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市场调查报告书
商品编码
1284288
到 2028 年的热界面材料 (TIM) 市场预测 - 按产品类型、成分、应用和地区分类的全球分析Thermal Interface Materials Market Forecasts to 2028 - Global Analysis By Product Type, Composition, Application and By Geography |
根据 Stratistics MRC,全球热界面材料 (TIM) 市场将在 2022 年达到 21.4 亿美元,在预测期内以 13.3% 的复合年增长率增长,到 2028 年将达到 45%。预计将达到2亿美元。
热界面填料用于封闭发热组件与其相应散热器之间自然形成的空间或界面。 为了最大限度地提高热传递,这些界面材料提供了一种导电介质并消除了空隙。 随着更小、更小和更高能量密度的小工具的生产,对能够改善从设备芯片到散热器的热传递并防止热量积聚以延长小工具寿命的产品的需求不断增加。。
根据行业分析,到 2030 年,全球汽车行业预计将增长到不到 9 万亿美元。 预计新车销量将占其中的 38% 左右。 因此,汽车行业的增长将为热界面材料 (TIM) 市场的增长创造有利可图的机会。
由于 LED 市场的扩张,对热界面材料 (TIM) 的需求正在增加。
荧光灯消耗的能量超出了必要,现在正被 LED 灯取代。 然而,LED照明具有内在的物理矛盾。 为了产生所需的流明输出,LED 的功率必须很高。 另一方面,LED电流要小,以减少能量损耗和发热。 解决这种物理矛盾,需要运用“时空分离”、“系统分离”、“条件分离”四项分离原则。 在许多优化达到极限的情况下,隔离是最好的选择。 但是,要延长LED的寿命,就需要足够的热交换介质。 TIM 在成本、散热能力和可用空间之间取得了理想的平衡。 预计对 TIM 的需求将随着对 LED 照明需求的增长而增长。 结合光学和热设计以提高整个系统(包括电子驱动系统)的效率和光质量,是先进 LED 设计面临的挑战。 因此,TIM 的需求和有效性将受到与 LED 设计复杂程度成比例的影响。
热界面材料 (TIM) 的性能受其物理特性的限制。
在过去几十年中,电子设备(尤其是微处理器芯片)的功率密度有所增加。 由于器件尺寸越来越小的持续趋势,电子电路中的热问题正在显着增加。 因此,关注热管理以确保电子设备按预期运行变得越来越重要和基本。 传导热传递通常用于将热量从原点分配到散热器的扩大表面积。 然而,热管理系统可以使用任何类型的热传递来将温度保持在适当的范围内并确保最佳性能和可靠性。 连接固体表面以最小化接触电阻的组件的一个关键组成部分是将 TIM 注入接头以填充空隙。 众所周知,TIM 是系统热阻的主要贡献者,儘管 TIM 的引入促进了界面处的热传递。
汽车中使用的热界面材料 (TIM) 有多种类型,包括必需的凝胶、间隙填充和绝缘垫、胶带和润滑脂。 根据行业分析,到 2030 年,全球汽车行业预计将增长到略低于 9 万亿美元。 预计新车销量将占其中的 38% 左右。 因此,汽车行业的扩张为扩大热界面材料 (TIM) 市场提供了机会。 此外,在预测期内,技术进步、终端用户行业多样化以及新兴国家对热界面材料不断增长的需求将为市场扩张带来许多新机遇。
TIM 的导热性与其价格直接相关。 然而,增加的导热性也会对整体组件产生负面影响,例如操作不便和相容性差。 TIM 的成本和设备拥有成本受导热性、相变、粘度、压力、除气、表面光洁度、应用便利性和材料机械性能等因素的影响。
COVID-19 疫情显着降低了对热界面材料 (TIM) 的需求,但只是持续了很短的一段时间。 随着电话会议的普及和远程工作的趋势,材料成为必需品。 在家工作的策略刺激了市场增长,并促进了笔记本电脑、智能手机、个人电脑等产品的销售。 在医疗设备中,由于对医疗设备的需求不断增加,需要更多的热界面材料 (TIM)。
有机硅部分占据了最大的市场份额。 在热界面材料 (TIM) 中,硅将在 2021 年处于领先地位。 硅因其在各种应用中的有效性能而得到更广泛的应用。 硅对冲击、振动和机械应力具有很强的抵抗力。 有机硅经常用于许多产品中,例如护垫、填缝剂、润滑脂和粘合剂。
由于在电气和电子元件中提供导热性的处理和安装程序易于处理,预计弹性垫在预测期内将实现显着的复合年增长率。 然而,有限的应用空间和较高的产品单价预计将抑制预测期内的增长。
亚太地区在 2019 年以超过 37% 的最高收入份额引领市场,因为该地区各行各业都拥有大型製造基地。 除了该地区的製造业基地外,较低的公司税、较高的家庭收入、较低的商品和服务税 (GST)、消费者健康意识、政府支持政策和生活方式的改变等因素都有助于该地区的增长。据信这影响了热界面材料 (TIM) 领域的发展。
预计亚太地区在预测期内将显着增长。 由于城市化、工业化以及对消费和电信设备的需求增加,该地区的热界面材料 (TIM) 市场正在扩大。 导热界面材料 (TIM) 在亚太地区的应用因其在医疗设备中的日益使用以及电动和混合动力汽车的普及而得到进一步推动。 鼓励使用可再生能源的计划的引入、公共和私营机构对研发的投资以及技术进步都有助于加速该地区的市场增长。
2022 年 6 月,道康宁公司推出了新的 TIM,DOWSIL TC-4040。 这种填缝剂易于分配,具有高导热性和抗塌落性。 这一新产品的推出将有助于公司在 TIM 市场保持竞争力。
2022 年 1 月,3M 扩大了在田纳西州克林顿的业务。 3M 将在田纳西州克林顿工厂投资约 4.7 亿美元,到 2025 年将新增约 600 个工作岗位。
2020 年 9 月,Parker Hannifin Corporation 推出了 THERM-A-GAP GEL 37,这是一种新型单组分导热可分配材料。 这一新产品的推出加强了公司在 TIM 市场的产品组合。
According to Stratistics MRC, the Global Thermal Interface Materials Market is accounted for $2.14 billion in 2022 and is expected to reach $4.52 billion by 2028 growing at a CAGR of 13.3% during the forecast period. Thermal interface fillers are used to close up spaces and interfaces that naturally form between heat-generating parts and their corresponding heat sinks. In order to maximize heat transfer, these interface materials provide a conductive medium and eliminate air gaps. The demand for products that can improve heat transfer from device chips to the heat sink, preventing heat buildup and extending the life of the gadget, has increased with the production of compact, miniaturized, and high-energy-density gadgets.
According to the industrial analysis, it is expected that the automotive industry will grow to under nine trillion US dollars by 2030 globally. The new vehicle sales will account for approx. 38% of this value. Hence, the growing automotive sector will create beneficial opportunities for the growth of the thermal interface materials market.
Thermal interface materials are in demand due to the expanding led market.
Fluorescent lighting that uses more energy than necessary is currently being replaced by LED. However, there are some physical inconsistencies with LED lights by nature. To produce the desired lumen outputs, LED power must be high. At the same time, LED current must be low to minimize energy loss and heat generation. Applying the four separation principles separation in time and space, separation at the system level, and separation on condition can resolve these physical contradictions. Separation is the best course of action in many situations where optimizations have reached their limits. But a sufficient heat exchange medium is needed to lengthen the LED's operating life. They strike the ideal balance between factors like cost, heat dissipating capacity, and available space. The demand for TIMs is anticipated to increase proportionally to the growth in demand for LED lighting. Combining the optical and thermal design disciplines to improve the overall system efficiency and light quality, including the electronic driving system, is the challenge of a sophisticated LED design. As a result, the demand for and effectiveness of TIMs will be affected proportionately as LED designs become more advanced.
Performance of thermal interface materials is constrained by physical properties.
Power densities in electronic devices, particularly in microprocessor chips, have increased over the last few decades. Electronic circuit thermal problems have significantly increased as a result of the ongoing trend toward smaller device dimensions. Thus, it is increasingly important and fundamental to focus on thermal management in order to guarantee that electronic devices function as intended. Conductive heat transfer is typically used to disperse the heat from its point of generation into the extended surface area of a heat sink. However, a thermal management system may use all modes of heat transfer to maintain temperatures within their appropriate limits and ensure maximum performance and reliability. A crucial component of an assembly when solid surfaces are connected together to minimize contact resistance is the injection of TIMs into the joint to fill the air spaces. It is well known that TIMs are the primary cause of the system's thermal resistance, even though their introduction facilitates heat transfer across an interface.
There are numerous types of thermal interface materials found in automobiles, including essential gels, gap-filling and insulating pads, adhesive tapes, and greases. The automotive industry is anticipated to grow to less than nine trillion US dollars globally by 2030, according to the industrial analysis. This value will be accounted for by new car sales to the tune of about 38%. In light of this, the expanding automotive industry will present favorable opportunities for the market for thermal interface materials to expand. Additionally, the forecast period will bring about a number of new opportunities for the market to expand due to rising technological advancements, a variety of end-user industries, and rising demand for thermal interface materials from emerging economies.
The thermal conductivity of TIMs directly relates to their price. However, an increase in thermal conductivity also has a detrimental effect on the assembly as a whole due to poor handling and decreased conformability. The cost of TIMs and the cost of ownership of equipment are influenced by factors like thermal conductivity, phase change, viscosity, pressure, outgassing, surface finish, ease of application, and mechanical properties of the material.
The COVID-19 epidemic significantly reduced demand for thermal interface materials, but it only lasted a short while. The growing Acceptance of teleconferencing and trends toward remote working have necessitated the materials. The work-from-home strategy stimulated market growth and raised sales of laptops, smartphones, personal computers, and other technology. Healthcare devices require more thermal interface materials due to the rise in demand for medical equipment.
The largest market share was held by the silicone segment. In terms of thermal interface materials, silicon led the way in 2021. Silicone has become more widely used as a result of its effective performance in a variety of applications. Silicone has a high level of resistance to shock, vibration, and mechanical stress. In numerous products, including pads, gap fillers, greases, and adhesives, silicone is frequently used.
Due to their straightforward handling and installation procedures for thermal conductivity in electrical and electronic components, elastomeric pads are predicted to experience a significant CAGR during the forecasted period. However, it is anticipated that the limited application space and high product unit costs will stifle growth in the anticipated time frame.
Due to the presence of a sizable manufacturing base for a variety of industries in the region, Asia Pacific led the market with the highest revenue share of more than 37% in 2019. Aside from the region's manufacturing base, factors like lower corporate taxes, rising household incomes, a decline in the Goods and Services Tax (GST), consumer health consciousness, supportive governmental policies, and changing lifestyles may have had an impact on the development of the thermal interface materials sector in the area.
During the forecast period, Asia-Pacific is anticipated to grow significantly. The region's market for thermal interface materials is expanding as a result of increased urbanization, industrialization, and consumer and telecommunications device demand. The adoption of thermal interface materials in Asia-Pacific is further boosted by their expanding use in medical devices and the rising popularity of electric and hybrid vehicles. The introduction of programs to encourage the use of renewable energy sources, investments in R&D by both public and private organizations, and technological advancements all help to speed up market growth in the area.
Some of the key players in Thermal Interface Materials market include AIM Specialty Materials, AOS Thermal Compounds LLC, CSL Silicones Inc. , CSW Industrials, Inc. , Fuji Polymer Industries Co., Ltd., GrafTech International Ltd., Henkel AG and Co. KgaA , Honeywell International, Inc., Hylomar LLC , Indium Corporation, Laird Technologies, Inc., Linseis GmbH, llinois Tool Works Inc , Mcgill Airseal LLC , Momentive Performance Materials, Inc., Parker Hannifin Corp., Pidilite Industries Ltd. , PPG Industries , Shin-Etsu Chemical Co. Ltd., The 3M Company, The Dow Chemical Company, Wacker Chemie AG and Wakefield Thermal, Inc.
In June 2022, Dow Corning Corporation launched a new TIMs, DOWSIL TC-4040. This gap filler is easy to dispense, possess high thermal conductivity, and resist slumping. This new product launch will help the company stay competitive in the TIMs market.
In January 2022, 3M expanded its operations in Clinton, Tennessee. 3M invested approximately USD 470 million and adding around 600 new jobs by 2025 at its plant in Clinton, Tennessee.
In September 2020, Parker Hannifin Corporation launched THERM-A-GAP GEL 37, a new single component, thermally conductive dispensable material. This new product launch will help the company to strengthen its product portfolio in the TIMs market.