市场调查报告书
商品编码
1489419
到 2030 年中介层和扇出晶圆层次电子构装市场预测:全球封装类型、装置类型、技术、最终用户和地区Interposer and Fan-out Wafer Level Packaging Market Forecasts to 2030 - Global Packaging Type (2.5D and 3D), Device Type, Technology, End User and By Geography |
根据 Stratistics MRC 的数据,2023 年全球中介层和扇出晶圆层次电子构装市场规模将达到 311 亿美元,预计在预测期内将以 14.3% 的复合年增长率增长,到 2030 年达到 793 亿美元。到过。
中介层和扇出晶圆层次电子构装(FOWLP) 是先进的半导体封装技术。中介层技术将硅或玻璃基板放置在积体电路之间,从而实现高密度连接和异质整合。另一方面,FOWLP 重新分配从晶片外围到封装表面的连接,从而提高性能并实现小型化。 FOWLP 有助于将多个晶片整合到一个封装中,从而能够开发更小、更强大的电子设备,例如智慧型手机、穿戴式装置和物联网设备,并促进半导体产业的创新。
对先进封装技术的需求不断增长
中介层和 FOWLP 可实现半导体元件的小型化和集成,从而实现更小的外形尺寸和更高的装置密度。这对于穿戴式装置、物联网装置和行动装置等空间敏感型应用至关重要。与传统封装方法相比,这些封装技术提高了电气和热性能。更短的互连、减少的寄生和改善的散热提高了装置性能、功率效率和可靠性,推动市场成长。
复杂的晶圆级工艺
复杂的晶圆级製程通常需要对专用设备和基础设施进行大量投资。製造商可能需要投资先进的製造设备和工具来处理复杂的工艺,例如线路重布(RDL)、穿透硅通孔(TSV) 和细间距互连。这些初始成本可能令人望而却步,尤其是对于小型或现金短缺的公司而言,并且可能会阻碍市场成长。
扩大异质集群的采用
异质整合使半导体公司能够开发具有独特功能和性能的创新产品。透过将多种功能整合到一个封装中,製造商可以满足消费性电子、汽车、医疗保健和物联网等行业的广泛应用。这个不断扩大的市场机会正在推动针对异质整合要求客製化的内插器和 FOWLP 技术的需求。
有限的生态系统
狭窄的生态系统意味着关键零件、材料和製造设备依赖有限数量的供应商。供应链中断,例如供不应求或单一供应商的品质问题,可能会严重影响生产计划和产品可用性。半导体公司在寻找替代供应商和降低供应链风险方面面临挑战,这可能会影响他们满足市场需求和客户期望的能力。
COVID-19 的影响
封锁措施和旅行限制影响了製造业务,导致供不应求和发货延误。家用电子电器和汽车等关键行业的需求不确定性进一步影响了市场成长,而疫情加速了数位转型,远距工作、线上教育和医疗保健应用对半导体设备的需求增加。
MEMS/感测器产业预计在预测期内规模最大
随着 MEMS 感测器在半导体封装中的整合推动小型化,实现更小的外形尺寸和增强的功能,MEMS/感测器领域预计将出现良好的成长。中介层和 FOWLP 技术促进了 MEMS 装置与其他半导体元件的集成,从而实现异质整合和系统级最佳化。这种整合提高了汽车、消费性电子、物联网和医疗保健领域基于 MEMS 的应用的效能、可靠性和成本效率。
消费性电子产业预计在预测期内复合年增长率最高
家用电子电器产业预计在预测期内复合年增长率最高。随着消费者对更小、更轻和更高性能设备的需求不断增加,半导体製造商正在转向采用中介层和 FOWLP 等先进封装解决方案来满足这些需求。这些技术可实现更高水准的整合、改进的温度控管和更高的电气性能,这对于智慧型手机、平板电脑、穿戴式装置和智慧家居设备等家用电子电器至关重要。
亚太地区预计将在预测期内占据最大的市场占有率,因为该地区是世界上一些最大的消费性电子市场的所在地,包括中国、日本、韩国和印度。对智慧型手机、平板电脑、穿戴式装置和其他消费性电子产品不断增长的需求正在推动内插器和 FOWLP 等先进封装技术的采用,以满足更小外形尺寸、更高性能和更高能源效率的要求。
预计北美在预测期内的复合年增长率最高,因为它是全球专门从事半导体封装及相关技术的研究机构、大学和研发中心的所在地。这些机构与产业合作伙伴合作进行前沿研究、开发创新解决方案并培训下一代半导体专业人员。学术界和工业界之间的协同效应将推动技术进步并加速北美内插器和 FOWLP 技术的商业化。
According to Stratistics MRC, the Global Interposer and Fan-out Wafer Level Packaging Market is accounted for $31.1 billion in 2023 and is expected to reach $79.3 billion by 2030 growing at a CAGR of 14.3% during the forecast period. Interposer and Fan-out Wafer Level Packaging (FOWLP) are advanced semiconductor packaging techniques. Interposer technology involves placing a silicon or glass substrate between integrated circuits, enabling high-density connections and heterogeneous integration. FOWLP, on the other hand, redistributes connections from the chip's periphery to the package's surface, enhancing performance and miniaturization. They facilitate the integration of multiple chips into a single package, enabling the development of smaller, more powerful electronic devices such as smartphones, wearables, and IoT devices, driving innovation in the semiconductor industry.
Increasing demand for advanced packaging technologies
Interposer and FOWLP enable the miniaturization and integration of semiconductor components, leading to smaller form factors and higher device density. This is crucial for applications where space is a premium, such as wearables, IoT devices, and mobile devices. These packaging technologies provide enhanced electrical and thermal performance compared to traditional packaging methods. They offer shorter interconnects reduced parasitics, and better heat dissipation, resulting in improved device performance, power efficiency, and reliability boosting the growth of the market.
Complex wafer-level processes
Complex wafer-level processes often require significant investment in specialized equipment and infrastructure. Manufacturers may need to invest in advanced fabrication facilities and tools to handle intricate processes such as redistribution layers (RDLs), through-silicon vias (TSVs), and fine pitch interconnects. These upfront costs can be prohibitive for some companies, particularly smaller players or those with limited financial resources, thus hindering market growth.
Growing adoption of heterogeneous integration
Heterogeneous integration allows semiconductor companies to develop innovative products with unique features and capabilities. By integrating diverse functionalities into a single package, manufacturers can address a broader range of applications across various industries, including consumer electronics, automotive, healthcare, and IoT. This expanded market opportunity fuels the demand for interposer and FOWLP technologies tailored to heterogeneous integration requirements.
Limited ecosystem
A narrow ecosystem may result in dependencies on a limited number of suppliers for critical components, materials, and manufacturing equipment. Supply chain disruptions, such as shortages or quality issues from a single source, can significantly impact production schedules and product availability. Semiconductor companies may face challenges in securing alternative suppliers or mitigating supply chain risks, affecting their ability to meet market demand and customer expectations.
Covid-19 Impact
Lockdown measures and travel restrictions affected manufacturing operations, leading to supply shortages and shipment delays. Uncertainty in demand from key industries like consumer electronics and automotive further impacted market growth, however, the pandemic also accelerated digital transformation, increasing demand for semiconductor devices for remote work, online education, and healthcare applications.
The MEMS/sensors segment is expected to be the largest during the forecast period
The MEMS/sensors segment is estimated to have a lucrative growth, due to integration of MEMS sensors within semiconductor packages drives miniaturization, enabling smaller form factors and enhanced functionality. Interposer and FOWLP technologies facilitate the integration of MEMS devices with other semiconductor components, enabling heterogeneous integration and system-level optimization. This integration enhances the performance, reliability, and cost-effectiveness of MEMS-based applications in automotive, consumer electronics, IoT, and healthcare sectors.
The consumer electronics segment is expected to have the highest CAGR during the forecast period
The consumer electronics segment is anticipated to witness the highest CAGR growth during the forecast period, as consumer demand for smaller, lighter, and more powerful devices increases, semiconductor manufacturers turn to advanced packaging solutions like interposer and FOWLP to meet these requirements. These technologies enable higher levels of integration, improved thermal management, and enhanced electrical performance, crucial for consumer electronics such as smartphones, tablets, wearables, and smart home devices.
Asia Pacific is projected to hold the largest market share during the forecast period owing to the Asia Pacific region which is home to some of the world's largest consumer electronics markets, including China, Japan, South Korea, and India. The increasing demand for smartphones, tablets, wearables, and other consumer electronics drives the adoption of advanced packaging technologies like interposer and FOWLP to meet the requirements of smaller form factors, higher performance, and improved energy efficiency.
North America is projected to have the highest CAGR over the forecast period, as North America hosts world-class research institutions, universities, and R&D centers specializing in semiconductor packaging and related technologies. These institutions collaborate with industry partners to conduct cutting-edge research, develop innovative solutions, and train the next generation of semiconductor professionals. The synergy between academia and industry fosters technological advancements and accelerates the commercialization of interposer and FOWLP technologies in North America.
Key players in the market
Some of the key players in the Interposer and Fan-out Wafer Level Packaging Market include Advanced MICRO DEVICES, Inc, Amkor Technology, ASE Technology Holding Co., Ltd., DAI Nippon Printing CO., LTD., DECA Technologies, Dupont, Global Foundries Inc, JCET Group LTD., Nexlogic Technologies INC., Powertech Technology Inc., RENA Technologies GMBH, Samsung, SAMTEC, SK Hynix Inc., SPTS Technologies Ltd., Teledyne Digital Imaging Inc., Toshiba Electronic Devices & Storage Corporation and United Microelectronics Corporation
In April 2024, Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions. Both companies have agreed on operating a dedicated packaging and test center at Amkor's manufacturing site in Porto.
In March 2024, DuPont and Menatek Defense Technologies announced that they have entered into an agreement related to the global bearing market. This collaboration between the two companies involves NAZ Bearings(R), an innovative bearing that is self-lubricating and maintenance free.
In April 2024, Teledyne DALSA, a Teledyne Technologies company announced a radiometric version of its MicroCalibir(TM) Long Wave Infrared (LWIR) compact camera platform that delivers accurate temperature measurements of +/-2°C or +/-2%.