市场调查报告书
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全球嵌入式非挥发性记忆体 (eNVM) 市场评估:按产品类型、按应用、按最终用途行业、按地区、机会、预测 (2017-2031)Embedded Non-Volatile Memory Market Assessment By Product Type, By Application, By End-use Industry, By Region, Opportunities and Forecast, 2017-2031F |
预计2023年全球嵌入式非挥发性记忆体(eNVM)市场规模将达15.3亿美元,2031年将达59.1亿美元,2024-2031年预测期间复合年增长率为18.4%。在消费性电子、汽车和工业等行业需求不断增长的推动下,嵌入式非挥发性记忆体 (eNVM) 市场呈现显着成长。对更小、更节能设备的需求不断增长,推动了先进嵌入式非挥发性记忆体 (eNVM) 技术的采用,该技术可提供更高的速度、耐用性和可扩展性。以数据为中心的应用程式的激增和连接设备数量的不断增加正在推动嵌入式非挥发性记忆体(eNVM)市场的发展。此外,汽车产业越来越依赖 eNVM 来实现关键功能,包括 ADAS(高级驾驶辅助系统),这也推动了这一成长轨迹。总体而言,多种因素正在为嵌入式非挥发性记忆体(eNVM)市场的持续扩张创造有利的环境。
嵌入式非挥发性记忆体市场的成长与快速成长的物联网格局一致,根据 "2023 年春季物联网状况" 报告,预计到 2023 年,活跃端点将达到 167 亿个。儘管成长速度较 2022 年略有放缓,但仍在上升,预计到 2027 年物联网连线数将达到 290 亿个。嵌入式非挥发性记忆体 (eNVM) 市场正受益于物联网的扩展,因为它在为互联设备提供可靠且节能的记忆体解决方案方面发挥着至关重要的作用。此外,嵌入式非挥发性记忆体 (eNVM) 市场得到了 eNVM 技术进步的支持,满足了物联网应用的需求。全球不确定性和地缘政治因素继续限制晶片供应。嵌入式非挥发性记忆体市场的持续成长得益于其在不断发展的物联网生态系统中的关键作用。
例如,eMemory于2023年4月透露,其NeoFuse OTP已通过台积电N5製程认证。NeoFuse OTP是一款嵌入式OTP NVM IP解决方案,具有低功耗、高可靠性、强安全性。
由于智慧型手机和穿戴式装置等消费性电子产品的需求不断增长,嵌入式非挥发性记忆体(eNVM)市场呈现显着成长。对可靠且节能的小型高效能记忆体解决方案的需求推动了这种快速成长。随着消费性电子产品的复杂性和功能不断增长,eNVM 提供更快的存取时间和更大的储存容量的要求变得至关重要。其无缝整合不仅改善了用户体验,而且使 eNVM 成为推动消费性电子产业创新和技术进步的基本要素。对 eNVM 的日益依赖证实了它在塑造现代电子领域中的重要角色。
例如,2023年3月,eMemory和UMC在UMC的22nm超低功耗製程上认证了eMemory的8Mb RRAM IP,增强了UMC针对物联网和行动应用的嵌入式记忆体产品。两家公司正在合作,利用 UMC 的 22nm 0.8V/2.5V RRAM 平台,为汽车产业开发创新的 RRAM 解决方案。
连接装置的激增是支援嵌入式非挥发性记忆体(eNVM)市场扩张的关键驱动力。这一趋势正在推动对可靠、高效能非挥发性记忆体解决方案的需求。随着从物联网应用到工业自动化等各个领域互连设备数量的不断增加,eNVM 的重要性对于有效的资料储存和检索变得至关重要。eNVM 以其可靠性和高效的资料管理而闻名,可确保这些互联生态系统内的无缝通讯和最佳功能。嵌入式非挥发性记忆体 (eNVM) 市场呈现显着成长,这表明 eNVM 在确保互连设备的弹性功能方面发挥关键作用。
本报告研究分析了全球嵌入式非挥发性记忆体(eNVM)市场,提供市场规模和预测、市场动态、主要参与者趋势和前景。
Global embedded non-volatile memory market size was valued at USD 1.53 billion in 2023, expected to reach USD 5.91 billion in 2031, with a CAGR of 18.4% for the forecast period between 2024 and 2031. The embedded non-volatile memory market is witnessing substantial growth, propelled by escalating demand in sectors like consumer electronics, automotive, and industrial. The increasing need for more compact and energy-efficient devices is a key driver, boosting the adoption of advanced embedded non-volatile memory (eNVM) technologies with improved speed, endurance, and scalability. The embedded non-volatile memory market expands as the number of connected devices continues to rise, along with the surge in data-centric applications. Moreover, the automotive industry's increasing reliance on eNVM for crucial functions, including advanced driver-assistance systems, adds momentum to this growth trajectory. Overall, a convergence of factors is creating a favorable environment for the ongoing expansion of the embedded non-volatile memory market.
According to "State of IoT-Spring 2023" report, the growth of the embedded non-volatile memory market aligns with the burgeoning IoT landscape, which is projected to reach 16.7 billion active endpoints in 2023. Despite a slight dip in growth compared to 2022, the trajectory remains upward, with an anticipated 29 billion IoT connections by 2027. The embedded non-volatile memory market benefits from IoT's expansion due to its integral role in providing reliable, energy-efficient memory solutions for connected devices. Furthermore, the embedded non-volatile memory market is sustained by technological advancements in eNVM, addressing the demands of IoT applications. The chip supply constraints persist due to global uncertainties and geopolitical factors; the embedded non-volatile memory market's sustained growth is supported by its critical role in the evolving IoT ecosystem.
For instance, in April 2023, eMemory revealed that its NeoFuse security-enhanced one-time programmable (OTP) was validated on the TSMC N5 process. NeoFuse OTP is an embedded one-time programmable NVM IP solution with low power consumption, high reliability, and strong security.
The embedded non-volatile memory market experiences substantial growth due to heightened demand in consumer electronics, such as smartphones and wearables. This surge is underpinned by the necessity for compact, high-performing memory solutions that deliver both reliability and energy efficiency. The requirement for eNVM, offering faster access times and expanded storage capacity, becomes pivotal as consumer electronic devices advance in complexity and features. Its seamless integration not only enhances user experience but also positions eNVM as a fundamental element driving innovation and technological advancement in the consumer electronics industry. The increasing reliance on eNVM underscores its critical role in shaping the landscape of contemporary electronic devices.
For instance, in March 2023, eMemory and UMC qualified eMemory's 8Mb Resistive Random Access Memory (RRAM) IP on UMC's 22nm ultra-low-power process, strengthening UMC's embedded memory offerings for IoT and mobile applications. The two companies were collaboratively working on innovative RRAM solutions tailored for the automotive sector, leveraging UMC's 22nm 0.8V/2.5V RRAM platform.
The growing prevalence of connected devices is a pivotal driver behind the expanding embedded non-volatile memory market. This trend intensifies the demand for trustworthy and high-performance non-volatile memory solutions. With a rising number of interconnected devices across diverse sectors, from IoT applications to industrial automation, the significance of eNVM becomes crucial for effective data storage and retrieval. eNVM, known for its reliability and efficient data management, ensures seamless communication and optimal functionality within these connected ecosystems. The embedded non-volatile memory market is experiencing significant growth, highlighting the critical role of eNVM in ensuring the resilient functioning of interconnected devices, which is representative of the developing landscape of modern technology.
For example, in November 2022, eMemory Technology Inc. partnered with Renesas Electronics Corporation to create a 5V OTP IP utilizing TSMC's 130nm BCD Plus process tailored for automotive applications. This collaboration extends their previous work on diverse IPs for TSMC's BCD platforms, particularly in power management ICs.
The increasing demand for smaller, energy-efficient devices is a key catalyst for expanding the embedded non-volatile memory market. In response to the prevailing emphasis on compact and power-efficient solutions, there is a notable surge in the adoption of eNVM solutions. These memory solutions effectively balance reduced form factors and dependable data storage, aligning with the evolving requirements of modern electronic devices. The pursuit of enhanced portability and extended battery life, particularly in wearables, IoT devices, and mobile gadgets, underscores the essential nature of eNVM. Consequently, the embedded non-volatile memory market gains prominence, driven by the pivotal role that compact eNVM solutions play in satisfying the demands of the energy-conscious landscape for consumer electronics.
For instance, in September 2023, GlobalFoundries revealed developments to its industry-leading 22FDX (22nm FD-SOI) platform, including introducing several new features and enhancements. These improvements are a strategic response to the increased need for improved power economy and top-tier performance in IoT and automotive applications.
Asia-Pacific's dominance in the embedded non-volatile memory market stems from its status as a semiconductor manufacturing hub, hosting major industry players and cutting-edge fabrication facilities. The region's rapid technological advancements and significant investments in research and development position it as a leader in eNVM innovation. Robust demand for consumer electronics, automotive applications, and the widespread adoption of IoT devices further drive the embedded non-volatile memory market's growth. Supported by favorable government initiatives, a skilled labor pool, and a dynamic market ecosystem, Asia-Pacific solidifies its dominant role in the ever-evolving landscape of embedded non-volatile memory.
For instance, in August 2023, Fujitsu Semiconductor Memory Solution Limited, headquartered in Japan, unveiled the release of "MB85RC512LY," an I2C-interface 512Kbit FeRAM with the highest density among Fujitsu's automotive-grade FeRAM products with an I2C interface.
Government initiatives drive revenue growth in the embedded non-volatile memory market. Governments are making substantial investments in semiconductor research and development across the globe. Programs like the United States Chip and Science Act (2022) and the European Union Chips Act (2022) serve as catalysts, fostering innovation and supporting domestic semiconductor manufacturing. These initiatives provide financial incentives for companies like TSMC and Samsung, encouraging substantial investments in new chip production capacity. By aligning policies with the needs of the semiconductor industry, governments create a conducive environment for technological progress. This proactive approach ensures that the embedded non-volatile memory market thrives within a robust and forward-looking ecosystem, ultimately leading to significant revenue growth.
For instance, in December 2023, The CHIPS and Science Act sought to restore United States semiconductor prominence. After dwindling to over 10% of global production, the Act propels planned investments exceeding USD 230 billion. This initiative fortifies national security, secures supply chains, and elevates American competitiveness in semiconductors and electronics.
The embedded non-volatile memory market witnessed distinct phases of impact during the COVID-19 pandemic. Initially, disruptions in the semiconductor supply chain caused shortages and production delays. However, the industry adapted to remote work, fostering increased digitization and heightened demand for eNVM in devices like IoT applications. In the post-pandemic era, the embedded non-volatile memory experienced a rebound, driven by accelerated digital transformation initiatives. The focus on smart devices and technologies in the aftermath of COVID-19 amplified the need for reliable eNVM solutions, establishing the embedded non-volatile memory market as a crucial player in the evolving semiconductor landscape, poised for substantial growth.
The Russia-Ukraine war introduced complexities to the embedded non-volatile memory market. Geopolitical tensions disrupt the semiconductor industry and eNVM production, leading to supply chain challenges. Rising costs of raw materials and logistics, coupled with geopolitical uncertainties, impact manufacturing, and embedded non-volatile memory market stability. Companies may reconsider production locations and logistics strategies, influencing embedded non-volatile memory market dynamics. Economic repercussions and currency fluctuations add to the challenges. Indirectly, affected regions may experience fluctuations in demand, contributing to embedded non-volatile memory market instability. In navigating these uncertainties, stakeholders in the embedded non-volatile memory market must prioritize strategic adaptation and contingency planning to mitigate the impacts of this geopolitical conflict on production and market dynamics.
In the competitive landscape of the embedded non-volatile memory market, key players such as GLOBALFOUNDRIES Inc., Samsung Electronics Co., Ltd., Semiconductor Manufacturing International Corporation, Taiwan Semiconductor Manufacturing Company Limited, and United Microelectronics Corporation stand out as leaders. These companies which are renowned for their technological expertise and extensive market presence, drive innovation in advanced eNVM solutions to meet evolving industry demands. The market outlook indicates that growth will continue, fueled by increased consumer electronics, automotive, and IoT demand. Strategic collaboration, partnerships, and continuous research and development efforts are anticipated to be crucial strategies for these players, ensuring their competitiveness in the rapidly evolving semiconductor sector.
In September 2023, GlobalFoundries officially opened its USD 4 billion expansion fabrication plant ("fab") in Singapore. The 23,000-square-meter fab will create 1,000 high-wage positions in Singapore, with 95% of them being equipment technicians, process technicians, and engineers.
In September 2023, GlobalFoundries and Microchip Technology unveiled the availability of the SST ESF3 third-generation embedded SuperFlash technology NVM solution in the GF 28SLPe foundry process via Microchip's Silicon Storage Technology (SST) subsidiary.
All segments will be provided for all regions and countries covered:
Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.