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市场调查报告书
商品编码
2007838
光子整合运算市场预测至2034年-全球分析(按整合类型、组件、材料平台、运算架构、波长范围、应用、最终用户和地区划分)Photonic Integrated Computing Market Forecasts to 2034 - Global Analysis By Integration Type, Component, Material Platform, Computing Architecture, Wavelength Range, Application, End User, and By Geography |
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根据 Stratistics MRC 的数据,预计到 2026 年,全球光子整合计算市场规模将达到 13 亿美元,并在预测期内以 21.5% 的复合年增长率增长,到 2034 年将达到 63 亿美元。
光子整合运算利用光而非电子进行资料处理和传输,与传统电子设备相比,可实现超高频宽、低延迟和显着的节能效果。这些系统将雷射、调製器和检测器等光学元件整合到单一晶片上,实现高速资料通讯、高级感测和人工智慧加速器等应用。随着资料中心需求、自主系统和下一代运算架构对光学解决方案的依赖性日益增强,预计该市场将快速扩张。
人工智慧和资料中心对频宽的需求激增
人工智慧 (AI) 工作负载和超大规模资料中心的爆炸性成长,迫切需要速度更快、能源效率更高的互连技术,而传统的铜基解决方案已无法满足这一需求。光子积体电路能够以极低的功耗实现Terabit特级的资料传输,直接解决了运算密集型环境中的瓶颈问题。随着 AI 模型规模每隔几个月就翻一番,光 I/O 的经济和技术优势显而易见,正加速其在全球云端服务供应商、半导体製造商和高效能运算设施中的应用。
製造流程的复杂性和高成本
光子积体电路的製造需要专门的代工厂、化合物半导体材料和精密封装技术,这些高成本标准CMOS电子元件。缺乏标准化的设计工具和製程设计套件(PDK)进一步增加了开发成本,延长了新产品的上市时间。雷射和硅光电混合整合带来的产量比率挑战也增加了成本,这限制了资金雄厚的成熟企业的准入,同时也延缓了小规模创新者本可以加速市场多元化。
与CMOS电子元件在共封装光学元件中的集成
将光电与传统CMOS电子技术融合到共封装光学元件中,为克服成本和复杂性障碍提供了突破性的机会。透过在同一基板上直接整合光引擎和开关硅,製造商可以利用现有的半导体基础设施,简化封装、提高能源效率并实现规模经济。领先的晶片製造商正在大力投资于此,从而为开发具有成本竞争力的光子运算解决方案铺平了道路,这些解决方案可部署在主流伺服器架构、通讯设备和边缘运算节点中。
与先进电子互连技术的竞争
低压差分讯号传输和铜基主动主动电缆等电讯号传输技术的持续创新,可能会缩小目前光子解决方案所拥有的性能优势。近封装光学元件和先进均衡技术等新兴技术,使得以往使用电链路的光技术能够实现更远的传输距离和更高的资料传输速度。如果这些电子替代方案能够在保持成本和整合优势的同时,提供足够的效能提升,那么光子整合运算的普及速度可能会放缓,尤其是在对成本较为敏感的市场领域。
疫情加速了数位转型,增加了对云端服务、串流媒体和远端协作的需求。这进一步加剧了资料中心频宽和电力预算的压力。儘管供应链中断暂时阻碍了光元件的供应,但整体影响是正面的。企业和超大规模资料中心业者加快了基础设施升级,优先考虑光连接模组。此次危机也凸显了弹性低延迟网路的重要性,并促使企业做出长期投资承诺,这将持续支撑光整合运算市场的发展动能。
预计在预测期内,混合整合细分市场将成为最大的细分市场。
预计在预测期内,混合整合领域将成为最大的细分市场。混合整合利用成熟的製造工艺,结合不同材料平台(例如用于发光的III-V族半导体和用于被动电路的硅)的优异特性,从而实现高性能。这种方法允许在组装前对雷射、调製器和检测器进行单独最佳化,与单晶片整合方法相比,可获得更高的光学效率和可靠性。其柔软性支援快速原型製作和异质系统设计,使得混合整合成为通讯、资料中心和新兴运算应用中复杂光子积体电路的理想选择。
在预测期内,光连接模组产业预计将呈现最高的复合年增长率。
预计在预测期内,光连接模组领域将呈现最高的成长率。光连接模组以高速光子连接取代晶片、基板和系统之间传统的电连接,从而显着提高频宽密度和能源效率。随着运算节点日益分散化和记忆体池不断扩展,对超低延迟、可扩展互连解决方案的需求呈指数级增长。光子互连支援晶片级处理器和机架级运算等架构,这些架构对于人工智慧丛集和高效能运算至关重要。光互连在下一代系统设计中发挥的关键作用,正推动其显着的成长动能。
在整个预测期内,北美预计将保持最大的市场份额,这主要得益于大型科技公司和领先的半导体代工厂的存在,以及政府对研发的大力投入。美国拥有密集的微光子积体电路Start-Ups生态系统、成熟的无晶圆厂设计公司以及超大规模资料中心营运商,这些企业都是光连接模组解决方案的早期采用者。在国家光电计画等项目的支持下,倡议合作将加速商业化进程,并在整个预测期内保持该地区的技术领先地位。
在预测期内,亚太地区预计将呈现最高的复合年增长率,这主要得益于半导体製造基础设施的大规模投资以及中国、日本和韩国资料中心的快速扩张。政府主导的旨在实现先进封装和光电自给自足的倡议,加上该地区在家用电子电器和通讯设备领域的领先地位,正在为技术应用创造有利环境。随着国内云端服务供应商不断提升其人工智慧能力,对光子整合运算解决方案的需求将加速成长,成长速度将超过其他地区。
According to Stratistics MRC, the Global Photonic Integrated Computing Market is accounted for $1.3 billion in 2026 and is expected to reach $6.3 billion by 2034 growing at a CAGR of 21.5% during the forecast period. Photonic integrated computing leverages light rather than electrons to process and transmit data, delivering ultra-high bandwidth, low latency, and dramatically reduced energy consumption compared to conventional electronics. These systems integrate optical components such as lasers, modulators, and detectors onto a single chip, enabling high-speed data communication, advanced sensing, and AI accelerator applications. The market is poised for rapid expansion as data-center demands, autonomous systems, and next-generation computing architectures increasingly rely on photonic solutions.
Soaring bandwidth demands from AI and data centers
The explosive growth of artificial intelligence workloads and hyperscale data centers is creating an urgent need for faster, more energy-efficient interconnects that traditional copper-based solutions cannot satisfy. Photonic integrated circuits enable terabit-scale data movement with a fraction of the power, directly addressing the bottleneck in compute-intensive environments. As AI model sizes double every few months, the economic and technical advantages of optical I/O become impossible to ignore, driving widespread adoption across cloud providers, semiconductor manufacturers, and high-performance computing facilities globally.
High manufacturing complexity and cost
Fabricating photonic integrated circuits requires specialized foundries, compound semiconductor materials, and precision packaging techniques that remain significantly more expensive than standard CMOS electronics. The lack of standardized design tools and process design kits (PDKs) further raises development costs and extends time-to-market for new products. Yield challenges associated with hybrid integration of lasers with silicon photonics add another layer of expense, limiting accessibility to well-funded incumbents and slowing the entry of smaller innovators who could otherwise accelerate market diversification.
Integration with CMOS electronics for co-packaged optics
The convergence of photonics with traditional CMOS electronics in co-packaged optics presents a transformative opportunity to overcome cost and complexity barriers. By combining optical engines directly with switching silicon on the same substrate, manufacturers can simplify packaging, improve power efficiency, and achieve economies of scale using established semiconductor infrastructure. Major chipmakers are investing heavily in this approach, creating a clear pathway toward cost-competitive photonic computing solutions that can be deployed across mainstream server architectures, telecommunications equipment, and edge computing nodes.
Competition from advanced electronic interconnects
Continuous innovation in electrical signaling, including low-voltage differential signaling and copper-based active cables, threatens to narrow the performance gap that currently favors photonic solutions. Emerging technologies such as near-package optics and advanced equalization techniques allow electrical links to reach distances and data rates previously thought impossible without optics. If these electronic alternatives deliver sufficient performance improvements while maintaining cost and integration advantages, they could delay the widespread adoption of photonic integrated computing, particularly in cost-sensitive market segments.
The pandemic accelerated digital transformation, intensifying demand for cloud services, streaming, and remote collaboration, which in turn increased pressure on data-center bandwidth and power budgets. Supply chain disruptions temporarily hampered photonic component availability, but the overall effect was a net positive: enterprises and hyperscalers fast-tracked infrastructure upgrades that favor optical interconnects. The crisis also underscored the importance of resilient, low-latency networks, prompting long-term investment commitments that continue to support photonic integrated computing market momentum.
The Hybrid Integration segment is expected to be the largest during the forecast period
The hybrid integration segment is anticpated to be the largest during the forecast period. Hybrid integration combines the best attributes of different material platforms such as III-V semiconductors for light generation and silicon for passive circuitry enabling high performance while leveraging established manufacturing processes. This approach allows lasers, modulators, and detectors to be optimized independently before assembly, yielding superior optical efficiency and reliability compared to monolithic alternatives. Its flexibility supports rapid prototyping and heterogeneous system design, making hybrid integration the preferred choice for complex photonic integrated circuits across telecommunications, data centers, and emerging computing applications.
The Optical Interconnects segment is expected to have the highest CAGR during the forecast period
The optical interconnects segment is estimated to have the highest growth rate during the forecast period. Optical interconnects replace traditional electrical links with high-speed photonic connections between chips, boards, and systems, delivering dramatic improvements in bandwidth density and energy efficiency. As compute nodes become more disaggregated and memory pools expand, the need for ultra-low-latency, scalable interconnect solutions grows exponentially. Photonic interconnects enable architectures such as chiplet-based processors and rack-scale computing, which are critical for AI clusters and high-performance computing. This foundational role in next-generation system design underpins its exceptional growth trajectory.
During the forecast period, the North America region is expected to hold the largest market share, driven by the presence of major technology companies, leading semiconductor foundries, and robust government research funding. The United States hosts a dense ecosystem of photonic integrated circuit startups, established fabless design houses, and hyperscale data-center operators who are early adopters of optical interconnect solutions. Collaborative initiatives between industry and academia, supported by programs like the National Photonics Initiative, accelerate commercialization and maintain the region's technological lead throughout the forecast period.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, fueled by massive investments in semiconductor manufacturing infrastructure and the rapid expansion of data centers across China, Japan, and South Korea. Government-backed initiatives to achieve self-sufficiency in advanced packaging and photonics, combined with the region's dominance in consumer electronics and telecommunications equipment, create a fertile environment for adoption. As domestic cloud service providers scale their AI capabilities, demand for photonic integrated computing solutions will grow at an accelerated pace, outpacing other regions.
Key players in the market
Some of the key players in Photonic Integrated Computing Market include Intel Corporation, IBM Corporation, Cisco Systems, Broadcom Inc., NVIDIA Corporation, GlobalFoundries, STMicroelectronics, Infinera Corporation, Lumentum Holdings, Coherent Corporation, Ayar Labs, Lightmatter, Lightelligence, Rockley Photonics, and Marvell Technology.
In March 2026, IBM unveiled a new blueprint for quantum-centric supercomputing, highlighting a reference architecture that integrates quantum processors (QPUs) with traditional GPUs and CPUs. This architecture relies on advanced interconnects and photonic-ready logic scaling to tackle complex scientific simulations.
In March 2026, Cisco expanded its Secure AI Factory collaboration with NVIDIA, focusing on integrated packages that simplify the deployment of photonic-based networking for large-scale enterprise AI infrastructure.
In November 2025, Intel announced a massive expansion of its patent portfolio focused on co-packaged optics (CPO) and glass substrates. The company revealed prototypes of its Optical Compute Interconnect (OCI), which utilizes a Photonic Integrated Circuit (PIC) hybrid-bonded to a glass substrate to achieve higher bandwidth and lower power consumption for future AI CPUs and GPUs.
Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.