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半导体代工市场 - 2018-2028 年全球产业规模、份额、趋势、机会和预测，按技术节点、按应用、地区、竞争细分

Semiconductor Foundry Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Technology Node, By Application, By Region, By Competition, 2018-2028
出版日期: | 出版商: TechSci Research | 英文 188 Pages | 商品交期: 2-3个工作天内

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简介目录

2022 年全球半导体代工市场价值达 760 亿美元，预计在预测期内将强劲成长，到 2028 年复合CAGR为7.1%。在多种因素的共同推动下，全球半导体代工市场正经历显着成长。它在现代数位经济中发挥着举足轻重的作用。专门从事积体电路 (IC) 製造的半导体代工厂已成为多个行业创新的关键。对电子产品小型化和效能增强的不懈追求，加上 5G、人工智慧 (AI) 和物联网 (IoT) 等变革性技术的出现，导致了对先进微晶片的巨大需求。

主要市场驱动因素

市场概况
预测期 2024-2028
2022 年市场规模 760 亿美元
2028 年市场规模 1157.3亿美元
2023-2028 年CAGR 7.1%
成长最快的细分市场 汽车
最大的市场 亚太地区

对先进半导体解决方案的需求不断增长

由于各行业对先进半导体解决方案的需求不断增长，全球半导体代工市场正经历显着成长。随着汽车、消费性电子、电信和物联网设备等产业不断发展，对电子产品的性能和效率提出更高的要求，对先进半导体的需求变得至关重要。需求激增是由多种因素推动的。首先，技术进步导致了创新应用和产品的发展，需要更强大和更复杂的半导体。例如，电动车、自动驾驶和智慧家庭的兴起需要具有更高处理能力、更高能源效率和增强连接性的半导体。其次，将半导体製造外包给专业代工厂的趋势不断成长，推动了市场的成长。许多公司更愿意专注于自己的核心竞争力，同时依靠半导体代工厂实现高效且具成本效益的製造流程。外包使公司能够获得先进的製造技术、减少资本支出并受益于专业铸造厂的专业知识。此外，半导体设计的复杂性显着增加，需要专门的专业知识和资源。代工厂提供设计服务、製程技术和製造专业知识，帮助公司将复杂的半导体设计推向市场。

这种合作使公司能够利用代工厂的能力并加快上市时间。此外，全球半导体代工市场是由客製化需求和缩短上市时间所推动的。代工厂提供灵活的製造解决方案，使公司能够根据特定要求客製化半导体设计。这种客製化使公司能够使其产品在市场上脱颖而出并满足消费者不断变化的需求。此外，代工厂提供更短的生产週期和更快的上市时间，使公司能够快速推出产品并获得竞争优势。最后，对能源效率的日益关注也促进了半导体代工市场的成长。随着能源消耗成为关键问题，公司正在寻求节能的半导体解决方案。铸造厂正在开发先进的製造流程和材料，以生产能耗更低的节能晶片。对能源效率的关注符合全球永续发展目标和法规，进一步推动了对半导体代工服务的需求。总之，各产业对先进半导体解决方案的需求不断增长，加上外包趋势、半导体设计的复杂性、客製化需求以及对能源效率的关注，是全球半导体代工市场不断增长的关键驱动力。

外包半导体製造

外包半导体製造已成为全球半导体代工市场成长的重要推手。由于几个关键因素，将半导体製造外包给专业代工厂的趋势得到了发展。首先，汽车、消费性电子、电信和物联网设备等产业的公司越来越关注其核心能力和策略重点。透过将半导体製造外包给专业代工厂，这些公司可以利用代工厂的专业知识和资源，从而将内部资源和投资分配给研究、开发和创新。这一策略转变使公司能够透过加快上市时间和减少资本支出，在快速发展的市场中保持竞争力。其次，半导体代工厂提供先进的製造技术和製造工艺，而这些技术和製造工艺对于公司内部开发来说可能不容易取得或在经济上不可行。铸造厂在研发方面投入巨资，以保持技术进步的前沿，使他们能够为客户提供尖端的解决方案。透过外包给这些代工厂，公司可以获得最先进的设施、先进的设备和专业知识，确保其半导体产品的高品质和高效製造。此外，外包半导体製造为公司提供了灵活性和可扩展性。

半导体的需求可能会波动，外包使公司能够根据市场需求调整产量，而无需对额外的製造基础设施进行大量投资。这种灵活性还使公司能够快速回应不断变化的市场动态和客户需求。此外，将半导体製造外包给专业代工厂可以降低与製造复杂性和供应链管理相关的风险。铸造厂建立了强大的供应链网络，确保原材料和零件的持续供应。他们还制定了严格的品质控制流程，以维持高製造标准。透过利用铸造厂的专业知识和能力，公司可以降低与製造挑战相关的风险，例如产量优化、製程可变性和品质控制。总之，半导体製造外包给专业代工厂正在推动全球半导体代工厂市场的成长。这种趋势使公司能够专注于其核心竞争力，获得先进的製造技术，实现灵活性和可扩展性，并降低製造风险。透过与半导体代工厂合作，公司可以优化其製造流程，加快上市时间，并在动态的半导体产业中保持竞争力。

技术进步

技术进步在推动全球半导体代工市场的成长中发挥着至关重要的作用。半导体产业的特点是快速创新和持续技术进步，这对半导体代工厂的能力和产品产生直接影响。首先，技术进步促进了先进製造流程的开发和实施。代工厂在研发方面投入巨资，以增强製造流程、提高晶片效能并降低功耗。更小晶体管尺寸的开发、3D 封装技术以及新材料的整合等创新使代工厂能够生产更先进、更有效率的半导体。这些进步不仅满足了对高效能晶片日益增长的需求，还有助于汽车、消费性电子、电信和物联网设备等各个行业的整体进步。其次，技术进步推动先进设计工具和方法的发展。随着半导体设计变得越来越复杂，代工厂需要保持在设计技术的最前沿，以支援客户的需求。

这包括采用先进的可製造性设计 (DFM) 技术、模拟工具和验证方法。透过利用这些技术进步，铸造厂可以优化设计流程、提高良率并缩短客户的上市时间。此外，技术进步使铸造厂能够提供更广泛的服务和解决方案。例如，先进封装技术的集成，例如係统级封装（SiP）和晶圆级封装（WLP），使代工厂能够为其客户提供更全面的整合解决方案。这些进步使电子设备小型化、提高性能并增强功能。此外，技术进步也有助于专业製程技术的发展。代工厂不断投资于研发，以开发和实施先进的製程节点，例如 FinFET 和 EUV 光刻。这些製程技术能够生产具有更高电晶体密度、更高功率效率和增强性能的晶片。透过提供这些先进的製程技术，代工厂可以满足对尖端半导体解决方案日益增长的需求。总之，技术进步有助于推动全球半导体代工市场的成长。这些进步使得先进製造流程、设计工具和专业製程技术的开发成为可能。透过利用这些技术进步，代工厂可以满足各行业不断变化的需求，提供全面的解决方案，并在动态的半导体市场中保持竞争力。

半导体设计的复杂度不断增加

半导体设计日益复杂，是全球半导体代工市场成长的重要推手。随着对具有更高性能和功能的先进电子设备的需求持续增长，半导体设计变得越来越复杂和整合。这种复杂性给缺乏专业知识和资源来处理复杂的半导体设计的公司带来了挑战。另一方面，半导体代工厂具备应对这些挑战所需的能力和知识。他们在研发方面投入巨资，以开发先进的设计工具、製程技术和可製造性设计 (DFM) 技术。透过利用他们的专业知识，代工厂可以帮助公司设计和优化复杂的半导体设计，确保可製造性并提高良率。公司和代工厂之间的合作能够成功生产复杂的晶片，满足汽车、消费性电子、电信和物联网设备等产业不断变化的需求。

此外，半导体设计日益复杂，推动了对专业代工服务的需求。代工厂提供一系列针对特定应用和行业量身定制的服务，例如汽车级製程、高效能运算和人工智慧晶片。这种专业化使铸造厂能够满足不同行业的独特要求，并提供满足其特定需求的客製化解决方案。透过提供专业服务，代工厂可以在市场上脱颖而出，并吸引寻求复杂半导体设计专业知识的客户。此外，半导体设计的复杂性推动了产业利害关係人、设计公司和代工厂之间的协作和伙伴关係。这些合作促进创新、知识共享和尖端解决方案的开发。透过合作，公司和代工厂可以克服半导体设计日益复杂性所带来的挑战，加快产品上市时间，并在快速发展的半导体产业中保持竞争力。总之，半导体设计日益复杂是全球半导体代工市场成长的关键驱动力。铸造厂在应对复杂设计相关挑战、提供专业服务和促进协作方面发挥着至关重要的作用。透过利用其专业知识和资源，代工厂使公司能够成功设计和製造复杂的半导体晶片，满足各个行业的需求并推动半导体代工市场的成长。

对客製化和上市时间的需求不断增长

不断增长的客製化需求和缩短的上市时间是全球半导体代工市场成长的重要驱动力。在当今快节奏、竞争激烈的商业环境中，各行业的公司都在寻找方法来使他们的产品脱颖而出并快速将其推向市场。这种客製化和加快上市时间的需求导致了对半导体代工厂的依赖增加。代工厂提供灵活的製造解决方案，使公司能够根据特定要求客製化半导体设计。这种客製化使公司能够客製化产品以满足目标市场的独特需求，从而增强竞争力。此外，代工厂提供更短的生产週期和更快的上市时间，使公司能够迅速推出产品并获得竞争优势。透过将半导体製造外包给专业代工厂，公司可以利用代工厂的专业知识、先进的製造流程和製造能力来简化生产流程并缩短上市时间。这种合作关係使公司能够专注于其核心竞争力，例如产品设计和行销，同时依靠铸造厂的专业製造专业知识。此外，公司和铸造厂之间的合作促进了创新和知识共享，从而促进了尖端解决方案的开发。

不断增长的客製化需求和缩短的上市时间也推动了先进设计工具和方法的采用。铸造厂投资于研发，以保持设计技术的前沿，例如可製造性设计 (DFM) 技术和模拟工具。这些工具使公司能够优化其半导体设计的可製造性、提高良率并缩短上市时间。透过利用半导体代工厂的专业知识和资源，公司可以加快产品开发週期，快速回应市场需求，并在竞争中保持领先。总之，不断增长的客製化需求和缩短的上市时间是全球半导体代工市场成长的关键驱动力。代工厂提供灵活的製造解决方案、更快的生产週期以及先进的设计工具，使公司能够自订其半导体设计并将其产品快速推向市场。透过与半导体代工厂合作，公司可以优化其製造流程，加快上市时间，并在动态的商业环境中保持竞争优势。

主要市场挑战

先进工艺技术的取得有限

先进製程技术的取得有限对全球半导体代工市场构成了重大挑战。先进製造流程的开发和实施需要在研发、专业设备和技术专长方面进行大量投资。这给中小型铸造厂造成了障碍，因为他们可能难以跟上快速进步并获得必要的资源来提供尖端工艺技术。因此，这些代工厂可能面临竞争劣势，并发现满足客户不断变化的需求具有挑战性。半导体产业的特点是不断创新且不断推动更小、更快、更节能的晶片。 FinFET、3D 电晶体和极紫外线 (EUV) 微影等先进製程技术对于实现这些目标至关重要。

然而，这些技术的开发和实施需要大量的研发投资、专业製造设备和高技能人员。拥有大量财力和成熟研发能力的大型铸造厂更有能力投资和采用这些先进製程技术。他们可以利用规模经济来分摊与技术开发和设备采购相关的高成本。相较之下，中小型代工厂由于财力有限且缺乏内部研发能力，可能很难进行类似的投资。这种对先进製程技术的有限存取可能会阻碍他们提供尖端解决方案并满足需要高性能、节能和紧凑半导体装置的客户日益增长的需求的能力。此外，缺乏先进製程技术可能会影响中小型铸造厂在全球市场的竞争力。客户，尤其是消费性电子、汽车和电信等行业的客户，通常优先考虑与能够提供最新製程技术的代工厂合作，以确保其产品始终处于创新前沿。因此，获得先进製程技术的机会有限可能会导緻小型代工厂失去潜在客户和市场份额。为了应对这项挑战，铸造厂、研究机构和产业利益相关者之间的合作和伙伴关係可以发挥至关重要的作用。透过汇集资源、共享专业知识以及共同投资研发，小型代工厂可以获得先进的製程技术，并在全球半导体代工厂市场中保持竞争力。此外，政府和行业协会可以透过资助计划、赠款和旨在促进小型铸造厂技术开发和采用的倡议来提供支援。这些努力有助于创造公平的竞争环境，并确保半导体代工市场的所有参与者都能获得最新的製程技术，从而促进创新并推动产业向前发展。

半导体设计的复杂度不断增加

半导体设计日益复杂，为半导体代工厂带来了巨大的挑战。随着晶片设计变得越来越复杂和集成，代工厂需要在先进工具、软体和专业知识方面进行大量投资，以有效处理这种复杂性。他们必须解决与功耗、热管理、讯号完整性和製造良率相关的各种挑战。这些设计的复杂性可能会导致开发週期更长、成本增加以及实现高产量的潜在困难，最终会影响代工厂在市场上的获利能力和竞争力。半导体设计的复杂性需要采取全面的方法来确保成功生产。代工厂必须投资尖端的设计工具和软体，以处理这些复杂的设计，实现高效的电源管理、有效的散热和强大的讯号完整性。

此外，他们需要实施先进的製造流程和技术，以优化良率并最大限度地减少生产过程中的缺陷。与复杂设计相关的较长开发週期要求代工厂仔细管理资源、时间和成本，以满足专案时程和客户期望。此外，半导体设计日益复杂，需要拥有设计工程、製程优化和品质控制等领域专业知识的高技能劳动力。铸造厂必须吸引并留住顶尖人才，以有效应对复杂设计带来的挑战并维持市场竞争优势。透过正面应对这些挑战，半导体代工厂可以克服现代晶片设计的复杂性，并为客户提供高品质、可靠且高效的半导体解决方案。这反过来又使他们能够保持竞争力，满足行业不断变化的需求，并推动半导体市场的创新。

熟练劳动力短缺

全球半导体代工市场正在努力解决熟练劳动力短缺的问题，特别是在製程工程、设备实体和先进封装等专业领域。这些领域需要拥有设计、开发和优化复杂半导体製程专业知识的高技能专业人员。此类人才的稀缺为该行业带来了一些挑战，包括对合格人才的竞争加剧、劳动力成本上升以及专案时间表可能出现的延误。为了解决这个问题，企业必须对教育和培训专案进行策略性投资。与学术机构的合作可以在培养一群拥有必要知识和专业技能的熟练专业人员方面发挥关键作用，以满足半导体代工市场的需求。透过与大学和技术学校合作，公司可以为符合行业要求的专业课程的发展做出贡献。

这可以包括实习、学徒和合作教育项目，为学生提供实践经验并接触半导体製造的现实挑战。此外，公司可以设立奖学金计划，并为攻读相关领域学位的学生提供经济支持。透过投资未来专业人员的教育和培训，半导体代工市场可以解决熟练劳动力的短缺问题，并确保该行业拥有可持续的人才库。此外，公司还可以专注于内部培训和发展计划，以提高现有员工的技能。这可能包括为员工提供持续学习的机会、参加行业会议和研讨会以及鼓励参与专业发展计划。透过在组织内培养和留住人才，公司可以减轻熟练劳动力短缺的影响，并保持在全球半导体代工市场的竞争优势。总体而言，解决半导体代工市场熟练劳动力短缺问题需要采取多方面的方法，包括与学术机构合作、教育和培训项目投资以及内部人才发展计划。透过采取积极措施，该行业可以克服这一挑战，并确保稳定供应熟练的专业人员，以推动半导体代工市场的创新和成长。

主要市场趋势

对先进製程技术的需求不断增长

全球半导体代工市场对先进製程技术的需求正在激增。随着对更小、更快、更节能的半导体的需求不断增长，代工厂正在尖端製造製程上进行大量投资。其中包括 FinFET、3D 电晶体和 EUV 微影等技术。采用这些先进的製程技术使代工厂能够製造高性能晶片，从而提高功率效率、更高的电晶体密度和增强的功能。例如，FinFET 技术的发展使半导体製造发生了革命性的变化，使电晶体的生产具有卓越的性能并降低了功耗。该技术涉及使用三维晶体管结构，增强对电流的控制，从而产生更快、更节能的晶片。同样，3D 电晶体的实施透过增加电晶体密度并实现更好的组件整合进一步突破了晶片性能的界限。该技术允许将电晶体堆迭在一起，最大限度地利用可用空间，并能够创建更复杂、更强大的晶片。此外，EUV光刻技术的引入显着提高了半导体製造的精度和解析度。

EUV 微影利用极紫外光在硅晶圆上创建复杂的图案，从而能够生产具有更小特征尺寸和更高集成度的晶片。光刻技术的进步为开发具有增强功能和改进性能的先进半导体装置铺平了道路。全球半导体代工市场对先进製程技术的需求不断增长，这是由于各行业（包括消费性电子、汽车、电信和物联网设备）对更小、更快、更节能的晶片的需求所推动的。能够成功采用和实施这些先进製程技术的铸造厂能够很好地满足客户不断变化的需求并保持市场竞争优势。

日益关注专业铸造服务

在全球半导体代工市场中，出现了向专业化代工服务的明显转变。铸造厂正在认识到透过提供客製化解决方案来满足特定应用和产业的重要性。这一趋势的推动因素是不同产业对半导体製造有独特的要求和要求。因此，铸造厂正在提供专门的流程和服务来满足这些特定需求。例如，铸造厂正在开发用于汽车应用的专用工艺，从而能够生产满足汽车行业在可靠性、耐用性和性能方面严格要求的半导体。同样，代工厂正在为物联网设备提供专门的服务，这些设备需要低功耗、小外形尺寸和高连接性。透过为物联网应用提供客製化解决方案，代工厂可以应对这个快速发展的行业的特定挑战和要求。此外，对专业代工服务的需求也延伸到人工智慧（AI）晶片领域。人工智慧晶片需要专门的架构、高运算能力和高效的记忆体管理。代工厂正在投资专门的製程和技术，以满足人工智慧晶片製造商的独特需求。这种专业化使代工厂能够利用他们的专业知识和资源来提供客製化解决方案，以优化人工智慧晶片的性能和效率。透过提供专业的代工服务，代工厂可以在市场上脱颖而出，并吸引寻求特定行业或应用专业知识的客户。全球半导体代工市场的专业化趋势使公司能够获得满足其特定需求的客製化解决方案，从而提高产品性能、加快上市时间并增强竞争力。

更复杂晶片设计的出现

随着半导体代工市场的发展，更复杂的晶片设计明显出现。这种转变是由对先进功能和在单一晶片上整合多个组件的需求不断增长所推动的。然而，这种趋势对铸造厂在高产量製造复杂设计方面提出了重大挑战。为了克服这些挑战，铸造厂正在对先进设计工具、製程技术和可製造性设计 (DFM) 技术进行大量投资。这些投资对于确保复杂晶片的成功生产至关重要。先进的设计工具使代工厂能够处理错综复杂的复杂晶片设计，从而实现高效的电源管理、有效的散热和强大的讯号完整性。製程技术透过提供製造复杂结构和在单一晶片上整合多个组件的必要能力，在实现复杂设计的製造方面发挥着至关重要的作用。此外，代工厂正在采用可製造性设计（DFM）技术，其中包括优化晶片设计以增强可製造性并提高良率。 DFM 技术在设计阶段考虑了各种製造限制和挑战，可以及早识别和缓解潜在问题。透过实施 DFM 技术，铸造厂可以最大限度地降低製造缺陷的风险、降低生产成本并提高整体良率。先进设计工具、製程技术和 DFM 技术的结合使代工厂能够有效应对复杂晶片设计带来的挑战。这反过来又确保了成功生产具有改进性能和功能的高品质晶片。透过在这些领域进行投资，代工厂可以保持市场竞争力，并满足对复杂半导体解决方案不断增长的需求。

目录

第 1 章：产品概述

  • 市场定义
  • 市场范围
    • 涵盖的市场
    • 考虑学习的年份
    • 主要市场区隔

第 2 章：研究方法

  • 研究目的
  • 基线方法
  • 范围的製定
  • 假设和限制
  • 研究来源
    • 二次研究
    • 初步研究
  • 市场研究方法
    • 自下而上的方法
    • 自上而下的方法
  • 计算市场规模和市场份额所遵循的方法
  • 预测方法
    • 数据三角测量与验证

第 3 章：执行摘要

第 4 章：COVID-19 对全球半导体代工市场的影响

第 5 章：客户之声

第 6 章：全球半导体代工市场概述

第 7 章：全球半导体代工市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依技术节点（10/7/5 nm、16/14 nm、20 nm、28 nm、45/40 nm、65 nm）
    • 按应用（消费性电子与通讯、汽车、工业、HPC）
    • 按地区（北美、欧洲、南美、中东和非洲、亚太地区）
  • 按公司划分 (2022)
  • 市场地图

第 8 章：北美半导体代工市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依技术节点
    • 按应用
    • 按国家/地区
  • 北美：国家分析
    • 美国
    • 加拿大
    • 墨西哥

第 9 章：欧洲半导体代工市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依技术节点
    • 按应用
    • 按国家/地区
  • 欧洲：国家分析
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙
    • 比利时

第 10 章：南美洲半导体代工市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依技术节点
    • 按应用
    • 按国家/地区
  • 南美洲：国家分析
    • 巴西
    • 哥伦比亚
    • 阿根廷
    • 智利
    • 秘鲁

第 11 章：中东和非洲半导体代工市场展望

  • 市场规模及预测
    • 按价值
  • 市占率及预测
    • 依技术节点
    • 按应用
    • 按国家/地区
  • 中东和非洲：国家分析
    • 沙乌地阿拉伯
    • 阿联酋
    • 南非
    • 土耳其
    • 以色列

第十二章：亚太半导体代工市场展望

  • 市场规模及预测
    • 按国家/地区
  • 亚太地区：国家分析
    • 中国半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用
    • 印度半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用
    • 日本半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用
    • 韩国半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用
    • 澳洲半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用
    • 印尼半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用
    • 越南半导体代工市场展望
      • 市场规模及预测
        • 按价值
      • 市占率及预测
        • 依技术节点
        • 按应用

第 13 章：市场动态

  • 司机
  • 挑战

第 14 章：市场趋势与发展

第 15 章：公司简介

  • 台积电 (TSMC)
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 三星电子有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 联电 (UMC)
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 格罗方德公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 中芯国际积体电路製造有限公司（SMIC）
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 先锋国际半导体公司 (VIS)
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 塔半导体有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • X-FAB 硅铸造厂 SE
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 力晶科技股份有限公司
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered
  • 东部HiTek株式会社
    • Business Overview
    • Key Revenue and Financials
    • Recent Developments
    • Key Personnel/Key Contact Person
    • Key Product/Services Offered

第 16 章：策略建议

第 17 章：关于我们与免责声明

简介目录
Product Code: 17695

Global Semiconductor Foundry Market has valued at USD 76 Billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 7.1% through 2028. The global semiconductor foundry market is experiencing significant growth, driven by a confluence of factors that underscore its pivotal role in the modern digital economy. Semiconductor foundries, specializing in the fabrication of integrated circuits (ICs), have become the linchpin for innovation across a multitude of industries. The relentless pursuit of miniaturization and performance enhancement in electronics, coupled with the emergence of transformative technologies like 5G, artificial intelligence (AI), and the Internet of Things (IoT), has led to an insatiable demand for advanced microchips.

Furthermore, the rising complexity and cost of semiconductor manufacturing processes have prompted an increasing number of fabless semiconductor companies and integrated device manufacturers (IDMs) to outsource their fabrication needs to foundries. This strategic shift has spurred the growth of foundry services, making them a vital ecosystem player. Companies like TSMC, GlobalFoundries, and Samsung Foundry have risen to prominence, catering to a broad spectrum of semiconductor applications.

Key Market Drivers

Market Overview
Forecast Period2024-2028
Market Size 2022USD 76 Billion
Market Size 2028USD 115.73 Billion
CAGR 2023-20287.1%
Fastest Growing SegmentAutomotive
Largest MarketAsia Pacific

Increasing Demand for Advanced Semiconductor Solutions

The Global Semiconductor Foundry Market is experiencing significant growth due to the increasing demand for advanced semiconductor solutions across various industries. As industries such as automotive, consumer electronics, telecommunications, and IoT devices continue to evolve and demand higher performance and efficiency from their electronic products, the need for advanced semiconductors has become paramount. This surge in demand is driven by several factors. Firstly, technological advancements have led to the development of innovative applications and products that require more powerful and sophisticated semiconductors. For instance, the rise of electric vehicles, autonomous driving, and smart homes has created a need for semiconductors with higher processing capabilities, improved energy efficiency, and enhanced connectivity. Secondly, the growing trend of outsourcing semiconductor manufacturing to specialized foundries has contributed to the market's growth. Many companies prefer to focus on their core competencies while relying on semiconductor foundries for efficient and cost-effective manufacturing processes. Outsourcing allows companies to access advanced fabrication technologies, reduce capital expenditure, and benefit from the expertise of specialized foundries. Additionally, the complexity of semiconductor design has increased significantly, requiring specialized expertise and resources. Foundries offer design services, process technologies, and manufacturing expertise to help companies bring their complex semiconductor designs to market.

This collaboration enables companies to leverage the foundries' capabilities and accelerate time-to-market. Furthermore, the global semiconductor foundry market is driven by the need for customization and reduced time-to-market. Foundries provide flexible manufacturing solutions that allow companies to customize their semiconductor designs according to specific requirements. This customization enables companies to differentiate their products in the market and meet the evolving demands of consumers. Additionally, foundries offer shorter production cycles and faster time-to-market, allowing companies to quickly launch their products and gain a competitive edge. Lastly, the increasing focus on energy efficiency is also contributing to the growth of the semiconductor foundry market. As energy consumption becomes a critical concern, companies are seeking energy-efficient semiconductor solutions. Foundries are developing advanced fabrication processes and materials that enable the production of energy-efficient chips with lower power consumption. This focus on energy efficiency aligns with global sustainability goals and regulations, further driving the demand for semiconductor foundry services. In conclusion, the increasing demand for advanced semiconductor solutions in various industries, coupled with the outsourcing trend, complexity of semiconductor design, need for customization, and focus on energy efficiency, are the key drivers behind the rising growth of the Global Semiconductor Foundry Market.

Outsourcing Semiconductor Manufacturing

Outsourcing semiconductor manufacturing has emerged as a significant driver of growth in the Global Semiconductor Foundry Market. The trend of outsourcing semiconductor manufacturing to specialized foundries has gained momentum due to several key factors. Firstly, companies across industries, such as automotive, consumer electronics, telecommunications, and IoT devices, are increasingly focusing on their core competencies and strategic priorities. By outsourcing semiconductor manufacturing to specialized foundries, these companies can leverage the expertise and resources of the foundries, allowing them to allocate their internal resources and investments towards research, development, and innovation. This strategic shift enables companies to stay competitive in the rapidly evolving market by accelerating time-to-market and reducing capital expenditure. Secondly, semiconductor foundries offer advanced fabrication technologies and manufacturing processes that may not be readily available or economically feasible for companies to develop in-house. Foundries invest heavily in research and development to stay at the forefront of technological advancements, enabling them to provide cutting-edge solutions to their clients. By outsourcing to these foundries, companies can access state-of-the-art facilities, advanced equipment, and specialized expertise, ensuring high-quality and efficient manufacturing of their semiconductor products. Additionally, outsourcing semiconductor manufacturing provides companies with flexibility and scalability.

The demand for semiconductors can fluctuate, and outsourcing allows companies to adjust their production volumes based on market demand without the need for significant investments in additional manufacturing infrastructure. This flexibility also enables companies to respond quickly to changing market dynamics and customer requirements. Furthermore, outsourcing semiconductor manufacturing to specialized foundries mitigates the risks associated with manufacturing complexities and supply chain management. Foundries have established robust supply chain networks, ensuring a consistent supply of raw materials and components. They also have stringent quality control processes in place to maintain high manufacturing standards. By leveraging the expertise and capabilities of foundries, companies can reduce the risks associated with manufacturing challenges, such as yield optimization, process variability, and quality control. In conclusion, the outsourcing of semiconductor manufacturing to specialized foundries is driving the growth of the Global Semiconductor Foundry Market. This trend allows companies to focus on their core competencies, access advanced fabrication technologies, achieve flexibility and scalability, and mitigate manufacturing risks. By partnering with semiconductor foundries, companies can optimize their manufacturing processes, accelerate time-to-market, and remain competitive in the dynamic semiconductor industry.

Technological Advancements

Technological advancements play a crucial role in driving the growth of the Global Semiconductor Foundry Market. The semiconductor industry is characterized by rapid innovation and continuous technological advancements, which have a direct impact on the capabilities and offerings of semiconductor foundries. Firstly, technological advancements enable the development and implementation of advanced fabrication processes. Foundries invest heavily in research and development to enhance their manufacturing processes, improve chip performance, and reduce power consumption. Innovations such as the development of smaller transistor sizes, 3D packaging technologies, and the integration of new materials enable foundries to produce more advanced and efficient semiconductors. These advancements not only cater to the increasing demand for high-performance chips but also contribute to the overall progress of various industries, including automotive, consumer electronics, telecommunications, and IoT devices. Secondly, technological advancements drive the development of advanced design tools and methodologies. As semiconductor designs become more complex, foundries need to stay at the forefront of design technologies to support their customers' requirements.

This includes the adoption of advanced design-for-manufacturability (DFM) techniques, simulation tools, and verification methodologies. By leveraging these technological advancements, foundries can optimize the design process, improve yield rates, and reduce time-to-market for their customers. Additionally, technological advancements enable foundries to offer a broader range of services and solutions. For instance, the integration of advanced packaging technologies, such as system-in-package (SiP) and wafer-level packaging (WLP), allows foundries to provide more comprehensive and integrated solutions to their customers. These advancements enable the miniaturization of electronic devices, improve performance, and enhance functionality. Moreover, technological advancements also contribute to the development of specialized process technologies. Foundries continuously invest in research and development to develop and implement advanced process nodes, such as FinFET and EUV lithography. These process technologies enable the production of chips with higher transistor densities, improved power efficiency, and enhanced performance. By offering access to these advanced process technologies, foundries can cater to the increasing demand for cutting-edge semiconductor solutions. In conclusion, technological advancements are instrumental in driving the growth of the Global Semiconductor Foundry Market. These advancements enable the development of advanced fabrication processes, design tools, and specialized process technologies. By leveraging these technological advancements, foundries can meet the evolving demands of various industries, offer comprehensive solutions, and stay competitive in the dynamic semiconductor market.

Increasing Complexity of Semiconductor Design

The increasing complexity of semiconductor design is a significant driver of growth in the Global Semiconductor Foundry Market. As the demand for advanced electronic devices with higher performance and functionality continues to rise, semiconductor designs have become increasingly intricate and integrated. This complexity poses challenges for companies that lack the specialized expertise and resources to handle the intricacies of semiconductor design. Semiconductor foundries, on the other hand, are equipped with the necessary capabilities and knowledge to address these challenges. They invest heavily in research and development to develop advanced design tools, process technologies, and design-for-manufacturability (DFM) techniques. By leveraging their expertise, foundries can assist companies in designing and optimizing complex semiconductor designs, ensuring manufacturability, and improving yield rates. The collaboration between companies and foundries enables the successful production of complex chips, meeting the evolving demands of industries such as automotive, consumer electronics, telecommunications, and IoT devices.

Moreover, the increasing complexity of semiconductor design drives the need for specialized foundry services. Foundries offer a range of services tailored to specific applications and industries, such as automotive-grade processes, high-performance computing, and AI chips. This specialization allows foundries to cater to the unique requirements of different industries and provide customized solutions that meet their specific needs. By offering specialized services, foundries can differentiate themselves in the market and attract customers seeking expertise in complex semiconductor designs. Additionally, the complexity of semiconductor design drives collaboration and partnerships between industry stakeholders, design houses, and foundries. These collaborations foster innovation, knowledge sharing, and the development of cutting-edge solutions. By working together, companies and foundries can overcome the challenges posed by the increasing complexity of semiconductor design, accelerate time-to-market, and stay competitive in the rapidly evolving semiconductor industry. In conclusion, the increasing complexity of semiconductor design is a key driver of growth in the Global Semiconductor Foundry Market. Foundries play a crucial role in addressing the challenges associated with complex designs, offering specialized services, and fostering collaboration. By leveraging their expertise and resources, foundries enable companies to successfully design and manufacture complex semiconductor chips, meeting the demands of various industries and driving the growth of the semiconductor foundry market.

Growing Need for Customization and Time-to-Market

The growing need for customization and reduced time-to-market is a significant driver of growth in the Global Semiconductor Foundry Market. In today's fast-paced and competitive business landscape, companies across industries are seeking ways to differentiate their products and bring them to market quickly. This need for customization and accelerated time-to-market has led to an increased reliance on semiconductor foundries. Foundries provide flexible manufacturing solutions that allow companies to customize their semiconductor designs according to specific requirements. This customization enables companies to tailor their products to meet the unique demands of their target markets, enhancing their competitiveness. Additionally, foundries offer shorter production cycles and faster time-to-market, enabling companies to swiftly launch their products and gain a competitive edge. By outsourcing semiconductor manufacturing to specialized foundries, companies can leverage the foundries' expertise, advanced fabrication processes, and manufacturing capabilities to streamline their production processes and reduce time-to-market. This partnership allows companies to focus on their core competencies, such as product design and marketing, while relying on the foundries' specialized manufacturing expertise. Furthermore, the collaboration between companies and foundries fosters innovation and knowledge sharing, enabling the development of cutting-edge solutions.

The growing need for customization and reduced time-to-market also drives the adoption of advanced design tools and methodologies. Foundries invest in research and development to stay at the forefront of design technologies, such as design-for-manufacturability (DFM) techniques and simulation tools. These tools enable companies to optimize their semiconductor designs for manufacturability, improve yield rates, and reduce time-to-market. By leveraging the expertise and resources of semiconductor foundries, companies can accelerate their product development cycles, respond quickly to market demands, and stay ahead of the competition. In conclusion, the growing need for customization and reduced time-to-market is a key driver of growth in the Global Semiconductor Foundry Market. Foundries provide flexible manufacturing solutions, faster production cycles, and access to advanced design tools, enabling companies to customize their semiconductor designs and bring their products to market quickly. By partnering with semiconductor foundries, companies can optimize their manufacturing processes, accelerate time-to-market, and maintain a competitive edge in the dynamic business environment.

Key Market Challenges

Limited Access to Advanced Process Technologies

Limited access to advanced process technologies poses a significant challenge in the global semiconductor foundry market. The development and implementation of advanced fabrication processes require substantial investments in research and development, specialized equipment, and technical expertise. This creates a barrier for small and medium-sized foundries, as they may struggle to keep up with the rapid advancements and acquire the necessary resources to offer cutting-edge process technologies. As a result, these foundries may face a competitive disadvantage and find it challenging to meet the evolving demands of customers. The semiconductor industry is characterized by continuous innovation and the constant push for smaller, faster, and more power-efficient chips. Advanced process technologies, such as FinFET, 3D transistors, and extreme ultraviolet (EUV) lithography, are crucial for achieving these goals.

However, the development and implementation of these technologies require substantial investments in research and development, specialized manufacturing equipment, and highly skilled personnel. Large foundries with significant financial resources and established research and development capabilities are better positioned to invest in and adopt these advanced process technologies. They can leverage their economies of scale to spread the high costs associated with technology development and equipment acquisition. In contrast, small and medium-sized foundries may struggle to make similar investments due to limited financial resources and a lack of in-house research and development capabilities. This limited access to advanced process technologies can hinder their ability to offer cutting-edge solutions and meet the increasing demands of customers who require high-performance, energy-efficient, and compact semiconductor devices. Furthermore, the lack of access to advanced process technologies can impact the competitiveness of small and medium-sized foundries in the global market. Customers, especially those in industries such as consumer electronics, automotive, and telecommunications, often prioritize working with foundries that can provide the latest process technologies to ensure their products remain at the forefront of innovation. Therefore, limited access to advanced process technologies can result in a loss of potential customers and market share for smaller foundries. To address this challenge, collaboration and partnerships between foundries, research institutions, and industry stakeholders can play a crucial role. By pooling resources, sharing expertise, and jointly investing in research and development, smaller foundries can gain access to advanced process technologies and remain competitive in the global semiconductor foundry market. Additionally, governments and industry associations can provide support through funding programs, grants, and initiatives aimed at promoting technology development and adoption among smaller foundries. These efforts can help level the playing field and ensure that all players in the semiconductor foundry market have access to the latest process technologies, fostering innovation and driving the industry forward.

Increasing Complexity of Semiconductor Designs

The growing complexity of semiconductor designs presents significant challenges for semiconductor foundries. As chip designs become increasingly intricate and integrated, foundries are required to make substantial investments in advanced tools, software, and expertise to effectively handle this complexity. They must address various challenges associated with power consumption, thermal management, signal integrity, and manufacturing yield. The intricate nature of these designs can result in longer development cycles, increased costs, and potential difficulties in achieving high yields, which can ultimately impact the profitability and competitiveness of foundries in the market. The complexity of semiconductor designs necessitates a comprehensive approach to ensure successful production. Foundries must invest in cutting-edge design tools and software that can handle the intricacies of these designs, enabling efficient power management, effective thermal dissipation, and robust signal integrity.

Additionally, they need to implement advanced manufacturing processes and techniques to optimize yield rates and minimize defects during production. The longer development cycles associated with complex designs require foundries to carefully manage resources, time, and costs to meet project timelines and customer expectations. Moreover, the increased complexity of semiconductor designs demands a highly skilled workforce with expertise in areas such as design engineering, process optimization, and quality control. Foundries must attract and retain top talent to effectively navigate the challenges posed by complex designs and maintain a competitive edge in the market. By addressing these challenges head-on, semiconductor foundries can overcome the complexities of modern chip designs and deliver high-quality, reliable, and efficient semiconductor solutions to their customers. This, in turn, enables them to remain competitive, meet the evolving demands of the industry, and drive innovation in the semiconductor market.

Shortage of Skilled Workforce

The global semiconductor foundry market is grappling with a shortage of skilled workforce, particularly in specialized areas such as process engineering, device physics, and advanced packaging. These areas require highly skilled professionals who possess the expertise to design, develop, and optimize complex semiconductor processes. The scarcity of such talent poses several challenges for the industry, including increased competition for qualified personnel, higher labor costs, and potential delays in project timelines. To tackle this issue, it is imperative for companies to make strategic investments in education and training programs. Collaborations with academic institutions can play a crucial role in developing a pipeline of skilled professionals who are equipped with the necessary knowledge and expertise to meet the demands of the semiconductor foundry market. By partnering with universities and technical schools, companies can contribute to the development of specialized curricula that align with the industry's requirements.

This can include internships, apprenticeships, and cooperative education programs that provide students with hands-on experience and exposure to real-world challenges in semiconductor manufacturing. Additionally, companies can establish scholarship programs and provide financial support to students pursuing degrees in relevant fields. By investing in the education and training of future professionals, the semiconductor foundry market can address the shortage of skilled workforce and ensure a sustainable talent pool for the industry. Furthermore, companies can also focus on internal training and development initiatives to upskill their existing workforce. This can involve providing employees with opportunities for continuous learning, attending industry conferences and workshops, and encouraging participation in professional development programs. By nurturing and retaining talent within the organization, companies can mitigate the impact of the skilled workforce shortage and maintain a competitive edge in the global semiconductor foundry market. Overall, addressing the shortage of skilled workforce in the semiconductor foundry market requires a multi-faceted approach that involves collaboration with academic institutions, investments in education and training programs, and internal talent development initiatives. By taking proactive measures, the industry can overcome this challenge and ensure a steady supply of skilled professionals to drive innovation and growth in the semiconductor foundry market.

Key Market Trends

Increasing Demand for Advanced Process Technologies

The global semiconductor foundry market is experiencing a surge in the need for advanced process technologies. With the growing demand for smaller, faster, and more power-efficient semiconductors, foundries are making significant investments in cutting-edge fabrication processes. These include technologies like FinFET, 3D transistors, and EUV lithography. The adoption of these advanced process technologies allows foundries to manufacture high-performance chips that offer improved power efficiency, higher transistor densities, and enhanced functionality. The development of FinFET technology, for instance, has revolutionized semiconductor manufacturing by enabling the production of transistors with superior performance and reduced power consumption. This technology involves the use of a three-dimensional transistor structure that enhances control over the flow of current, resulting in faster and more energy-efficient chips. Similarly, the implementation of 3D transistors has further pushed the boundaries of chip performance by increasing transistor density and enabling better integration of components. This technology allows for the stacking of transistors on top of each other, maximizing the use of available space and enabling the creation of more complex and powerful chips. Additionally, the introduction of EUV lithography has significantly improved the precision and resolution of semiconductor manufacturing.

EUV lithography utilizes extreme ultraviolet light to create intricate patterns on silicon wafers, enabling the production of chips with smaller feature sizes and higher levels of integration. This advancement in lithography technology has paved the way for the development of advanced semiconductor devices with enhanced functionality and improved performance. The rising demand for advanced process technologies in the global semiconductor foundry market is driven by the need for smaller, faster, and more power-efficient chips across various industries, including consumer electronics, automotive, telecommunications, and IoT devices. Foundries that can successfully adopt and implement these advanced process technologies are well-positioned to meet the evolving demands of customers and maintain a competitive edge in the market.

Growing Focus on Specialized Foundry Services

In the global semiconductor foundry market, there is a noticeable shift towards specialized foundry services. Foundries are recognizing the importance of catering to specific applications and industries by offering tailored solutions. This trend is driven by the understanding that different industries have unique requirements and demands when it comes to semiconductor manufacturing. As a result, foundries are providing specialized processes and services to meet these specific needs. For instance, foundries are developing specialized processes for automotive applications, enabling the production of semiconductors that meet the stringent requirements of the automotive industry in terms of reliability, durability, and performance. Similarly, foundries are offering specialized services for IoT devices, which require low power consumption, small form factors, and high connectivity. By providing customized solutions for IoT applications, foundries can address the specific challenges and requirements of this rapidly growing industry. Additionally, the demand for specialized foundry services extends to the field of artificial intelligence (AI) chips. AI chips require specialized architectures, high computational power, and efficient memory management. Foundries are investing in specialized processes and technologies to meet the unique needs of AI chip manufacturers. This specialization allows foundries to leverage their expertise and resources to deliver customized solutions that optimize the performance and efficiency of AI chips. By offering specialized foundry services, foundries can differentiate themselves in the market and attract customers seeking expertise in specific industries or applications. This trend towards specialization in the global semiconductor foundry market enables companies to access tailored solutions that meet their specific needs, resulting in improved product performance, faster time-to-market, and enhanced competitiveness.

Emergence of More Complex Chip Designs

As the semiconductor foundry market evolves, there is a noticeable emergence of more complex chip designs. This shift is driven by the growing demand for advanced functionalities and the integration of multiple components on a single chip. However, this trend poses significant challenges for foundries in terms of manufacturing complex designs with high yields. To overcome these challenges, foundries are making substantial investments in advanced design tools, process technologies, and design-for-manufacturability (DFM) techniques. These investments are crucial for ensuring the successful production of complex chips. Advanced design tools enable foundries to handle the intricacies of complex chip designs, allowing for efficient power management, effective thermal dissipation, and robust signal integrity. Process technologies play a vital role in enabling the manufacturing of complex designs by providing the necessary capabilities to fabricate intricate structures and integrate multiple components on a single chip. Additionally, foundries are adopting design-for-manufacturability (DFM) techniques, which involve optimizing chip designs to enhance manufacturability and improve yield rates. DFM techniques consider various manufacturing constraints and challenges during the design phase, allowing for the identification and mitigation of potential issues early on. By implementing DFM techniques, foundries can minimize the risk of manufacturing defects, reduce production costs, and improve overall yield rates. The combination of advanced design tools, process technologies, and DFM techniques enables foundries to effectively address the challenges posed by complex chip designs. This, in turn, ensures the successful production of high-quality chips with improved performance and functionality. By investing in these areas, foundries can stay competitive in the market and meet the increasing demand for complex semiconductor solutions.

Segmental Insights

Technology Node Insights

In 2022, the 7/5 nm technology node segment dominated the Global Semiconductor Foundry Market and is expected to maintain its dominance during the forecast period. The 7/5 nm technology node represents the most advanced and cutting-edge semiconductor manufacturing process available in the market. This technology node offers significant advantages such as higher transistor densities, improved power efficiency, and enhanced performance compared to previous nodes. These benefits make it highly desirable for a wide range of applications, including high-performance computing, artificial intelligence, 5G, and automotive electronics. The demand for advanced functionalities and the need for smaller, faster, and more power-efficient semiconductors have been the key drivers behind the dominance of the 7/5 nm technology node. Additionally, the increasing adoption of technologies like Internet of Things (IoT), cloud computing, and data centers has further fueled the demand for chips manufactured using the 7/5 nm technology node. The dominance of the 7/5 nm technology node is also attributed to the significant investments made by foundries in research and development, equipment, and expertise to develop and optimize this advanced manufacturing process. Furthermore, the continuous advancements in semiconductor technology and the ongoing race among semiconductor foundries to offer the most advanced and competitive solutions are expected to maintain the dominance of the 7/5 nm technology node in the Global Semiconductor Foundry Market during the forecast period.

Application Insights

In 2022, the consumer electronics and communication segment dominated the Global Semiconductor Foundry Market and is expected to maintain its dominance during the forecast period. The consumer electronics and communication segment encompasses a wide range of devices, including smartphones, tablets, wearables, and networking equipment. This segment's dominance can be attributed to the increasing demand for advanced semiconductor solutions in the consumer electronics industry, driven by factors such as technological advancements, rising disposable incomes, and changing consumer preferences. The rapid pace of innovation in consumer electronics, with the introduction of new features, higher performance requirements, and the need f

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Formulation of the Scope
  • 2.4. Assumptions and Limitations
  • 2.5. Sources of Research
    • 2.5.1. Secondary Research
    • 2.5.2. Primary Research
  • 2.6. Approach for the Market Study
    • 2.6.1. The Bottom-Up Approach
    • 2.6.2. The Top-Down Approach
  • 2.7. Methodology Followed for Calculation of Market Size & Market Shares
  • 2.8. Forecasting Methodology
    • 2.8.1. Data Triangulation & Validation

3. Executive Summary

4. Impact of COVID-19 on Global Semiconductor Foundry Market

5. Voice of Customer

6. Global Semiconductor Foundry Market Overview

7. Global Semiconductor Foundry Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Technology Node (10/7/5 nm, 16/14 nm, 20 nm, 28 nm, 45/40 nm, 65 nm)
    • 7.2.2. By Application (Consumer Electronics and Communication, Automotive, Industrial, HPC)
    • 7.2.3. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
  • 7.3. By Company (2022)
  • 7.4. Market Map

8. North America Semiconductor Foundry Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Technology Node
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. North America: Country Analysis
    • 8.3.1. United States Semiconductor Foundry Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Technology Node
        • 8.3.1.2.2. By Application
    • 8.3.2. Canada Semiconductor Foundry Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Technology Node
        • 8.3.2.2.2. By Application
    • 8.3.3. Mexico Semiconductor Foundry Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Technology Node
        • 8.3.3.2.2. By Application

9. Europe Semiconductor Foundry Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Technology Node
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Europe: Country Analysis
    • 9.3.1. Germany Semiconductor Foundry Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Technology Node
        • 9.3.1.2.2. By Application
    • 9.3.2. France Semiconductor Foundry Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Technology Node
        • 9.3.2.2.2. By Application
    • 9.3.3. United Kingdom Semiconductor Foundry Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Technology Node
        • 9.3.3.2.2. By Application
    • 9.3.4. Italy Semiconductor Foundry Market Outlook
      • 9.3.4.1. Market Size & Forecast
        • 9.3.4.1.1. By Value
      • 9.3.4.2. Market Share & Forecast
        • 9.3.4.2.1. By Technology Node
        • 9.3.4.2.2. By Application
    • 9.3.5. Spain Semiconductor Foundry Market Outlook
      • 9.3.5.1. Market Size & Forecast
        • 9.3.5.1.1. By Value
      • 9.3.5.2. Market Share & Forecast
        • 9.3.5.2.1. By Technology Node
        • 9.3.5.2.2. By Application
    • 9.3.6. Belgium Semiconductor Foundry Market Outlook
      • 9.3.6.1. Market Size & Forecast
        • 9.3.6.1.1. By Value
      • 9.3.6.2. Market Share & Forecast
        • 9.3.6.2.1. By Technology Node
        • 9.3.6.2.2. By Application

10. South America Semiconductor Foundry Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Technology Node
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Semiconductor Foundry Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Technology Node
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Semiconductor Foundry Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Technology Node
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Semiconductor Foundry Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Technology Node
        • 10.3.3.2.2. By Application
    • 10.3.4. Chile Semiconductor Foundry Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Technology Node
        • 10.3.4.2.2. By Application
    • 10.3.5. Peru Semiconductor Foundry Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Technology Node
        • 10.3.5.2.2. By Application

11. Middle East & Africa Semiconductor Foundry Market Outlook

  • 11.1. Market Size & Forecast
    • 11.1.1. By Value
  • 11.2. Market Share & Forecast
    • 11.2.1. By Technology Node
    • 11.2.2. By Application
    • 11.2.3. By Country
  • 11.3. Middle East & Africa: Country Analysis
    • 11.3.1. Saudi Arabia Semiconductor Foundry Market Outlook
      • 11.3.1.1. Market Size & Forecast
        • 11.3.1.1.1. By Value
      • 11.3.1.2. Market Share & Forecast
        • 11.3.1.2.1. By Technology Node
        • 11.3.1.2.2. By Application
    • 11.3.2. UAE Semiconductor Foundry Market Outlook
      • 11.3.2.1. Market Size & Forecast
        • 11.3.2.1.1. By Value
      • 11.3.2.2. Market Share & Forecast
        • 11.3.2.2.1. By Technology Node
        • 11.3.2.2.2. By Application
    • 11.3.3. South Africa Semiconductor Foundry Market Outlook
      • 11.3.3.1. Market Size & Forecast
        • 11.3.3.1.1. By Value
      • 11.3.3.2. Market Share & Forecast
        • 11.3.3.2.1. By Technology Node
        • 11.3.3.2.2. By Application
    • 11.3.4. Turkey Semiconductor Foundry Market Outlook
      • 11.3.4.1. Market Size & Forecast
        • 11.3.4.1.1. By Value
      • 11.3.4.2. Market Share & Forecast
        • 11.3.4.2.1. By Technology Node
        • 11.3.4.2.2. By Application
    • 11.3.5. Israel Semiconductor Foundry Market Outlook
      • 11.3.5.1. Market Size & Forecast
        • 11.3.5.1.1. By Value
      • 11.3.5.2. Market Share & Forecast
        • 11.3.5.2.1. By Technology Node
        • 11.3.5.2.2. By Application

12. Asia Pacific Semiconductor Foundry Market Outlook

  • 12.1. Market Size & Forecast
        • 12.1.1.1.1. By Technology Node
        • 12.1.1.1.2. By Application
    • 12.1.2. By Country
  • 12.2. Asia-Pacific: Country Analysis
    • 12.2.1. China Semiconductor Foundry Market Outlook
      • 12.2.1.1. Market Size & Forecast
        • 12.2.1.1.1. By Value
      • 12.2.1.2. Market Share & Forecast
        • 12.2.1.2.1. By Technology Node
        • 12.2.1.2.2. By Application
    • 12.2.2. India Semiconductor Foundry Market Outlook
      • 12.2.2.1. Market Size & Forecast
        • 12.2.2.1.1. By Value
      • 12.2.2.2. Market Share & Forecast
        • 12.2.2.2.1. By Technology Node
        • 12.2.2.2.2. By Application
    • 12.2.3. Japan Semiconductor Foundry Market Outlook
      • 12.2.3.1. Market Size & Forecast
        • 12.2.3.1.1. By Value
      • 12.2.3.2. Market Share & Forecast
        • 12.2.3.2.1. By Technology Node
        • 12.2.3.2.2. By Application
    • 12.2.4. South Korea Semiconductor Foundry Market Outlook
      • 12.2.4.1. Market Size & Forecast
        • 12.2.4.1.1. By Value
      • 12.2.4.2. Market Share & Forecast
        • 12.2.4.2.1. By Technology Node
        • 12.2.4.2.2. By Application
    • 12.2.5. Australia Semiconductor Foundry Market Outlook
      • 12.2.5.1. Market Size & Forecast
        • 12.2.5.1.1. By Value
      • 12.2.5.2. Market Share & Forecast
        • 12.2.5.2.1. By Technology Node
        • 12.2.5.2.2. By Application
    • 12.2.6. Indonesia Semiconductor Foundry Market Outlook
      • 12.2.6.1. Market Size & Forecast
        • 12.2.6.1.1. By Value
      • 12.2.6.2. Market Share & Forecast
        • 12.2.6.2.1. By Technology Node
        • 12.2.6.2.2. By Application
    • 12.2.7. Vietnam Semiconductor Foundry Market Outlook
      • 12.2.7.1. Market Size & Forecast
        • 12.2.7.1.1. By Value
      • 12.2.7.2. Market Share & Forecast
        • 12.2.7.2.1. By Technology Node
        • 12.2.7.2.2. By Application

13. Market Dynamics

  • 13.1. Drivers
  • 13.2. Challenges

14. Market Trends and Developments

15. Company Profiles

  • 15.1. Taiwan Semiconductor Manufacturing Company Limited (TSMC)
    • 15.1.1. Business Overview
    • 15.1.2. Key Revenue and Financials
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel/Key Contact Person
    • 15.1.5. Key Product/Services Offered
  • 15.2. Samsung Electronics Co., Ltd.
    • 15.2.1. Business Overview
    • 15.2.2. Key Revenue and Financials
    • 15.2.3. Recent Developments
    • 15.2.4. Key Personnel/Key Contact Person
    • 15.2.5. Key Product/Services Offered
  • 15.3. United Microelectronics Corporation (UMC)
    • 15.3.1. Business Overview
    • 15.3.2. Key Revenue and Financials
    • 15.3.3. Recent Developments
    • 15.3.4. Key Personnel/Key Contact Person
    • 15.3.5. Key Product/Services Offered
  • 15.4. GlobalFoundries Inc.
    • 15.4.1. Business Overview
    • 15.4.2. Key Revenue and Financials
    • 15.4.3. Recent Developments
    • 15.4.4. Key Personnel/Key Contact Person
    • 15.4.5. Key Product/Services Offered
  • 15.5. Semiconductor Manufacturing International Corporation (SMIC)
    • 15.5.1. Business Overview
    • 15.5.2. Key Revenue and Financials
    • 15.5.3. Recent Developments
    • 15.5.4. Key Personnel/Key Contact Person
    • 15.5.5. Key Product/Services Offered
  • 15.6. Vanguard International Semiconductor Corporation (VIS)
    • 15.6.1. Business Overview
    • 15.6.2. Key Revenue and Financials
    • 15.6.3. Recent Developments
    • 15.6.4. Key Personnel/Key Contact Person
    • 15.6.5. Key Product/Services Offered
  • 15.7. Tower Semiconductor Ltd.
    • 15.7.1. Business Overview
    • 15.7.2. Key Revenue and Financials
    • 15.7.3. Recent Developments
    • 15.7.4. Key Personnel/Key Contact Person
    • 15.7.5. Key Product/Services Offered
  • 15.8. X-FAB Silicon Foundries SE
    • 15.8.1. Business Overview
    • 15.8.2. Key Revenue and Financials
    • 15.8.3. Recent Developments
    • 15.8.4. Key Personnel/Key Contact Person
    • 15.8.5. Key Product/Services Offered
  • 15.9. Powerchip Technology Corporation
    • 15.9.1. Business Overview
    • 15.9.2. Key Revenue and Financials
    • 15.9.3. Recent Developments
    • 15.9.4. Key Personnel/Key Contact Person
    • 15.9.5. Key Product/Services Offered
  • 15.10. Dongbu HiTek Co., Ltd.
    • 15.10.1. Business Overview
    • 15.10.2. Key Revenue and Financials
    • 15.10.3. Recent Developments
    • 15.10.4. Key Personnel/Key Contact Person
    • 15.10.5. Key Product/Services Offered

16. Strategic Recommendations

17. About Us & Disclaimer