![]() |
市场调查报告书
商品编码
1403360
2030年全球半导体双面曝光机市场预测:按类型、技术、应用和地区分析Double-Sided Exposure Machine for Semiconductor Market Forecasts to 2030 - Global Analysis By Type (Semi Automatic and Fully Automatic), Technology (Photolithography and E-beam Lithography), Application and By Geography |
根据 Stratistics MRC 的数据,全球半导体双面曝光机市场预计在预测期内将以 5.5% 的复合年增长率成长。
用于半导体生产的专用工具称为半导体双面曝光机。它采用先进的光学元件和光源将复杂的电路图案投影到晶圆的抗蚀剂涂层表面上。其精度和效率对于维持半导体製造所需的高标准至关重要,其中奈米级特征和精确对准对于成功生产尖端电子设备至关重要。
据联华电子称,该工厂也将成为新加坡最先进的半导体代工厂之一,将生产22奈米和28奈米晶片。
双面曝光机能够生产满足这些新兴技术(例如 5G、边缘运算和电动车)要求的半导体。这些持续的技术进步正在汽车、医疗保健和通讯等多个行业中实施。我们也致力于生产这些应用所需的高密度、高效能晶片,支援市场扩张。
由于这些先进系统的集中密集性质,製造商,特别是中小型企业面临财务挑战。有限的竞争可能会导致价格上涨。此外,行业成本敏感度和要求可能会降低持续技术进步的广泛采用,这对市场成长构成了主要障碍。
具有垂直堆迭半导体层的 3D 积体电路 (IC) 需要在晶圆的两侧进行精确且同步的曝光。将机器学习和人工智慧融入曝光机有助于提高对准精度、错误侦测和校正精度。此外,这些技术旨在提高整体生产力并满足不断发展的电子行业的需求,该行业越来越依赖 3D IC 来提高性能和小型化,从而不断增长的市场正在推动
专利纠纷会拖延新产品的开发和市场的开拓。这些机器中包含的复杂技术很容易受到专利纠纷和法律挑战。法律模糊性为投资者和製造商创造了一个困难的环境,并透过影响产品价格、盈利和监管机构的潜在阻力来影响市场潜力。此外,对智慧财产权的担忧也可能减少产业合作和收购,阻碍市场扩张。
半导体双面曝光设备市场受到COVID-19爆发的负面影响。製造流程受到锁定和限制、劳动力供应中断、远端工作挑战和健康问题的影响,导致先进机械的开发和部署延迟和效率低下。此外,旅行限制使得国际合作和安装变得困难,经济挑战迫使一些公司推迟或取消扩建计划。
半自动部分估计占最大占有率。这是指将手动控制与先进自动化功能结合的设备,包括提高曝光过程的准确性和效率的自动化功能,提供一定程度的弹性和人为控制。随着技术的进步,这些设备不断发展,将提高准确性、速度和整体性能的技术融入到寻求可自订和适应性流程的半导体製造商的经济高效的解决方案中,这支持了该领域的扩展。
光刻产业预计在预测期内将出现最高的复合年增长率,因为它涉及将复杂电路图案精确转移到半导体晶圆上所需的设备。 EUV 微影、高解析度成像和先进半导体元件等多种图案化技术的进步对于从通讯和电子到人工智慧和物联网等新兴技术的广泛应用至关重要。此外,这些设备使用先进的光学技术来确保晶圆两面同时精确对准和曝光,这显着推动了市场成长。
由于影响半导体生产的政府法律和法规,欧洲在预测期内占据了最大的市场占有率。欧盟(EU)重视研究、技术和创新,为半导体产业的发展创造了有利的环境。德国、英国、荷兰等国家处于半导体技术发展的前端。政府计划以及学术机构和行业相关人员之间的合作有助于该地区在半导体创新方面的领导地位,从而推动该地区的成长。
由于现代半导体研究、自动化、材料和精密光学的持续发展,预计北美在预测期内将呈现最高的复合年增长率。尼康公司、ASML Holding NV、佳能公司和上海微电子设备(集团)有限公司等大公司为该地区的卓越技术做出了贡献。由熟练的专业人员、研究设施和机械组成的强大生态系统满足了推动市场扩张的行业不断变化的需求。
According to Stratistics MRC, the Global Double-Sided Exposure Machine for Semiconductor Market is accounted for growing at a CAGR of 5.5% during the forecast period. A specialized tool used in the production of semiconductors is known as double-sided exposure machine for semiconductors. It employs advanced optics and light sources to project intricate circuit patterns onto the photoresist-coated surfaces of the wafer. Its precision and efficiency are essential for maintaining the high standards required in semiconductor manufacturing, where nanoscale features and precise alignment are paramount for the successful production of cutting-edge electronic devices.
According to UMC, it would also be one of the most advanced semiconductor foundries in Singapore and will produce 22 nm and 28 nm chips.
Double-Sided Exposure Machines enable the fabrication of semiconductors that meet the requirements of these emerging technologies, including 5G, edge computing, and electric vehicles. These ongoing technological advancements are implemented in various industries, including automotive, healthcare, and communications. In addition, they contribute to the production of high-density and high-performance chips needed for these applications, which is boosting market expansion.
Manufacturers, especially smaller ones, face financial challenges due to the capital-intensive nature of these advanced systems. Limited competition can contribute to higher prices, as manufacturers may have more control over pricing in the absence of extensive alternatives. In addition, the widespread adoption of ongoing technological advancements may be decreased by the industry's cost sensitivity and requirements, which significantly hamper the market's growth.
3D three-dimensional integrated circuits (ICs), with vertically stacked semiconductor layers, demand precise and simultaneous exposure on both sides of wafers. Incorporating machine learning and artificial intelligence into exposure machines can contribute to better alignment accuracy, error detection, and correction. Additionally, these technologies aimed at improving overall productivity, meeting the demands of an evolving electronics industry that increasingly relies on 3D ICs for improved performance and miniaturization, thereby driving market's expansion.
Patent disputes can cause delays in new product development and market launches. The complex technologies involved in these machines make them susceptible to patent disputes and legal challenges. Legal ambiguities affect the market's potential by creating a difficult environment for investors and manufacturers, influencing product pricing, profitability, and potential resistance from regulatory authorities. Furthermore, IP concerns may also decrease industry-player collaboration or acquisitions, which can hinder market expansion.
The market for double-sided exposure machines for semiconductors was adversely affected by the COVID-19 pandemic. Manufacturing processes were impacted by lockdowns and restrictions, disruptions to workforce availability, remote work challenges, and health concerns, which contributed to delays and inefficiencies in the development and deployment of advanced machinery. Additionally, travel restrictions made it more difficult to collaborate and install internationally, and economic challenges prompted some companies to delay or cancel expansion projects, which thereby hampered market growth.
The semi automatic segment is estimated to hold the largest share. It refers to equipment that combines advanced automation features with manual control including automated features to improve accuracy and exposure process efficiency, providing a certain amount of flexibility and human control. As technology advances, these machines continue to evolve, incorporating technologies to enhance precision, speed, and overall performance with cost-effective solutions for semiconductor manufacturers seeking customizable and adaptable processes which are boosting this segment expansion.
The photolithography segment is anticipated to have highest CAGR during the forecast period, due to it deals with devices that are necessary for accurately transferring complex circuit patterns onto semiconductor wafers. Advancements in multiple patterning techniques, such as EUV lithography, high-resolution imaging, and advanced semiconductor devices are essential for a wide range of applications, from telecommunications and electronics to emerging technologies like artificial intelligence and the Internet of Things. In addition, these devices use sophisticated optical methods to simultaneously assure precise alignment and exposure on both sides of the wafer which significantly drive market's growth.
Europe commanded the largest market share during the extrapolated period owing to government laws and regulations that affect the production of semiconductors. The European Union prioritizes research, technology, and innovation, creating an environment that is favorable for advancements in the semiconductor industry. Countries like Germany, the United Kingdom, and the Netherlands are at the forefront of semiconductor technology development. Government programs and collaborations between academic institutions and industry players contribute to the region's leadership in semiconductor innovation and thereby boosting the region's growth.
North America is expected to witness highest CAGR over the projection period, owing to modern semiconductor research and ongoing developments in automation, materials, and precision optics. Some of the major key players including Nikon Corporation, ASML Holding NV, Canon Inc. and Shanghai Micro Electronics Equipment (Group) Co., Ltd. are contributing in developing the region's technological excellence. Strong ecosystem of skilled professionals and research facilities, machines, are meeting the evolving needs of the industry which are propelling the market expansion.
Some of the key players in the Double-Sided Exposure Machine for Semiconductor Market include ORC Manufacturing, Ushio Lighting, Csun, Canon Inc, Orbotech Ltd., Neutronix Quintel, Idonus Sarl, Seimyung Vactron, Adtec Engineering and ASML Holding N.V.
In November 2023, Neutronix-Quintel, Inc., a leading provider of production photolithography equipment, announced the introduction of the NxQ 8000 CT mask aligner to be used for advanced applications.
In October 2023, Canon, a leader in production inkjet presses, announced a technology preview of the Canon varioPRINT iX1700, a new 170 A4 images per minute, sheetfed inkjet press, at Canon Expo in Yokohama, Japan.
In September 2023, Independent visual content provider, EPA Images, announced a five-year partnership with Canon Europe to renew and update its photography and videography equipment to confront the challenges in a changing world.