全球半导体组装和测试外包（OSAT）的成长机会

先进封装的日益普及以及对具有成本效益的 ATP 解决方案的需求推动了成长

本研究分析了全球半导体组装和测试外包 (OSAT) 市场。由于各行业越来越多地采用先进封装技术，OSAT 市场预计将显着成长。 OSAT 是一家专门为集成设备製造商 (IDM)、代工厂和无晶圆厂晶片製造商提供组装、测试和封装 (ATP) 服务的第三方供应商。我们提供先进和传统包装和检测方面的专业知识，受益于大批量製造能力的规模经济。透过将后端製造流程外包给 OSAT，晶片製造商可以专注于其核心竞争力，从而缩短週转时间和上市时间。

该研究重点关注提供封装和检验服务的 OSAT 和代工厂，不包括具有内部封装能力的 IDM。 OSAT 和 Foundry 根据 ATP 服务产生的收益深入研究市场估计和预测。它对最终用户产业进行了深入分析，并概述了 OSAT 透过先进封装技术实现电动车、5G 部署和物联网 (IoT) 等变革趋势的潜力。此外，我们也检验了产业整合和地缘政治因素对 OSAT 市场的影响。

研究的主要目的是确定该领域产生的成长机会，并评估加速或阻碍市场成长的因素。研究了基于最终用户行业、封装技术、互连类型和地区的细分市场。该研究包括与 OSAT 生态系统中的行业专家和相关人员讨论中获得的见解，并辅以二次研究，并提供了到 2027 年的市场规模估计和成长预测。主要亮点包括对区域需求模式的洞察以及对每个最终用户部门的 OSAT 机会的全面分析。此外，我们也研究资本支出趋势、OSAT 设施分布和 OSAT 价值链。它还包括竞争分析并提供主要企业的市场占有率。

目录

战略衝动

• 为什么成长如此困难？
• The Strategic Imperative 8（TM）
• 关键策略要务对半导体组装和测试外包 (OSAT) 产业的影响
• 成长机会推动Growth Pipeline Engine（TM）

成长机会分析

• 分析范围
• 半导体封装技术的分类
• OSAT价值链的主要参与企业
• 按最终用户细分
• 小晶片的兴起
• WBG 半导体封装趋势
• 混合键合
• 主要竞争
• 成长指标
• 生长促进因子
• 促生长因子分析
• 成长抑制因素
• 成长抑制因素分析
• 预测假设
• 收益预测
• 按最终用户分類的收益预测
• 按包装类型分類的收益预测
• 收益预测（按互连类型）
• 封装互连技术 - 全球 OSAT、IDM、晶圆代工市场占有率
• 按地区分類的收益预测
• OSAT 设施（按地区）
• 收益预测分析
• 价格趋势和预测分析
• 竞争环境
• 收益占有率
• 收益占有率分析
• OSAT形势- 资本支出趋势
• OSAT形势- 前 25 家纯 OSAT 公司分析
• 全球着名 ATMP 投资
• 2020-2023年ATMP投资形势
• OSAT 成功秘诀
• 竞争分析
• 併购分析

印度的 OSAT形势与机会

• 印度半导体产业
• 印度的半导体政策
• 收益预测 - 印度 ATMP 现状
• 收益预测分析 – ATMP 市场
• 印度的 OSAT 机会
• 印度 ATMP形势- 当前情况
• 印度ATMP产能
• 印度 ATMP 产业的发展

OSAT 中的人工智慧

• OSAT 智慧製造实施的主要支柱
• 半导体封装和检测中的 AI/ML
• OSAT/ATMP形势现有且潜在的 AI/ML 解决方案
• 着名的 ATMP AI/ML 解决方案 - 影响分析仪表板
• 案例#1：用于高效 OSAT 营运的端到端软体解决方案
• 案例#2：采用 PDF 解决方案的 Exensio OSAT

成长机会分析 - 行动消费性电子产品

• 成长指标
• 收益预测
• 收益预测（按互连类型）
• 按包装类型分類的收益预测
• 按地区分類的收益预测
• 预测分析
• 适用于 5G 的 AiP
• 智慧型手机 RF FEM、天线和封装技术与网路生成的演变
• 竞争环境
• 收益占有率

成长机会分析 -通讯/基础设施

• 成长指标
• 收益预测
• 收益预测（按互连类型）
• 按包装类型分類的收益预测
• 按地区分類的收益预测
• 预测分析
• 全球 5G 采用 - 2021 年和 2025 年
• 竞争环境
• 收益占有率

成长机会分析 -汽车/交通

• 成长指标
• 收益预测
• 收益预测（按互连类型）
• 按包装类型分類的收益预测
• 按地区分類的收益预测
• 预测分析
• 竞争环境
• 收益占有率

成长机会分析 - 其他

• 成长指标
• 收益预测
• 收益预测（按互连类型）
• 按包装类型分類的收益预测
• 按地区分類的收益预测
• 预测分析
• 竞争环境
• 收益占有率

OSAT 的永续性

• 半导体生态系统关于永续性和循环经济的五个主要趋势
• 半导体生态系统与联合国永续发展目标之间的合作对于为脱碳铺路至关重要
• OSAT 的关键永续性因素
• 联合国永续发展目标
• Amkor Technology
• ASE Technology

成长机会宇宙

• 成长机会 1：HI 的验证与检验
• 成长机会2：工业4.0提高报酬率和效率
• 成长机会3：上下游策略配合措施
• 成长机会4：半导体封装中的3D列印
• 成长机会5：数位转型，有效应对衝击
• 成长机会六：併购

下一步

Increasing Adoption of Advanced Packaging and the Need for Cost-effective ATP Solutions will Fuel Transformational Growth

This study analyzes the global outsourced semiconductor assembly and test (OSAT) market, which is set to experience substantial growth driven by the increasing adoption of advanced packaging technology across various industries. OSATs are third-party providers that specialize in assembly, testing, and packaging (ATP) services and cater to integrated device manufacturers (IDMs), foundries, and fabless chip manufacturers. They offer expertise in both advanced and conventional packaging and testing, benefiting from economies of scale due to their high-volume manufacturing capabilities. By outsourcing backend manufacturing processes to OSATs, chip manufacturers can focus on their core competencies and experience faster turnaround times and reduced time-to-market.

This study focuses on pure-play OSATs and foundries offering packaging and testing services, excluding IDMs with in-house packaging capabilities. The research delves into market estimates and forecasts based on the revenue generated by OSATs and foundries through ATP services. The study analyzes end-user industries in detail, outlining the potential OSATs hold for enabling transformative trends like electric mobility, 5G deployments, and the Internet of Things (IoT) through advanced packaging technologies. Additionally, it examines the impact of industry consolidation and geopolitical factors on the OSAT market.

The primary goal of this study is to identify growth opportunities emerging from this space and assess factors that may accelerate or hinder market growth. It examines market segments based on end-user industries, packaging technology, interconnect type, and geography. The research includes findings from discussions with industry experts and stakeholders in the OSAT ecosystem, complemented by secondary research, to estimate market size and forecast growth up to 2027. Some of the key study highlights include insights into demand patterns across different regions and a comprehensive analysis of each end-user sector's OSAT opportunities. Additionally, the study examines the capital expenditure trend, the distribution of OSAT facilities, and the value chain of OSAT. The report also contains a competitive analysis, providing market shares for major players.

Table of Contents

Strategic Imperatives

• Why is it Increasingly Difficult to Grow?
• The Strategic Imperative 8™
• The Impact of the Top 3 Strategic Imperatives on the Outsourced Semiconductor Assembly and Test (OSAT) Industry
• Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis

• Scope of Analysis
• Classification of Semiconductor Packaging Technology
• Key Participants in the OSAT Value Chain
• Segmentation by End Users
• The Rise of Chiplets
• Packaging Trends in Wide-bandgap (WBG) Semiconductors
• Hybrid Bonding
• Key Competitors
• Growth Metrics
• Growth Drivers
• Growth Driver Analysis
• Growth Restraints
• Growth Restraint Analysis
• Forecast Assumptions
• Revenue Forecast
• Revenue Forecast by End User
• Revenue Forecast by Packaging Type
• Revenue Forecast by Interconnect Type
• Packaging Interconnect Technologies-Global Market Share of OSATs, IDMs, and Foundries
• Revenue Forecast by Region
• OSAT Facilities by Region
• Revenue Forecast Analysis
• Pricing Trends and Forecast Analysis
• Competitive Environment
• Revenue Share
• Revenue Share Analysis
• OSAT Landscape-Capex Trend
• OSAT Landscape-Analysis of Top 25 Pure-play OSATs
• Notable ATMP Investments Globally
• ATMP Investment Landscape, 2020-2023
• OSATs' Recipe for Success
• Analysis of Competition
• M&A Analysis

Indian OSAT Landscape and Opportunities

• Indian Semiconductor Industry
• Indian Semiconductor Policy
• Revenue Forecast-Indian ATMP Landscape
• Revenue Forecast Analysis-ATMP Market
• Indian OSAT Opportunities
• Indian ATMP Landscape-Current Scenario
• India ATMP Capabilities
• Developments in the Indian ATMP Sector

AI in OSATs

• Key Pillars for Implementation of Smart Manufacturing in OSATs
• AI/ML in Semiconductors Packaging and Testing
• Existing and Potential AI/ML Solutions for the OSATs/ATMP Landscape
• Notable AI/ML Solutions for ATMP-Impact Analysis Dashboard
• Case #1: End-to-End Software Solution for Efficient OSAT Operations
• Case #2: Exensio OSAT by PDF Solutions

Growth Opportunity Analysis-Mobile & Consumer Electronics

• Growth Metrics
• Revenue Forecast
• Revenue Forecast by Interconnect Type
• Revenue Forecast by Packaging Type
• Revenue Forecast by Region
• Forecast Analysis
• AiP for 5G
• Evolution of RF FEM, Antenna, and Packaging Technology in Smartphones with Network Generations
• Competitive Environment
• Revenue Share

Growth Opportunity Analysis-Telecom & Infrastructure

• Growth Metrics
• Revenue Forecast
• Revenue Forecast by Interconnect Type
• Revenue Forecast by Packaging Type
• Revenue Forecast by Region
• Forecast Analysis
• Global 5G Adoption-2021 and 2025
• Competitive Environment
• Revenue Share

Growth Opportunity Analysis-Automotive & Transportation

• Growth Metrics
• Revenue Forecast
• Revenue Forecast by Interconnect Type
• Revenue Forecast by Packaging Type
• Revenue Forecast by Region
• Forecast Analysis
• Competitive Environment
• Revenue Share

Growth Opportunity Analysis-Others

• Growth Metrics
• Revenue Forecast
• Revenue Forecast by Interconnect Type
• Revenue Forecast by Packaging Type
• Revenue Forecast by Region
• Forecast Analysis
• Competitive Environment
• Revenue Share

Sustainability in OSATs

• Top 5 Trends in the Semiconductor Ecosystem for Sustainability and the Circular Economy
• Semiconductor Ecosystem Alignment with UN SDGs Critical to Paving the Path to Decarbonization
• Key Sustainability Factors for OSATs
• UN SDGs
• Amkor Technology
• ASE Technology

Growth Opportunity Universe

• Growth Opportunity 1: Validation and Verification for HI
• Growth Opportunity 2: Industry 4.0 for Improving Margins and Efficiency
• Growth Opportunity 3: Strategic Upstream and Downstream Efforts
• Growth Opportunity 4: 3D Printing in Semiconductor Packaging
• Growth Opportunity 5: Digital Transformation for Efficiently Tackling Shocks
• Growth Opportunity 6: M&As

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