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全球人工智慧资料中心互连趋势（2025）
市场调查报告书
商品编码
1873713

全球人工智慧资料中心互连趋势（2025）

2025 Global AI Data Center Interconnect Trends
出版日期: | 出版商: TrendForce | 英文 8 Pages | 商品交期: 最快1-2个工作天内

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简介目录

人工智慧驱动的资料中心正从单晶片架构演进异质多GPU架构。高速光互连实现了可扩展性，而硅光子学和共封装光学技术则在模组化、基于生态系统的竞争中提升了频宽和能源效率。

样品预览


主要亮点：

  • 从单一节点到多层协作互连（纵向扩展、横向扩展、横向扩展）。
  • 高速光互连正在设定效能和可扩展性的极限，从而推动对收发器的需求。
  • 硅光子学、共封装和光I/O正在降低功耗并提高频宽。
  • 供应商正在寻求生态系统整合或模组化，从而推动系统级和平台级的竞争。

目录

第一章：引言

  • 2025年光收发器模组出货量：高规格800G和1.6T模组将成长

第二章：AI资料中心架构从单节点设计转向包含纵向扩展、横向扩展和跨域扩展架构的分层协作互连模型

  • 纵向扩展、横向扩展和跨域扩展互连技术范例
  • 资料中心网路三大扩展架构比较

第三章：对高频宽、低损耗通讯日益增长的需求将推动光解决方案取代铜线，成为互连的主流机架内部以及资料中心之间。

  • 光通讯模组正从可插拔晶片发展到专用积体电路 (ASIC) 晶片，最终实现光元件和 ASIC 的共封装。
  • 台湾半导体元件、光通讯元件和计算设备的一体化供应链

第四章：未来竞争格局：NVIDIA 和 Broadcom 专注于生态系统整合和模组化，推动资料中心互连市场成长

  • NVIDIA 与 Broadcom：资料中心互连技术与产品对比

第五章：市场竞争从晶片效能延伸至系统和生态系统平台开发，提高资料传输效率是未来成功的关键

简介目录
Product Code: TRi-0096

AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandwidth and energy efficiency amid modular, ecosystem-based competition.

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Key Highlights:

  • Shift from single node to multi layer collaborative interconnect (Scale Up, Scale Out, Scale Across).
  • High speed optical interconnects set performance and scalability limits; transceiver demand rises.
  • Silicon photonics, co packaging and optical I/O reduce power and raise bandwidth.
  • Vendors pursue ecosystem integration or modularization, driving system level and platform-based competition.

Table of Contents

1. Introduction

  • Shipments of Optical Transceiver Modules in 2025 Have Shown Growth for High-Spec 800G and 1.6T Modules

2. AI Data Center Architectures Are Transitioning from Single-Node Designs to a Hierarchical Collaborative Interconnection Model, Encompassing Scale-Up, Scale-Out, and Scale-Across Architectures

  • Examples of Scale-Up, Scale-Out, and Scale-Across Interconnect Technologies
  • Comparison of Three Major Expansion Architectures for Data Center Networks

3. Rising Demand for High-Bandwidth, Low-Loss Communication Drives Optical Solutions to Replace Copper Wires as Mainstream Interconnects Within Racks and Between Data Centers

  • Optical Communication Modules Are Evolving from Pluggable Forms to ASIC Chips and Will Ultimately Achieve Co-Packaging of Optical Components and ASICs
  • Supply Chain for Integration of Semiconductor Components, Optical Communication Components, and Computing Equipment in Taiwan

4. Future Competitive Landscape: NVIDIA and Broadcom Will Respectively Focus on Ecosystem Integration and Modularization, Driving Growth in Data Center Interconnect Market

  • NVIDIA vs. Broadcom: Comparison of Data Center Interconnect Technologies and Products

5. Market Competition Will Expand from Chip Performance to Development of Systems and Ecosystem Platforms; Enhanced Data Transmission Efficiency Is the Key to Future Success