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市场调查报告书
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1687812

外包半导体组装和测试（OSAT） -市场占有率分析、行业趋势和统计、成长预测（2025-2030）

Outsourced Semiconductor Assembly and Test (OSAT) - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
出版日期: | 出版商: Mordor Intelligence | 英文 187 Pages | 商品交期: 2-3个工作天内

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简介目录

预计 2025 年半导体组装和测试外包市场规模将达到 471 亿美元，到 2030 年将达到 712.1 亿美元，预测期内（2025-2030 年）的复合年增长率为 8.62%。

外包半导体组装与测试 (OSAT)-市场-IMG1

半导体产业继续发展，重点是小型化和效率。半导体已成为所有现代技术的基石。该领域的进步和创新对所有下游技术产生直接影响。人工智慧（AI）和云端运算等电子技术的快速发展，加上对高速、低功耗和高度积体电路（IC）的旺盛需求，带来了巨大的销售。

主要亮点

  • 外包也是半导体产业的关键因素。除了设计之外，半导体产品开发的製造方面还依赖第三方供应商提供的服务。晶圆厂 (Fabs) 和 OSAT 是半导体外包的两个突出例子。
  • OSAT半导体公司提供第三方IC封装和测试服务，在代工厂生产的半导体装置推出市场之前对其进行封装和测试。这些公司提供创新且经济高效的解决方案，可提供更快的处理速度、更强大的性能和功能，同时占用电子设备中更少的空间。
  • 英特尔、AMD 和 Nvidia 等半导体设计公司与 OSAT 公司签订合同，以运行该公司的设计。例如，英特尔既是晶片设计公司，也是一家代工厂（晶圆供应商）。在将晶片发送给客户之前，英特尔委託晶片封装外包给另一家 OSAT 进行组装和测试服务。
  • 各大半导体製造商对封装业务的垂直整合对全球OSAT市场构成了重大威胁。美国贸易战等多种因素正造成半导体产业供应链出现缺口。
  • OSAT供应商是提供半导体积体电路组装、封装和测试服务的第三方。疫情过后，随着晶片製造商专注于生产更小、更快、更有效率的半导体，半导体产业正在呈现成长态势。

半导体组装测试外包（OSAT）市场趋势

通讯成为最大的应用领域

  • 由于封装在通讯价值链中仍处于起步阶段，半导体市场的成长对 OSAT 市场的发展有直接的影响。代工厂可以自行封装，也可以外包。例如，半导体和通讯设备製造商高通 (Qualcomm) 与 OSAT 签订合约来处理其封装需求。
  • 通讯应用主要为通讯业的通讯晶片。功率放大器（PA）、前端模组（FEM）以及其他射频（RF）和连接设备等设备是 OSAT 和OEM的主要需求来源。根据半导体产业协会的数据，所有製造的半导体中约有 31% 用于通讯，例如网路设备和智慧型手机无线电。
  • 通讯应用通常部署在恶劣的环境条件下，需要可靠的封装解决方案。特别是在大规模通讯应用中，系统级封装（SiP）通常是各种通讯设备的首选。
  • 过去几年，智慧型手机市场在硬体和软体方面都取得了显着成长。儘管新冠疫情期间全球智慧型手机出货量有所下降，但包括中国在内的许多市场仍保持着较高的渗透率。生物感测器、5G智慧型手机和人工智慧功能等趋势预计将再次推动新智慧型手机的销售。
  • 根据GSMA预测，到2025年，亚太地区的智慧型手机普及率预计将上升至83%。同时，行动用户普及率预计到同年将达到62%。此外，5G智慧型手机的广泛应用预计将显着提高连网型设备密度、无线资料通讯频宽和延迟。
  • 多家半导体厂商预计，硅含量更高的5G智慧型手机将在全球广泛应用。 5G智慧型手机需要更高的功率效率、更快的通讯速度和更复杂的功能，这将增加每台装置使用的半导体元件数量。因此，消费性电子产业对半导体封装解决方案的需求预计将大幅增加。
  • 根据GSMA报告，预计2025年，全球约三分之一的人口将能够使用5G网路。报告也指出，届时5G连线数将超过4亿，约占所有行动连线的14%。
  • 预计到2023年底，5G普及率将达到17%，到2030年将成长到54%（相当于53亿个连线）。预计这项技术进步将为全球经济贡献近1兆美元。因此，预计半导体需求将推动市场成长。

韩国：预计市场将显着成长

  • 韩国是全球OSAT供应商最有前景的市场之一。该国拥有三星和 SK 海力士等知名消费性电子晶片製造商，是半导体设备技术创新的蓬勃发展的中心。
  • 韩国政府正专注于智慧製造，并计划在 2025 年之前将全自动製造公司的数量增加到 30,000 家。政府旨在透过采用现代化自动化、资料交换和物联网技术来实现这一目标，这些技术有望成为该国 OSAT 服务的主要驱动力。
  • 随着三星电子系统半导体业务的成长，韩国的半导体测试部门也取得了显着成长。 NEPES Ark、LB Semicon、Tesna、Hana Micron 等国内半导体测试公司正在对必要的设施和设备进行大量投资，以应对系统半导体供应量的增加。
  • SK海力士正在投资120兆韩元（约8亿日圆），在龙仁市元山地区建造下一代记忆体生产基地。 SK Hynix计划于2025年开始建造其记忆体製造厂。 SK Hynix也是HBM3的製造商。该公司计划在其利川 DRAM 製造工厂建立一条 TSV 封装生产线。为了提升HBM的竞争力，三星和SK海力士正在考虑增加更多的封装生产线。
  • 三星正在努力取代台积电提供的 2.5D内插器整合服务。我们正在努力降低TSV（硅穿孔电极）封装方法的製造成本。与SK海力士相比，三星是HBM（高频宽记忆体）市场的后来者。儘管如此，三星声称正在增加对 HBM 产能的投资，并表示打算在 2023 年之前推出新的 HBM 产品，这为扩大 HBM 封装产能提供了可能性。
  • 5G领域的发展也推动了晶片先进封装的成长。据越南科学技术资讯通信部称，截至 2023 年 2 月，越南 5G用户数量为 2,913 万，比 2021 年 2 月的 1,366 万增长 113%。

半导体组装和测试外包（OSAT）市场概况

外包半导体组装和测试 (OSAT) 市场较为分散，主要企业包括日月光科技控股、安靠科技公司、力成科技公司、南茂科技公司和京元电子等。该市场中的公司正在采用创新、伙伴关係和收购等策略来增强其产品供应并获得永续的竞争优势。

2023 年 12 月 - 力成科技（PTI）股份有限公司在最近的公告中宣布与华邦电子股份有限公司建立合作伙伴关係。此次合作旨在共同推动2.5D（晶圆上晶片）/3D先进基板业务。 PTI 将指导客户利用 WEC 的硅中介层、DRAM 和快闪记忆体来实现异质部署，并满足市场对高频宽和高效能运算服务的需求。

2023 年 10 月－ASE Technology Holding 推出协作设计工具集整合设计生态系统 (IDE)。该工具集旨在系统地增强整个 VIPack 平台的先进封装架构。这种创新方法实现了从单晶粒SoC 到多晶片分解 IP 区块（包括晶片和记忆体）的无缝过渡。这可以透过使用 2.5D 或先进的扇出结构进行整合来实现。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3个月的分析师支持

目录

第一章 引言

  • 研究假设和市场定义
  • 研究范围

第二章调查方法

第三章执行摘要

第四章 市场洞察

  • 市场概览
  • 半导体产业展望
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买家的议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争
  • 产业价值链分析
  • COVID-19疫情对市场的影响评估

第五章市场动态

  • 市场驱动因素
    • 半导体在汽车领域的应用日益增多
    • 5G等趋势将推动半导体封装的演进
  • 市场限制
    • 整合产业是 OSAT 公司关注的主要议题之一。

第六章市场区隔

  • 按服务类型
    • 包装
    • 测试
  • 按包装类型
    • 球栅阵列 (BGA) 封装
    • 晶片级封装（CSP）
    • 堆迭晶片封装
    • 多晶片封装
    • 四方扁平和双列直插式封装
  • 按应用
    • 通讯设备
    • 消费性电子产品
    • 车
    • 运算与网络
    • 工业的
    • 其他用途
  • 按地区
    • 美国
    • 中国
    • 台湾
    • 韩国
    • 马来西亚
    • 新加坡
    • 日本

第七章竞争格局

  • 公司简介
    • ASE Technology Holding Co. Ltd
    • Amkor Technology Inc.
    • Powertech Technology Inc.
    • ChipMOS Technologies Inc.
    • King Yuan Electronics Co. Ltd
    • Formosa Advanced Technologies Co. Ltd
    • Jiangsu Changjiang Electronics Technology Co. Ltd
    • UTAC Holdings Ltd
    • Lingsen Precision Industries Ltd
    • Tongfu Microelectronics Co.
    • Chipbond Technology Corporation
    • Hana Micron Inc.
    • Integrated Micro-electronics Inc.
    • Tianshui Huatian Technology Co. Ltd
  • Vendor Share Analysis

第八章投资分析

第九章 市场机会与未来趋势

简介目录
Product Code: 66300

The Outsourced Semiconductor Assembly and Test Market size is estimated at USD 47.10 billion in 2025, and is expected to reach USD 71.21 billion by 2030, at a CAGR of 8.62% during the forecast period (2025-2030).

Outsourced Semiconductor Assembly and Test (OSAT) - Market - IMG1

The semiconductor industry has been growing, focusing on miniaturization and efficiency. Semiconductors are emerging as building blocks of all modern technology. The advancements and innovations in this field directly impact all downstream technologies. The rapid development of electronics technology, including artificial intelligence (AI) and cloud computing, is complemented by a high demand for integrated circuits (ICs) with high speed, low power consumption, and high integration, leading to its significant sales.

Key Highlights

  • Outsourcing is also a significant factor in the semiconductor industry. More than just design, the manufacturing aspect of semiconductor product development is dependent on the services provided by third-party vendors. Fabs (Pure-Play Foundries) and OSATs are two prominent examples of semiconductor outsourcing.
  • OSAT semiconductor firms provide third-party IC packaging and testing services package and test semiconductor devices made by foundries before shipping them to the market. Such companies in the market provide innovative and cost-effective solutions that deliver faster processing speeds, higher performance, and functionality while taking up less space in an electronic device.
  • Semiconductor design companies, such as Intel, AMD, and Nvidia, contract OSAT companies to execute the companies' designs. For instance, Intel is a chip designer and a foundry (wafer provider) because they own and operate their fabs or foundries. Before shipping the chips to customers, Intel outsources its chip packaging to different OSATs for assembly and test services.
  • Vertical integration of key semiconductor manufacturers into packaging operations is a significant threat to the global OSAT market. Various factors, such as the US-China trade war, have caused a supply chain gap in the semiconductor industry.
  • The suppliers of as OSAT are third parties that provide the assembly, packaging and testing services for a semiconductor integrated circuit. Post COVID, semiconductor industry has been witnessing the growth due to chipmakers are focused on producing smaller, faster and more efficient semiconductors and where which increased the growth of OSAT as its has playes an essential part in the by filling the gap between IC design and availability.

Outsourced Semiconductor Assembly and Test (OSAT) Market Trends

Communication to be the Largest Application Segment

  • The semiconductor market's growth directly influences the OSAT market's development because the packaging is still at an early stage in the telecommunications value chain. The foundries can either handle the packaging themselves or contract it out. For instance, Qualcomm, a manufacturer of semiconductors and telecom equipment, contracts OSATs to handle its packaging needs.
  • The communication applications primarily consist of communication chips in the telecommunication industry. Equipment such as power amplifiers (PAs), front-end modules (FEMs), and other RF and connectivity devices are major sources of demand for OSATs and OEMs. According to the Semiconductor Industry Association, about 31% of all semiconductors manufactured are used for communications, including networking equipment and smartphone radios.
  • Communication applications require highly reliable packaging solutions as they are often deployed in harsh environmental conditions. In many cases, a system in package (SiP) is preferred for a large variety of communication equipment, especially in large-scale telecommunication applications.
  • The smartphone market has grown significantly in hardware and software over the past few years. Despite declining global smartphone unit shipments during COVID-19, there was high penetration in many markets, including China. Sales of new smartphones are expected to regain momentum, driven by trends like biosensors, 5G smartphones, and AI features.
  • The smartphone adoption rate in Asia-Pacific is expected to rise to 83% by 2025, according to GSMA. Concurrently, the mobile subscriber penetration rate is expected to reach 62% by the same year. The proliferation of 5G smartphones is also expected to significantly improve connected device density, wireless data communication bandwidth, and latency.
  • Many semiconductor producers anticipate that 5G smartphones with higher silicon contents will be widely adopted worldwide. The use of semiconductor components per device will rise due to the need for 5G smartphones to have higher power efficiency, faster speeds, and more complex functionalities. In turn, the consumer electronics industry is anticipated to experience a significant increase in demand for semiconductor packaging solutions.
  • According to the GSMA Report, around one-third of the global population is estimated to have access to 5G networks by 2025. The report also states that there will be more than 400 million 5G connections at that time, accounting for approximately 14% of all mobile connections.
  • The adoption of 5G was projected to reach 17% by the end of 2023 and increase to 54% (equivalent to 5.3 billion connections) by 2030. This technological advancement is anticipated to contribute nearly USD 1 trillion to the global economy. As a result, the demand for semiconductors will enhance the market's growth.

South Korea Expected to Register Significant Growth in the Market

  • South Korea is one of the promising markets for global OSAT vendors. The country is also home to some prominent chip makers for the consumer electronics segment, such as Samsung and SK Hynix, making it a lucrative hub for innovation in semiconductor devices.
  • The South Korean government focuses on smart manufacturing and plans to have 30,000 fully automated manufacturing companies by 2025. The government aims to achieve this by incorporating the latest automation, data exchange, and IoT technologies, which are expected to be significant drivers for OSAT services in the country.
  • The country's semiconductor testing sector has grown significantly with the growth of Samsung Electronics' system semiconductor business. The semiconductor testing companies in the country, such as NEPES Ark, LB Semicon, Tesna, and Hana Micron, have been dealing with increased supplies of system semiconductors by making significant investments in necessary facilities and equipment.
  • SK Hynix is constructing a base for manufacturing next-generation memory in the Wonsam town region of Yongin by investing KRW 120 trillion ( USD 90 billion). The chipmaker anticipates breaking construction on the memory manufacturing facility in 2025. SK Hynix is also the manufacturer of HBM3. The company plans to install TSV packaging production lines at its Icheon DRAM manufacturing facility. To improve its HBM competitiveness, Samsung and SK Hynix are considering adding more packaging production lines.
  • Samsung has been working on replacing the 2.5D interposer integration service offered by TSMC. It seeks to lower the cost of manufacturing the through-silicon via (TSV) packaging method. Compared to SK Hynix, Samsung is a latecomer to the HBM (high bandwidth memory) market. Still, the business claims it is increasing investments in its HBM capacity and declared intentions to introduce new HBM products by 2023, opening possibilities for expanding HBMs' packaging capacity.
  • The developments in the 5G space have also led to the growth of advanced packaging of chips. According to the Ministry of Science and ICT, as of February 2023, the country had 29.13 million 5G Subscribers, an increase of 113% compared to 13.66 million 5G subscribers in February 2021.

Outsourced Semiconductor Assembly and Test (OSAT) Market Overview

The outsourced semiconductor assembly and test services (OSAT) market is fragmented, with the presence of major players like ASE Technology Holding Co. Ltd, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., and King Yuan Electronics Co. Ltd. Players in the market are adopting strategies such as innovations, partnerships, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

December 2023 - In a recent announcement, Powertech Technology (PTI) Inc. revealed its partnership with Winbond Electronics Corporation by signing a letter of intent. This collaboration aims to jointly advance the business of 2.5D (Chip on Wafer on Substrate)/3D advanced packaging. PTI will guide its customers to leverage WEC's silicon Interposer, DRAM, and Flash to enable heterogeneous integration and cater to the market's demand for high-bandwidth and high-performance computing services.

October 2023 - ASE Technology Holding Co. Ltd launched its Integrated Design Ecosystem (IDE), a collaborative design toolset. This toolset is designed to enhance advanced package architecture across the VIPack platform systematically. This innovative approach enables a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory. It can be achieved by integrating them using 2.5D or advanced fanout structures.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Semiconductor Industry Outlook
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Bargaining Power of Suppliers
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Threat of New Entrants
    • 4.3.4 Threat of Substitutes
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Industry Value Chain Analysis
  • 4.5 Assessment of the Impact of COVID-19 Pandemic on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increased Applications of Semiconductors in Automotive
    • 5.1.2 Advancement in Semiconductor Packaging Due to Trends like 5G
  • 5.2 Market Restraints
    • 5.2.1 Vertical Integration is One of the Significant Concerns of OSAT Players

6 MARKET SEGMENTATION

  • 6.1 By Service Type
    • 6.1.1 Packaging
    • 6.1.2 Testing
  • 6.2 By Type of Packaging
    • 6.2.1 Ball Grid Array (BGA) Packaging
    • 6.2.2 Chip Scale Packaging (CSP)
    • 6.2.3 Stacked Die Packaging
    • 6.2.4 Multi Chip Packaging
    • 6.2.5 Quad Flat and Dual-inline Packaging
  • 6.3 By Application
    • 6.3.1 Communication
    • 6.3.2 Consumer Electronics
    • 6.3.3 Automotive
    • 6.3.4 Computing and Networking
    • 6.3.5 Industrial
    • 6.3.6 Other Applications
  • 6.4 By Geography
    • 6.4.1 United States
    • 6.4.2 China
    • 6.4.3 Taiwan
    • 6.4.4 South Korea
    • 6.4.5 Malaysia
    • 6.4.6 Singapore
    • 6.4.7 Japan

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ASE Technology Holding Co. Ltd
    • 7.1.2 Amkor Technology Inc.
    • 7.1.3 Powertech Technology Inc.
    • 7.1.4 ChipMOS Technologies Inc.
    • 7.1.5 King Yuan Electronics Co. Ltd
    • 7.1.6 Formosa Advanced Technologies Co. Ltd
    • 7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd
    • 7.1.8 UTAC Holdings Ltd
    • 7.1.9 Lingsen Precision Industries Ltd
    • 7.1.10 Tongfu Microelectronics Co.
    • 7.1.11 Chipbond Technology Corporation
    • 7.1.12 Hana Micron Inc.
    • 7.1.13 Integrated Micro-electronics Inc.
    • 7.1.14 Tianshui Huatian Technology Co. Ltd
  • 7.2 Vendor Share Analysis

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS