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市场调查报告书
商品编码
1489419

到 2030 年中介层和扇出晶圆层次电子构装市场预测：全球封装类型、装置类型、技术、最终用户和地区

Interposer and Fan-out Wafer Level Packaging Market Forecasts to 2030 - Global Packaging Type (2.5D and 3D), Device Type, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，2023 年全球中介层和扇出晶圆层次电子构装市场规模将达到 311 亿美元，预计在预测期内将以 14.3% 的复合年增长率增长，到 2030 年达到 793 亿美元。到过。

中介层和扇出晶圆层次电子构装(FOWLP) 是先进的半导体封装技术。中介层技术将硅或玻璃基板放置在积体电路之间，从而实现高密度连接和异质整合。另一方面，FOWLP 重新分配从晶片外围到封装表面的连接，从而提高性能并实现小型化。 FOWLP 有助于将多个晶片整合到一个封装中，从而能够开发更小、更强大的电子设备，例如智慧型手机、穿戴式装置和物联网设备，并促进半导体产业的创新。

对先进封装技术的需求不断增长

中介层和 FOWLP 可实现半导体元件的小型化和集成，从而实现更小的外形尺寸和更高的装置密度。这对于穿戴式装置、物联网装置和行动装置等空间敏感型应用至关重要。与传统封装方法相比，这些封装技术提高了电气和热性能。更短的互连、减少的寄生和改善的散热提高了装置性能、功率效率和可靠性，推动市场成长。

复杂的晶圆级工艺

复杂的晶圆级製程通常需要对专用设备和基础设施进行大量投资。製造商可能需要投资先进的製造设备和工具来处理复杂的工艺，例如线路重布(RDL)、穿透硅通孔(TSV) 和细间距互连。这些初始成本可能令人望而却步，尤其是对于小型或现金短缺的公司而言，并且可能会阻碍市场成长。

扩大异质集群的采用

异质整合使半导体公司能够开发具有独特功能和性能的创新产品。透过将多种功能整合到一个封装中，製造商可以满足消费性电子、汽车、医疗保健和物联网等行业的广泛应用。这个不断扩大的市场机会正在推动针对异质整合要求客製化的内插器和 FOWLP 技术的需求。

有限的生态系统

狭窄的生态系统意味着关键零件、材料和製造设备依赖有限数量的供应商。供应链中断，例如供不应求或单一供应商的品质问题，可能会严重影响生产计划和产品可用性。半导体公司在寻找替代供应商和降低供应链风险方面面临挑战，这可能会影响他们满足市场需求和客户期望的能力。

COVID-19 的影响

封锁措施和旅行限制影响了製造业务，导致供不应求和发货延误。家用电子电器和汽车等关键行业的需求不确定性进一步影响了市场成长，而疫情加速了数位转型，远距工作、线上教育和医疗保健应用对半导体设备的需求增加。

MEMS/感测器产业预计在预测期内规模最大

随着 MEMS 感测器在半导体封装中的整合推动小型化，实现更小的外形尺寸和增强的功能，MEMS/感测器领域预计将出现良好的成长。中介层和 FOWLP 技术促进了 MEMS 装置与其他半导体元件的集成，从而实现异质整合和系统级最佳化。这种整合提高了汽车、消费性电子、物联网和医疗保健领域基于 MEMS 的应用的效能、可靠性和成本效率。

消费性电子产业预计在预测期内复合年增长率最高

家用电子电器产业预计在预测期内复合年增长率最高。随着消费者对更小、更轻和更高性能设备的需求不断增加，半导体製造商正在转向采用中介层和 FOWLP 等先进封装解决方案来满足这些需求。这些技术可实现更高水准的整合、改进的温度控管和更高的电气性能，这对于智慧型手机、平板电脑、穿戴式装置和智慧家居设备等家用电子电器至关重要。

占比最大的地区：

亚太地区预计将在预测期内占据最大的市场占有率，因为该地区是世界上一些最大的消费性电子市场的所在地，包括中国、日本、韩国和印度。对智慧型手机、平板电脑、穿戴式装置和其他消费性电子产品不断增长的需求正在推动内插器和 FOWLP 等先进封装技术的采用，以满足更小外形尺寸、更高性能和更高能源效率的要求。

复合年增长率最高的地区：

预计北美在预测期内的复合年增长率最高，因为它是全球专门从事半导体封装及相关技术的研究机构、大学和研发中心的所在地。这些机构与产业合作伙伴合作进行前沿研究、开发创新解决方案并培训下一代半导体专业人员。学术界和工业界之间的协同效应将推动技术进步并加速北美内插器和 FOWLP 技术的商业化。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球中介层与扇出晶圆层次电子构装市场：依封装类型

  • 2.5D
  • 3D

第六章全球中介层与扇出晶圆层次电子构装市场：依元件类型

  • 成像和光电
  • 关于LED
  • 逻辑积体电路
  • MEMS/感测器
  • 储存装置
  • 其他设备类型

第七章全球中介层与扇出晶圆层次电子构装市场：依技术分类

  • 内插器
  • 扇出晶圆级封装 (FOWLP)
  • 穿透硅通孔

第八章全球中介层与扇出晶圆层次电子构装市场：依最终用户分类

  • 家用电器
  • 通讯
  • 车
  • 军事和航太
  • 智慧科技
  • 医疗设备
  • 其他最终用户

第九章全球中介层与扇出晶圆层次电子构装市场：依地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第10章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十一章 公司概况

  • Advanced MICRO DEVICES, Inc
  • Amkor Technology
  • ASE Technology Holding Co., Ltd.
  • DAI Nippon Printing CO., LTD.
  • DECA Technologies
  • Dupont
  • Global Foundries Inc
  • JCET Group LTD.
  • Nexlogic Technologies INC.
  • Powertech Technology Inc.
  • RENA Technologies GMBH
  • Samsung
  • SAMTEC
  • SK Hynix Inc.
  • SPTS Technologies Ltd.
  • Teledyne Digital Imaging Inc.
  • Toshiba Electronic Devices & Storage Corporation
  • United Microelectronics Corporation
Product Code: SMRC26205

According to Stratistics MRC, the Global Interposer and Fan-out Wafer Level Packaging Market is accounted for $31.1 billion in 2023 and is expected to reach $79.3 billion by 2030 growing at a CAGR of 14.3% during the forecast period. Interposer and Fan-out Wafer Level Packaging (FOWLP) are advanced semiconductor packaging techniques. Interposer technology involves placing a silicon or glass substrate between integrated circuits, enabling high-density connections and heterogeneous integration. FOWLP, on the other hand, redistributes connections from the chip's periphery to the package's surface, enhancing performance and miniaturization. They facilitate the integration of multiple chips into a single package, enabling the development of smaller, more powerful electronic devices such as smartphones, wearables, and IoT devices, driving innovation in the semiconductor industry.

Market Dynamics:

Driver:

Increasing demand for advanced packaging technologies

Interposer and FOWLP enable the miniaturization and integration of semiconductor components, leading to smaller form factors and higher device density. This is crucial for applications where space is a premium, such as wearables, IoT devices, and mobile devices. These packaging technologies provide enhanced electrical and thermal performance compared to traditional packaging methods. They offer shorter interconnects reduced parasitics, and better heat dissipation, resulting in improved device performance, power efficiency, and reliability boosting the growth of the market.

Restraint:

Complex wafer-level processes

Complex wafer-level processes often require significant investment in specialized equipment and infrastructure. Manufacturers may need to invest in advanced fabrication facilities and tools to handle intricate processes such as redistribution layers (RDLs), through-silicon vias (TSVs), and fine pitch interconnects. These upfront costs can be prohibitive for some companies, particularly smaller players or those with limited financial resources, thus hindering market growth.

Opportunity:

Growing adoption of heterogeneous integration

Heterogeneous integration allows semiconductor companies to develop innovative products with unique features and capabilities. By integrating diverse functionalities into a single package, manufacturers can address a broader range of applications across various industries, including consumer electronics, automotive, healthcare, and IoT. This expanded market opportunity fuels the demand for interposer and FOWLP technologies tailored to heterogeneous integration requirements.

Threat:

Limited ecosystem

A narrow ecosystem may result in dependencies on a limited number of suppliers for critical components, materials, and manufacturing equipment. Supply chain disruptions, such as shortages or quality issues from a single source, can significantly impact production schedules and product availability. Semiconductor companies may face challenges in securing alternative suppliers or mitigating supply chain risks, affecting their ability to meet market demand and customer expectations.

Covid-19 Impact

Lockdown measures and travel restrictions affected manufacturing operations, leading to supply shortages and shipment delays. Uncertainty in demand from key industries like consumer electronics and automotive further impacted market growth, however, the pandemic also accelerated digital transformation, increasing demand for semiconductor devices for remote work, online education, and healthcare applications.

The MEMS/sensors segment is expected to be the largest during the forecast period

The MEMS/sensors segment is estimated to have a lucrative growth, due to integration of MEMS sensors within semiconductor packages drives miniaturization, enabling smaller form factors and enhanced functionality. Interposer and FOWLP technologies facilitate the integration of MEMS devices with other semiconductor components, enabling heterogeneous integration and system-level optimization. This integration enhances the performance, reliability, and cost-effectiveness of MEMS-based applications in automotive, consumer electronics, IoT, and healthcare sectors.

The consumer electronics segment is expected to have the highest CAGR during the forecast period

The consumer electronics segment is anticipated to witness the highest CAGR growth during the forecast period, as consumer demand for smaller, lighter, and more powerful devices increases, semiconductor manufacturers turn to advanced packaging solutions like interposer and FOWLP to meet these requirements. These technologies enable higher levels of integration, improved thermal management, and enhanced electrical performance, crucial for consumer electronics such as smartphones, tablets, wearables, and smart home devices.

Region with largest share:

Asia Pacific is projected to hold the largest market share during the forecast period owing to the Asia Pacific region which is home to some of the world's largest consumer electronics markets, including China, Japan, South Korea, and India. The increasing demand for smartphones, tablets, wearables, and other consumer electronics drives the adoption of advanced packaging technologies like interposer and FOWLP to meet the requirements of smaller form factors, higher performance, and improved energy efficiency.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, as North America hosts world-class research institutions, universities, and R&D centers specializing in semiconductor packaging and related technologies. These institutions collaborate with industry partners to conduct cutting-edge research, develop innovative solutions, and train the next generation of semiconductor professionals. The synergy between academia and industry fosters technological advancements and accelerates the commercialization of interposer and FOWLP technologies in North America.

Key players in the market

Some of the key players in the Interposer and Fan-out Wafer Level Packaging Market include Advanced MICRO DEVICES, Inc, Amkor Technology, ASE Technology Holding Co., Ltd., DAI Nippon Printing CO., LTD., DECA Technologies, Dupont, Global Foundries Inc, JCET Group LTD., Nexlogic Technologies INC., Powertech Technology Inc., RENA Technologies GMBH, Samsung, SAMTEC, SK Hynix Inc., SPTS Technologies Ltd., Teledyne Digital Imaging Inc., Toshiba Electronic Devices & Storage Corporation and United Microelectronics Corporation

Key Developments:

In April 2024, Infineon and Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions. Both companies have agreed on operating a dedicated packaging and test center at Amkor's manufacturing site in Porto.

In March 2024, DuPont and Menatek Defense Technologies announced that they have entered into an agreement related to the global bearing market. This collaboration between the two companies involves NAZ Bearings(R), an innovative bearing that is self-lubricating and maintenance free.

In April 2024, Teledyne DALSA, a Teledyne Technologies company announced a radiometric version of its MicroCalibir(TM) Long Wave Infrared (LWIR) compact camera platform that delivers accurate temperature measurements of +/-2°C or +/-2%.

Packaging Types Covered:

  • 2.5D
  • 3D

Device Types Covered:

  • Imaging & Optoelectronics
  • LEDs
  • Logic Ics
  • MEMS/Sensors
  • Memory Devices
  • Other Device Types

Technologies Covered:

  • Interposer
  • Fan-Out Wafer-Level Packaging (FOWLP)
  • Through Silicon Vias

End Users Covered:

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Military and Aerospace
  • Smart Technologies
  • Medical devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Interposer and Fan-out Wafer Level Packaging Market, By Packaging Type

  • 5.1 Introduction
  • 5.2 2.5D
  • 5.3 3D

6 Global Interposer and Fan-out Wafer Level Packaging Market, By Device Type

  • 6.1 Introduction
  • 6.2 Imaging & Optoelectronics
  • 6.3 LEDs
  • 6.4 Logic Ics
  • 6.5 MEMS/Sensors
  • 6.6 Memory Devices
  • 6.7 Other Device Types

7 Global Interposer and Fan-out Wafer Level Packaging Market, By Technology

  • 7.1 Introduction
  • 7.2 Interposer
  • 7.3 Fan-Out Wafer-Level Packaging (FOWLP)
  • 7.4 Through Silicon Vias

8 Global Interposer and Fan-out Wafer Level Packaging Market, By End User

  • 8.1 Introduction
  • 8.2 Consumer Electronics
  • 8.3 Telecommunication
  • 8.4 Automotive
  • 8.5 Military and Aerospace
  • 8.6 Smart Technologies
  • 8.7 Medical devices
  • 8.8 Other End Users

9 Global Interposer and Fan-out Wafer Level Packaging Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 Advanced MICRO DEVICES, Inc
  • 11.2 Amkor Technology
  • 11.3 ASE Technology Holding Co., Ltd.
  • 11.4 DAI Nippon Printing CO., LTD.
  • 11.5 DECA Technologies
  • 11.6 Dupont
  • 11.7 Global Foundries Inc
  • 11.8 JCET Group LTD.
  • 11.9 Nexlogic Technologies INC.
  • 11.10 Powertech Technology Inc.
  • 11.11 RENA Technologies GMBH
  • 11.12 Samsung
  • 11.13 SAMTEC
  • 11.14 SK Hynix Inc.
  • 11.15 SPTS Technologies Ltd.
  • 11.16 Teledyne Digital Imaging Inc.
  • 11.17 Toshiba Electronic Devices & Storage Corporation
  • 11.18 United Microelectronics Corporation

List of Tables

  • Table 1 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 3 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 4 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 5 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 6 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 7 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 8 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 9 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 10 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 11 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 12 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 13 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 14 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 15 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 16 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 17 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 18 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 19 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 20 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 21 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 22 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 23 Global Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 24 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 25 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 26 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 27 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 28 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 29 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 30 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 31 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 32 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 33 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 34 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 35 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 36 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 37 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 38 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 39 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 40 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 41 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 42 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 43 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 44 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 45 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 46 North America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 47 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 48 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 49 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 50 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 51 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 52 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 53 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 54 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 55 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 56 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 57 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 58 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 59 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 60 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 61 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 62 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 63 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 64 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 65 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 66 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 67 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 68 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 69 Europe Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 70 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 71 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 72 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 73 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 74 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 75 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 76 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 77 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 78 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 79 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 80 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 81 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 82 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 83 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 84 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 85 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 86 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 87 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 88 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 89 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 90 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 91 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 92 Asia Pacific Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 93 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 94 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 95 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 96 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 97 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 98 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 99 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 100 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 101 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 102 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 103 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 104 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 105 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 106 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 107 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 108 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 109 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 110 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 111 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 112 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 113 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 114 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 115 South America Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)
  • Table 116 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Country (2021-2030) ($MN)
  • Table 117 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Packaging Type (2021-2030) ($MN)
  • Table 118 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By 2.5D (2021-2030) ($MN)
  • Table 119 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By 3D (2021-2030) ($MN)
  • Table 120 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Device Type (2021-2030) ($MN)
  • Table 121 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Imaging & Optoelectronics (2021-2030) ($MN)
  • Table 122 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By LEDs (2021-2030) ($MN)
  • Table 123 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Logic Ics (2021-2030) ($MN)
  • Table 124 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By MEMS/Sensors (2021-2030) ($MN)
  • Table 125 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Memory Devices (2021-2030) ($MN)
  • Table 126 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other Device Types (2021-2030) ($MN)
  • Table 127 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Technology (2021-2030) ($MN)
  • Table 128 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Interposer (2021-2030) ($MN)
  • Table 129 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2021-2030) ($MN)
  • Table 130 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Through Silicon Vias (2021-2030) ($MN)
  • Table 131 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By End User (2021-2030) ($MN)
  • Table 132 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 133 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Telecommunication (2021-2030) ($MN)
  • Table 134 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Automotive (2021-2030) ($MN)
  • Table 135 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Military and Aerospace (2021-2030) ($MN)
  • Table 136 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Smart Technologies (2021-2030) ($MN)
  • Table 137 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Medical devices (2021-2030) ($MN)
  • Table 138 Middle East & Africa Interposer and Fan-out Wafer Level Packaging Market Outlook, By Other End Users (2021-2030) ($MN)