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市场调查报告书
商品编码
1679212
2030 年行动系统晶片(SoC) 市场预测:以核心类型、核心架构、连结性、效能分类、应用和地区进行的全球分析Mobile System-on-Chip (SoC) Market Forecasts to 2030 - Global Analysis By Core Type (Quad-core, Hexa-core, Octa-core, Deca-core & Higher and Other Core Types), Core Architecture, Connectivity, Performance Category, Application and By Geography |
根据 Stratistics MRC 的数据,全球行动系统晶片(SoC) 市场预计在 2024 年达到 8.5 亿美元,到 2030 年将达到 31.5 亿美元,预测期内的复合年增长率为 19.4%。
行动系统晶片(SoC) 是一种将智慧型手机或平板电脑的基本组件组合到单一晶片上的积体电路。它包括 CPU(处理器)、GPU(图形)、RAM 控制器、数据机(用于连接)、ISP(影像讯号处理器)、AI 引擎和其他专用处理器。行动 SoC 专为节能和小尺寸而设计,可优化性能并最大限度地降低能耗。
根据爱立信的行动报告,到年终,全球5G行动用户数量预计将超过15亿,这将对能够支援高速资料处理和高效电源管理的先进SoC解决方案产生巨大的需求。
智慧型手机日益普及
在印度、东南亚和非洲等新兴市场,智慧型手机的普及率正在迅速增长,对高性价比、高性能 SoC 的需求也日益增长。同时,在高阶领域,对先进 AI、5G 和游戏功能的需求正在推动旗舰 SoC 的技术创新。随着智慧型手机成为通讯、工作、娱乐和电子商务的必需品,製造商不断开发速度更快、更节能、功能更丰富的 SoC。需求的激增正促使晶片製造商加强生产和研发力度,进一步推动市场扩张。
复杂的製造工艺
製造行动 SoC 非常复杂,因为它涉及将 CPU、GPU、AI 引擎、数据机、ISP 和记忆体控制器等多个组件整合到单一紧凑晶片上。奈米级的先进製造需要高精度的微影术、大量的研发以及昂贵的铸造工作。其他挑战包括低产量比率、高缺陷风险和供应链限制。这将增加生产成本、限制供应并造成延误,从而阻碍市场成长。
5G 网路的兴起
消费者对更快的连接速度、更低的延迟和更高的效率的需求正在推动智慧型手机製造商采用支援 5G 的 SoC。这将推动处理能力、人工智慧和电源效率的创新。 SoC 製造商正在投资先进的 5G 晶片组以满足需求。此外,物联网、云端游戏和人工智慧主导应用的兴起将进一步加速 5G SoC 的采用,使其成为下一代智慧型手机和行动运算生态系统的关键元素。
热和功率限制
行动 SoC 面临热量和功率限制,因为它们要求在紧凑、电池供电的设备中实现高性能。随着处理器的功能越来越强大,它们会产生更多的热量,需要高效的冷却解决方案。过热会导致热感节流,降低效能并影响使用者体验。耗电的 SoC 会很快耗尽电池,从而限制其使用时间。这些挑战增加了设计复杂性和研发成本,阻碍了市场成长,限制了高效能运算的进步。
COVID-19 疫情扰乱了行动 SoC 市场,造成供应链瓶颈、晶片短缺以及工厂关闭导致的生产延迟。由于智慧型手机销量下降,需求最初有所下降,但随着人们更依赖远距工作、线上学习和数位娱乐,需求又出现激增。 5G、主导应用和游戏智慧型手机的加速普及部分抵消了这些损失。然而,物流成本上升、地缘政治紧张局势以及原材料短缺持续影响市场,推动半导体製造业回流和投资。
预计四核心市场在预测期内将占据最大份额
预计预测期内四核心处理器将占据最大的市场占有率。四核心移动 SoC 在性能、能源效率和成本效益之间实现了平衡。与双核心处理器相比,四个 CPU 核心可带来更流畅的多工处理、更好的游戏效能和更快的应用程式执行速度。它还能有效分配工作负载,降低功耗和发热量。它也是一款更实惠的 SoC,非常适合注重成本的消费者。
智慧型手机市场预计在预测期内实现最高复合年增长率
预计智慧型手机领域将在预测期内实现最高成长率。在智慧型手机中,行动 SoC 将 CPU、GPU、数据机、AI 引擎、ISP 和记忆体控制器整合到单一晶片上,以实现高效能、低功耗和紧凑的设计。这使得处理速度更快、游戏更高级、人工智慧摄影、5G 连接和流畅的多任务处理成为可能。智慧型手机 SoC 有多种版本,从廉价到旗舰型,可满足各种用户的需求。
由于智慧型手机普及率高、5G 推出以及强大的半导体生态系统,预计亚太地区将在预测期内占据最大的市场占有率。中国、印度、韩国和台湾等国家占据生产和消费主导地位。中国在智慧型手机製造领域处于领先地位(华为、小米),而台湾(台积电)和韩国(三星)则是主要的晶片製造商。印度行动市场的成长正在推动高性价比 SoC 的需求。 「印度製造」等政府倡议以及中国为实现晶片独立而做出的努力正在推动投资。
在预测期内,预计北美将呈现最高的复合年增长率,这得益于对高阶智慧型手机的强劲需求、5G 的扩张以及人工智慧设备的推动。美国是高通(骁龙)、苹果(A系列)、Nvidia等主要SoC开发商的所在地,是先进研发和技术创新的所在地。加拿大透过半导体研究支持成长。该地区受益于早期的技术采用、高消费支出和强大的通讯基础设施。
According to Stratistics MRC, the Global Mobile System-on-Chip (SoC) Market is accounted for $0.85 billion in 2024 and is expected to reach $3.15 billion by 2030 growing at a CAGR of 19.4% during the forecast period. A Mobile System-on-Chip (SoC) is an integrated circuit that combines essential smartphone or tablet components into a single chip. It includes the CPU (processor), GPU (graphics), RAM controller, modem (for connectivity), ISP (image signal processor), AI engine, and other specialized processors. Designed for power efficiency and compactness, mobile SoCs optimize performance while minimizing energy consumption.
According to Ericsson's mobility report, 5G mobile subscriptions are expected to surpass 1.5 billion globally by the end of 2023, creating substantial demand for advanced SoC solutions that can support high-speed data processing and efficient power management.
Growing smartphone penetration
Emerging markets like India, Southeast Asia, and Africa witness rapid smartphone adoption, driving the need for cost-effective yet high-performance SoCs. Meanwhile, premium segments demand advanced AI, 5G, and gaming capabilities, pushing innovation in flagship SoCs. With smartphones becoming essential for communication, work, entertainment, and e-commerce, manufacturers continuously develop faster, energy-efficient, and feature-rich SoCs. This surge in demand encourages chipmakers to enhance production and R&D, further propelling market expansion.
Complex manufacturing processes
Mobile SoC manufacturing is complex due to the integration of multiple components like CPU, GPU, AI engine, modem, ISP, and memory controller on a single, compact chip. Advanced nanometer-scale fabrication requires high-precision lithography, extensive R&D, and expensive foundries. Also, challenges include low yield rates, high defect risks, and supply chain constraints. This hampers market growth by increasing production costs, limiting supply, and causing delays.
Increasing 5G networks
Consumers demand faster connectivity, lower latency, and improved efficiency, pushing smartphone manufacturers to adopt 5G-capable SoCs. This fuels innovation in processing power, AI, and power efficiency. SoC makers are investing in advanced 5G chipsets to meet demand. Additionally, the rise of IoT, cloud gaming, and AI-driven applications further accelerates 5G SoC adoption, making it a key factor in the next-generation smartphone and mobile computing ecosystem.
Thermal & power constraints
Mobile SoCs face thermal and power constraints due to the need for high performance in compact, battery-powered devices. As processors become more powerful, they generate more heat, requiring efficient cooling solutions. Excessive heat can lead to thermal throttling, reducing performance and affecting user experience. Power-hungry SoCs drain batteries quickly, limiting usage time. These challenges hamper market growth by increasing design complexity, R&D costs, and limiting advancements in high-performance computing.
The covid-19 pandemic disrupted the mobile SoC market, causing supply chain bottlenecks, chip shortages, and production delays due to factory shutdowns. Demand initially declined as smartphone sales dropped, but later surged with increased reliance on remote work, online learning, and digital entertainment. The accelerated adoption of 5G, AI-driven applications, and gaming smartphones partially offset losses. However, rising logistics costs, geopolitical tensions, and raw material shortages continued to impact the market, driving reshoring efforts and investment in semiconductor manufacturing.
The quad-core segment is expected to be the largest during the forecast period
The quad-core segment is expected to account for the largest market share during the forecast period. A quad-core mobile SoC offers a balance of performance, power efficiency, and cost-effectiveness. With four CPU cores, it enables smooth multitasking, better gaming performance, and faster app execution compared to dual-core processors. It efficiently distributes workloads, reducing power consumption and heat generation. They are also more affordable SoCs, making them ideal for cost-conscious consumers.
The smartphones segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the smartphones segment is predicted to witness the highest growth rate. In smartphones, a Mobile SoC integrates the CPU, GPU, modem, AI engine, ISP, and memory controller into a single chip, ensuring high performance, power efficiency, and compact design. It enables fast processing, advanced gaming, AI-driven photography, 5G connectivity, and smooth multitasking. Smartphone SoCs range from budget-friendly to flagship-grade, catering to different user needs.
During the forecast period, the Asia Pacific region is expected to hold the largest market share due to high smartphone adoption, 5G rollout, and a strong semiconductor ecosystem. Countries like China, India, South Korea, and Taiwan dominate production and consumption. China leads in smartphone manufacturing (Huawei, Xiaomi), while Taiwan (TSMC) and South Korea (Samsung) are key chipmakers. India's growing mobile market boosts demand for cost-effective SoCs. Government initiatives, such as "Make in India" and China's chip independence efforts, drive investments.
Over the forecast period, the North America region is anticipated to exhibit the highest CAGR driven by strong demand for premium smartphones, 5G expansion, and AI-powered devices. The U.S. is home to leading SoC developers like Qualcomm (Snapdragon), Apple (A-series), and NVIDIA, with advanced R&D and innovation. Canada supports growth through semiconductor research. The region benefits from early technology adoption, high consumer spending, and strong telecom infrastructure.
Key players in the market
Some of the key players in mobile system-on-chip (SoC) market include Qualcomm Technologies, Inc., Samsung Electronics Corporation, Apple Inc., Intel Corporation, Shanghai Technologies Corporation, Broadcom Inc., NVIDIA Corporation, Marvell Technology Group Ltd., STMicroelectronics, Texas Instruments Inc., NXP Semiconductors, Renesas Electronics Corporation, Fujitsu Semiconductor Limited, Google, MediaTek Inc., HiSilicon, Spreadtrum Communications and Allwinner Technology Corporation.
In February 2025, MediaTek has unveiled the Dimensity 7400 and Dimensity 7400X, designed to enhance AI processing, gaming performance, and power efficiency in smartphones and foldable devices. Both chipsets are built on TSMC's 4nm (N4P) process technology, ensuring improved energy efficiency and extended battery life.
In October 2024, Qualcomm introduced the Snapdragon 8 Elite Mobile Platform, heralded as the world's fastest mobile system-on-a-chip (SoC). This platform is powered by the second-generation Qualcomm Oryon(TM) CPU, featuring an octa-core configuration with two prime cores clocked at up to 4.32 GHz and six performance cores at up to 3.53 GHz.
Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.