年间契约型资讯服务
商品编码
1413686
先进封装专利监测服务Advanced Packaging Patent Monitoring Service |
该服务提供半导体先进封装领域专利活动的最新数据(新专利申请数量、获得的新专利数量、专利到期/放弃数量、专利转让数量以及专利诉讼的最新趋势/反对)。等)。
在半导体产业,对单一包装中更多运算能力和记忆体的需求不断增长,以缩小外形尺寸并提高产品效能。然而,随着节点达到其发展极限,摩尔定律变得越来越难以实现。因此,晶片小型化的进程正在放缓。2.5D和3D堆迭以及扇出晶圆级封装等先进封装技术已成为满足半导体产业需求的重要解决方案。这些新方法能够将多个晶片整合到单一封装中,并有可能结合成熟和先进的节点,取代主导的倒装晶片 (FC) 和引线键合 (WB) 互补技术。这些先进封装技术的路线图具有挑战性,包括高密度扇出(HD FO) 重新分布层(RDL)、高密度输入/输出互连(I/O) 以及硅中介层、嵌入式桥接器和混合键合对先进互连技术(例如小晶片方法)的需求正在加剧供应链竞争。2.5/3D 封装市场具有最高的成长潜力,由于小晶片 3D 整合混合键合的普及,3D SoC 技术成长最快。在扇出 WLP 产业中,超高密度扇出 (UHD FO) 正在经历最高的成长,因为与硅中介层相比,它已成为一种经济高效的解决方案。半导体封装主要由ASE/SPIL、Amkor 和 JCET等 OSAT 完成,它们继续在该领域发挥重要作用。然而,TSMC、Samsung和Intel正在开发创新的 2.5D/3D 封装解决方案,例如硅中介层、嵌入式桥和混合结。透过提供先进的后端解决方案并利用前端功能,这些公司有望影响该领域未来的技术和智慧财产权 (IP) 发展。
在此背景下,监控主要公司的专利活动和智慧财产权(IP)策略至关重要。这些知识可以帮助您了解竞争对手的研发路线图和策略、评估风险并发现商机。我们的服务支援 TSMC、Intel、Samsung、Amkor、ASE、SPIL、JCET、Deca、Nepes、Powertech (PTI)、SJSemi、Tongfu (TFME)、Huatian、Infineon、Micron、SK Hynix、YMTC、GlobalFoundries、Xperi/Adeia 能够定期了解各大公司的智慧财产权活动,例如
我们的服务利用每季更新一次的 Excel 资料库,让您能够从季度分析报告以及与分析师的直接互动中受益。
我们的服务使您能够了解竞争对手目前的专利活动、智慧财产权动态、专利转移(包括收购和授权)、专利诉讼、技术开发和研发策略。此外,可以在早期发现进入该业务领域的新进入者。
追踪最近的专利申请趋势可以让您追踪您所在领域的最新创新。获取已提交发明的详细资讯并追踪技术发展。受新技术解决方案的启发,研究和开发活动可能会得到改善。
在授予专有权之前获取有关已提交专利申请的信息,并迅速采取行动,防止可能对您的业务产生负面影响的知识产权註册。
监控新颁发的专利,以确保您的产品和工艺不受专利保护,并且您可以安全地製造它们,而不会侵犯他人拥有的有效智慧财产权。您可以定期评估您的销售和使用的商业自由度。
透过追踪过期和废弃的专利,您可以识别公共领域中可以安全用于您的开发的发明。
每个季度,我们都会提供近三个月知识产权动态特写,重点关注主要知识产权企业和主要专利技术。突出显示了关键专利申请人及其发明、被阻止的专利、有前途的专利以及新到期或放弃的关键专利。
您将有机会透过电话或电子邮件与分析师直接互动,并透过问答和公开讨论(每年 100 小时)获取有关特定专利技术或公司智慧财产权组合的具体资讯。
Get up-to-date data on Advanced Semiconductor Packaging patent activity: New patent applications, patents newly granted, expired or abandoned patents, latest patent transfers, patent litigations and oppositions.
In the semiconductor industry, there is a growing demand for integrating more compute and memory within a single package in order to achieve smaller form factors and improve product performance. However, Moore's Law becomes increasingly difficult to achieve as node advancement reaches its limits. As a result, the process of chip miniaturization has been slowing down. Advanced packaging techniques, such as 2.5D & 3D stacking, and fan-out wafer level packaging, have emerged as crucial solutions to meet the needs of the semiconductor industry. These new approaches allow for the integration of multiple dies into a single package, with the possibility of combining mature and advanced nodes, and they have supplemented the dominant flip-chip (FC) and wire-bond (WB) technologies. The roadmap for these advanced packaging technologies is challenging and the supply chain is becoming increasingly competitive, with the demand for high-density fan-out (HD FO) redistribution layers (RDLs), high-density input/output interconnections (I/O), and advanced interconnect technologies such as silicon interposer, embedded bridge, hybrid bonding, and chiplets approach. The market for 2.5/3D packaging shows the most potential for growth, with 3D SoC technology growing the most driven by the increasing popularity of hybrid bonding for chiplets 3D integration. In the fan-out WLP industry, the segment experiencing the highest growth is the ultra-high density fan-out (UHD FO), which has emerged as a more cost-effective solution compared to silicon interposers. Semiconductor packaging was primarily performed by OSATs such as ASE/SPIL, Amkor, JCET, etc. and they continue to play an important role in this field. However, it is TSMC, Samsung and Intel that have been developing innovative 2.5D/3D packaging solutions such as silicon interposer, embedded bridge, and hybrid bonding. By offering advanced back-end solutions and using their front-end capabilities, these companies poised to influence future technology and intellectual property (IP) developments in this area.
In this context, it is crucial to monitor patent activity and intellectual property (IP) strategies of key players. Such knowledge can assist in understanding your competitors' R&D roadmap and strategies, evaluate the risks, and detect business opportunities. The Advanced Packaging Patent Monitor gives periodic insights on the IP activity of a selection of key companies: TSMC, Intel, Samsung, Amkor, ASE, SPIL, JCET, Deca, Nepes, Powertech (PTI), SJSemi, Tongfu (TFME), Huatian, Infineon, Micron, SK Hynix, YMTC, GlobalFoundries, and Xperi/Adeia.
The Advanced Packaging patent monitoring service allows you to take advantage of a quarterly-updated Excel database and benefit from both quarterly analysis reports and direct interaction with our analysts.
With the help of the patent monitoring service, you will be aware of your competitors' current patenting activities, their IP dynamics, patent transfers including acquisitions and licenses, patent litigation, technology development and R&D strategies. You will also be able to early detect new entrants in your business area.
By keeping note of any recent patent filings, you can track the newest innovations in the field. You will get details on claimed inventions and you can follow technology developments. New technical solutions could inspire and improve your R&D activity.
You will obtain information on patent applications filed even before exclusive rights have been granted and you can react in time to prevent registration of IP rights that may be harmful to your business.
Monitoring newly-issued patents allows you to regularly assess your freedom-to-operate, ensuring your products or processes are not covered by patents, and thus that they can be manufactured, sold or used safely without infringing valid IP rights owned by others.
By tracking both expired patents and abandoned patents, you will be able to identify inventions entering the public domain that you can use safely for your development.
On a quarterly basis, the report will provide the IP trends over the three last months, with a close look to key IP players and key patented technologies. Main patent applicants and their inventions, blocking patents, promising patents and key patents newly expired or abandoned will be highlighted.
Take advantage of direct interaction with our analysts by phone call and/or email and get specific input for specific patented technologies and company IP portfolios through Q&A session and open discussion (100h per year).