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市场调查报告书
商品编码
1447091
至 2030 年 SiC 晶圆抛光市场预测 - 按产品类型、製程类型、应用、最终用户和地理位置进行的全球分析SiC Wafer Polishing Market Forecasts to 2030 - Global Analysis By Product Type, Process Type, Application, End User and By Geography |
根据 Stratistics MRC 的数据,2023 年全球 SiC 晶圆抛光市场规模为 4 亿美元,预计到 2030 年将达到 33.5 亿美元,预测期内复合CAGR为 35.5%。它涉及去除表面缺陷和粗糙度,以实现具有精确厚度和高品质的光滑、平坦的表面。该工艺利用研磨材料和抛光垫与化学浆料相结合,逐渐减少表面不规则性并增强晶圆的表面性能。 SiC 晶圆抛光对于优化装置性能、提高成品率以及确保电力电子、汽车和航空航天等各种应用中使用的电子元件的可靠性至关重要。
基于 SiC 的功率元件的使用不断增加
随着产业向更节能和高性能的电子系统过渡,基于 SiC 的功率元件因其能够在更高的温度、电压和频率下运行同时保持效率而受到关注。对碳化硅功率元件不断增长的需求需要具有精确表面光洁度的高品质碳化硅晶圆,促使製造商投资先进的抛光技术和设备。因此,SiC基功率元件的日益普及直接刺激了对抛光SiC晶圆的需求,推动了SiC晶圆抛光市场的成长。
生产成本高
抛光碳化硅 (SiC) 晶圆的过程涉及多个复杂且资源密集的步骤,导致生产成本增加。 SiC 晶圆抛光所需的设备(例如抛光机和计量工具)非常复杂,采购和维护成本高昂。此外,此製程中使用的磨料浆和抛光垫经过专门配製,以实现精确的表面光洁度,从而增加了材料成本。操作设备和准确执行抛光过程所需的专业知识进一步增加了劳动力成本,从而阻碍了市场扩张。
电动车的成长
全球为减少碳排放和对化石燃料的依赖而转向电动车,正在推动电动车对碳化硅电力电子装置的需求。与传统硅基元件相比,SiC 具有多种优势,包括更高的功率效率、更少的散热和更高的功率密度,使其成为电动车中功率转换和马达驱动系统的理想选择,从而刺激了对SiC 晶圆抛光服务的需求。
表面缺陷和良率损失
刮痕、凹坑和颗粒等表面缺陷会损害装置性能和可靠性,导致产量损失和製造成本增加。这些缺陷的产生可能是由于多种因素造成的,包括碳化硅材料的硬度和脆性、抛光参数的变化以及杂质的存在。表面缺陷导致的产量损失不仅影响获利能力,也影响顾客满意度和品牌声誉。因此,表面缺陷和良率损失是阻碍市场需求的因素。
Covid-19 影响
COVID-19大流行对SiC晶圆抛光市场产生了重大影响。疫情初期,限制出行和封锁措施导致生产设施暂时关闭和生产计划推迟,影响了碳化硅晶圆和抛光服务的供应。此外,消费者支出的减少以及汽车和电子等最终用户产业的中断也抑制了对碳化硅半导体元件的需求,影响了整体市场成长。
预计化学机械抛光领域在预测期内将是最大的
据估计,化学机械抛光领域占最大份额。该过程首先将化学浆料涂覆到 SiC 晶圆的表面上。浆料含有悬浮在溶液中的磨料颗粒,与表面材料反应,有助于材料去除。 CMP 在 SiC 晶圆抛光方面具有多项优势,包括精确控製材料去除、出色的表面品质和高产量。此外,透过结合化学力和机械力,CMP 可以达到先进 SiC 半导体装置所需的严格表面规格,从而提高装置性能、良率和可靠性。
预计抛光垫细分市场在预测期内复合CAGR最高
预计抛光垫细分市场在预测期内将出现利润丰厚的成长。这些垫是 CMP 製程的重要组成部分,广泛用于抛光 SiC 晶圆。抛光垫通常由柔软的弹性材料製成,例如聚氨酯或合成聚合物。它们的设计目的是在抛光过程中施加受控压力的同时,将磨料浆均匀地保持并分布在晶圆表面上。抛光垫的成分和结构经过精心设计,以确保均匀的材料去除并最大限度地减少晶圆表面的缺陷。
由于汽车、电力电子、电信和消费性电子等各行业对碳化硅半导体元件的需求不断增长,亚太地区在推断期内占据了最大的市场份额。日本和台湾等国家成熟的半导体製造商和研究机构的存在,为 SiC 晶圆抛光技术的进步做出了贡献。这些机构积极参与旨在提高碳化硅基装置性能和效率的研发活动,从而推动对先进晶圆抛光技术的需求。
预计北美地区在预测期内将实现获利成长。北美在电子和半导体领域的强大影响力,加上其先进的基础设施和熟练的劳动力,推动了该地区碳化硅晶圆抛光市场的成长。该地区的公司处于开发尖端抛光技术和技术的前沿,以满足汽车、航空航太、再生能源和电信等各种应用对高品质碳化硅晶圆不断增长的需求。
2023年9月,杜邦宣布与在科斯达克交易所上市的韩国印刷电路板(PCB)材料製造商YMT建立策略合作关係。此次合作结合了杜邦的电路成像材料专业知识和YMT的本地网络,能够以更快的响应、更好的服务和整体解决方案最好地满足本地客户的需求。
2023 年 6 月,杜邦公司和 JetCool Technologies Inc. 宣布开展合作,以增加先进液体冷却技术的采用,从而实现半导体、资料中心和其他高效能运算应用的热管理。
2023 年 3 月,3M 宣布与业界领先的互联安全软体公司 Guardhat 合作。鑑于连线作为安全计画关键要素的重要性,3M 正在将其安全检查管理 (SIM) 软体转移到 Guardhat。
According to Stratistics MRC, the Global SiC Wafer Polishing Market is accounted for $0.40 billion in 2023 and is expected to reach $3.35 billion by 2030 growing at a CAGR of 35.5% during the forecast period. It involves the removal of surface imperfections and roughness to achieve a smooth, flat surface with precise thickness and high quality. This process utilizes abrasive materials and polishing pads combined with chemical slurries to gradually reduce surface irregularities and enhance the wafer's surface properties. SiC wafer polishing is essential for optimizing device performance, improving yield, and ensuring the reliability of electronic components used in various applications, including power electronics, automotive, and aerospace.
Rising adoption of SiC-based power devices
As industries transition towards more energy-efficient and high-performance electronic systems, SiC-based power devices have gained traction due to their ability to operate at higher temperatures, voltages, and frequencies while maintaining efficiency. This growing demand for SiC-based power devices necessitates high-quality SiC wafers with precise surface finishes, prompting manufacturers to invest in advanced polishing techniques and equipment. Thus, the rising adoption of SiC-based power devices directly fuels the demand for polished SiC wafers, driving growth in the SiC wafer polishing market.
High Production Costs
The process of polishing silicon carbide (SiC) wafers involves several complex and resource-intensive steps, contributing to elevated production expenses. The equipment required for SiC wafer polishing, such as polishing machines and metrology tools, is sophisticated and expensive to procure and maintain. Additionally, the abrasive slurries and polishing pads used in the process are specially formulated to achieve precise surface finishes, adding to material costs. The expertise required to operate the equipment and perform the polishing process accurately further increases labor expenses, which hampers market expansion.
Growth in electric vehicles
The global shift towards electric mobility to reduce carbon emissions and dependence on fossil fuels is driving the demand for SiC-based power electronics in electric vehicles. SiC offers several advantages over traditional silicon-based devices, including higher power efficiency, reduced heat dissipation, and increased power density, making it an ideal choice for power conversion and motor drive systems in electric vehicles, stimulating demand for SiC wafer polishing services.
Surface defects and yield loss
Surface defects such as scratches, pits, and particles can impair device performance and reliability, leading to yield loss and increased manufacturing costs. These defects can arise due to various factors, including the hardness and brittleness of SiC material, variations in polishing parameters, and the presence of impurities. Yield loss due to surface defects not only impacts profitability but also affects customer satisfaction and brand reputation. Therefore, surface defects and yield loss are the elements hindering market demand.
Covid-19 Impact
The COVID-19 pandemic had a significant impact on the SiC wafer polishing market. During the initial phases of the pandemic, restrictions on movement and lockdown measures led to temporary closures of manufacturing facilities and delays in production schedules, affecting the supply of SiC wafers and polishing services. Moreover, reduced consumer spending and disruptions in end-user industries such as automotive and electronics also dampened demand for SiC-based semiconductor devices, impacting overall market growth.
The chemical-mechanical polishing segment is expected to be the largest during the forecast period
The chemical-mechanical polishing segment is estimated to hold the largest share. This process begins with the application of chemical slurry onto the surface of the SiC wafer. The slurry contains abrasive particles suspended in a solution that reacts with the surface material, aiding in material removal. CMP offers several advantages in SiC wafer polishing, including precise control over material removal, excellent surface quality, and high throughput. Moreover, by combining chemical and mechanical forces, CMP can achieve the stringent surface specifications required for advanced SiC semiconductor devices, improving device performance, yield, and reliability.
The polishing pads segment is expected to have the highest CAGR during the forecast period
The polishing pads segment is anticipated to have lucrative growth during the forecast period. These pads are essential components of the CMP process, which is widely used for polishing SiC wafers. Polishing pads are typically made of a soft, resilient material such as polyurethane or a synthetic polymer. They are designed to hold and distribute the abrasive slurry evenly across the wafer surface while applying controlled pressure during polishing. The composition and structure of the polishing pad are carefully engineered to ensure uniform material removal and minimize defects on the wafer surface.
Asia Pacific commanded the largest market share during the extrapolated period owing to increasing demand for SiC-based semiconductor devices across various industries such as automotive, power electronics, telecommunications, and consumer electronics. The presence of established semiconductor manufacturers and research institutions in countries like Japan and Taiwan has contributed to the advancement of SiC wafer polishing technologies. These institutions are actively involved in research and development activities aimed at enhancing the performance and efficiency of SiC-based devices, thereby driving the demand for advanced wafer polishing techniques.
North America is expected to witness profitable growth over the projection period. North America's strong presence in the electronics and semiconductor sectors, coupled with its advanced infrastructure and skilled workforce, has propelled the growth of the SiC wafer polishing market in the region. Companies in the region are at the forefront of developing cutting-edge polishing techniques and technologies to meet the growing demand for high-quality SiC wafers used in various applications, including automotive, aerospace, renewable energy, and telecommunications.
Key players in the market
Some of the key players in the SiC Wafer Polishing Market include DuPont Incorporated, Entegris, 3M, Fujimi Corporation, Engis Corporation, JSR Corporation, Ferro Corporation, Kemet, Lapmaster Wolters, Advanced Abrasives Corporation and Logitech Ltd.
In September 2023, DuPont announced that it entered into a strategic collaboration relationship with YMT, a Korean printed circuit board (PCB) materials manufacturer listed on the KOSDAQ exchange. This collaboration combines DuPont's circuit imaging material expertise and YMT's local network, which can best address the local customer needs with faster response, better service, and a total solution.
In June 2023, DuPont Incorporated and JetCool Technologies Inc. announced a collaboration to increase adoption of advanced liquid cooling technology, enabling thermal management for semiconductors, data centers and other high-performance computing applications.
In March 2023, 3M announced collaboration with Guardhat, an industry-leading connected safety software company. Given the importance of connectivity as a key ingredient in safety programs, 3M is transferring its Safety Inspection Management (SIM) software to Guardhat.