全球外延片市场（2023-2030）：按材料（硅/砷化镓）和用途（IC/LED）分類的规模、份额、成长分析和预测

Global Epitaxial Wafer Market Size, Share, Growth Analysis, By Material(Silicon, gallium arsenide (GaAs)), By Application(ICs, LEDs) - Industry Forecast 2023-2030

出版日期: 2023年09月17日 | 出版商:

SkyQuest | 英文 157 Pages | 商品交期: 3-5个工作天内

价格

简介目录

全球外延片市场规模预计将从2021年的24.6762亿美元成长到2022年的27.78亿美元，预测期内年复合成长率为12.9%，到2030年将达到73.54亿美元，规模预计还将增长。

促进因素

对智慧型手机、平板电脑、穿戴式科技和物联网设备等尖端电子设备的需求不断增长，在市场成长中发挥关键作用。这些设备严重依赖高性能半导体零件，其准确性和有效性需要使用外延晶圆。随着消费者对更智慧、更快速、互联程度更高的设备的趋势不断增强，IC 製造对外延片的需求持续成长。

抑制因素

製造外延片需要先进的机械和技术，并且需要製造商大量的初始资金。这种资金需求可能是一个重大障碍，特别是对于希望进入该行业的小型企业和新兴市场。与建立外延晶圆製造工厂相关的大量前期投资可能会阻碍市场进入和成长。

市场趋势

半导体技术的快速小型化和进步是全球外延片市场的重要趋势。随着电子设备变得越来越小、越来越复杂，对具有卓越精度和性能的外延晶圆的需求不断增加。该市场的成长也与5G技术、人工智慧、物联网、边缘运算等需求的不断增长有关，其中小型高效半导体零件发挥关键作用。

本报告调查了全球外延片市场，并提供了市场概况、市场各种影响因素分析、技术和创新趋势、法律制度、市场规模趋势和预测，以及各个细分市场和地区的细分。竞争形势、主要企业概况等

市场概况
市场规模
市场动态
- 促进因素
- 机会
- 抑制因素
- 任务
关键市场洞察
- 技术分析
- 价格分析
- 供应链分析
- 价值链分析
- 市场生态系统
- 智慧财产权分析
- 贸易分析
- 启动分析
- 原料分析
- 创新矩阵
- 研发线产品分析
- 总体经济指标
- 重点投资分析
- 关键成功要素
- 竞争程度
市场动态及前景
- 市场动态
  - 促进因素
  - 机会
  - 抑制因素
  - 任务
法规状况
波特的分析
Skyquest 对未来颠覆的独家见解

全球外延片市场：依材料分类

市场概况
硅
砷化镓 (GaAs)
碳化硅（SiC）

全球外延片市场：依用途

市场概况
IC
LED
太阳能电池

全球外延片市场：按地区划分

市场概况
北美洲
欧洲
亚太地区
拉丁美洲
中东/非洲

竞争形势

前5名企业对比
主要企业市场地位
主要企业的招募策略
关键成功策略
近期市集活动
主要企业市场占有率
主要企业简介
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
GlobalWafers Co., Ltd.
Shin-Etsu Chemical Co., Ltd.
SUMCO Corporation
Nichia Corporation
IQE plc
ASM International NV
Applied Materials, Inc.
Hitachi Metals, Ltd.
Tower Semiconductor Ltd.
SK Siltron Co., Ltd.
United Microelectronics Corporation (UMC)
II-VI Incorporated
Epistar Corporation
Veeco Instruments Inc.
Nichicon Corporation
Monocrystal Inc.
SunEdison Semiconductor Limited
Sino American Silicon Products Inc. (SAS)
IQE Taiwan Co., Ltd.

简介目录

Product Code: SQMIG45I2107

Market Insights

Global Epitaxial Wafer Market size was valued at USD 2467.62 million in 2021 and is poised to grow from USD 2778 million in 2022 to USD 7354 million by 2030, at a CAGR of 12.9 % during the forecast period (2023-2030).

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Top-down and bottom-up approaches were used to estimate and validate the size of epitaxial wafer and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined by using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Segmental Analysis

The epitaxial wafer market is segmented by material, application, and region. By material, the market is segmented into silicon, gallium arsenide (GaAs), and silicon carbide (SiC). By application, the market is segmented into ICs, LEDs, and solar cells. By region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers

Increasing Need for Cutting-edge Electronics

The surging need for cutting-edge electronic gadgets, such as smartphones, tablets, wearable technology, and Internet of Things (IoT) enabled devices, plays a crucial role in propelling the epitaxial wafer market forward. These devices heavily depend on high-performance semiconductor components, necessitating the use of epitaxial wafers due to their accuracy and effectiveness. As consumer preferences gravitate toward smarter, quicker, and more interconnected devices, the demand for epitaxial wafers for the manufacturing of integrated circuits (ICs) remains on a consistent rise.

Restraints

Significant Initial Capital Requirements

The production of epitaxial wafers necessitates advanced machinery and technologies, resulting in substantial initial capital requirements for producers. This financial demand can pose a notable obstacle, particularly for minor enterprises or emerging markets aspiring to penetrate the industry. The considerable upfront expenditures linked to establishing facilities for epitaxial wafer production have the potential to hinder both market entry and growth.

Market Trends

The Global Epitaxial Wafer Market is witnessing a significant trend characterized by rapid miniaturization and the advancement of semiconductor technologies. As electronic devices continue to shrink in size while becoming more potent, the need for epitaxial wafers possessing superior precision and performance attributes is on the rise. This phenomenon is in sync with the expanding demand for various applications such as 5G technology, artificial intelligence (AI), Internet of Things (IoT), and edge computing, where compact and high-efficiency semiconductor components play a critical role.