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市场调查报告书
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1371887

2030 年先进封装和切割设备市场预测：按类型、材料、组件、技术、用途和地区进行的全球分析

Advanced Packaging and Cutting Equipment Market Forecasts to 2030 - Global Analysis By Type, Material, Component, Technology, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2023年全球先进封装和切割设备市场规模将达317亿美元，预计到2030年将达到612亿美元，预测期内年复合成长率为9.84%。

一种称为「先进包装和切割设备」的产品类型用于多种领域，以有效包装、加工和切割材料和产品。这些尖端解决方案旨在加强品管、减少浪费并改善製造和包装业务中的生产流程。技术进步不断刺激该领域的创新，创造出更有效、更具适应性的机器。

印度电子与半导体协会预计，到2025年，该国半导体零件市场价值预计将达到323.5亿美元。

提高效率

现代机器实现切割和包装操作的自动化，减少了对体力劳动的需求并提高了生产力。快速的处理速度可提高产量并缩短製造时间。先进的机械确保透过使用精确的检测和切割方法定期将产品切割成正确的尺寸和形状。这种精度减少了浪费并提高了最终产品的品质。这些都是市场拓展的动力。

弹性有限

有些切割和包装技术不够弹性，无法适应不同的产品变化和包装设计。对于需要频繁更换生产线的公司来说，这种限制可能是一个问题。将新设备整合到当前的生产线中可能很困难，并且可能需要对製造过程中的其他步骤进行更改或改进。因此，这阻碍了市场的成长。

增强安全性

感测器、紧急停止机制和防护屏障等安全元件经常被纳入先进技术中，以减少事故和伤害的可能性。自动化可以减少操作员面临潜在危险任务的机会。透过将最先进的包装设备与追踪和追溯系统整合，可以改善整个供应链的库存管理和产品监控。因此，这些都是推动市场扩张的因素。

初始成本高

安装和购买最先进的包装设备的成本可能很高。对于新参与企业和小型企业来说，这种初期成本可能是一个主要障碍。该设备经常需要定期维护才能保持正常运作。随着时间的推移，维护成本将会增加，包括替换零件、技术人员成本和维修停机时间。这些都阻碍了市场的拓展。

COVID-19 的影响：

疫情扰乱了全球供应系统，影响了先进包装器材和切割机械的製造和分销。许多製造商在所需零件和消耗品的交付方面遇到了问题，影响了他们完成订单的能力。由于经济不确定性和封锁措施，汽车和航太航太等一些严重依赖先进封装和切割技术的领域在疫情期间出现了需求减少。因此，设备订单减少。

切割机部门预计将在预测期内成为最大的行业

预计切割机领域在预测期内将是最大的。切割机是一种使用一种或多种磨料来研磨、刮擦、切割、剪切或以其他方式从工件上去除材料的设备。水平加工中心和立式加工中心是最常用的两种切削设备。立式加工中心用于45度切削等锐角加工，水平加工中心用于直线加工。

汽车电子设备领域预计在预测期内复合年复合成长率最高

预计汽车电子领域在预测期内年复合成长率最高。随着越来越多的消费者选择高科技汽车并要求电气元件采用优质包装，对汽车产品的需求不断增加。由于对智慧型手机、平板电脑等便携式设备、笔记型电脑和上网本等电脑配件的需求迅速增长，以及消费者可支配所得的增加，预计消费性电子产品将在未来年度大幅增长。

占比最大的地区：

预计北美在预测期内将占据最大的市场占有率，可可支配所得的增加刺激了对先进包装解决方案的需求。能源和电力部门更先进技术的使用正在推动市场扩张。此外，预计在预测期内微控制器和微处理器在家用电子电器和电动车中的使用将会增加，从而推动对先进封装解决方案的需求。

复合年复合成长率最高的地区：

预计亚太地区在预测期内将维持最高的年复合成长率。最尖端科技的可用性、对智慧产品的需求激增以及该地区工业部门的持续成长是这一惊人增长的原因。许多非营利组织正在积极致力于开发改进的电力基础设施，进一步加速先进封装领域的扩张和封装技术的进步。

免费客製化服务

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和年复合成长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第1章执行摘要

第2章前言

  • 概述
  • 利害关係人
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 调查来源
    • 主要调查来源
    • 二次调查来源
    • 先决条件

第3章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 新兴市场
  • 新型冠状病毒感染疾病（COVID-19）的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第5章全球先进包装和切割设备市场：按类型

  • 切割机
  • 底线机
  • 包装机

5.5

旋转模具

  • 旋盖机
  • CNC机
  • 切丁机
  • 层压机
  • 其他类型

第6章全球先进封装与切割设备市场：依材料分类

  • 金属
  • 陶瓷製品
  • 塑胶
  • 混合
  • 玻璃
  • 其他材料

第7章全球先进包装和切割设备市场：按组成部分

  • 软体
  • 硬体
  • 服务
  • 其他组件

第8章全球先进封装与切割设备市场：依技术分类

  • 雷射基地
  • 机械的
  • 水刀
  • 电浆
  • 其他技术

第9章全球先进封装与切割设备市场：依用途

  • 家用电器
  • 汽车电子
  • 沟通
  • 航太和国防
  • 工业的
  • 卫生保健
  • 其他用途

第10章全球先进封装与切割设备市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第11章进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第12章公司简介

  • Microchip Technology Inc.
  • ASM Pacific
  • Teradyne
  • Advantest
  • COHU Semiconductor Equipment Group
  • Intel
  • SUSS Microtec
  • Tokyo Seimitsu
  • Samsung Electronics Co. Ltd
  • Applied Material
  • Shinkawa
  • Hitachi
  • Toray Engineering
  • DISCO
  • KulickeandSoffa
Product Code: SMRC23944

According to Stratistics MRC, the Global Advanced Packaging and Cutting Equipment Market is accounted for $31.7 billion in 2023 and is expected to reach $61.2 billion by 2030 growing at a CAGR of 9.84% during the forecast period. A type of equipment and technology known as "advanced packaging and cutting equipment" is used in a number of different sectors to effectively package, process, and cut materials or products. These cutting-edge solutions are intended to boost quality control, decrease waste, and enhance production processes in manufacturing and packaging operations. Technology advancements continue to spur innovation in this area, resulting in more effective and adaptable machinery.

According to India Electronics and Semiconductor Association, the semiconductor component market in the country is expected to be worth $ 32.35 billion by 2025.

Market Dynamics:

Driver:

Increased efficiency

Modern machinery automates the cutting and packing operations, lowering manual labor requirements and boosting productivity. Quicker output and shorter manufacturing times result from quicker processing rates. Advanced machinery ensures that items are regularly cut to the proper size and form via the use of accurate measurements and cutting methods. This accuracy lowers waste and raises the caliber of the final product. These are the elements driving the market's expansion.

Restraint:

Limited Flexibility

Some cutting and packing technology may not be flexible enough to accommodate a variety of product variants or packaging designs. For companies that need to alter their manufacturing lines often, this constraint might be an issue. It can be challenging to integrate new equipment into current production lines and may call for alterations or improvements to other steps in the manufacturing process. Consequently, this hinders market growth.

Opportunity:

Enhanced safety

Safety elements like sensors, emergency stop mechanisms, and protective barriers are frequently incorporated into advanced technology to lower the chance of accidents and injuries. Automation can reduce the amount of time operators are exposed to potentially dangerous jobs. Improved inventory management and product monitoring across the supply chain are made possible by the integration of cutting-edge packaging equipment with tracking and traceability systems. Therefore, these are the elements driving the market's expansion.

Threat:

High initial cost

The cost of installing and buying cutting-edge packing equipment might be high. For new or small firms, this upfront cost can be a major obstacle. To make sure that they function properly, this equipment frequently needs routine maintenance. Over time, maintenance costs, such as those for replacement components, technician fees, and downtime for repairs, can mount. These are the things that are impeding the market's expansion.

COVID-19 Impact:

The pandemic affected the manufacturing and distribution of sophisticated packaging and cutting machinery by upsetting global supply systems. Many manufacturers experienced issues with the delivery of necessary parts and supplies, which affected their capacity to complete orders. Due to economic uncertainty and lockdown measures, several sectors that significantly rely on sophisticated packaging and cutting technology, such as the automotive and aerospace industry, saw a decline in demand during the epidemic. As a result, fewer equipment orders were placed.

The cutting machine segment is expected to be the largest during the forecast period

The cutting machine segment is expected to be the largest during the forecast period. A cutting machine is a device that grinds, shaves, snips, shears, or otherwise removes material from a work piece using one or more abrasives. Horizontal and vertical machining centers are the two most used types of cutting equipment. Vertical machining centers are used to create 45-degree cuts and other sharp angles, whereas horizontal machining centers are used to produce straight cuts.

The automotive electronics segment is expected to have the highest CAGR during the forecast period

The automotive electronics segment is expected to have the highest CAGR during the forecast period. The need for automotive electronics is rising as more consumers choose high-tech automobiles, which necessitate premium packaging for electrical components. Over the next years, consumer electronics are expected to experience significant growth due to the quickly rising demand for portable devices like smartphones, tablets, and PC accessories like laptops and Netbooks, as well as an increase in consumer disposable income.

Region with largest share:

North America is projected to hold the largest market share during the forecast period due to increase in disposable income among the population has spurred the demand for advanced packaging solutions. The use of more advanced technologies by the energy and power sector has boosted market expansion. During the market's forecast period, it is also anticipated that the increasing use of microcontrollers and microprocessors in consumer electronics and electric cars would fuel demand for advanced packaging solutions.

Region with highest CAGR:

Asia Pacific is projected to hold the highest CAGR over the forecast period. The availability of cutting-edge technology, the soaring demand for smart gadgets, and the ongoing rise of the region's industrial industries are all credited with this astounding increase. A number of non-profit organizations actively engage in the development of improved power infrastructure, further accelerating the expansion of the advanced packaging sector and advancing packaging technology.

Key players in the market:

Some of the key players in Advanced Packaging and Cutting Equipment Market include: Microchip Technology Inc., ASM Pacific, Teradyne, Advantest, COHU Semiconductor Equipment Group, Intel, SUSS Microtec, Tokyo Seimitsu, Samsung Electronics Co. Ltd, Applied Material, Shinkawa, Hitachi, Toray Engineering, DISCO and KulickeandSoffa.

Key Developments:

In August 2023, Samsung announced its collaboration with Intel to deliver cutting-edge vRAN solutions with enhanced performance to meet rising capacity demands.

In July 2023, Microchip Technology Incorporated announced a multi-year initiative to invest approximately $300 million in expanding its operations in India.

In June 2023, Intel announced that it is using its own EMIB packaging technology for its new Xeon Scalable processors. EMIB is a 2.5D packaging technology that can integrate multiple dies on a single substrate.

Types Covered:

  • Cutting Machine
  • Scribing Machine
  • Packaging machines
  • Rotary die
  • Capping machines
  • CNC machine
  • Dicing Machine
  • Lamination Machine
  • Other Types

Materials Covered:

  • Metal
  • Ceramic
  • Plastic
  • Hybrid
  • Glass
  • Other Materials

Components Covered:

  • Software
  • Hardware
  • Services
  • Other Components

Technologies Covered:

  • Laser-Based
  • Mechanical
  • Waterjet
  • Plasma
  • Other Technologies

Applications Covered:

  • Consumer Electronics
  • Automotive Electronics
  • Communication
  • Aerospace & Defense
  • Industrial
  • Healthcare
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Packaging and Cutting Equipment Market, By Type

  • 5.1 Introduction
  • 5.2 Cutting Machine
  • 5.3 Scribing Machine
  • 5.4 Packaging machines

5.5

Rotary die

  • 5.6 Capping machines
  • 5.7 CNC machine
  • 5.8 Dicing Machine
  • 5.9 Lamination Machine
  • 5.10 Other Types

6 Global Advanced Packaging and Cutting Equipment Market, By Material

  • 6.1 Introduction
  • 6.2 Metal
  • 6.3 Ceramic
  • 6.4 Plastic
  • 6.5 Hybrid
  • 6.6 Glass
  • 6.7 Other Materials

7 Global Advanced Packaging and Cutting Equipment Market, By Component

  • 7.1 Introduction
  • 7.2 Software
  • 7.3 Hardware
  • 7.4 Services
  • 7.5 Other Components

8 Global Advanced Packaging and Cutting Equipment Market, By Technology

  • 8.1 Introduction
  • 8.2 Laser-Based
  • 8.3 Mechanical
  • 8.4 Waterjet
  • 8.5 Plasma
  • 8.6 Othe Technologies

9 Global Advanced Packaging and Cutting Equipment Market, By Application

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive Electronics
  • 9.4 Communication
  • 9.5 Aerospace & Defense
  • 9.6 Industrial
  • 9.7 Healthcare
  • 9.8 Other Applications

10 Global Advanced Packaging and Cutting Equipment Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Microchip Technology Inc.
  • 12.2 ASM Pacific
  • 12.3 Teradyne
  • 12.4 Advantest
  • 12.5 COHU Semiconductor Equipment Group
  • 12.6 Intel
  • 12.7 SUSS Microtec
  • 12.8 Tokyo Seimitsu
  • 12.9 Samsung Electronics Co. Ltd
  • 12.10 Applied Material
  • 12.11 Shinkawa
  • 12.12 Hitachi
  • 12.13 Toray Engineering
  • 12.14 DISCO
  • 12.15 KulickeandSoffa

List of Tables

  • Table 1 Global Advanced Packaging and Cutting Equipment Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Advanced Packaging and Cutting Equipment Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Advanced Packaging and Cutting Equipment Market Outlook, By Cutting Machine (2021-2030) ($MN)
  • Table 4 Global Advanced Packaging and Cutting Equipment Market Outlook, By Scribing Machine (2021-2030) ($MN)
  • Table 5 Global Advanced Packaging and Cutting Equipment Market Outlook, By Packaging machines (2021-2030) ($MN)
  • Table 6 Global Advanced Packaging and Cutting Equipment Market Outlook, By

Table Rotary die (2021-2030) ($MN)

  • Table 7 Global Advanced Packaging and Cutting Equipment Market Outlook, By Capping machines (2021-2030) ($MN)
  • Table 8 Global Advanced Packaging and Cutting Equipment Market Outlook, By CNC machine (2021-2030) ($MN)
  • Table 9 Global Advanced Packaging and Cutting Equipment Market Outlook, By Dicing Machine (2021-2030) ($MN)
  • Table 10 Global Advanced Packaging and Cutting Equipment Market Outlook, By Lamination Machine (2021-2030) ($MN)
  • Table 11 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 12 Global Advanced Packaging and Cutting Equipment Market Outlook, By Material (2021-2030) ($MN)
  • Table 13 Global Advanced Packaging and Cutting Equipment Market Outlook, By Metal (2021-2030) ($MN)
  • Table 14 Global Advanced Packaging and Cutting Equipment Market Outlook, By Ceramic (2021-2030) ($MN)
  • Table 15 Global Advanced Packaging and Cutting Equipment Market Outlook, By Plastic (2021-2030) ($MN)
  • Table 16 Global Advanced Packaging and Cutting Equipment Market Outlook, By Hybrid (2021-2030) ($MN)
  • Table 17 Global Advanced Packaging and Cutting Equipment Market Outlook, By Glass (2021-2030) ($MN)
  • Table 18 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Materials (2021-2030) ($MN)
  • Table 19 Global Advanced Packaging and Cutting Equipment Market Outlook, By Component (2021-2030) ($MN)
  • Table 20 Global Advanced Packaging and Cutting Equipment Market Outlook, By Software (2021-2030) ($MN)
  • Table 21 Global Advanced Packaging and Cutting Equipment Market Outlook, By Hardware (2021-2030) ($MN)
  • Table 22 Global Advanced Packaging and Cutting Equipment Market Outlook, By Services (2021-2030) ($MN)
  • Table 23 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Components (2021-2030) ($MN)
  • Table 24 Global Advanced Packaging and Cutting Equipment Market Outlook, By Technology (2021-2030) ($MN)
  • Table 25 Global Advanced Packaging and Cutting Equipment Market Outlook, By Laser-Based (2021-2030) ($MN)
  • Table 26 Global Advanced Packaging and Cutting Equipment Market Outlook, By Mechanical (2021-2030) ($MN)
  • Table 27 Global Advanced Packaging and Cutting Equipment Market Outlook, By Waterjet (2021-2030) ($MN)
  • Table 28 Global Advanced Packaging and Cutting Equipment Market Outlook, By Plasma (2021-2030) ($MN)
  • Table 29 Global Advanced Packaging and Cutting Equipment Market Outlook, By Othe Technologies (2021-2030) ($MN)
  • Table 30 Global Advanced Packaging and Cutting Equipment Market Outlook, By Application (2021-2030) ($MN)
  • Table 31 Global Advanced Packaging and Cutting Equipment Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 32 Global Advanced Packaging and Cutting Equipment Market Outlook, By Automotive Electronics (2021-2030) ($MN)
  • Table 33 Global Advanced Packaging and Cutting Equipment Market Outlook, By Communication (2021-2030) ($MN)
  • Table 34 Global Advanced Packaging and Cutting Equipment Market Outlook, By Aerospace & Defense (2021-2030) ($MN)
  • Table 35 Global Advanced Packaging and Cutting Equipment Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 36 Global Advanced Packaging and Cutting Equipment Market Outlook, By Healthcare (2021-2030) ($MN)
  • Table 37 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Applications (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.