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市场调查报告书
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半导体组装和测试合约服务市场：按服务类型、封装类型和最终用户分類的全球预测 - 2025-2030

Outsourced Semiconductor Assembly & Test Services Market by Service Type (Assembly & Packaging, Testing), Packaging Type (Flip Chip, Wafer Level, Wire Bond), End-User - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 192 Pages | 商品交期: 最快1-2个工作天内

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2023年半导体组装测试合约服务市场规模为333.4亿美元，预计2024年将达到356.2亿美元，复合年增长率为7.62%，2030年将达到557.5亿美元。

半导体组装和测试外包服务（OSAT）是半导体产业的重要服务，提供半导体装置的封装、测试和组装等专业服务。该服务区弥合了晶片製造厂和电子设备製造商之间的差距，简化了家电、汽车、医疗保健和通讯等多个行业的生产。随着半导体设备变得越来越复杂、越来越小，对 OSAT 的需求显而易见，需要许多晶片製造商内部不具备的专业知识和基础设施。最终用途多种多样，高效能运算、物联网设备和先进半导体节点等领域的需求量很高。市场开拓的主要驱动力是数位设备的普及、5G技术的演进以及人工智慧应用开发的进步导致对半导体的需求不断扩大。晶圆级封装和 2.5/3D IC 等先进封装技术的日益普及，为满足对更小、更快、更有效率设备不断增长的需求提供了重要机会。然而，该市场面临供应链限制、初始基础设施成本高昂以及由少数大型企业主导的竞争格局等挑战，这些都可能成为新进业者的障碍。随着半导体设计复杂性的增加，环保包装材料和技术的开发以及检测服务的自动化和准确性的提高的创新机会已经成熟。当前 OSAT 市场的本质是动态且快节奏的，通常需要策略伙伴关係和研发投资才能有效利用新趋势。公司可以透过专注于扩展其服务能力（包括先进的分析和测试服务）来满足不断变化的客户需求，从而实现显着成长。策略性地理扩张，特别是在电子产业蓬勃发展的亚太地区，可以提供显着的竞争优势。

主要市场统计
基准年[2023] 333.4亿美元
预测年份 [2024] 356.2亿美元
预测年份 [2030] 557.5亿美元
复合年增长率（%） 7.62%

市场动态：快速发展的半导体组装和测试合约服务市场的关键市场洞察

由于供需的动态互动，半导体组装和测试合约服务市场正在经历转型。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时消费行为及其对製造成本的影响以及对采购趋势的影响。

  • 市场驱动因素
    • 半导体製造的公私倡议和奖励
    • 扩大工业电子设备和医疗设备的生产
    • 更倾向于具成本效益的外包服务
  • 市场限制因素
    • 出现意外成本且业务弹性有限
  • 市场机会
    • OSAT服务中智慧型系统的部署
    • 增加先进封装和测试的投资和技术
  • 市场挑战
    • 营运管理限制和资料安全问题

波特的五力：驾驭半导体组装和测试合约服务市场的策略工具

波特的五力框架是理解市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势、解决弱点并避免潜在的挑战，以确保更强大的市场地位。

PESTLE分析：了解半导体组装和测试合约服务市场的外部影响

外部宏观环境因素在塑造半导体组装和测试合约服务市场的绩效动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并为他们做出积极主动的决策做好准备。

市场占有率分析 了解半导体组装和测试合约服务市场的竞争状况

对半导体组装和测试合约服务市场的详细市场占有率分析提供了对供应商绩效的全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV定位矩阵半导体组装与测试合约服务市场供应商的绩效评估

FPNV定位矩阵是评估半导体组装和测试合约服务市场供应商的重要工具。此矩阵允许业务组织根据供应商的商务策略和产品满意度评估供应商，从而做出符合其目标的明智决策。四个象限清楚且准确地划分供应商，帮助使用者辨识最能满足其策略目标的合作伙伴和解决方案。

本报告提供了涵盖关键重点领域的全面市场分析：

1. 市场渗透率：对当前市场环境的详细回顾，包括行业主要企业的大量资料。

2. 市场开拓：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、开拓地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：彻底分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监理核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，以帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 半导体製造领域的公私合营措施和奖励
      • 工业电子和医疗设备产量增加
      • 高性价比外包服务的大趋势
    • 抑制因素
      • 意外的隐性成本和有限的营运弹性
    • 机会
      • OSAT服务中引进智慧型系统
      • 增加先进封装和测试的投资和技术
    • 任务
      • 操作控制限制和资料安全问题
  • 市场区隔分析
    • 服务类型：组装和包装服务的新兴需求，以提高产品的耐用性和性能
    • 最终用户：智慧型手机和穿戴式装置等家用电器的拥有量增加
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境
  • 客户客製化

第六章半导体组装/测试合约服务市场：依服务类型

  • 组装和包装
  • 测试

第七章 半导体组装与测试合约服务市场：依封装类型

  • 覆晶
  • 晶圆级
  • 焊接线

第八章 半导体组装与测试合约服务市场：依最终使用者分类

  • 电脑和网路
  • 家电
  • 工业电子
  • 通讯

第九章 北美、南美半导体组装测试代工服务市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第十章 亚太地区半导体组装测试代工服务市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第十一章 欧洲、中东、非洲半导体组装测试代工服务市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十二章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
    • 西门子与 SPIL 合作，为扇出晶圆级封装提供 3D检验工作流程
    • 塔塔集团电子和半导体业务的扩张
    • 世芯科技宣布3DFabric联盟支持计划
    • 印度距离兴建 10 亿美元的美光科技半导体工厂又近了一步
    • Amkor 扩展车辆电气化电源解决方案
    • Amkor 扩展车辆电气化电源解决方案
    • Amkor 和 GlobalFoundries 在欧洲提供大规模半导体测试和组装服务
    • TÜV Nord 集团收购 HTV 多数股权
    • Integra Technologies 选择堪萨斯州作为 OSAT 最大的半导体计划
    • 台积电成立OIP 3DFabric联盟，塑造半导体与系统创新的未来
    • 三星电子在 2022 年三星代工论坛上宣布 1.4 奈米製程技术与产能投资计划
    • 全球半导体组装和测试设施资料库追踪 475 个整合装置製造商设施

公司名单

  • EV Group
  • GEM Electronics（Shanghai）Co., Ltd.
  • Chipbond Technology Corporation
  • Carsem（M）Sdn Bhd
  • Unisem Group
  • Integra Technologies
  • King Yuan ELECTRONICS CO., LTD.
  • yieldwerx
  • Sanmina Corporation
  • Integrated Micro-electronics Inc.
  • Jiangsu Changdian Technology Co., Ltd.
  • ASE Technology Holding Co, Ltd.
  • Formosa Advanced Technologies Co., Ltd.
  • Inari Amertron Berhad
  • LB Semicon
  • HANA Micron Inc.
  • Natronix Semiconductor Technology Pte Ltd.
  • Walton Advanced Engineering, Inc.
  • AT Semicon Co., Ltd.
  • Greatek Electronics Inc.
  • Amkor Technology, Inc.
  • Samsung Electronics Co., Ltd.
  • LIPAC Co., Ltd.
  • Lingsen Precision Industries , LTD.
  • Nepes Corporation
  • ORIENT SEMICONDUCTOR ELECTRONICS LIMITED
  • Bluetest Testservice GmbH
  • Tongfu Microelectronics Co., Ltd.
  • UTAC Holdings Ltd.
  • Chipmos Technologies Inc.
  • Powertech Technology Inc.
  • Doosan Corporation
Product Code: MRR-742BD5182FC0

The Outsourced Semiconductor Assembly & Test Services Market was valued at USD 33.34 billion in 2023, expected to reach USD 35.62 billion in 2024, and is projected to grow at a CAGR of 7.62%, to USD 55.75 billion by 2030.

Outsourced Semiconductor Assembly and Test Services (OSAT) are integral to the semiconductor industry, providing specialized services such as packaging, testing, and assembly of semiconductor devices. This service segment bridges the gap between chip fabrication plants and electronic device manufacturers, streamlining production for various industries, including consumer electronics, automotive, healthcare, and telecommunications. The necessity of OSAT is underscored by the ever-increasing complexity and miniaturization of semiconductor devices, which demand specialized expertise and infrastructure that many chip companies lack in-house. End-use applications span a broad spectrum, with significant demand from sectors emphasizing high-performance computing, IoT devices, and advanced semiconductor nodes. Market growth is primarily driven by escalating demand for semiconductors due to the proliferation of digital devices, the evolution of 5G technology, and the ongoing development of AI applications. A significant opportunity lies in the increasing adoption of advanced packaging technologies like wafer-level packaging and 2.5/3D ICs, which can cater to the rising demand for smaller, faster, and more efficient devices. However, the market faces challenges such as supply chain constraints, high initial infrastructure costs, and a competitive landscape dominated by a few large players that could create barriers for new entrants. Innovation opportunities are ripe in developing eco-friendly packaging materials and techniques, as well as in enhancing the automation and precision of testing services to accommodate growing complexities in semiconductor designs. The current nature of the OSAT market is dynamic and fast-paced, often necessitating strategic partnerships and investments in R&D to effectively capitalise on emerging trends. Companies could see substantial growth by focusing on expanding service capabilities to include advanced analytical and testing services to meet evolving client needs. Strategic geographical expansions, especially in regions like Asia-Pacific with booming electronics industries, could provide a significant competitive edge.

KEY MARKET STATISTICS
Base Year [2023] USD 33.34 billion
Estimated Year [2024] USD 35.62 billion
Forecast Year [2030] USD 55.75 billion
CAGR (%) 7.62%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Outsourced Semiconductor Assembly & Test Services Market

The Outsourced Semiconductor Assembly & Test Services Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Public-private initiatives and incentives for semiconductor manufacturing
    • Growth in production of industrial electronics and medical devices
    • Significant inclination toward cost effective outsourced services
  • Market Restraints
    • Hidden unforeseen cost and limited flexibility in operations
  • Market Opportunities
    • Deployment of intelligent system in OSAT services
    • Rising investments and technologies for advanced packaging and testing
  • Market Challenges
    • Limited control over operations and data security concerns

Porter's Five Forces: A Strategic Tool for Navigating the Outsourced Semiconductor Assembly & Test Services Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Outsourced Semiconductor Assembly & Test Services Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Outsourced Semiconductor Assembly & Test Services Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Outsourced Semiconductor Assembly & Test Services Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Outsourced Semiconductor Assembly & Test Services Market

A detailed market share analysis in the Outsourced Semiconductor Assembly & Test Services Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Outsourced Semiconductor Assembly & Test Services Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Outsourced Semiconductor Assembly & Test Services Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Key Company Profiles

The report delves into recent significant developments in the Outsourced Semiconductor Assembly & Test Services Market, highlighting leading vendors and their innovative profiles. These include EV Group, GEM Electronics (Shanghai) Co., Ltd., Chipbond Technology Corporation, Carsem (M) Sdn Bhd, Unisem Group, Integra Technologies, King Yuan ELECTRONICS CO., LTD., yieldwerx, Sanmina Corporation, Integrated Micro-electronics Inc., Jiangsu Changdian Technology Co., Ltd., ASE Technology Holding Co, Ltd., Formosa Advanced Technologies Co., Ltd., Inari Amertron Berhad, LB Semicon, HANA Micron Inc., Natronix Semiconductor Technology Pte Ltd., Walton Advanced Engineering, Inc., AT Semicon Co., Ltd., Greatek Electronics Inc., Amkor Technology, Inc., Samsung Electronics Co., Ltd., LIPAC Co., Ltd., Lingsen Precision Industries , LTD., Nepes Corporation, ORIENT SEMICONDUCTOR ELECTRONICS LIMITED, Bluetest Testservice GmbH, Tongfu Microelectronics Co., Ltd., UTAC Holdings Ltd., Chipmos Technologies Inc., Powertech Technology Inc., and Doosan Corporation.

Market Segmentation & Coverage

This research report categorizes the Outsourced Semiconductor Assembly & Test Services Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Service Type, market is studied across Assembly & Packaging and Testing.
  • Based on Packaging Type, market is studied across Flip Chip, Wafer Level, and Wire Bond.
  • Based on End-User, market is studied across Computer & Networking, Consumer Electronics, Industrial Electronics, and Telecommunication.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Public-private initiatives and incentives for semiconductor manufacturing
      • 5.1.1.2. Growth in production of industrial electronics and medical devices
      • 5.1.1.3. Significant inclination toward cost effective outsourced services
    • 5.1.2. Restraints
      • 5.1.2.1. Hidden unforeseen cost and limited flexibility in operations
    • 5.1.3. Opportunities
      • 5.1.3.1. Deployment of intelligent system in OSAT services
      • 5.1.3.2. Rising investments and technologies for advanced packaging and testing
    • 5.1.4. Challenges
      • 5.1.4.1. Limited control over operations and data security concerns
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Service Type: Emerging need for assembly & packaging services for improving product durability and performance
    • 5.2.2. End-User: Expanding ownership of consumer electronics such as smartphones and wearable devices
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental
  • 5.5. Client Customization

6. Outsourced Semiconductor Assembly & Test Services Market, by Service Type

  • 6.1. Introduction
  • 6.2. Assembly & Packaging
  • 6.3. Testing

7. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type

  • 7.1. Introduction
  • 7.2. Flip Chip
  • 7.3. Wafer Level
  • 7.4. Wire Bond

8. Outsourced Semiconductor Assembly & Test Services Market, by End-User

  • 8.1. Introduction
  • 8.2. Computer & Networking
  • 8.3. Consumer Electronics
  • 8.4. Industrial Electronics
  • 8.5. Telecommunication

9. Americas Outsourced Semiconductor Assembly & Test Services Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Outsourced Semiconductor Assembly & Test Services Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Outsourced Semiconductor Assembly & Test Services Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
    • 12.3.2. Tata Group's Expansion in Electronics and Semiconductor Business
    • 12.3.3. Alchip Technologies Announces 3DFabric Alliance Support Plans
    • 12.3.4. India Close to Getting a USD 1 Billion Micron Technology Semiconductor Plant
    • 12.3.5. Amkor Expands Power Solutions for Automotive Electrification
    • 12.3.6. Amkor Expands Power Solutions for Automotive Electrification
    • 12.3.7. Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
    • 12.3.8. Tuv Nord Group Acquires Majority Stake in HTV
    • 12.3.9. Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project
    • 12.3.10. TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
    • 12.3.11. Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
    • 12.3.12. Worldwide Semiconductor Assembly And Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities

Companies Mentioned

  • 1. EV Group
  • 2. GEM Electronics (Shanghai) Co., Ltd.
  • 3. Chipbond Technology Corporation
  • 4. Carsem (M) Sdn Bhd
  • 5. Unisem Group
  • 6. Integra Technologies
  • 7. King Yuan ELECTRONICS CO., LTD.
  • 8. yieldwerx
  • 9. Sanmina Corporation
  • 10. Integrated Micro-electronics Inc.
  • 11. Jiangsu Changdian Technology Co., Ltd.
  • 12. ASE Technology Holding Co, Ltd.
  • 13. Formosa Advanced Technologies Co., Ltd.
  • 14. Inari Amertron Berhad
  • 15. LB Semicon
  • 16. HANA Micron Inc.
  • 17. Natronix Semiconductor Technology Pte Ltd.
  • 18. Walton Advanced Engineering, Inc.
  • 19. AT Semicon Co., Ltd.
  • 20. Greatek Electronics Inc.
  • 21. Amkor Technology, Inc.
  • 22. Samsung Electronics Co., Ltd.
  • 23. LIPAC Co., Ltd.
  • 24. Lingsen Precision Industries , LTD.
  • 25. Nepes Corporation
  • 26. ORIENT SEMICONDUCTOR ELECTRONICS LIMITED
  • 27. Bluetest Testservice GmbH
  • 28. Tongfu Microelectronics Co., Ltd.
  • 29. UTAC Holdings Ltd.
  • 30. Chipmos Technologies Inc.
  • 31. Powertech Technology Inc.
  • 32. Doosan Corporation

LIST OF FIGURES

  • FIGURE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET RESEARCH PROCESS
  • FIGURE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET DYNAMICS
  • TABLE 7. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY ASSEMBLY & PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TESTING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WAFER LEVEL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COMPUTER & NETWORKING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY INDUSTRIAL ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 20. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 23. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 26. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 27. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 29. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 31. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 32. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 33. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 35. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 36. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 38. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 39. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 41. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 42. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 43. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 45. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 46. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 47. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 49. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 51. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 52. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 53. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 55. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 57. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 58. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 59. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 61. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 63. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 64. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 65. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 67. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 68. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 70. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 72. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 73. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 74. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 76. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 79. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 80. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 82. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 83. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 84. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 86. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 88. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 89. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 90. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 92. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 95. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 96. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 98. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 100. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 101. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 102. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 104. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 107. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 108. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 109. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 110. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 111. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 112. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 113. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 114. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 115. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 116. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 117. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 118. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 119. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 120. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 121. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 122. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 123. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 124. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 125. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 126. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 128. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 129. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 130. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 131. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 132. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 133. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 134. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 135. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 136. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 137. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 138. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 140. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 141. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 142. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 143. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 146. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 147. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2023