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市场调查报告书
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1787889

2032 年系统晶片市场预测:按类型、核心数量、架构、应用、最终用户和地区进行的全球分析

System-on-Chip Market Forecasts to 2032 - Global Analysis By Type, Core Count, Architecture, Application, End User and By Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的预测,全球系统晶片市场规模预计在 2025 年达到 2,230.6 亿美元,到 2032 年将达到 4,374.5 亿美元,复合年增长率为 10.1%。

将电脑或电子系统所需的所有组件整合到单一晶片上的积体电路称为系统系统晶片晶片 (SoC)。它通常包含中央处理器 (CPU)、记忆体、输入/输出埠、图形处理单元 (GPU)、数位讯号处理器 (DSP)、无线通讯模组以及其他支援元件。 SoC 结构紧凑、节能且专为特定目的而设计,是嵌入式系统、行动装置和物联网 (IoT) 装置的理想选择。与传统的多晶片解决方案相比,SoC 透过将多种功能整合到单一晶片上,最大限度地减少了空间需求、提高了效能并降低了成本。

根据代表美国公司的领先产业组织半导体产业协会 (SIA) 的数据,该协会负责美国约 80% 的半导体生产,预计 2024 年全球半导体收益将达到 6276 亿美元(2025 年第一季为 1,677 亿美元,2025 年 4 月为 570 亿美元),成长 2.5%,成长 2.5%,成长 2.5%。

包括智慧型手机在内的行动装置增加

推动 SoC 市场发展的关键因素之一是智慧型手机和行动运算设备的快速成长。客户需要更强大、功能更丰富、支援多工、更节能、体积更小的设备。 SoC 透过将 CPU、GPU、数据机、记忆体控制器以及有时还整合到单一晶片上,不仅满足了这些需求,还降低了尺寸和功耗。这种整合技术使行动电话变得更薄、性能更快、电池续航时间更长。此外,随着 5G 在全球范围内的加速普及,整合 5G 数据机的 SoC 也正在开发中,这进一步提升了 SoC 在行动技术中的重要性。

製造成本高且初期投资大

开发SoC需要大量的前期投资,包括研发、设计工具、IP授权以及代工厂的进入。在先进节点(例如5奈米或3奈米)生产SoC需要成本高昂的半导体製造工艺,而晶圆厂(fab)的建造和营运成本高达数十亿美元。全球只有台积电、三星和英特尔等少数几家公司能够量产先进的SoC。高昂的资本支出对新参与企业和中小型公司构成了巨大的进入障碍。此外,即使是一个设计缺陷也可能导致对整个晶片进行昂贵且耗时的返工,从而导致巨大的故障和返工成本。

生物医学医疗设备和医疗保健的成长

新冠疫情 (COVID-19) 疫情推动了全球对穿戴式监控、远距医疗和诊断设备的需求,为 SoC 在医疗技术领域的整合开闢了新的途径。行动诊断套件、智慧胰岛素帮浦、穿戴式医疗设备以及连网心电图 (ECG)/心电图监测仪都需要安全有效的片上通讯和运算。透过将感测器、数据处理、无线通讯和安全功能整合到单一单元中,SoC 提供了可靠、紧凑的解决方案。人工智慧在医疗保健领域的应用,例如影像分析和预测诊断等任务,进一步推动了对具有医疗级安全性和处理能力的 SoC 的需求。

依赖少数代工厂

以台积电和三星为首的少数几家代工厂控制着先进SoC(尤其是采用5奈米和3奈米製程节点的SoC)的绝大部分製造。由于这种高度依赖,这些代工厂的停工,无论是由于产能限制、自然灾害、政治动盪或设备短缺,都可能影响全球SoC的生产。 2020-2022年的晶片短缺表明,依赖少数晶圆厂可能会严重影响家用电子电器、汽车和智慧型手机等下游产业。此外,这种垄断结构限制了晶片设计商的议价能力和价格竞争力,增加了供应侧出现瓶颈的可能性。

COVID-19的影响

新冠疫情最初扰乱了全球供应链、半导体製造和物流,原因是工厂关闭和劳动力短缺,尤其是在中国大陆、台湾和东南亚等主要製造地。这对系统晶片(SoC) 市场产生了多方面的影响。这些中断导致了严重的晶片短缺,使得包括家用电子电器、智慧型手机、汽车和工业设备在内的多个行业的 SoC 供应减少。这场疫情也加速了全球数位转型,推动了对基于 SoC 的设备(例如笔记型电脑、智慧型手机、物联网感测器、医疗穿戴设备和云端基础设施组件)的需求。此外,需求激增和供不应求导致价格波动,凸显了国内半导体能力的战略重要性。

预计数位 SoC 市场在预测期内将占据最大份额

预计数位SoC领域将在预测期内占据最大的市场占有率。这种主导地位源自于数位SoC在穿戴式装置、笔记型电脑、平板电脑、智慧型手机和高效能运算系统等家用电子电器的广泛应用。数位SoC透过将CPU、GPU、记忆体控制器以及最新的AI加速器等基本元件整合到单一晶片上,实现了强大的处理能力、节能性和紧凑的设备设计。此外,儘管对更快处理速度、5G设备、边缘AI和智慧应用的需求日益增长,数位SoC仍透过支援各行各业的各种即时和运算密集型应用继续占据市场主导地位。

预计预测期内汽车和运输领域将以最高的复合年增长率成长。

由于尖端电子设备在汽车中的应用日益广泛,尤其是联网汽车、自动驾驶系统和电动车,预计汽车和交通运输领域将在预测期内实现最高成长率。资讯娱乐、电池管理、车联网 (V2X)通讯和高级驾驶辅助系统 (ADAS) 等应用都依赖 SoC 来实现即时处理。随着汽车製造商转向集中式运算和软体定义的车辆架构,高性能、节能的 SoC 的需求日益增长。此外,汽车安全和排放标准的监管要求也迫使汽车製造商采用依赖基于 SoC 解决方案的智慧技术。

比最大的地区

预计亚太地区将在预测期内占据最大的市场占有率。该地区在消费性电子和半导体生产领域占据主导地位,各行各业也越来越多地采用最尖端科技。中国大陆、韩国、台湾和日本等国家和地区拥有主要的晶片代工厂、电子巨头以及强大的供应链生态系统,这些都促进了SoC的大规模开发和部署。智慧型手机、5G基础设施、电动车和物联网设备的强劲需求进一步推动了该位置SoC的消费。此外,印度「印度製造」计画等政府措施以及中国推动半导体自力更生的努力也在加速国内SoC的设计和製造。

复合年增长率最高的地区

预计北美地区在预测期内的复合年增长率最高。该地区在先进半导体设计领域的领先地位、对整合人工智慧和机器学习、边缘运算、无人驾驶汽车设备的高需求以及5G基础设施的日益普及,是推动这一成长的关键因素。 AMD、NVIDIA、高通和英特尔等主要科技公司和晶片设计公司的入驻,以及美国《晶片与科学法案》等政府专案的投资增加,正在刺激技术创新和国内製造业的发展。此外,云端资料中心、国防电子以及电动和自动驾驶汽车专案的成长,正在推动各行各业对系统单晶片(SoC)的快速应用。

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目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 二手研究资料
    • 先决条件

第三章市场走势分析

  • 介绍
  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球系统晶片市场类型

  • 介绍
  • 数位SoC
  • 混合讯号SoC
  • 模拟SoC
  • 射频/连接 SoC

6. 全球系统晶片市场(以核心数为单位)

  • 介绍
  • 单核
  • 双核心
  • 四核心
  • 八核心
  • 多核心

7. 全球系统晶片市场(依架构)

  • 介绍
  • 手臂
  • x86
  • RISC-V
  • 百万指令
  • 其他架构

第 8 章:全球系统晶片市场(按应用)

  • 介绍
  • 家用电子电器产品
  • 智慧型手机和便携式电子设备
  • ADAS 系统
  • 医疗设备
  • 射频设备
  • 电力电子
  • 有线和无线通讯设备
  • 其他的

9. 全球系统晶片市场(按最终用户)

  • 介绍
  • 家用电子电器
  • 汽车和运输
  • 资讯科技/通讯
  • 航太和国防
  • 卫生保健
  • 电力/公共产业
  • 其他的

第 10 章:全球系统晶片市场(按地区)

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十二章 公司概况

  • Broadcom Inc.
  • Intel Corporation
  • Huawei Technologies Co. Ltd.
  • Microchip Technology Inc
  • Advanced Micro Devices Inc.
  • NXP Semiconductors NV
  • MediaTek Inc.
  • Infineon Technologies AG
  • Toshiba Corporation
  • STMicroelectronics NV
  • Apple, Inc.
  • NVIDIA Corporation
  • Texas Instruments Incorporated
  • Samsung Electronics Co. Ltd.
  • Qualcomm Incorporated
  • Renesas Electronics Corporation
  • Taiwan Semiconductor Manufacturing Co., Ltd.
Product Code: SMRC30154

According to Stratistics MRC, the Global System-on-Chip Market is accounted for $223.06 billion in 2025 and is expected to reach $437.45 billion by 2032 growing at a CAGR of 10.1% during the forecast period. The integrated circuit that houses all of the necessary parts of a computer or electronic system on a single chip is called a System-on-Chip (SoC). A central processing unit (CPU), memory, input/output ports, and auxiliary parts like graphics processing units (GPUs), digital signal processors (DSPs), and wireless communication modules are usually included. Compact, power-efficient, and application-specific, SoCs are perfect for embedded systems, mobile devices, and Internet of Things (IoT) gadgets. In comparison to conventional multi-chip solutions, SoCs minimize space requirements, improve performance, and lower costs by combining multiple functions into a single chip.

According to the Semiconductor Industry Association (SIA)-a key trade association that represents U.S. companies responsible for roughly 80% of America's semiconductor production-global semiconductor revenue reached $627.6 billion in 2024, including $167.7 billion in the first quarter of 2025, and $57.0 billion in April 2025, reflecting an increase of 2.5%.

Market Dynamics:

Driver:

Increase in smartphones and other mobile devices

One of the main factors propelling the SoC market is the exponential rise in smartphones and mobile computing devices. Customers are calling for more potent, feature-rich, multitasking, energy-efficient, and small devices. By combining the CPU, GPU, modem, memory controller, and occasionally AI engines onto a single chip, SoCs satisfy these requirements while lowering size and power consumption. Thinner phones with faster performance and longer battery life are made possible by this integration. Moreover, SoCs with integrated 5G modems are also being developed as 5G adoption picks up speed worldwide, further solidifying their importance in mobile technologies.

Restraint:

High fabrication costs and initial investment

Large upfront expenditures in R&D, design tools, IP licensing, and foundry access are required for SoC development. The fabrication of SoCs at advanced nodes (such as 5 nm and 3 nm) requires very costly semiconductor fabrication processes; the construction and operation of fabrication plants (fabs) can cost billions of dollars. Only a small number of businesses worldwide, including TSMC, Samsung, and Intel, are able to mass-produce sophisticated SoCs. The high capital expenditure serves as a major barrier to entry for new or smaller players. Furthermore, a single design flaw may require an expensive and time-consuming re-spin of the entire chip, resulting in a huge cost of failure or rework.

Opportunity:

Growth in biomedical devices and healthcare

Enhanced by the COVID-19 pandemic, the global demand for wearable monitoring, remote healthcare, and diagnostic devices has opened up new avenues for SoC integration in medical technology. Mobile diagnostic kits, smart insulin pumps, wearable medical devices, and connected ECG/EKG monitors all need secure and effective on-chip communication and computation. Through the integration of sensors, data processing, wireless communication, and security features into a single unit, SoCs offer a dependable and small solution. Additionally, a further factor driving demand for SoCs with medical-grade safety and processing capabilities is the use of AI in healthcare for tasks like imaging analysis and predictive diagnostics.

Threat:

Reliance on a small group of foundries

A small number of companies, most notably TSMC and Samsung Foundry, control a large portion of the manufacturing of advanced SoCs, especially those that use 5 nm and 3 nm process nodes. Because of this concentrated reliance, any interruption in these foundries-whether brought on by capacity limitations, natural disasters, political unrest, or equipment shortages-may have an impact on the production of SoC worldwide. The shortage of chips in 2020-2022 demonstrated how downstream industries like consumer electronics, automobiles, and smartphones can be seriously crippled by reliance on a small number of fabs. Moreover, chip designers' bargaining power and price competitiveness are restricted by this monopoly-like structure, raising the possibility of supply-side bottlenecks.

Covid-19 Impact:

Due to factory closures and labor shortages, particularly in major manufacturing hubs like China, Taiwan, and Southeast Asia, the COVID-19 pandemic initially disrupted global supply chains, semiconductor fabrication, and logistics. This had a multifaceted effect on the System-on-Chip (SoC) market. Due to these disruptions, there was a severe shortage of chips, which impacted the availability of SoCs in a variety of industries, including consumer electronics, smartphones, automobiles, and industrial devices. Global digital transformation was also sped up by the pandemic, which raised demand for SoC-powered gadgets like laptops, smartphones, IoT sensors, medical wearables, and cloud infrastructure parts. Additionally, price volatility resulted from this spike in demand and supply shortages, underscoring the strategic significance of domestic semiconductor capabilities.

The digital SoCs segment is expected to be the largest during the forecast period

The digital SoCs segment is expected to account for the largest market share during the forecast period. The extensive use of digital SoCs in consumer electronics like wearables, laptops, tablets, smartphones, and high-performance computing systems is what is causing this dominance. Digital SoCs allow for powerful processing, energy efficiency, and small device designs by combining necessary parts like CPUs, GPUs, memory controllers, and increasingly AI accelerators onto a single chip. Furthermore, digital SoCs continue to dominate the market by supporting a wide range of real-time and compute-intensive applications across industries, despite the growing demand for faster processing, 5G-enabled devices, AI at the edge, and smart applications.

The automotive and transportation segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive and transportation segment is predicted to witness the highest growth rate because of the growing use of cutting-edge electronics in automobiles, particularly in connected cars, autonomous driving systems, and electric vehicles. Applications like infotainment, battery management, vehicle-to-everything (V2X) communication, and advanced driver assistance systems (ADAS) depend on SoCs to enable real-time processing. High-performance, energy-efficient SoCs are becoming more and more in demand as automakers move toward centralized computing and software-defined vehicle architectures. Additionally, manufacturers are being forced to embrace smart technologies that rely on SoC-based solutions due to regulatory requirements for vehicle safety and emission standards.

Region with largest share:

During the forecast period, the Asia-Pacific region is expected to hold the largest market share, driven by the area's leadership in the production of consumer electronics and semiconductors, as well as the expanding use of cutting-edge technologies in a variety of industries. Major chip foundries, electronics behemoths, and a strong supply chain ecosystem that facilitates large-scale SoC development and deployment are located in nations like China, South Korea, Taiwan, and Japan. SoC consumption is further increased in the region by the robust demand for smartphones, 5G infrastructure, electric vehicles, and Internet of Things devices. Furthermore, domestic SoC design and manufacturing are also being accelerated by government initiatives like India's "Make in India" program and China's push for semiconductor self-reliance.

Region with highest CAGR:

Over the forecast period, the North American region is anticipated to exhibit the highest CAGR. The region's leadership in advanced semiconductor design, the high demand for devices with AI and ML integrated, and the growing uptake of edge computing, driverless cars and 5G infrastructures are all contributing factors to this growth. Growing investments under government programs like the U.S. CHIPS and Science Act, along with the presence of significant tech firms and chip designers like AMD, NVIDIA, Qualcomm, and Intel, are speeding up innovation and domestic manufacturing. Moreover, rapid SoC adoption across a variety of industries is also being fueled by the growth of cloud data centers, defense-grade electronics, and electric and autonomous vehicle programs.

Key players in the market

Some of the key players in System-on-Chip Market include Broadcom Inc., Intel Corporation, Huawei Technologies Co. Ltd., Microchip Technology Inc, Advanced Micro Devices Inc., NXP Semiconductors NV, MediaTek Inc., Infineon Technologies AG, Toshiba Corporation, STMicroelectronics NV, Apple, Inc., NVIDIA Corporation, Texas Instruments Incorporated, Samsung Electronics Co. Ltd., Qualcomm Incorporated, Renesas Electronics Corporation and Taiwan Semiconductor Manufacturing Co., Ltd.

Key Developments:

In July 2025, Microchip Technology announces that under a new partnership agreement with Delta Electronics, Inc. the companies will collaborate to use Microchip's mSiC(TM) products and technology in Delta's designs. The synergies between the companies aim to accelerate the development of innovative SiC solutions, energy-saving products and systems that enable a more sustainable future.

In April 2025, Intel Corporation announced that it has entered into a definitive agreement to sell 51% of its Altera business to Silver Lake, a global leader in technology investing. The transaction, which values Altera at $8.75 billion, establishes Altera's operational independence and makes it the largest pure-play FPGA semiconductor solutions company.

In November 2024, Broadcom Inc. and Telia Company announced the expansion of their longtime partnership with a new multi-year agreement, which will see Telia further modernize and transform its telco and cloud infrastructure with the VMware product portfolio. Telia, a Nordic and Baltic telecommunications leader and Nordic media house, will continue its network and IT cloud journey with both VMware Telco Cloud Platform and VMware Cloud Foundation as the basis of its modern cloud platform.

Types Covered:

  • Digital SoCs
  • Mixed-Signal SoCs
  • Analog SoCs
  • RF/Connectivity SoCs

Core Counts Covered:

  • Single-core
  • Dual-core
  • Quad-core
  • Octa-core
  • Multi-core

Architectures Covered:

  • ARM
  • x86
  • RISC-V
  • MIPS
  • Other Architectures

Applications Covered:

  • Home Appliances
  • Smartphones & Portable Electronic Devices
  • ADAS System
  • Medical Devices
  • RF Devices
  • Power Electronics
  • Wired & Wireless Communication Devices
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive and Transportation
  • IT & Telecommunication
  • Aerospace & Defense
  • Healthcare
  • Power & Utility
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global System-on-Chip Market, By Type

  • 5.1 Introduction
  • 5.2 Digital SoCs
  • 5.3 Mixed-Signal SoCs
  • 5.4 Analog SoCs
  • 5.5 RF/Connectivity SoCs

6 Global System-on-Chip Market, By Core Count

  • 6.1 Introduction
  • 6.2 Single-core
  • 6.3 Dual-core
  • 6.4 Quad-core
  • 6.5 Octa-core
  • 6.6 Multi-core

7 Global System-on-Chip Market, By Architecture

  • 7.1 Introduction
  • 7.2 ARM
  • 7.3 x86
  • 7.4 RISC-V
  • 7.5 MIPS
  • 7.6 Other Architectures

8 Global System-on-Chip Market, By Application

  • 8.1 Introduction
  • 8.2 Home Appliances
  • 8.3 Smartphones & Portable Electronic Devices
  • 8.4 ADAS System
  • 8.5 Medical Devices
  • 8.6 RF Devices
  • 8.7 Power Electronics
  • 8.8 Wired & Wireless Communication Devices
  • 8.9 Other Applications

9 Global System-on-Chip Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive and Transportation
  • 9.4 IT & Telecommunication
  • 9.5 Aerospace & Defense
  • 9.6 Healthcare
  • 9.7 Power & Utility
  • 9.8 Other End Users

10 Global System-on-Chip Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Broadcom Inc.
  • 12.2 Intel Corporation
  • 12.3 Huawei Technologies Co. Ltd.
  • 12.4 Microchip Technology Inc
  • 12.5 Advanced Micro Devices Inc.
  • 12.6 NXP Semiconductors NV
  • 12.7 MediaTek Inc.
  • 12.8 Infineon Technologies AG
  • 12.9 Toshiba Corporation
  • 12.10 STMicroelectronics NV
  • 12.11 Apple, Inc.
  • 12.12 NVIDIA Corporation
  • 12.13 Texas Instruments Incorporated
  • 12.14 Samsung Electronics Co. Ltd.
  • 12.15 Qualcomm Incorporated
  • 12.16 Renesas Electronics Corporation
  • 12.17 Taiwan Semiconductor Manufacturing Co., Ltd.

List of Tables

  • Table 1 Global System-on-Chip Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global System-on-Chip Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global System-on-Chip Market Outlook, By Digital SoCs (2024-2032) ($MN)
  • Table 4 Global System-on-Chip Market Outlook, By Mixed-Signal SoCs (2024-2032) ($MN)
  • Table 5 Global System-on-Chip Market Outlook, By Analog SoCs (2024-2032) ($MN)
  • Table 6 Global System-on-Chip Market Outlook, By RF/Connectivity SoCs (2024-2032) ($MN)
  • Table 7 Global System-on-Chip Market Outlook, By Core Count (2024-2032) ($MN)
  • Table 8 Global System-on-Chip Market Outlook, By Single-core (2024-2032) ($MN)
  • Table 9 Global System-on-Chip Market Outlook, By Dual-core (2024-2032) ($MN)
  • Table 10 Global System-on-Chip Market Outlook, By Quad-core (2024-2032) ($MN)
  • Table 11 Global System-on-Chip Market Outlook, By Octa-core (2024-2032) ($MN)
  • Table 12 Global System-on-Chip Market Outlook, By Multi-core (2024-2032) ($MN)
  • Table 13 Global System-on-Chip Market Outlook, By Architecture (2024-2032) ($MN)
  • Table 14 Global System-on-Chip Market Outlook, By ARM (2024-2032) ($MN)
  • Table 15 Global System-on-Chip Market Outlook, By x86 (2024-2032) ($MN)
  • Table 16 Global System-on-Chip Market Outlook, By RISC-V (2024-2032) ($MN)
  • Table 17 Global System-on-Chip Market Outlook, By MIPS (2024-2032) ($MN)
  • Table 18 Global System-on-Chip Market Outlook, By Other Architectures (2024-2032) ($MN)
  • Table 19 Global System-on-Chip Market Outlook, By Application (2024-2032) ($MN)
  • Table 20 Global System-on-Chip Market Outlook, By Home Appliances (2024-2032) ($MN)
  • Table 21 Global System-on-Chip Market Outlook, By Smartphones & Portable Electronic Devices (2024-2032) ($MN)
  • Table 22 Global System-on-Chip Market Outlook, By ADAS System (2024-2032) ($MN)
  • Table 23 Global System-on-Chip Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 24 Global System-on-Chip Market Outlook, By RF Devices (2024-2032) ($MN)
  • Table 25 Global System-on-Chip Market Outlook, By Power Electronics (2024-2032) ($MN)
  • Table 26 Global System-on-Chip Market Outlook, By Wired & Wireless Communication Devices (2024-2032) ($MN)
  • Table 27 Global System-on-Chip Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 28 Global System-on-Chip Market Outlook, By End User (2024-2032) ($MN)
  • Table 29 Global System-on-Chip Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 30 Global System-on-Chip Market Outlook, By Automotive and Transportation (2024-2032) ($MN)
  • Table 31 Global System-on-Chip Market Outlook, By IT & Telecommunication (2024-2032) ($MN)
  • Table 32 Global System-on-Chip Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 33 Global System-on-Chip Market Outlook, By Healthcare (2024-2032) ($MN)
  • Table 34 Global System-on-Chip Market Outlook, By Power & Utility (2024-2032) ($MN)
  • Table 35 Global System-on-Chip Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.