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市场调查报告书
商品编码
1383422
2030年自动双面曝光设备的市场预测:按类型、应用和地区分類的全球分析Automated Double-Sided Exposure Machine Market Forecasts to 2030 - Global Analysis By Type, By Application (Advanced Packaging, Light-emitting diode, Micro-electromechanical systems Manufacturing and Other Applications) and By Geography |
根据 Stratistics MRC 的数据,全球自动双面曝光设备市场在预测期内将以 7.5%的年复合成长率成长。
自动双面曝光设备是专为半导体製造、PCB製造等行业的精密光刻製程而设计的专用製造工具。这些设备可处理晶圆和 PCB 等基板,并以高精度曝光双面。自动执行基板处理、对准和曝光,减少对体力劳动的需求。这些系统可确保精确对准、严格的公差和高效的製造,从而可以在基板的两面创建复杂且精确的图案、电路和特征。
根据美国国家有线和通讯协会的数据,2020 年全球连网设备数量将达到约 501 亿台。根据半导体产业协会(SIA)的数据,1999年至2019年美国产业的研发支出年复合成长率约为6.6%。
印刷基板(PCB)复杂性的增加是自动双面曝光设备市场的关键驱动因素。印刷基板越来越需要适应复杂的电路设计、小型化零件和密集的互连。因此,对自动双面曝光设备的需求正在迅速增加。这些机器提供在 PCB 两面创建精细、高解析度图案所需的精度和自动化,满足现代电子产品的要求。此外,多层设计可以高效生产高品质、高性能的 PCB,使其成为当今电子市场不可或缺的一部分。
自动双面曝光设备需要大量的资金投入用于采购、安装和维护。该成本包括先进技术、精密工程和复杂的自动化系统。此外,对无尘室环境和熟练人员的需求增加了营运成本。这些大量的初始和持续投资可能会阻碍中小型製造商和新兴企业进入市场。
随着电子工业的快速发展,对更高性能和更小零件的需求不断增加。自动双面曝光设备可以在半导体晶圆和PCB等基板的两面精确地创建复杂的电路和图案。该技术对于满足现代微电子学的严格要求至关重要,例如 5G通讯、人工智慧、物联网设备和新兴技术。随着工业界寻求生产更强大、更紧凑的电子系统,对这些机器的需求可能会增加。
半导体製造和电子产业的快速发展推动了曝光技术的持续创新。随着新的、更有效率的机器的出现,旧机器可能会过时,导致性能下降、精度降低和营运成本更高。这可能会对製造商的竞争力以及满足日益复杂和小型电子零件的市场需求的能力产生负面影响。
COVID-19大流行对自动双面曝光设备市场产生了矛盾的影响。疫情扰乱了供应链,导致设备生产和交付延误。此外,由于製造商应对经济不确定性,对某些产品的需求暂时下降。然而,疫情加速了数位转型,凸显了对先进半导体和电子製造的需求。因此,半导体製造对高精度曝光设备的需求增加,其采用率也随之增加。因此,科技和电子产品在疫情后环境中的重要性日益增加,为市场创造了新的机会。
由于其效率、精度和大规模生产的适用性,全自动细分市场预计将主导市场。全自动机器减少了对体力劳动的需求,并确保一致、无错误的加工。全自动机器是精度和产量至关重要的行业的首选,例如半导体製造和 PCB 製造。此外,随着技术的进步以及对更小、更高性能零件的需求的增加,双面曝光过程的自动化变得至关重要。
由于半导体技术的快速发展,半导体装置製造领域预计将具有最高的年复合成长率。该领域的成长是由半导体设计日益复杂所推动的,包括 3D 封装、MEMS 装置和先进储存技术,这些都需要精密的双面曝光。此外,半导体产能的增加也推动了自动双面曝光设备的需求。
预计在预测期内,北美将引领自动双面曝光设备市场。该地区半导体产业蓬勃发展,自动双面曝光设备已广泛应用。北美也是创新中心、研究机构和技术中心的所在地,技术不断进步,需要尖端机械。此外,政府在研发方面的支出以及对数位转型的大力关注确保了北美市场的稳定成长轨迹。
预计亚太地区自动双面曝光设备市场将显着成长。随着对先进电子设备的需求不断增加,自动化和物联网技术的采用不断增加,对高精度曝光机的需求也不断增加。此外,政府配合措施、研发投资以及领先半导体製造商的存在也有助于亚太地区的市场扩张。
According to Stratistics MRC, the Global Automated Double-Sided Exposure Machine Market is growing at a CAGR of 7.5% during the forecast period. Automated double-sided exposure machines are specialized manufacturing tools designed for precision photolithography processes in industries like semiconductor manufacturing and PCB fabrication. These machines handle substrates, such as wafers or PCBs, exposing both sides with high precision. They offer automated substrate handling, alignment, and exposure, reducing the need for manual intervention. These systems ensure accurate registration, tight tolerances, and efficient manufacturing, enabling the creation of intricate and precise patterns, circuits, and features on both sides of the substrate.
According to the National Cable and Telecommunications Association, there were around 50.1 billion connected devices in 2020 across the globe. According to the Semiconductor Industry Association (SIA), the U.S. industry's expenditures in R&D increased at a compound annual growth rate of about 6.6 percent from 1999 to 2019.
The growing complexity of printed circuit boards (PCBs) is a significant driver in the automated double-sided exposure machine market. PCBs are increasingly required to accommodate intricate circuit designs, miniaturized components, and densely packed interconnects. As a result, the demand for automated double-sided exposure machines has surged. These machines provide the essential precision and automation needed to create fine, high-resolution patterns on both sides of the PCBs, meeting the requirements of modern electronic devices. Additionally, multi-layered designs efficiently ensure the production of high-quality, high-performance PCBs, making them indispensable in the current electronics market.
Automated double-sided exposure machines require substantial capital investments for procurement, installation, and maintenance. The costs involve advanced technologies, precision engineering, and complex automation systems. Additionally, the need for cleanroom environments and skilled personnel adds to operational expenses. These substantial initial and ongoing investments can deter smaller manufacturers and startups from entering the market.
As the electronics industry continues to advance rapidly, there is a growing need for higher-performance, miniaturized components. Automated double-sided exposure machines enable the precise fabrication of intricate circuits and patterns on both sides of substrates, such as semiconductor wafers and PCBs. This technology is integral to meeting the stringent requirements of modern microelectronics, including those in 5G communications, artificial intelligence, IoT devices, and emerging technologies. The demand for these machines is set to rise as industries seek to produce more powerful and compact electronic systems.
Rapid advancements in the semiconductor manufacturing and electronics industries drive constant innovation in exposure technology. As newer, more efficient machines emerge, older models may become outdated, leading to reduced performance, lower precision, and higher operational costs. This can negatively impact manufacturers' competitiveness and ability to meet market demands for increasingly complex and smaller electronic components.
The COVID-19 pandemic had a conflicting impact on the automated double-sided exposure machine market. The pandemic disrupted supply chains, leading to delays in equipment production and delivery. It also temporarily reduced demand for certain products as manufacturers adjusted to the economic uncertainties. However, the pandemic accelerated the digital transformation, emphasizing the need for advanced semiconductor and electronics manufacturing. This drove demand for high-precision exposure equipment used in semiconductor fabrication, which witnessed increased adoption. As a result, the growing importance of technology and electronics in a post-pandemic environment has generated new opportunities for the market.
The fully automatic segment is anticipated to dominate the market due to its efficiency, precision, and suitability for high-volume manufacturing. Fully automatic machines reduce the need for manual intervention, ensuring consistent and error-free processing. Industries such as semiconductor manufacturing and PCB fabrication, where precision and throughput are paramount, fully automatic machines are favored. Additionally, as technology advances and demands for miniaturization and high-performance components increase, the automation of double-sided exposure processes becomes indispensable.
The semiconductor device manufacturing segment is projected to experience the highest CAGR owing to the rapid evolution of semiconductor technologies, driven by demand for smaller, more powerful, and energy-efficient electronic devices, which has fueled the need for advanced exposure equipment. This segment's growth is propelled by the rising complexity of semiconductor designs, including 3D packaging, MEMS devices, and advanced memory technologies, all requiring precise double-sided exposure. Additionally, increasing semiconductor production capacity is contributing to the demand for automated double-sided exposure machines.
North America is anticipated to lead the market for automated double-sided exposure machines during the forecast period. The area is dwelling to a thriving semiconductor industry, which uses these machines extensively. Along with this, North America is home to significant innovation hubs, research institutes, and technology hubs, which fuel ongoing technological advancements and the need for state-of-the-art machinery. In addition, government spending on R&D and a strong emphasis on digital transformation guarantee a stable growth trajectory for the North American market.
Asia Pacific is poised to witness substantial growth in the automated double-sided exposure machine market. With increasing demand for advanced electronic devices, coupled with the growing adoption of automation and IoT technologies, the need for high-precision exposure machines is on the rise. Furthermore, government initiatives, investments in research and development, and the presence of leading semiconductor manufacturers contribute to the market's expansion in Asia Pacific.
Some of the key players in Automated Double-Sided Exposure Machine Market include: Adtec Engineering Co., Ltd., Altix, Ambala Electronic Instruments, ASML, Beijing Golden Eagle Electronic Equipments, Dalesway Print Technology, Giga Solutions, Guangdong KST Optical, Idonus Sarl, Kexin Electronics Co., Ltd, M&R Nano Technology Co., Ltd., Mega Electronics INC., Orbotech Ltd., ORC Manufacturing Vertriebs GmbH, San-Ei Giken, Taiyo Nippon Sanso Corp., Toray Engineering Co.,Ltd., Ushio Lighting, Inc. and Xudian Technology.
In October 2022, KLA Corporation introduced the new Orbotech Corus™ 8M direct imaging (DI) solution, the first system built on the all-in-one revolutionary Orbotech Corus platform, combining the functionality and automation of an entire direct imaging production line in a closed, clean and compact unit. Providing increased resolution with high accuracy to pattern finer lines, the extendable Orbotech Corus™ DI platform is unique in its ability to support highly efficient double-sided imaging in a fully automated solution optimized for high throughput and capacity.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.