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市场调查报告书
商品编码
1179566

半导体封装和测试合同市场：按工艺、封装类型、应用分类：2021-2031 年全球机遇分析和行业预测

Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031
出版日期: | 出版商: Allied Market Research | 英文 225 Pages | 商品交期: 2-3个工作天内

价格

2021年全球半导体组装与检测市场规模将达到345.535亿美元，2031年将达到603.345亿美元，预计2022-2031年復合年增长率为6.32%，有望创历史新高

OSAT (Outsourced Semiconductor Assembly and Test) 是多家提供 IC 封装和测试服务的公司。 IDM 和代工厂通常将一定比例的 IC 封装生产外包给 OSAT，并自行完成封装工作。 OSAT主要是为消费品、电信、计算机、物联网（IoT）、汽车电子、可穿戴设备和其他新兴市场等各个市场的半导体公司提供先进的封装和测试解决方案。

全球半导体组装和检测市场背后的主要因素是家电需求的增加和城市化进程的推进。 此外，智能手机的普及极大地推动了市场的增长。 然而，与 OSAT 服务相关的高成本可能会阻碍预测期内的市场增长。 另一方面，芯片市场的增长有望为OSAT公司提供巨大商机。

装配部门将成为 2021 年最大的收入来源，预计 2022 年至 2031 年的复合年增长率将达到 6.46%。 这是由于半导体製造业对有效供应链管理的需求不断增长。 按封装类型划分，球栅阵列部分将成为 2020 年最大的收入贡献者，预计 2022 年至 2031 年的复合年增长率将达到 5.63%。 半导体行业的技术进步导致对更薄、更轻的电子产品的需求激增。

在此背景下，球栅阵列型封装主要以其小型化优势推动该类型封装的增长。 按地区来看半导体组装和检测合同市场的趋势，正在四个地区进行分析：北美、欧洲、亚太地区和 Ram 地区。 分析证实，北美在 2021 年贡献了最大的收入。 这得益于工业化的进步，汽车工业和通讯业的快速发展。

内容

第一章介绍

第 2 章执行摘要

第 3 章市场概述

  • 市场定义和范围
  • 主要发现
    • 主要投资领域
  • 波特的五力分析
  • 主要公司的定位
  • 市场动态
    • 司机
    • 约束因素
    • 机会
  • COVID-19 影响分析

第 4 章半导体组装和检测合同市场：按流程

  • 概览
    • 市场规模和预测
  • 缝纫
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：国家分析
  • 排序
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 测试
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 大会
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类

第 5 章半导体组装和检测合同市场：按封装类型

  • 概览
    • 市场规模和预测
  • 球栅阵列
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 芯片级封装
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 多包
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 堆迭模具
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 四路、双路
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类

第 6 章半导体组装和检测合同市场：按应用

  • 概览
    • 市场规模和预测
  • 汽车领域
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 消费类电子产品
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 工业设备
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 通讯领域
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 航空航天与国防
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 医疗/保健
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类
  • 物流和运输
    • 主要市场趋势、增长因素和机遇
    • 市场规模和预测：按地区
    • 市场分析：按国家/地区分类

第 7 章半导体组装和检测合同市场：按地区

  • 概览
    • 市场规模和预测
  • 北美
    • 主要趋势和机会
    • 北美市场规模趋势和预测：按流程
    • 北美市场规模和预测：按包装类型
    • 北美市场规模和预测：按应用
    • 北美市场规模和预测：按国家/地区分类
      • 美国
      • 加拿大
      • 墨西哥
  • 欧洲
    • 主要趋势和机会
    • 欧洲市场规模和预测：按流程
    • 欧洲市场规模和预测：按包装类型
    • 欧洲市场规模和预测：按应用分类
    • 欧洲市场规模和预测：按国家/地区分类
      • 英国
      • 德国
      • 法国
      • 意大利
      • 俄罗斯
      • 瑞典
      • 荷兰
      • 其他欧洲地区
  • 亚太地区
    • 主要趋势和机会
    • 亚太市场规模和预测：按流程
    • 亚太地区市场规模和按包装类型预测
    • 亚太市场规模和预测：按应用
    • 亚太地区的市场规模和预测：按国家/地区分类
      • 中国
      • 印度
      • 日本
      • 韩国
      • 其他欧洲地区
  • 拉美
    • 主要趋势和机会
    • LAMEA 市场规模和预测：按流程
    • LAMEA 市场规模和预测：按包装类型
    • LAMEA 市场规模和预测：按应用分类
    • LAMEA 市场规模和预测：按国家/地区分类
      • 拉丁美洲
      • 中东
      • 非洲

第八章公司情况

  • 简介
  • 关键成功策略
  • 10 家主要公司的产品映射
  • 比赛仪表板
  • 竞争热图
  • 主要发展

第九章公司简介

  • ADVANCED SILICON S.A.
  • ALPHACORE INC.
  • AMKOR TECHNOLOGY, INC
  • DEVICE ENGINEERING INC.
  • HIDENSITY GROUP（HMT MICROELECTRONIC AG）
  • PRESTO ENGINEERING GROUP
  • Sencio BV
  • SHORTLINK GROUP
  • SIFIVE, INC.（OPENFIVE）
  • LUMINAR TECHNOLOGIES, INC.（BLACK FOREST ENGINEERING）
Product Code: A08874

The global outsourced semiconductor assembly and test market was valued at $34,553.5 million in 2021, and is projected to reach $60,334.5 million by 2031, registering a CAGR of 6.32% from 2022 to 2031. Outsourced semiconductor assembly and test (OSAT) are the number of companies that offers third-party IC-packaging as well as test services. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. OSAT mainly emphasizes on providing advanced packaging as well as test solutions for semiconductor companies in various markets such as consumer goods, communications, and computing along with emerging markets such as Internet of Things (IoT), automotive electronics, and wearable devices.

The global outsourced semiconductor assembly and test market is mainly driven by increase in demand for consumer electronics and surge in degree of urbanization. In addition, increase in adoption of smartphones significantly fuels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the other hand, growth in the chip market is anticipated to provide a huge opportunity for OSAT companies.

The assembly segment was the largest revenue contributor in 2021, and is expected to grow at a CAGR of 6.46% from 2022 to 2031. This is attributed to rise in need for effective supply chain management in the semiconductor manufacturing industry. By packaging type, the ball grid array segment was the leading largest contributor of revenue in 2020 and is expected to grow at a CAGR of 5.63% from 2022 to 2031. Technological advancements in the semiconductor industry has led to surge in demand for thinner and lighter electronics products.

This factor primarily drives growth of the ball grid array type of packaging, owing to several miniaturization advantages that it offers. By region, the outsourced semiconductor assembly and test market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. The analysis identified that North America contributed for the maximum revenue in 2021. This is attributed to increase in industrialization as well as rapid development in automotive and telecommunication industries.

The key players profiled in the report include Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive). Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, and acquisition to strengthen their foothold in the outsourced semiconductor assembly and test industry.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the outsourced semiconductor assembly and testing market analysis from 2021 to 2031 to identify the prevailing outsourced semiconductor assembly and testing market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the outsourced semiconductor assembly and testing market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global outsourced semiconductor assembly and testing market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Process

  • Sawing
  • Sorting
  • Testing
  • Assembly

By Packaging Type

  • Ball grid array
  • Chip scale package
  • Multi-package
  • Stacked die
  • Quad and dual

By Application

  • Automotive
  • Consumer electronics
  • Industrial
  • Telecommunication
  • Aerospace and defense
  • Medical and healthcare
  • Logistics and transportation

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Russia
    • Sweden
    • Netherlands
    • Rest Of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest Of Europe
  • LAMEA
    • Latin America
    • Middle East
    • Africa
  • Key Market Players
    • ADVANCED SILICON S.A.
    • ALPHACORE INC.
    • AMKOR TECHNOLOGY, INC.
    • DEVICE ENGINEERING INC.
    • HIDENSITY GROUP (HMT MICROELECTRONIC AG)
    • PRESTO ENGINEERING GROUP
    • Sencio BV
    • SHORTLINK GROUP
    • SIFIVE, INC. (OPENFIVE)
    • LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.Report description
  • 1.2.Key market segments
  • 1.3.Key benefits to the stakeholders
  • 1.4.Research Methodology
    • 1.4.1.Secondary research
    • 1.4.2.Primary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.Key findings of the study
  • 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

  • 3.1.Market definition and scope
  • 3.2.Key findings
    • 3.2.1.Top investment pockets
  • 3.3.Porter's five forces analysis
  • 3.4.Top player positioning
  • 3.5.Market dynamics
    • 3.5.1.Drivers
    • 3.5.2.Restraints
    • 3.5.3.Opportunities
  • 3.6.COVID-19 Impact Analysis on the market

CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS

  • 4.1 Overview
    • 4.1.1 Market size and forecast
  • 4.2 Sawing
    • 4.2.1 Key market trends, growth factors and opportunities
    • 4.2.2 Market size and forecast, by region
    • 4.2.3 Market analysis by country
  • 4.3 Sorting
    • 4.3.1 Key market trends, growth factors and opportunities
    • 4.3.2 Market size and forecast, by region
    • 4.3.3 Market analysis by country
  • 4.4 Testing
    • 4.4.1 Key market trends, growth factors and opportunities
    • 4.4.2 Market size and forecast, by region
    • 4.4.3 Market analysis by country
  • 4.5 Assembly
    • 4.5.1 Key market trends, growth factors and opportunities
    • 4.5.2 Market size and forecast, by region
    • 4.5.3 Market analysis by country

CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE

  • 5.1 Overview
    • 5.1.1 Market size and forecast
  • 5.2 Ball grid array
    • 5.2.1 Key market trends, growth factors and opportunities
    • 5.2.2 Market size and forecast, by region
    • 5.2.3 Market analysis by country
  • 5.3 Chip scale package
    • 5.3.1 Key market trends, growth factors and opportunities
    • 5.3.2 Market size and forecast, by region
    • 5.3.3 Market analysis by country
  • 5.4 Multi-package
    • 5.4.1 Key market trends, growth factors and opportunities
    • 5.4.2 Market size and forecast, by region
    • 5.4.3 Market analysis by country
  • 5.5 Stacked die
    • 5.5.1 Key market trends, growth factors and opportunities
    • 5.5.2 Market size and forecast, by region
    • 5.5.3 Market analysis by country
  • 5.6 Quad and dual
    • 5.6.1 Key market trends, growth factors and opportunities
    • 5.6.2 Market size and forecast, by region
    • 5.6.3 Market analysis by country

CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION

  • 6.1 Overview
    • 6.1.1 Market size and forecast
  • 6.2 Automotive
    • 6.2.1 Key market trends, growth factors and opportunities
    • 6.2.2 Market size and forecast, by region
    • 6.2.3 Market analysis by country
  • 6.3 Consumer electronics
    • 6.3.1 Key market trends, growth factors and opportunities
    • 6.3.2 Market size and forecast, by region
    • 6.3.3 Market analysis by country
  • 6.4 Industrial
    • 6.4.1 Key market trends, growth factors and opportunities
    • 6.4.2 Market size and forecast, by region
    • 6.4.3 Market analysis by country
  • 6.5 Telecommunication
    • 6.5.1 Key market trends, growth factors and opportunities
    • 6.5.2 Market size and forecast, by region
    • 6.5.3 Market analysis by country
  • 6.6 Aerospace and defense
    • 6.6.1 Key market trends, growth factors and opportunities
    • 6.6.2 Market size and forecast, by region
    • 6.6.3 Market analysis by country
  • 6.7 Medical and healthcare
    • 6.7.1 Key market trends, growth factors and opportunities
    • 6.7.2 Market size and forecast, by region
    • 6.7.3 Market analysis by country
  • 6.8 Logistics and transportation
    • 6.8.1 Key market trends, growth factors and opportunities
    • 6.8.2 Market size and forecast, by region
    • 6.8.3 Market analysis by country

CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION

  • 7.1 Overview
    • 7.1.1 Market size and forecast
  • 7.2 North America
    • 7.2.1 Key trends and opportunities
    • 7.2.2 North America Market size and forecast, by Process
    • 7.2.3 North America Market size and forecast, by Packaging Type
    • 7.2.4 North America Market size and forecast, by Application
    • 7.2.5 North America Market size and forecast, by country
      • 7.2.5.1 U.S.
      • 7.2.5.1.1 Market size and forecast, by Process
      • 7.2.5.1.2 Market size and forecast, by Packaging Type
      • 7.2.5.1.3 Market size and forecast, by Application
      • 7.2.5.2 Canada
      • 7.2.5.2.1 Market size and forecast, by Process
      • 7.2.5.2.2 Market size and forecast, by Packaging Type
      • 7.2.5.2.3 Market size and forecast, by Application
      • 7.2.5.3 Mexico
      • 7.2.5.3.1 Market size and forecast, by Process
      • 7.2.5.3.2 Market size and forecast, by Packaging Type
      • 7.2.5.3.3 Market size and forecast, by Application
  • 7.3 Europe
    • 7.3.1 Key trends and opportunities
    • 7.3.2 Europe Market size and forecast, by Process
    • 7.3.3 Europe Market size and forecast, by Packaging Type
    • 7.3.4 Europe Market size and forecast, by Application
    • 7.3.5 Europe Market size and forecast, by country
      • 7.3.5.1 UK
      • 7.3.5.1.1 Market size and forecast, by Process
      • 7.3.5.1.2 Market size and forecast, by Packaging Type
      • 7.3.5.1.3 Market size and forecast, by Application
      • 7.3.5.2 Germany
      • 7.3.5.2.1 Market size and forecast, by Process
      • 7.3.5.2.2 Market size and forecast, by Packaging Type
      • 7.3.5.2.3 Market size and forecast, by Application
      • 7.3.5.3 France
      • 7.3.5.3.1 Market size and forecast, by Process
      • 7.3.5.3.2 Market size and forecast, by Packaging Type
      • 7.3.5.3.3 Market size and forecast, by Application
      • 7.3.5.4 Italy
      • 7.3.5.4.1 Market size and forecast, by Process
      • 7.3.5.4.2 Market size and forecast, by Packaging Type
      • 7.3.5.4.3 Market size and forecast, by Application
      • 7.3.5.5 Russia
      • 7.3.5.5.1 Market size and forecast, by Process
      • 7.3.5.5.2 Market size and forecast, by Packaging Type
      • 7.3.5.5.3 Market size and forecast, by Application
      • 7.3.5.6 Sweden
      • 7.3.5.6.1 Market size and forecast, by Process
      • 7.3.5.6.2 Market size and forecast, by Packaging Type
      • 7.3.5.6.3 Market size and forecast, by Application
      • 7.3.5.7 Netherlands
      • 7.3.5.7.1 Market size and forecast, by Process
      • 7.3.5.7.2 Market size and forecast, by Packaging Type
      • 7.3.5.7.3 Market size and forecast, by Application
      • 7.3.5.8 Rest of Europe
      • 7.3.5.8.1 Market size and forecast, by Process
      • 7.3.5.8.2 Market size and forecast, by Packaging Type
      • 7.3.5.8.3 Market size and forecast, by Application
  • 7.4 Asia-Pacific
    • 7.4.1 Key trends and opportunities
    • 7.4.2 Asia-Pacific Market size and forecast, by Process
    • 7.4.3 Asia-Pacific Market size and forecast, by Packaging Type
    • 7.4.4 Asia-Pacific Market size and forecast, by Application
    • 7.4.5 Asia-Pacific Market size and forecast, by country
      • 7.4.5.1 China
      • 7.4.5.1.1 Market size and forecast, by Process
      • 7.4.5.1.2 Market size and forecast, by Packaging Type
      • 7.4.5.1.3 Market size and forecast, by Application
      • 7.4.5.2 India
      • 7.4.5.2.1 Market size and forecast, by Process
      • 7.4.5.2.2 Market size and forecast, by Packaging Type
      • 7.4.5.2.3 Market size and forecast, by Application
      • 7.4.5.3 Japan
      • 7.4.5.3.1 Market size and forecast, by Process
      • 7.4.5.3.2 Market size and forecast, by Packaging Type
      • 7.4.5.3.3 Market size and forecast, by Application
      • 7.4.5.4 South Korea
      • 7.4.5.4.1 Market size and forecast, by Process
      • 7.4.5.4.2 Market size and forecast, by Packaging Type
      • 7.4.5.4.3 Market size and forecast, by Application
      • 7.4.5.5 Rest of Europe
      • 7.4.5.5.1 Market size and forecast, by Process
      • 7.4.5.5.2 Market size and forecast, by Packaging Type
      • 7.4.5.5.3 Market size and forecast, by Application
  • 7.5 LAMEA
    • 7.5.1 Key trends and opportunities
    • 7.5.2 LAMEA Market size and forecast, by Process
    • 7.5.3 LAMEA Market size and forecast, by Packaging Type
    • 7.5.4 LAMEA Market size and forecast, by Application
    • 7.5.5 LAMEA Market size and forecast, by country
      • 7.5.5.1 Latin America
      • 7.5.5.1.1 Market size and forecast, by Process
      • 7.5.5.1.2 Market size and forecast, by Packaging Type
      • 7.5.5.1.3 Market size and forecast, by Application
      • 7.5.5.2 Middle East
      • 7.5.5.2.1 Market size and forecast, by Process
      • 7.5.5.2.2 Market size and forecast, by Packaging Type
      • 7.5.5.2.3 Market size and forecast, by Application
      • 7.5.5.3 Africa
      • 7.5.5.3.1 Market size and forecast, by Process
      • 7.5.5.3.2 Market size and forecast, by Packaging Type
      • 7.5.5.3.3 Market size and forecast, by Application

CHAPTER 8: COMPANY LANDSCAPE

  • 8.1. Introduction
  • 8.2. Top winning strategies
  • 8.3. Product Mapping of Top 10 Player
  • 8.4. Competitive Dashboard
  • 8.5. Competitive Heatmap
  • 8.6. Key developments

CHAPTER 9: COMPANY PROFILES

  • 9.1 ADVANCED SILICON S.A.
    • 9.1.1 Company overview
    • 9.1.2 Company snapshot
    • 9.1.3 Operating business segments
    • 9.1.4 Product portfolio
    • 9.1.5 Business performance
    • 9.1.6 Key strategic moves and developments
  • 9.2 ALPHACORE INC.
    • 9.2.1 Company overview
    • 9.2.2 Company snapshot
    • 9.2.3 Operating business segments
    • 9.2.4 Product portfolio
    • 9.2.5 Business performance
    • 9.2.6 Key strategic moves and developments
  • 9.3 AMKOR TECHNOLOGY, INC
    • 9.3.1 Company overview
    • 9.3.2 Company snapshot
    • 9.3.3 Operating business segments
    • 9.3.4 Product portfolio
    • 9.3.5 Business performance
    • 9.3.6 Key strategic moves and developments
  • 9.4 DEVICE ENGINEERING INC.
    • 9.4.1 Company overview
    • 9.4.2 Company snapshot
    • 9.4.3 Operating business segments
    • 9.4.4 Product portfolio
    • 9.4.5 Business performance
    • 9.4.6 Key strategic moves and developments
  • 9.5 HIDENSITY GROUP (HMT MICROELECTRONIC AG)
    • 9.5.1 Company overview
    • 9.5.2 Company snapshot
    • 9.5.3 Operating business segments
    • 9.5.4 Product portfolio
    • 9.5.5 Business performance
    • 9.5.6 Key strategic moves and developments
  • 9.6 PRESTO ENGINEERING GROUP
    • 9.6.1 Company overview
    • 9.6.2 Company snapshot
    • 9.6.3 Operating business segments
    • 9.6.4 Product portfolio
    • 9.6.5 Business performance
    • 9.6.6 Key strategic moves and developments
  • 9.7 Sencio BV
    • 9.7.1 Company overview
    • 9.7.2 Company snapshot
    • 9.7.3 Operating business segments
    • 9.7.4 Product portfolio
    • 9.7.5 Business performance
    • 9.7.6 Key strategic moves and developments
  • 9.8 SHORTLINK GROUP
    • 9.8.1 Company overview
    • 9.8.2 Company snapshot
    • 9.8.3 Operating business segments
    • 9.8.4 Product portfolio
    • 9.8.5 Business performance
    • 9.8.6 Key strategic moves and developments
  • 9.9 SIFIVE, INC. (OPENFIVE)
    • 9.9.1 Company overview
    • 9.9.2 Company snapshot
    • 9.9.3 Operating business segments
    • 9.9.4 Product portfolio
    • 9.9.5 Business performance
    • 9.9.6 Key strategic moves and developments
  • 9.10 LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)
    • 9.10.1 Company overview
    • 9.10.2 Company snapshot
    • 9.10.3 Operating business segments
    • 9.10.4 Product portfolio
    • 9.10.5 Business performance
    • 9.10.6 Key strategic moves and developments

LIST OF TABLES

  • TABLE 1. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SAWING, BY REGION, 2021-2031 ($MILLION)
  • TABLE 3. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SAWING, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 4. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SORTING, BY REGION, 2021-2031 ($MILLION)
  • TABLE 5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SORTING, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TESTING, BY REGION, 2021-2031 ($MILLION)
  • TABLE 7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TESTING, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR ASSEMBLY, BY REGION, 2021-2031 ($MILLION)
  • TABLE 9. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR ASSEMBLY, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR BALL GRID ARRAY, BY REGION, 2021-2031 ($MILLION)
  • TABLE 12. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR BALL GRID ARRAY, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 13. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CHIP SCALE PACKAGE, BY REGION, 2021-2031 ($MILLION)
  • TABLE 14. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CHIP SCALE PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 15. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MULTI-PACKAGE, BY REGION, 2021-2031 ($MILLION)
  • TABLE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MULTI-PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 17. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR STACKED DIE, BY REGION, 2021-2031 ($MILLION)
  • TABLE 18. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR STACKED DIE, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 19. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR QUAD AND DUAL, BY REGION, 2021-2031 ($MILLION)
  • TABLE 20. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR QUAD AND DUAL, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 21. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 22. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AUTOMOTIVE, BY REGION, 2021-2031 ($MILLION)
  • TABLE 23. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AUTOMOTIVE, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 24. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2021-2031 ($MILLION)
  • TABLE 25. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 26. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR INDUSTRIAL, BY REGION, 2021-2031 ($MILLION)
  • TABLE 27. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR INDUSTRIAL, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 28. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TELECOMMUNICATION, BY REGION, 2021-2031 ($MILLION)
  • TABLE 29. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 30. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AEROSPACE AND DEFENSE, BY REGION, 2021-2031 ($MILLION)
  • TABLE 31. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AEROSPACE AND DEFENSE, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 32. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MEDICAL AND HEALTHCARE, BY REGION, 2021-2031 ($MILLION)
  • TABLE 33. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MEDICAL AND HEALTHCARE, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 34. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR LOGISTICS AND TRANSPORTATION, BY REGION, 2021-2031 ($MILLION)
  • TABLE 35. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR LOGISTICS AND TRANSPORTATION, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 36. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION, 2021-2031 ($MILLION)
  • TABLE 37. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 38. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 39. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 40. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 41. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 42. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 43. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 44. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 45. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 46. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 47. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 48. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 49. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 50. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 51. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 52. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 53. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 54. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 55. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 56. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 57. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 58. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 59. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 60. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 61. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 62. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 63. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 64. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 65. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 66. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 67. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 68. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 69. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 70. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 71. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 72. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 73. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 74. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 75. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 76. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 77. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 78. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 79. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 80. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 81. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 82. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 83. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 84. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 85. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 86. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 87. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 88. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 89. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 90. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 91. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 92. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 93. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 94. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 95. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 96. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 97. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 98. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 99. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 100. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
  • TABLE 101. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 102. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 103. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 104. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 105. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 106. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 107. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
  • TABLE 108. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
  • TABLE 109. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
  • TABLE 110.ADVANCED SILICON S.A.: COMPANY SNAPSHOT
  • TABLE 111.ADVANCED SILICON S.A.: OPERATING SEGMENTS
  • TABLE 112.ADVANCED SILICON S.A.: PRODUCT PORTFOLIO
  • TABLE 113.ADVANCED SILICON S.A.: NET SALES,
  • TABLE 114.ADVANCED SILICON S.A.: KEY STRATERGIES
  • TABLE 115.ALPHACORE INC.: COMPANY SNAPSHOT
  • TABLE 116.ALPHACORE INC.: OPERATING SEGMENTS
  • TABLE 117.ALPHACORE INC.: PRODUCT PORTFOLIO
  • TABLE 118.ALPHACORE INC.: NET SALES,
  • TABLE 119.ALPHACORE INC.: KEY STRATERGIES
  • TABLE 120.AMKOR TECHNOLOGY, INC: COMPANY SNAPSHOT
  • TABLE 121.AMKOR TECHNOLOGY, INC: OPERATING SEGMENTS
  • TABLE 122.AMKOR TECHNOLOGY, INC: PRODUCT PORTFOLIO
  • TABLE 123.AMKOR TECHNOLOGY, INC: NET SALES,
  • TABLE 124.AMKOR TECHNOLOGY, INC: KEY STRATERGIES
  • TABLE 125.DEVICE ENGINEERING INC.: COMPANY SNAPSHOT
  • TABLE 126.DEVICE ENGINEERING INC.: OPERATING SEGMENTS
  • TABLE 127.DEVICE ENGINEERING INC.: PRODUCT PORTFOLIO
  • TABLE 128.DEVICE ENGINEERING INC.: NET SALES,
  • TABLE 129.DEVICE ENGINEERING INC.: KEY STRATERGIES
  • TABLE 130.HIDENSITY GROUP (HMT MICROELECTRONIC AG): COMPANY SNAPSHOT
  • TABLE 131.HIDENSITY GROUP (HMT MICROELECTRONIC AG): OPERATING SEGMENTS
  • TABLE 132.HIDENSITY GROUP (HMT MICROELECTRONIC AG): PRODUCT PORTFOLIO
  • TABLE 133.HIDENSITY GROUP (HMT MICROELECTRONIC AG): NET SALES,
  • TABLE 134.HIDENSITY GROUP (HMT MICROELECTRONIC AG): KEY STRATERGIES
  • TABLE 135.PRESTO ENGINEERING GROUP: COMPANY SNAPSHOT
  • TABLE 136.PRESTO ENGINEERING GROUP: OPERATING SEGMENTS
  • TABLE 137.PRESTO ENGINEERING GROUP: PRODUCT PORTFOLIO
  • TABLE 138.PRESTO ENGINEERING GROUP: NET SALES,
  • TABLE 139.PRESTO ENGINEERING GROUP: KEY STRATERGIES
  • TABLE 140.SENCIO BV: COMPANY SNAPSHOT
  • TABLE 141.SENCIO BV: OPERATING SEGMENTS
  • TABLE 142.SENCIO BV: PRODUCT PORTFOLIO
  • TABLE 143.SENCIO BV: NET SALES,
  • TABLE 144.SENCIO BV: KEY STRATERGIES
  • TABLE 145.SHORTLINK GROUP: COMPANY SNAPSHOT
  • TABLE 146.SHORTLINK GROUP: OPERATING SEGMENTS
  • TABLE 147.SHORTLINK GROUP: PRODUCT PORTFOLIO
  • TABLE 148.SHORTLINK GROUP: NET SALES,
  • TABLE 149.SHORTLINK GROUP: KEY STRATERGIES
  • TABLE 150.SIFIVE, INC. (OPENFIVE): COMPANY SNAPSHOT
  • TABLE 151.SIFIVE, INC. (OPENFIVE): OPERATING SEGMENTS
  • TABLE 152.SIFIVE, INC. (OPENFIVE): PRODUCT PORTFOLIO
  • TABLE 153.SIFIVE, INC. (OPENFIVE): NET SALES,
  • TABLE 154.SIFIVE, INC. (OPENFIVE): KEY STRATERGIES
  • TABLE 155.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): COMPANY SNAPSHOT
  • TABLE 156.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): OPERATING SEGMENTS
  • TABLE 157.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): PRODUCT PORTFOLIO
  • TABLE 158.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): NET SALES,
  • TABLE 159.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): KEY STRATERGIES

LIST OF FIGURES

  • FIGURE 1.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET SEGMENTATION
  • FIGURE 2.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031
  • FIGURE 3.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031
  • FIGURE 4. TOP INVESTMENT POCKETS, BY REGION
  • FIGURE 5.PORTER FIVE-1
  • FIGURE 6.PORTER FIVE-2
  • FIGURE 7.PORTER FIVE-3
  • FIGURE 8.PORTER FIVE-4
  • FIGURE 9.PORTER FIVE-5
  • FIGURE 10.TOP PLAYER POSITIONING
  • FIGURE 11.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
  • FIGURE 12.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY PROCESS,2021(%)
  • FIGURE 13.COMPARATIVE SHARE ANALYSIS OF SAWING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 14.COMPARATIVE SHARE ANALYSIS OF SORTING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 15.COMPARATIVE SHARE ANALYSIS OF TESTING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 16.COMPARATIVE SHARE ANALYSIS OF ASSEMBLY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 17.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY PACKAGING TYPE,2021(%)
  • FIGURE 18.COMPARATIVE SHARE ANALYSIS OF BALL GRID ARRAY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 19.COMPARATIVE SHARE ANALYSIS OF CHIP SCALE PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 20.COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 21.COMPARATIVE SHARE ANALYSIS OF STACKED DIE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 22.COMPARATIVE SHARE ANALYSIS OF QUAD AND DUAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 23.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY APPLICATION,2021(%)
  • FIGURE 24.COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 25.COMPARATIVE SHARE ANALYSIS OF CONSUMER ELECTRONICS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 26.COMPARATIVE SHARE ANALYSIS OF INDUSTRIAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 27.COMPARATIVE SHARE ANALYSIS OF TELECOMMUNICATION OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 28.COMPARATIVE SHARE ANALYSIS OF AEROSPACE AND DEFENSE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 29.COMPARATIVE SHARE ANALYSIS OF MEDICAL AND HEALTHCARE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 30.COMPARATIVE SHARE ANALYSIS OF LOGISTICS AND TRANSPORTATION OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
  • FIGURE 31.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET BY REGION,2021
  • FIGURE 32.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 33.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 34.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 35.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 36.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 37.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 38.ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 39.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 40.SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 41.NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 42.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 43.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 44.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 45.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 46.SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 47.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 48.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 49.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 50.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
  • FIGURE 51. TOP WINNING STRATEGIES, BY YEAR
  • FIGURE 52. TOP WINNING STRATEGIES, BY DEVELOPMENT
  • FIGURE 53. TOP WINNING STRATEGIES, BY COMPANY
  • FIGURE 54.PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 55.COMPETITIVE DASHBOARD
  • FIGURE 56.COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
  • FIGURE 57.ADVANCED SILICON S.A..: NET SALES ,($MILLION)
  • FIGURE 58.ALPHACORE INC..: NET SALES ,($MILLION)
  • FIGURE 59.AMKOR TECHNOLOGY, INC.: NET SALES ,($MILLION)
  • FIGURE 60.DEVICE ENGINEERING INC..: NET SALES ,($MILLION)
  • FIGURE 61.HIDENSITY GROUP (HMT MICROELECTRONIC AG).: NET SALES ,($MILLION)
  • FIGURE 62.PRESTO ENGINEERING GROUP.: NET SALES ,($MILLION)
  • FIGURE 63.SENCIO BV.: NET SALES ,($MILLION)
  • FIGURE 64.SHORTLINK GROUP.: NET SALES ,($MILLION)
  • FIGURE 65.SIFIVE, INC. (OPENFIVE).: NET SALES ,($MILLION)
  • FIGURE 66.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING).: NET SALES ,($MILLION)