半导体组装流程设备的全球市场规模:封装技术，各用途，各终端用户，各地区，范围及预测

半导体组装製程设备市场规模及预测

2023年半导体组装製程设备市场规模为39.8亿美元，2024-2030年预测期间复合年增长率为9.1%，到2030年将达到72.8亿美元。半导体组装製程设备市场包括半导体製造组装和封装阶段所使用的机器、工具和设备。这包括晶片键合、引线键合、封装和测试等各种製程。该市场涵盖前端和后端组装工艺，满足全球半导体製造商的多样化需求。

推动全球半导体组装製程设备市场的因素

半导体组装製程设备市场的市场推动因素受到多种因素的影响。

技术开发：

半导体技术的持续发展（包括开发更小、更强大的晶片）推动了对日益复杂的组装製程设备的需求。

消费性电子产品的需求不断成长：

随着智慧型手机、笔记型电脑、平板电脑设备和其他消费性电子设备的需求不断增加，对半导体组装设备的需求也不断增加，以满足这些生产需求。

物联网与人工智慧的普及：

人工智慧（AI）和物联网（IoT）技术在各行业的广泛使用增加了对半导体的需求，从而推动了组装製程设备市场。

汽车工业的成长：

汽车产业向ADAS（高级驾驶辅助系统）、电动车（EV）和自动驾驶汽车（AV）的转变需要提高汽车中安装的半导体水平，从而导致对装配工艺设备的需求。

5G技术部署：

随着 5G 网路在全球范围内推广，製造用于通讯设备和基础设施的专用半导体的需求不断增加，从而推动了对组装製程设备的需求。

快速都市化与工业化：

由于製造、基础设施和医疗保健等各行业对电子产品的需求不断增长，新兴国家的半导体组装设备市场正在迅速成长。

小型化趋势：

随着电子设备的小型化，需要先进的组装製程设备来处理较小的零件并实现高精度和准确度。

政府投资与计画：

政府对半导体工厂和基础设施的投资，以及旨在促进半导体生产和研发（R&D）业务的计划，都有助于市场扩张。

供应链弹性意识：

随着 COVID-19 大流行凸显了供应链弹性的重要性，半导体公司正在对组装製程设备进行现代化改造，以提高製造能力并减少对外部供应商的依赖，并开始投资。

环境法规：

随着环境永续发展法规变得更加严格，将采用更节能和环保的半导体组装製程设备，这将影响市场动态。

限制全球半导体组装製程设备市场的因素

有几个因素可能会成为半导体组装製程设备市场的限製或课题。

初始投资高：

初始投资高：由于购买和安装半导体製造製程设备所需的初始资本支出较高，中小型半导体製造商难以进入新市场并扩大业务。

相容性与整合复杂性：

将新的组装製程设备与您目前的生产基础设施整合需要花费大量的精力和时间。多个软体平台和设备组件之间的不相容性可能会阻碍新技术的采用。

半导体产业是週期性的，会随着需求的突然增加而起起落落。市场饱和、地缘政治不稳定和经济波动都会破坏装配製程设备的需求并影响市场成长。

庞大的交货时间和上市时间压力：

半导体製造商面临更快发布新产品和缩短产品开发週期的压力。采购和设置装配工艺设备的交货时间过长可能会影响上市时间和製造计划，从而导致成本和机会的浪费。

世界半导体短缺：

半导体供应链的中断，例如近期因需求增加、生产中断和地缘政治紧张局势等因素造成的供应短缺，可能会对组装製程设备市场带来不确定性和瓶颈。

技术快速过时：

半导体产业以其快速的技术进步而闻名，这导致设备和技术很快就过时。为了长期保持竞争力和相关性，半导体製造商必须仔细考虑对组装製程设备的投资。

激烈的竞争：

在半导体组装製程设备产业，国内外许多竞争对手都在争夺市场占有率。激烈的竞争可能导致价格竞争压力、利润率下降以及难以根据功能和性能实现产品差异化。

贸易法与智慧财产权保护：

贸易法和专利纠纷等智慧财产权保护问题使半导体製造商陷入法律困境，并使其难以在全球开发和部署装配线设备。

应对复杂的法规：

开发、生产和销售半导体组装製程设备更加困难且昂贵，因为它必须遵守许多监管要求，例如安全标准、环境法和出口法规。

环境问题：

半导体製造使用危险化学品并产生大量废弃物，增加了采用更清洁、更永续的製造方法的压力。

目录

第1章 简介

• 市场定义
• 市场区隔
• 调查手法

第2章 摘要整理

• 主要调查结果
• 市场概要
• 市场亮点

第3章 市场概要

• 市场规模与成长的可能性
• 市场趋势
• 推动市场要素
• 阻碍市场要素
• 市场机会
• 波特的五力分析

第4章 半导体组装流程设备市场:封装技术

• 通孔技术(THT)
• 表面装置技术(SMT)
• 先进包装

第5章 半导体组装流程设备市场:各用途

• 消费者电子产品
• 汽车
• 产业
• 通讯
• 医疗

第6章 半导体组装流程设备市场:各终端用户

• 半导体厂商
• 目的地品牌製造商(OEM)
• 电子设备製造服务(EMS)供应商

第7章 各地区分析

• 北美
• 美国
• 加拿大
• 墨西哥
• 欧洲
• 英国
• 德国
• 法国
• 义大利
• 亚太地区
• 中国
• 日本
• 印度
• 澳洲
• 南美
• 巴西
• 阿根廷
• 智利
• 中东·非洲
• 南非
• 沙乌地阿拉伯
• 阿拉伯联合大公国

第8章 市场动态

• 推动市场要素
• 阻碍市场要素
• 市场机会
• COVID-19对市场的影响

第9章 竞争情形

• 主要企业
• 市场占有率分析

第10章 企业简介

• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

第11章 市场展望和机会

• 新兴技术
• 今后的市场趋势
• 投资机会

第12章 附录

• 简称清单
• 出处和参考文献

Semiconductor Assembly Process Equipment Market Size And Forecast

Semiconductor Assembly Process Equipment Market size was valued at USD 3.98 Billion in 2023 and is projected to reach USD 7.28 Billion by 2030, growing at a CAGR of 9.1% during the forecast period 2024-2030. The Semiconductor Assembly Process Equipment Market encompasses the machinery, tools, and equipment utilized in the assembly and packaging stages of semiconductor manufacturing. This includes various processes such as die bonding, wire bonding, encapsulation, and testing, among others. The market covers both front-end and back-end assembly processes, catering to the diverse needs of semiconductor manufacturers worldwide.

Global Semiconductor Assembly Process Equipment Market Drivers

The market drivers for the Semiconductor Assembly Process Equipment Market can be influenced by various factors. These may include:

Technological Developments:

The need for increasingly complex assembly process equipment is driven by ongoing developments in semiconductor technology, such as the creation of smaller and more potent chips.

Growing Demand for Consumer Electronics:

In order to meet the production demands of these items, there is an increasing need for semiconductor assembly equipment due to the growing demand for smartphones, laptops, tablets, and other consumer electronics devices.

Growing Adoption of IoT and AI:

As a result of the widespread use of artificial intelligence (AI) and Internet of Things (IoT) technologies in a variety of industries, there is an increased need for semiconductors, which in turn propels the market for assembly process equipment.

Growth of the Automotive Industry:

The automotive industry's transition to advanced driver-assistance systems (ADAS), electric cars (EVs), and autonomous vehicles (AVs) necessitates a higher level of semiconductor content in vehicles, which increases demand for assembly process equipment.

5G Technology Deployment:

As 5G networks are deployed globally, the need for specialized semiconductors to be produced for telecommunications devices and infrastructure is increasing, which is driving demand for assembly process equipment.

Rapid Urbanization and Industrialization:

As a result of rising demand for electronics across a range of industries, including manufacturing, infrastructure, and healthcare, emerging nations are seeing a surge in the market for semiconductor assembly equipment.

Miniaturization Trend:

As electronic devices get smaller and more compact, there is a need for sophisticated assembly process equipment that can handle smaller components and achieve high precision and accuracy.

Government Investments and Programs:

Government investments in semiconductor fabs and infrastructure, as well as programs targeted at advancing semiconductor production and research and development (R&D) operations, all contribute to the expansion of the market.

Awareness of Supply Chain Resilience:

The COVID-19 pandemic brought attention to the significance of supply chain resilience, which incentivized semiconductor companies to make investments in modernizing assembly process equipment to augment manufacturing capacities and mitigate reliance on outside suppliers.

Environmental rules:

As environmental sustainability rules become more stringent, more energy-efficient and environmentally friendly semiconductor assembly process equipment is adopted, which in turn affects market dynamics.

Global Semiconductor Assembly Process Equipment Market Restraints

Several factors can act as restraints or challenges for the Semiconductor Assembly Process Equipment Market. These may include:

High Initial Expenditure:

Small and medium-sized semiconductor manufacturers find it difficult to enter new markets and expand due to the high initial capital expenditure needed to buy and install equipment for the semiconductor manufacturing process.

Compatibility and Integration Complexity:

It can take a lot of effort and time to integrate new assembly process equipment with the current production infrastructure. New technology adoption may be hampered by incompatibilities between several software platforms and equipment components.

The semiconductor industry is cyclical, experiencing upswings and downswings in response to spikes in demand. Market saturation, geopolitical unrest, and economic swings can all have an impact on market growth by causing demand instability for assembly process equipment.

Extensive Lead Times and Time-to-Market Pressures:

Semiconductor producers are under pressure to accelerate the release of new products and reduce the length of their product development cycles. Long lead times for purchasing and setting up assembly process equipment can affect time-to-market and manufacturing schedules, costing money and opportunities.

Global Semiconductor Shortages:

Uncertainty and bottlenecks in the market for assembly process equipment can result from disruptions in the semiconductor supply chain, such as the shortages that have occurred recently as a result of factors like increased demand, production disruptions, and geopolitical tensions.

Fast technical Obsolescence:

The semiconductor industry is known for its quick technical progress, which causes equipment and technology to become outdated very quickly. In order to maintain their competitiveness and relevance over the long run, semiconductor manufacturers need to carefully consider their investments in assembly process equipment.

Tight Competition:

There are many national and international competitors fighting for market share in the semiconductor assembly process equipment industry. Pricing pressure, dwindling profit margins, and difficulties differentiating products based on features and capabilities can all result from intense competition.

Trade laws and intellectual property protection:

Trade laws and intellectual property protection issues, such as patent disputes, can put semiconductor manufacturers in a legal bind and make it more difficult for them to develop and implement assembly line equipment on a global scale.

Complex Regulatory Compliance:

The development, production, and marketing of semiconductor assembly process equipment are made more difficult and expensive by the need to comply with a number of regulatory requirements, including safety standards, environmental laws, and export controls.

Environmental Concerns:

Because the semiconductor manufacturing process uses hazardous chemicals and produces a lot of waste, there is growing pressure to adopt cleaner, more sustainable manufacturing practices, which could result in higher costs and more work to comply with regulations.

Global Semiconductor Assembly Process Equipment Market Segmentation Analysis

The Global Semiconductor Assembly Process Equipment Market is segmented on the basis of Packaging Technology, Application, End-User, and Geography.

Semiconductor Assembly Process Equipment Market, By Packaging Technology

• Through-Hole Technology (THT)
• : Involves mounting components by inserting leads through holes in the PCB and soldering them on the opposite side.
• Surface Mount Technology (SMT)
• : Involves mounting components directly onto the surface of the PCB.
• Advanced Packaging
• : Includes various techniques such as System-in-Package (SiP), Chip-on-Board (COB), and Wafer Level Packaging (WLP).

Semiconductor Assembly Process Equipment Market, By Application

• Consumer Electronics
• : Includes applications in smartphones, tablets, laptops, and wearables.
• Automotive
• : Involves assembly process equipment used in automotive electronics, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).
• Industrial
• : Covers equipment used in industrial automation, robotics, and control systems.
• Telecommunications
• : Encompasses equipment for telecommunications infrastructure, including base stations, routers, and switches.
• Medical
• : Involves assembly equipment used in medical devices and equipment, such as pacemakers, medical imaging devices, and monitoring systems.

Semiconductor Assembly Process Equipment Market, By End-User

• Semiconductor Manufacturers
• : Companies involved in the fabrication of semiconductor chips.
• Original Equipment Manufacturers (OEMs)
• : Companies that integrate semiconductor components into their end products, such as electronics manufacturers.
• Electronic Manufacturing Services (EMS) Providers
• : Contract manufacturers that offer assembly and manufacturing services to OEMs.

Semiconductor Assembly Process Equipment Market, By Geography

• North America:
• Market conditions and demand in the United States, Canada, and Mexico.
• Europe:
• Analysis of the Semiconductor Assembly Process Equipment Market in European countries.
• Asia-Pacific:
• Focusing on countries like China, India, Japan, South Korea, and others.
• Middle East and Africa:
• Examining market dynamics in the Middle East and African regions.
• Latin America:
• Covering market trends and developments in countries across Latin America.

Key Players

• The major players in the Semiconductor Assembly Process Equipment Market are:
• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

TABLE OF CONTENTS

1. Introduction

• Market Definition
• Market Segmentation
• Research Methodology

2. Executive Summary

• Key Findings
• Market Overview
• Market Highlights

3. Market Overview

• Market Size and Growth Potential
• Market Trends
• Market Drivers
• Market Restraints
• Market Opportunities
• Porter's Five Forces Analysis

4. Semiconductor Assembly Process Equipment Market, By Packaging Technology

• Through-Hole Technology (THT)
• Surface Mount Technology (SMT)
• Advanced Packaging

5. Semiconductor Assembly Process Equipment Market, By Application

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Medical

6. Semiconductor Assembly Process Equipment Market, By End-User

• Semiconductor Manufacturers
• Original Equipment Manufacturers (OEMs)
• Electronic Manufacturing Services (EMS) Providers

7. Regional Analysis

• North America
• United States
• Canada
• Mexico
• Europe
• United Kingdom
• Germany
• France
• Italy
• Asia-Pacific
• China
• Japan
• India
• Australia
• Latin America
• Brazil
• Argentina
• Chile
• Middle East and Africa
• South Africa
• Saudi Arabia
• UAE

8. Market Dynamics

• Market Drivers
• Market Restraints
• Market Opportunities
• Impact of COVID-19 on the Market

9. Competitive Landscape

• Key Players
• Market Share Analysis

10. Company Profiles

• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

11. Market Outlook and Opportunities

• Emerging Technologies
• Future Market Trends
• Investment Opportunities

12. Appendix

• List of Abbreviations
• Sources and References