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市场调查报告书
商品编码
1996647

谷歌资料中心互连架构:800G+光学模组的兴起及2026年供应链展望

Google's Data Center Interconnect Architecture: Rise of 800G+ Optical Modules and 2026 Supply Chain Outlook

出版日期: | 出版商: TrendForce | 英文 14 Pages | 商品交期: 最快1-2个工作天内

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简介目录

1. 谷歌正在将其专有的TPU、Ironwood机架、3D Torus拓扑结构和Apollo OCS光纤骨干网路整合到一个统一的高速互连架构中。因此,丛集规划的重点正从单一伺服器转向以机架和超级伺服器舱为中心的模组化设计。

2. 在这种架构下,资料中心部署中超过 800G 的高速光学模组的比例预计将从 2024 年的约 20% 增加到 2026 年的 60% 以上。这些模组不再是可选的升级,而是正在成为下一代丛集的标准配置,推动每年的需求量达到数百万个单元。

3. 在光互连供应链中,超过800G的光学模组和OCS系统正成为深度整合到Google基础设施中的关键组件。预计2026年至2028年间,该领域的供应紧张程度和盈利将主要取决于雷射和MEMS的产能和产量比率。

4. 对于产业策略家和投资者而言,仅关注GPU和TPU的出货量不足以评估未来几年的市场前景。追踪800G/1.6T光学模组的出货量和渗透率同样重要,有助于全面了解运算能力部署与高速互连投资之间的结构性转变。

本报告深入分析了高速光学模组市场,并提供了有关Google资料中心互连架构变化的影响的资讯。

目录

第一章:Google:从内部运算使用者到高速互连设计者

第二章:这种架构转变将透过两种主要方式重塑高速光学模组市场

第三章:Google的 Fabric 架构

第四章:高速光学与供应链动态

第五章:情境分析

第六章:TRI的观点

简介目录
Product Code: TRi-173

1. Google is consolidating its proprietary TPUs, Ironwood racks, 3D Torus topology, and the Apollo OCS optical backbone into a unified high-speed interconnect architecture. As a result, the focus of cluster planning is shifting from individual servers to modular designs centered on racks and Superpods.

2. Under this architecture, the share of 800G+ high-speed optical modules in data centers deployments is projected to grow from roughly 20% in 2024 to over 60% by 2026. No longer an optional upgrade, these modules are becoming the baseline configuration for next-generation clusters, driving annual demand into the millions.

3. For the optical interconnect supply chain, 800G+ optical modules and OCS systems are becoming critical elements deeply integrated with Google's infrastructure. Between 2026 and 2028, supply tightness and profitability within the sector will be primarily driven by the available production capacity and yield rates of lasers and MEMS.

4. For industry strategists and investors, assessing the market outlook over the coming years requires looking beyond GPU and TPU shipments. It is equally important to track the shipment volume and penetration of 800G/1.6T optical modules to fully understand the structural shifts between computing power deployment and high-speed interconnect investments.

Key Highlights

  • Google integrates TPUs, Ironwood racks, 3D Torus topology, and Apollo OCS into a unified high-speed interconnect, shifting cluster planning from server-centric to rack- and Superpod-centric modular designs.
  • High-speed optical modules (800G+) see rising deployment in data centers, evolving from optional to essential baseline for next-gen clusters, fueling massive demand.
  • Optical interconnect supply chain emphasizes 800G+ modules and OCS as core to Google's infrastructure; future tightness and profitability hinge on laser and MEMS production capacity and yields.
  • Strategists and investors should track 800G/1.6T module shipments and penetration beyond GPU/TPU volumes to grasp shifts in computing power and interconnect investments.

Table of Contents

1. Google: From In-House Compute User to Architect of High-Speed Interconnects

2. Two primary ways this architectural shift is reshaping the high-speed optical module market

  • Figure 1: 2024~2026 Global Transceiver Shipments
  • Figure 2: 2026 >800G Transceiver Shipment & Google TPU Shipment

3. Google Fabric Architecture

  • Figure 3: Ironwood TPU Fabric
  • Figure 4: 3D Torus & Apollo OCS
  • Table 1: Analysis of Google's Network Architecture

4. High Speed Optics & Supply Chain Dynamics

5. Scenario Analysis

  • Table 2: Bear/Base/Bull Scenarios for Annual TPU Shipments in 2026
  • Table 3: Impact of Bear/Base/Bull Scenarios on Architecture, Supply Chain, and Technology

6. TRI's View