Gold Stud Bumping
  • 7.2 By Packaging Technology
    • 7.2.1 BGA (2.1D/2.5D/3D)
    • 7.2.2 CSP
  • 7.3 By Product (Only Qualitative Analysis)
    • 7.3.1 Memory
    • 7.3.2 Light Emitting Diode
    • 7.3.3 CMOS Image Sensor
    • 7.3.4 SoC
    • 7.3.5 GPU
    • 7.3.6 CPU
  • 7.4 By End User
    • 7.4.1 Military and Defense
    • 7.4.2 Medical and Healthcare
    • 7.4.3 Industrial Sector
    • 7.4.4 Automotive
    • 7.4.5 Consumer Electronics
    • 7.4.6 Telecommunications
  • 7.5 By Geography
    • 7.5.1 China
    • 7.5.2 Taiwan
    • 7.5.3 United States
    • 7.5.4 South Korea
    • 7.5.5 Malaysia
    • 7.5.6 Singapore
    • 7.5.7 Japan

8 COMPETITIVE LANDSCAPE

  • 8.1 Company Profiles
    • 8.1.1 Amkor Technology Inc.
    • 8.1.2 UTAC Holdings Ltd
    • 8.1.3 Taiwan Semiconductor Manufacturing Company Limited
    • 8.1.4 Chipbond Technology Corporation
    • 8.1.5 TF AMD Microlectronics Sdn Bhd
    • 8.1.6 Jiangsu Changjiang Electronics Technology Co. Ltd
    • 8.1.7 Powertech Technology Inc.
    • 8.1.8 ASE Industrial Holding Ltd (Siliconware Precision Industries Co. Ltd)

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET