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2023年至2028年半导体组装与测试服务（OSAT）市场预测
市场调查报告书
商品编码
1410073

2023年至2028年半导体组装与测试服务（OSAT）市场预测

Outsourced Semiconductor Assembly And Test Services (OSAT) Market - Forecasts from 2023 to 2028
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计到 2021 年，半导体组装和测试服务 (OSAT) 市场规模将达到 225.5138 亿美元，预测期内复合年增长率为 16.01%。

半导体组装和测试服务（OSAT）是指为半导体公司提供专业化製造和测试服务的行业。 OSAT 公司与半导体製造商签订合同，组装、封装和测试积体电路 (IC) 和其他半导体装置。我们提供先进封装技术（例如晶圆层次电子构装和倒装晶片键合）的专业知识以及全面的测试服务，以确保半导体成品的品质和可靠性。 OSAT 服务使半导体公司专注于核心研发，同时受益于外包合作伙伴提供的专业能力和成本效率。

介绍

半导体组装和测试服务（OSAT）市场是指以外包方式为半导体公司提供组装和测试服务的产业。随着半导体装置变得越来越复杂、越来越小，市场正在经历显着成长，增加了对专业知识和先进封装解决方案的需求。该市场还提供经济高效且扩充性的製造和检验服务，使半导体公司能够简化业务、缩短上市时间并专注于核心竞争力。 OSAT 市场的特点是技术进步、严格的品质标准以及由创新和以客户为中心的解决方案驱动的竞争形势。

促进因素

半导体装置的复杂度不断增加

随着先进积体电路 (IC) 等半导体装置变得越来越复杂，组装和检查需要专门的知识和专业知识。 OSAT 供应商引领市场，提供满足复杂封装要求所需的能力和技术。

对小型化的需求不断增加

对更小、更紧凑的电子设备的需求持续成长。小型化需要先进的封装技术，例如晶圆层次电子构装和倒装晶片键合，而 OSAT 公司擅长这些技术并正在推动市场成长。

成本优化和效率

透过将组装和测试服务委託给 OSAT 供应商，半导体公司可以优化成本并提高业务效率。 OSAT 供应商可以利用规模经济、专业知识和先进设备来提供具有成本效益的製造和测试解决方案。

技术进步

OSAT 公司不断投资于研发，以保持在组装和测试技术进步的前沿。随着半导体製造商为其产品寻求尖端解决方案，我们采用和开发新技术的能力正在推动市场开拓。

专注于核心能力

半导体公司通常更愿意将组装和测试等非核心功能外包给 OSAT 供应商。这使您能够专注于自己的核心竞争力，例如 IC 设计和创新，同时依靠 OSAT 的专业封装和测试服务。

上市时间压力

半导体产业是一个竞争激烈的行业，上市时间至关重要。 OSAT 供应商提供快速的周转时间和简化的流程，使半导体公司能够满足市场需求并更快地推出产品。

扩充性和弹性

OSAT 供应商扩大生产规模和回应需求变化的能力是一个关键驱动因素。半导体公司可以利用 OSAT 合作伙伴提供的可扩展性和弹性来快速回应市场波动。

品质和可靠性要求

半导体产业强调品质和可靠性。 OSAT供应商拥有专业的测试能力和品管流程，以确保半导体装置的完整性和性能，并满足严格的行业标准。

全球趋势与外包：

半导体产业的全球化导致越来越多的组装和测试服务外包给 OSAT 供应商。公司受益于全球设施网路、特定地区的成本优势以及利用 OSAT 在全球的专业知识的能力。

对先进封装解决方案的需求不断增长：

随着半导体装置变得越来越复杂，对先进封装解决方案的需求也增加。 OSAT 供应商凭藉其在 2.5D 和 3D 封装、异质整合和系统级封装(SiP) 等先进封装技术方面的专业知识来推动市场成长。

主要企业提供的产品

Powertech Technology Inc. (PTI) 宣布推出新的「扇出面板级封装」(FOPLP) 技术，该技术能够生产用于移动、汽车和其他应用的高密度、高性能半导体封装。该技术旨在满足对更小、更有效率的半导体封装不断增长的需求。长电科技集团旗下星科金朋宣布推出全新先进晶圆级球栅阵列 (eWLB) 技术，可生产适用于行动、汽车和其他应用的高性能、低成本半导体封装。该技术旨在满足对更小、更有效率的半导体封装不断增长的需求。台积电宣布推出全新 InFO（整合式扇出）先进封装技术，可生产适用于行动、汽车和其他应用的高性能、低功耗半导体封装。该技术旨在满足对更小、更有效率的半导体封装不断增长的需求。

先进封装领域正成长

半导体组装和测试服务（OSAT）市场中正在经历快速正成长的细分市场是先进封装细分市场。随着半导体元件的发展，对晶圆层次电子构装、倒装晶片接合和封装等先进封装解决方案的需求不断增加。这些先进的封装技术可实现更高的性能、更小的尺寸和更高的能源效率。随着半导体公司寻求他们的专业知识来满足复杂和小型化半导体装置的要求，专门从事先进封装解决方案的 OSAT 供应商的需求不断增加，使他们成为该领域的首选。我们正在推动积极成长。

预计亚太地区将主导 OSAT市场占有率

亚太地区预计将主导半导体组装和测试服务（OSAT）市场占有率。由于成本优势、熟练劳动力和强大的供应链生态系统等因素，该地区已成为半导体製造的重要中心。中国、台湾和韩国等国家已成为半导体产业的主要参与者，吸引了半导体公司和 OSAT 供应商。该地区领先的半导体製造商的存在、高产量和技术专长有助于他们在 OSAT市场占有率中占据主导地位。

主要进展

2023年6月，全球最大的半导体公司之一美光科技宣布有意在印度古吉拉突邦建造一座新的组装和测试工厂。这座新工厂将使美光能够组装和测试生产 DRAM 和 NAND 产品，以满足国内和国际市场的需求。 2022年12月，印度领先企业集团之一塔塔集团宣布透过塔塔电子私人有限公司进军半导体业务。该公司计划建立一个半导体组装和测试（OSAT）部门，也称为组装、测试、标记和封装（ATMP）部门。此举意义重大，因为它符合印度政府的生产挂钩激励（PLI）计划，该计划旨在发展印度的半导体和显示器製造生态系统。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表

第二章调查方法

  • 调查资料
  • 先决条件

第三章执行摘要

  • 研究亮点

第四章市场动态

  • 市场驱动因素
  • 市场抑制因素
  • 波特五力分析
  • 产业价值链分析

第五章半导体组装与测试合约服务（OSAT）市场：依服务类型

  • 介绍
  • 包装
  • 测试

第六章 半导体组装与测试服务（OSAT）市场：依封装类型

  • 介绍
  • 球栅阵列 (BGA) 封装
  • 晶片级封装 (CSP)
  • 堆迭晶片封装
  • 多晶片封装
  • 四扁平和双列直插封装

第七章 半导体组装与测试合约服务（OSAT）市场：依应用分类

  • 介绍
  • 沟通
  • 家用电器
  • 车
  • 运算和网路
  • 工业的
  • 其他的

第八章半导体组装和测试合约服务（OSAT）市场：按地区

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 其他的
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 韩国
    • 台湾
    • 泰国
    • 印尼
    • 其他的

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作

第十章 公司简介

  • ASE Group（ASE Technology Holdings）
  • Amkor Technology Inc.
  • Powertech Technology Inc.
  • ChipMOS Technologies Inc.
  • King Yuan Electronics Co. Ltd
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • UTAC Holdings Ltd
  • Lingsen Precision Industries Ltd
  • Tongfu Microelectronics Co.
简介目录
Product Code: KSI061615732

The Outsourced Semiconductor Assembly and Test Services (OSAT) market was valued at US$22,551.380 million in 2021 and is expected to grow at a CAGR of 16.01% during the forecast period.

Outsourced Semiconductor Assembly and Test Services (OSAT) refer to the industry that provides specialized manufacturing and testing services for semiconductor companies. OSAT companies are contracted by semiconductor manufacturers to handle the assembly, packaging, and testing of integrated circuits (ICs) and other semiconductor devices. They offer expertise in advanced packaging technologies, such as wafer-level packaging and flip-chip bonding, as well as comprehensive testing services to ensure the quality and reliability of the final semiconductor products. OSAT services allow semiconductor companies to focus on core research and development while benefiting from the specialized capabilities and cost-effectiveness offered by these outsourcing partners.

Introduction:

The Outsourced Semiconductor Assembly and Test Services (OSAT) Market refers to the industry encompassing the provision of assembly and testing services for semiconductor companies on an outsourced basis. This market has been witnessing significant growth due to the increasing complexity and miniaturization of semiconductor devices, driving the demand for specialized expertise and advanced packaging solutions. This market also offers cost-effective and scalable manufacturing and testing services, allowing semiconductor companies to streamline their operations, reduce time-to-market, and focus on core competencies. The OSAT market is characterized by technological advancements, stringent quality standards, and a competitive landscape driven by innovation and customer-centric solutions.

Drivers:

Increasing Complexity of Semiconductor Devices:

The rising complexity of semiconductor devices, such as advanced integrated circuits (ICs), requires specialized knowledge and expertise in assembly and testing. OSAT providers offer the necessary capabilities and technologies to handle complex packaging requirements, driving the market.

Growing Demand for Miniaturization:

The demand for smaller, more compact electronic devices continues to rise. Miniaturization requires advanced packaging techniques, including wafer-level packaging and flip-chip bonding, which OSAT companies specialize in, driving their market growth.

Cost Optimization and Efficiency:

Outsourcing assembly and testing services to OSAT providers allows semiconductor companies to optimize costs and improve operational efficiency. OSAT providers can leverage economies of scale, expertise, and advanced equipment to provide cost-effective manufacturing and testing solutions.

Technological Advancements:

OSAT companies constantly invest in research and development to stay at the forefront of technological advancements in assembly and testing. Their ability to adopt and develop new technologies drives the market as semiconductor companies seek the latest solutions for their products.

Focus on Core Competencies:

Semiconductor companies often prefer to outsource non-core functions, such as assembly and testing, to OSAT providers. This enables them to focus on their core competencies, such as IC design and innovation, while relying on specialized OSAT services for packaging and testing.

Time-to-Market Pressure:

The semiconductor industry operates in a highly competitive landscape, where time-to-market is critical. OSAT providers offer quick turnaround times and streamlined processes, enabling semiconductor companies to meet market demands and launch products faster.

Scalability and Flexibility:

The ability of OSAT providers to scale production and adapt to changing demand is a significant driver. Semiconductor companies can leverage the scalability and flexibility offered by OSAT partners, allowing them to respond quickly to market fluctuations.

Quality and Reliability Requirements:

The semiconductor industry places a strong emphasis on quality and reliability. OSAT providers are equipped with specialized testing capabilities and quality control processes to ensure the integrity and performance of semiconductor devices, meeting stringent industry standards.

Globalization and Outsourcing Trends:

The globalization of the semiconductor industry has led to increased outsourcing of assembly and testing services to OSAT providers. Companies benefit from access to a global network of facilities, cost advantages in certain regions, and the ability to tap into OSAT expertise worldwide.

Increasing Demand for Advanced Packaging Solutions:

As semiconductor devices become more advanced, the need for sophisticated packaging solutions grows. OSAT providers offer expertise in advanced packaging technologies, such as 2.5D and 3D packaging, heterogeneous integration, and system-in-package (SiP), driving their market growth.

Products offered by key companies:

  • Powertech Technology Inc. (PTI) launched its new "Fan-Out Panel Level Packaging" (FOPLP) technology, which enables the production of high-density, high-performance semiconductor packages for mobile, automotive, and other applications. The technology is designed to meet the growing demand for smaller, more efficient semiconductor packages.
  • STATS ChipPAC , a subsidiary of JCET Group launched its new "Advanced Embedded Wafer Level Ball Grid Array" (eWLB) technology, which enables the production of high-performance, low-cost semiconductor packages for mobile, automotive, and other applications. The technology is designed to meet the growing demand for smaller, more efficient semiconductor packages.
  • TSMC launched its new "Integrated Fan-Out (InFO) Advanced Packaging" technology, which enables the production of high-performance, low-power semiconductor packages for mobile, automotive, and other applications. The technology is designed to meet the growing demand for smaller, more efficient semiconductor packages.

Positive growth in the advanced packaging segment:

The segment that is experiencing rapid positive growth in the Outsourced Semiconductor Assembly and Test Services (OSAT) market is the advanced packaging segment. As semiconductor devices continue to evolve, there is a growing demand for advanced packaging solutions such as wafer-level packaging, flip-chip bonding, and packaging. These advanced packaging technologies enable higher performance, smaller form factors, and improved power efficiency. OSAT providers specializing in advanced packaging solutions are witnessing increased demand as semiconductor companies seek their expertise to meet the requirements of complex and miniaturized semiconductor devices, driving positive growth in this segment.

The Asia-Pacific region is expected to dominate the OSAT market share:

Asia-Pacific is expected to dominate the Outsourced Semiconductor Assembly and Test Services (OSAT) market share. The region has emerged as a key hub for semiconductor manufacturing, driven by factors such as cost advantages, a skilled workforce, and a strong supply chain ecosystem. Countries like China, Taiwan, and South Korea have established themselves as major players in the semiconductor industry, attracting semiconductor companies and OSAT providers. The presence of leading semiconductor manufacturers, high production volumes, and technological expertise in the region contribute to its dominance in the OSAT market share.

Key developments:

  • In June 2023, one of the biggest semiconductor firms in the world, Micron Technology, Inc., revealed intentions to construct a new assembly and testing facility in Gujarat, India. With its new location, Micron will be able to meet demand from both local and foreign markets and conduct assembly and test production for both DRAM and NAND products.
  • In Dec 2022, Tata Group, one of India's leading conglomerates, announced its entry into the semiconductor business through Tata Electronics Private Limited. The company plans to set up an Outsourced Semiconductor Assembly and Test (OSAT) unit, also known as an Assembly, Testing, Marking, and Packaging (ATMP) unit. This move is significant as it aligns with the Indian government's production-linked incentive (PLI) scheme, aimed at developing the semiconductor and display manufacturing ecosystem in India.

Segmentation

By Service Type

  • Packaging
  • Testing

By Packaging Type

  • Ball Grid Array (BGA) Packaging
  • Chip-scale Packaging (CSP)
  • Stacked Die Packaging
  • Multi-chip Packaging
  • Quad Flat and Dual-inline Packaging

By Application

  • Communication
  • Consumer Electronics
  • Automotive
  • Computing and Networking
  • Industrial
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Assumptions

3. EXECUTIVE SUMMARY

  • 3.1. Research Highlights

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Force Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY SERVICE TYPE

  • 5.1. Introduction
  • 5.2. Packaging
  • 5.3. Testing

6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY PACKAGING TYPE

  • 6.1. Introduction
  • 6.2. Ball Grid Array (BGA) Packaging
  • 6.3. Chip-scale Packaging (CSP)
  • 6.4. Stacked Die Packaging
  • 6.5. Multi-chip Packaging
  • 6.6. Quad Flat and Dual-inline Packaging

7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. Communication
  • 7.3. Consumer Electronics
  • 7.4. Automotive
  • 7.5. Computing and Networking
  • 7.6. Industrial
  • 7.7. Others

8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. United States
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. United Kingdom
    • 8.4.2. Germany
    • 8.4.3. France
    • 8.4.4. Italy
    • 8.4.5. Spain
    • 8.4.6. Others
  • 8.5. The Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. Japan
    • 8.6.2. China
    • 8.6.3. India
    • 8.6.4. South Korea
    • 8.6.5. Taiwan
    • 8.6.6. Thailand
    • 8.6.7. Indonesia
    • 8.6.8. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations

10. COMPANY PROFILES

  • 10.1. ASE Group (ASE Technology Holdings)
  • 10.2. Amkor Technology Inc.
  • 10.3. Powertech Technology Inc.
  • 10.4. ChipMOS Technologies Inc.
  • 10.5. King Yuan Electronics Co. Ltd
  • 10.6. Jiangsu Changjiang Electronics Technology Co. Ltd
  • 10.7. UTAC Holdings Ltd
  • 10.8. Lingsen Precision Industries Ltd
  • 10.9. Tongfu Microelectronics Co.