市场调查报告书
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到2028年的物联网芯片市场预测—产品(处理器、连接IC)、功耗(小于1W、1-3W、3-5W、5-10W、10W)、用户、地区世界分析IoT Chip Market Forecasts to 2028 - Global Analysis By Product (Processor, Connectivity IC and Other Products), By Power Consumption (Less Than 1 W, 1-3 W, 3-5 W, 5-10 W and More Than 10 W), By End User and By Geography |
根据Stratistics MRC,2022年全球物联网芯片市场规模将达到5357亿美元,预测期内以16.9%的复合年增长率增长,2028年预计将达到1兆3671亿美元。
物联网模块或芯片通常是指可以安装在机器、物体或事物上以建立与无线网络的连接并发送和接收数据的电子设备。 这些设备使用许多协议,例如 NB-IoT、LTE 和 BLE 5.0。 这些设备包含有助于无线传输和接收数据的技术,例如传感器和软件。 因此,物联网芯片是嵌入各种产品、机器和其他设备中的小型电子元件。 它是构成整个物联网机制的重要元素,没有它,整个系统将无法运行。 物联网为个人和企业提供了广泛的可能性。
根据《经济时报》的一项研究,在印度,蜂窝物联网模块芯片组的出货量正在增长,高通以 42% 的份额领先市场。 该公司扩展了其物联网芯片组产品组合,目标是为零售、工业和智慧城市等垂直行业提供优质的 4G 和 5G 解决方案。
用于物联网应用的嵌入式处理器出货量预计增长速度超过任何其他嵌入式处理领域。 尤其是 32 位 MCU,将用于需要具有更高计算能力的高级实时传感器的汽车、工业和医疗应用,而基于 MCU 的设备预计将占据增长的大部分。 开发具有内置无线电功能的专用 MCU 也是公认的趋势。 传统的通用 MCU 受到这些专用 MCU 的威胁,这些 MCU 使许多消费和工业设备能够连接到互联网。
随着物联网在所有最终用途行业(例如可穿戴技术、医疗保健和零售)中的迅速采用,该技术具有巨大的潜力。 然而,对数据安全和隐私的担忧已成为该领域的重要增长抑制因素。 随着 IoT 引入最终用户应用程序,连接设备的数量不断增加,将生成大量数据。 该系统可能会被网络犯罪分子入侵,然后滥用这些数据进行间谍活动。 例如,它可用于自动註册汽车保险、跟踪健康状况、监控业务策略的有效性等等。 作为边缘设备和云端服务之间的通信层,物联网网关必须管理大量的物联网设备和它们之间迁移的数据。
为了提高生产力,世界各国政府都在支持和促进物联网的研发。 政府部门预计将成为该技术的主要潜在客户之一。 智能交通管理系统、智能仪表节能以及智能摄像头安全系统的进步只是物联网可以带来重大创新和改进的一些关键领域。 新加坡、芬兰和澳大利亚等政府正在资助新的物联网研究计划,以实现未来的智慧城市。
任何物联网设备都需要更好的电源管理和更低的光功耗。 连接紧张也将是一个主要挑战,因为需要同时连接数百甚至数千台设备。 例如,一个典型的智能住宅可能有 50-100 个连接的小工具,例如灯、恆温器和电器,每个都有自己的电源要求。 使用智能电錶等工具可以提高电力线的效率。 一个关键挑战是采用 Wi-Fi 等无线技术的设备的电源管理,这需要相当大的功率。
由于 COVID-19 流行病,全球部署的供应链严重短缺,市场受到严重影响。 由于各国限制个人在世界各地移动的权利,生产也受到阻碍。 更加自动化和復杂的系统对于从大流行中恢復至关重要。 随着未来物联网兼容产品市场的扩大,预计全球对物联网芯片的需求将很高。
由于现场可编程门阵列 (FPGA) 在可穿戴技术中的使用越来越多,逻辑设备部分预计在预测期内将占据最大份额。 逻辑设备可以提高原型设计和调试能力。 由于其卓越的性能、可编程性和成本效益,预计 FPGA 的采用率会增加。 并且与中央处理器 (CPU) 相比,FPGA 可以更快地实现任何功能。 FPGA 可以在功能上进行修改、更新、重新配置和更改,从而允许它们执行全新的和多样化的活动。
由于对智能手錶等具有物联网功能的可穿戴产品的需求不断增长,预计消费电子领域在整个预测期内将快速增长。 智能家电在语音助手、安全与安保、空气和水质监测、照明控制和锁具等家庭自动化应用中的使用不断增加,预计也将在预测期内推动该细分市场的收入增长。这是一个重要的促进因素。
预计亚太地区将成为预测期内最大的市场,因为包括中国、日本、台湾和印度在内的许多国家/地区正在增加物联网芯片在智慧城市发展中的使用。 物联网的部署在很大程度上受到了中国和印度等国家政府对智慧城市项目的积极举措的影响。 随着在製造和过程自动化行业中使用量的增加,它也有望推动市场发展。 此外,由于物联网投资,新加坡和韩国被确定为物联网芯片部署的重要市场。 根据经济合作与发展组织的数据,韩国是第一个比其他任何国家都更频繁地连接到互联网的重要市场。
随着亚洲国家越来越多地将物联网纳入其长期上市项目,预计亚太地区将获得丰厚的市场份额。 例如,中国中央政府选择了 200 多个地区进行智慧城市倡议评估。 其中包括北京、上海、广州和杭州。 此外,印度的目标是让100个城市变得智能,这有望促进汽车行业和智能家居的电子产品销售。 此外,由于物联网在 5G 服务中的使用越来越多,市场正在扩大,预计这一趋势将在预测期内持续。
2022 年 7 月,HT Micron 在巴黎 LoRaWAN 世博会上推出了巴西製造的新型 LoRa 和蓝牙物联网芯片。 iMCP HTLRBL32L 是一个 13x13x1.1mm 系统级封装,可轻鬆集成和原型设计远程和短程物联网解决方案。
2021 年 10 月,三星和英特尔发布了可能支持智能物联网应用的新半导体产品。 三星宣布已开始批量生产其基于 DDR5(双倍数据速率 5)标准和 14 纳米芯片的最新动态随机存取存储器 (RAM) 电路。 这款新产品可处理人工智能 (AI) 和 5G 通信等数据密集型工作负载。
According to Stratistics MRC, the Global IoT Chip Market is accounted for $535.7 billion in 2022 and is expected to reach $1367.1 billion by 2028 growing at a CAGR of 16.9% during the forecast period. IoT modules or chips are commonly referred to as electronic devices placed in machines, objects, and things that are capable of establishing a connection to wireless networks and transmitting and receiving data. These devices use many protocols, including NB-IoT, LTE, and BLE 5.0. These devices include sensors, software, and other technologies that facilitate wireless data sending and receiving. IoT chips are therefore tiny electronic components that are integrated into a variety of products, machines, and other devices. It is a crucial component of the overall IoT mechanism, and its absence will render the entire system ineffective. IoT has provided an array of possibilities for individuals and businesses.
According to Economic Times's survey, cellular IoT module chipset shipments grew in India, and Qualcomm led the market with a 42% share. The company has been broadening its IoT chipset portfolio, targeting premium 4G and 5G solutions for verticals such as retail, industrial, smart cities, and more.
Unit shipments of embedded processors intended for Internet of Things applications are anticipated to increase more rapidly in the future than the rest of the embedded processing sector. A significant portion of that growth is expected to originate from MCU-based devices, particularly 32-bit MCUs, which are becoming more common as a result of their increasing use in automotive, industrial, and medical applications requiring sophisticated real-time sensors with higher computing capabilities. The development of application-specific MCUs with built-in wireless capabilities is another trend that has been recognised. Traditional general-purpose MCUs are at risk from these application-specific MCUs, which enable numerous home appliances and industrial devices to connect to the internet.
Due to the rapid adoption of IoT across all end-use industries, including wearable technology, healthcare, and retail, this technology has enormous potential. Data security and privacy concerns, however, are significant growth inhibitors for the sector. A significant amount of data is being produced as the number of connected devices grows along with the adoption of IoT in end-user applications. Systems can be hacked by cybercriminals, which subsequently exploit the data for espionage. For instance, this information can be used to automatically acquire auto insurance, assess a person's health, monitor the effectiveness of a business's strategies, and more. The IoT gateway must manage a substantial number of IoT devices as well as the data migrated between them in order to operate as a communication layer between edge devices and cloud services.
In order to increase productivity, governments around the world are supporting and promoting IoT research and development. The government sector is predicted to be one of the technology's major potential customers. Smart traffic management systems, energy conservation via smart metres, and security system advancements via smart cameras are just some of the important sectors where IoT can bring about significant innovation and improvements. New IoT research initiatives are being funded by the governments of various nations, including Singapore, Finland, and Australia, in preparation for the creation of smart cities in the future.
Any IoT device must have improved power management and low optical power consumption. Another major challenge would be the connectivity strain, as hundreds or perhaps thousands of devices would need to be connected simultaneously. For instance, a typical smart house may include 50 to 100 linked lights, thermostats, appliances, and other gadgets, each of which has its own power requirements. The electricity line would be made more efficient using tools like smart metres. The key challenge is the power management of devices employing wireless technologies, such as Wi-Fi, which demand considerable power.
Due to severe shortages in the supply chain that developed globally as a result of the COVID-19 epidemic, the market was severely impacted. Production was also hampered by the restrictions that countries imposed on individual rights of movement around the world. To succeed, more automated and sophisticated systems have become essential as the world begins to recover from the pandemic. IoT chips will therefore be in high demand globally as the market for IoT-enabled products is expected to grow in the future.
Due to an increase in the use of Field-Programmable Gate Arrays (FPGAs) in wearable technology, the logic device segment is anticipated to register the largest share throughout the projection period. Improved prototyping and debugging capabilities are made possible by logic devices. Some major aspects that are anticipated to increase the adoption and use of FPGAs include their improved performance, programmability, and cost-efficiency. Additionally, when compared to a central processing unit (CPU), an FPGA can implement any function more quickly. FPGAs are capable of modifying, updating, reconfiguring, and changing functionality to carry out entirely new and diverse activities.
Due to the increased demand for wearables with IoT capabilities, such as smartwatches, the consumer electronics segment is anticipated to grow rapidly throughout the projected period. Additionally, a significant driver anticipated to propel this segment's revenue growth throughout the forecast period is the rising usage of smart appliances for home automation applications including voice assistants, safety & security, air & water quality monitoring, lighting control, and locks.
Due to the increasing use of IoT chips in smart city development across a number of nations, including China, Japan, Taiwan, and India, Asia-Pacific is expected to have the largest market over the projected period. IoT implementation is being significantly influenced by rising government initiatives for smart city projects in nations like China and India. Additionally, rising use in the manufacturing and process automation industries is anticipated to boost market. Moreover, due to investment in IoT, important markets for IoT chip adoption include Singapore and South Korea. South Korea is the first significant market to connect to the Internet more frequently than any other, according to the Organisation for Economic Cooperation and Development.
Because Asian countries are increasingly incorporating IoT into their long-term development projects, the Asia-Pacific region is expected to have lucrative market share. For instance, the central government of China selected more than 200 communities for the evaluation of smart city initiatives. Beijing, Shanghai, Guangzhou, and Hangzhou are among the cities. India's goal of making 100 cities smart is also anticipated to boost electronics sales in the automobile industry and in smart homes. Moreover, the market is expanding as a result of the growing usage of IoT in 5G services, and this trend is expected to continue during the forecast period.
Some of the key players in IoT Chip market include: Silicon Labs, Dialog Semiconductor, Expressif Systems, Gainspan, Nordic semiconductor, TE Connectivity Ltd., STMicroelectronics N.V., Advanced Micro Devices (AMD), Samsung Electronics, NVIDIA Corporation, Huawei Technologies Co., Ltd., Renesas Electronics Corporation, Cypress Semiconductor Corporation, Microchip Technology Inc., Marvell Technology Group Ltd., MediaTek Inc., NXP Semiconductors N.V., Qualcomm Incorporated, Texas Instruments Incorporated and Intel Corporation.
In July 2022, HT Micron introduced the new LoRa and Bluetooth Internet of Things chip made in Brazil at the LoRaWAN World Expo in Paris. The iMCP HTLRBL32L, a system-in-package of 13x13x1.1 mm, enables easy integration and prototyping of long- and short-range solutions for the IoT.
In October 2021, Samsung and Intel have announced new semiconductor products that may support intelligent IoT applications. Samsung announced that it had started mass production of a recent dynamic random access memory (RAM) circuit based on the DDR5 (Double Data Rate 5) standard and 14-nanometer chips. This new product handles data-intensive workloads such as artificial intelligence (AI) and 5G communications.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.