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市场调查报告书
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1524098

OSAT -市场占有率分析、产业趋势与统计、成长预测（2024-2029）

OSAT - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 187 Pages | 商品交期: 2-3个工作天内

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简介目录

OSAT市场规模预计2024年为433.6亿美元，预计2029年将达到712.1亿美元，在市场估计和预测期间（2024-2029年）复合年增长率预计为8.62%。

OSAT市场

半导体产业持续成长，重点关注小型化和效率。半导体正在成为所有现代技术的建造模组。该领域的进步和创新对所有下游技术产生直接影响。人工智慧（AI）和云端运算等电子技术的快速发展，加上对高速、低功耗、高度积体电路（IC）的高需求，导致销售强劲。

主要亮点

  • 外包也是半导体产业的重要元素。除了设计之外，半导体产品开发的製造方面还依赖第三方供应商提供的服务。 Fabs（纯晶圆代工厂）和 OSAT 是半导体外包的两个突出例子。
  • OSAT 半导体公司提供第三方IC封装和测试服务，在晶圆代工厂製造的半导体装置投放市场之前对其进行封装和测试。这些公司提供创新、经济高效的解决方案，在电子设备内的空间内提供更快的处理速度、更高的效能和功能。
  • 英特尔、AMD 和 Nvidia 等半导体设计公司与 OSAT 公司签订合约来执行他们的设计。例如，英特尔既是晶片设计公司，也是一家晶圆代工厂（晶圆供应公司）。在将晶片运送给客户之前，英特尔委託晶片封装外包给各个 OSAT 来提供组装和测试服务。
  • 主要半导体製造商垂直整合到封装业务是全球 OSAT 市场的主要威胁。美国贸易战等多种因素正造成半导体产业供应链缺口。
  • OSAT 供应商是为半导体积体电路提供组装、封装和测试服务的第三方。自新冠疫情以来，随着晶片製造商专注于生产更小、更快和更有效率的半导体，半导体产业呈现成长态势。

OSAT市场趋势

通讯成为最大的应用领域

  • 半导体市场的成长直接影响OSAT市场的开拓。这是因为包装仍处于通讯价值链的早期阶段。晶圆代工厂可以自己封装或外包。例如，半导体和通讯设备製造商高通与 OSAT 签订合约来满足其封装需求。
  • 通讯应用主要是通讯业的通讯晶片。功率放大器 (PA)、前端模组 (FEM) 以及其他射频和连接设备等设备是 OSAT 和OEM的主要需求来源。根据半导体产业协会的数据，生产的所有半导体中约有 31% 用于网路设备和智慧型手机无线等通讯。
  • 通讯应用通常部署在恶劣的环境条件下，需要可靠的封装解决方案。特别是在大规模通讯应用中，系统级封装 (SiP) 通常是各种通讯设备的首选。
  • 过去几年，智慧型手机市场的硬体和软体都出现了显着成长。儘管全球智慧型手机出货量在 COVID-19 期间有所下降，但包括中国在内的许多市场的渗透率都很高。由于生物感测器、5G 智慧型手机和人工智慧功能等趋势，新型智慧型手机的销售预计将恢復势头。
  • 根据 GSMA 的数据，到 2025 年，亚太地区的智慧型手机普及率预计将上升至 83%。同时，行动用户渗透率预计到同年将达到 62%。 5G 智慧型手机的广泛采用预计还将显着提高连网型设备密度、无线资料通讯频宽和延迟。
  • 许多半导体製造商预计高硅含量的5G智慧型手机将在全球广泛采用。 5G智慧型手机需要更高的能源效率、更快的通讯速度和更复杂的功能，这将增加每台装置的半导体元件的使用量。因此，消费性电子产业对半导体封装解决方案的需求预计将大幅增加。
  • 根据GSMA报告，预计2025年，全球约三分之一的人口将连接5G网路。报告称，届时5G连线数将超过4亿，约占所有行动连线的14%。
  • 预计到年终， 5G 渗透率将达到 17%，到 2030 年将增至 54%（相当于 53 亿个连线）。这项技术进步预计将为全球经济贡献近1兆美元。因此，对半导体的需求预计将促进市场成长。

韩国市场预计将显着成长

  • 韩国是全球OSAT厂商最有前景的市场之一。该国是三星和 SK 海力士等消费性电子领域着名晶片製造商的所在地，使其成为半导体设备创新的有利中心。
  • 韩国政府重点发展智慧製造，计画在2025年拥有3万家全自动化製造业。政府的目标是透过整合最新的自动化、资料交换和物联网技术来实现这一目标，这些技术预计将成为该国 OSAT 服务的关键驱动力。
  • 随着三星电子系统半导体业务的成长，该国的半导体测试产业也显着成长。 NEPES Ark、LB Semicon、Tesna 和 Hana Micron 等国内半导体测试公司正在透过大力投资必要的设施和设备来应对系统半导体供应的增加。
  • SK海力士正投资120兆韩元（约900亿日圆）在龙仁市元山地区建造下一代记忆体生产基地。 SK 海力士计划于 2025 年开始建造其记忆体製造厂。 SK海力士也是HBM3的製造商。该公司计划在其利川 DRAM 製造工厂安装一条 TSV 封装生产线。为了提高HBM的竞争力，三星和SK海力士正在考虑扩大其封装生产线。
  • 三星正致力于取代台积电提供的2.5D内插器整合服务。我们正在努力降低TSV（硅穿孔电极）封装方法的製造成本。与SK海力士相比，三星在HBM（高频宽记忆体）市场上属于后来者。儘管如此，三星仍声称将增加对HBM产能的投资，并表示有意在2023年之前推出新的HBM产品，为HBM封装产能扩张开闢了可能性。
  • 5G领域的发展也带动了晶片先进封装的成长。根据科学资讯通信部的数据，截至 2023 年 2 月，日本 5G用户数为 2,913 万，比 2021 年 2 月的 1,366 万增加了 113%。

OSAT产业概况

半导体组装与测试服务 (OSAT) 市场较为分散，主要企业包括日月光科技控股(ASE Technology Holding)、安靠科技(Amkor Technology Inc.)、力成科技(Powertech Technology Inc.)、茂茂科技(ChipMOS Technologies Inc.) 和景源电子(King Yuan Electronics)。市场参与者正在采取创新、合作和收购等策略来增强其产品供应并获得永续的竞争优势。

*在最近的一份公告中，力成科技 (PTI) Inc. 宣布与华邦电子公司建立合作伙伴关係。此次合作旨在共同推动2.5D（晶圆上基板）/3D先进封装业务。透过利用WEC的硅中介层、DRAM和快闪记忆体，PTI实现异质整合并引导客户满足市场对高频宽和高效能运算服务的需求。

*2023 年 10 月 - 日月光科技控股宣布推出整合设计生态系统 (IDE)，这是一个协作设计工具集。该工具集旨在系统地增强整个 VIPack 平台的先进封装架构。这种创新方法可实现从单晶粒SoC 到多晶片分解 IP 模组（包括小晶片和记忆体）的无缝过渡。这可以透过使用 2.5D 或先进的扇出结构进行整合来实现。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 半导体产业展望
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • 产业价值链分析
  • COVID-19 大流行的市场影响评估

第五章市场动态

  • 市场驱动因素
    • 半导体在汽车中的应用增加
    • 5G 等趋势推动半导体封装的先进发展
  • 市场限制因素
    • 垂直整合是 OSAT 厂商主要关注的问题之一。

第六章 市场细分

  • 按服务类型
    • 包装
    • 测试
  • 按包装类型
    • 球栅阵列 (BGA) 封装
    • 晶片级封装 (CSP)
    • 堆迭晶片封装
    • 多晶片封装
    • 四扁平和双列直插封装
  • 按申请
    • 通讯设备
    • 消费性电子产品
    • 车
    • 运算与网络
    • 工业的
    • 其他应用
  • 按地区
    • 美国
    • 中国
    • 台湾
    • 韩国
    • 马来西亚
    • 新加坡
    • 日本

第七章 竞争格局

  • 公司简介
    • ASE Technology Holding Co. Ltd
    • Amkor Technology Inc.
    • Powertech Technology Inc.
    • ChipMOS Technologies Inc.
    • King Yuan Electronics Co. Ltd
    • Formosa Advanced Technologies Co. Ltd
    • Jiangsu Changjiang Electronics Technology Co. Ltd
    • UTAC Holdings Ltd
    • Lingsen Precision Industries Ltd
    • Tongfu Microelectronics Co.
    • Chipbond Technology Corporation
    • Hana Micron Inc.
    • Integrated Micro-electronics Inc.
    • Tianshui Huatian Technology Co. Ltd
  • Vendor Share Analysis

第八章投资分析

第九章 市场机会及未来趋势

简介目录
Product Code: 66300

The OSAT Market size is estimated at USD 43.36 billion in 2024, and is expected to reach USD 71.21 billion by 2029, growing at a CAGR of 8.62% during the forecast period (2024-2029).

OSAT - Market

The semiconductor industry has been growing, focusing on miniaturization and efficiency. Semiconductors are emerging as building blocks of all modern technology. The advancements and innovations in this field directly impact all downstream technologies. The rapid development of electronics technology, including artificial intelligence (AI) and cloud computing, is complemented by a high demand for integrated circuits (ICs) with high speed, low power consumption, and high integration, leading to its significant sales.

Key Highlights

  • Outsourcing is also a significant factor in the semiconductor industry. More than just design, the manufacturing aspect of semiconductor product development is dependent on the services provided by third-party vendors. Fabs (Pure-Play Foundries) and OSATs are two prominent examples of semiconductor outsourcing.
  • OSAT semiconductor firms provide third-party IC packaging and testing services package and test semiconductor devices made by foundries before shipping them to the market. Such companies in the market provide innovative and cost-effective solutions that deliver faster processing speeds, higher performance, and functionality while taking up less space in an electronic device.
  • Semiconductor design companies, such as Intel, AMD, and Nvidia, contract OSAT companies to execute the companies' designs. For instance, Intel is a chip designer and a foundry (wafer provider) because they own and operate their fabs or foundries. Before shipping the chips to customers, Intel outsources its chip packaging to different OSATs for assembly and test services.
  • Vertical integration of key semiconductor manufacturers into packaging operations is a significant threat to the global OSAT market. Various factors, such as the US-China trade war, have caused a supply chain gap in the semiconductor industry.
  • The suppliers of as OSAT are third parties that provide the assembly, packaging and testing services for a semiconductor integrated circuit. Post COVID, semiconductor industry has been witnessing the growth due to chipmakers are focused on producing smaller, faster and more efficient semiconductors and where which increased the growth of OSAT as its has playes an essential part in the by filling the gap between IC design and availability.

OSAT Market Trends

Communication to be the Largest Application Segment

  • The semiconductor market's growth directly influences the OSAT market's development because the packaging is still at an early stage in the telecommunications value chain. The foundries can either handle the packaging themselves or contract it out. For instance, Qualcomm, a manufacturer of semiconductors and telecom equipment, contracts OSATs to handle its packaging needs.
  • The communication applications primarily consist of communication chips in the telecommunication industry. Equipment such as power amplifiers (PAs), front-end modules (FEMs), and other RF and connectivity devices are major sources of demand for OSATs and OEMs. According to the Semiconductor Industry Association, about 31% of all semiconductors manufactured are used for communications, including networking equipment and smartphone radios.
  • Communication applications require highly reliable packaging solutions as they are often deployed in harsh environmental conditions. In many cases, a system in package (SiP) is preferred for a large variety of communication equipment, especially in large-scale telecommunication applications.
  • The smartphone market has grown significantly in hardware and software over the past few years. Despite declining global smartphone unit shipments during COVID-19, there was high penetration in many markets, including China. Sales of new smartphones are expected to regain momentum, driven by trends like biosensors, 5G smartphones, and AI features.
  • The smartphone adoption rate in Asia-Pacific is expected to rise to 83% by 2025, according to GSMA. Concurrently, the mobile subscriber penetration rate is expected to reach 62% by the same year. The proliferation of 5G smartphones is also expected to significantly improve connected device density, wireless data communication bandwidth, and latency.
  • Many semiconductor producers anticipate that 5G smartphones with higher silicon contents will be widely adopted worldwide. The use of semiconductor components per device will rise due to the need for 5G smartphones to have higher power efficiency, faster speeds, and more complex functionalities. In turn, the consumer electronics industry is anticipated to experience a significant increase in demand for semiconductor packaging solutions.
  • According to the GSMA Report, around one-third of the global population is estimated to have access to 5G networks by 2025. The report also states that there will be more than 400 million 5G connections at that time, accounting for approximately 14% of all mobile connections.
  • The adoption of 5G was projected to reach 17% by the end of 2023 and increase to 54% (equivalent to 5.3 billion connections) by 2030. This technological advancement is anticipated to contribute nearly USD 1 trillion to the global economy. As a result, the demand for semiconductors will enhance the market's growth.

South Korea Expected to Register Significant Growth in the Market

  • South Korea is one of the promising markets for global OSAT vendors. The country is also home to some prominent chip makers for the consumer electronics segment, such as Samsung and SK Hynix, making it a lucrative hub for innovation in semiconductor devices.
  • The South Korean government focuses on smart manufacturing and plans to have 30,000 fully automated manufacturing companies by 2025. The government aims to achieve this by incorporating the latest automation, data exchange, and IoT technologies, which are expected to be significant drivers for OSAT services in the country.
  • The country's semiconductor testing sector has grown significantly with the growth of Samsung Electronics' system semiconductor business. The semiconductor testing companies in the country, such as NEPES Ark, LB Semicon, Tesna, and Hana Micron, have been dealing with increased supplies of system semiconductors by making significant investments in necessary facilities and equipment.
  • SK Hynix is constructing a base for manufacturing next-generation memory in the Wonsam town region of Yongin by investing KRW 120 trillion ( USD 90 billion). The chipmaker anticipates breaking construction on the memory manufacturing facility in 2025. SK Hynix is also the manufacturer of HBM3. The company plans to install TSV packaging production lines at its Icheon DRAM manufacturing facility. To improve its HBM competitiveness, Samsung and SK Hynix are considering adding more packaging production lines.
  • Samsung has been working on replacing the 2.5D interposer integration service offered by TSMC. It seeks to lower the cost of manufacturing the through-silicon via (TSV) packaging method. Compared to SK Hynix, Samsung is a latecomer to the HBM (high bandwidth memory) market. Still, the business claims it is increasing investments in its HBM capacity and declared intentions to introduce new HBM products by 2023, opening possibilities for expanding HBMs' packaging capacity.
  • The developments in the 5G space have also led to the growth of advanced packaging of chips. According to the Ministry of Science and ICT, as of February 2023, the country had 29.13 million 5G Subscribers, an increase of 113% compared to 13.66 million 5G subscribers in February 2021.

OSAT Industry Overview

The outsourced semiconductor assembly and test services (OSAT) market is fragmented, with the presence of major players like ASE Technology Holding Co. Ltd, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., and King Yuan Electronics Co. Ltd. Players in the market are adopting strategies such as innovations, partnerships, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

* December 2023 - In a recent announcement, Powertech Technology (PTI) Inc. revealed its partnership with Winbond Electronics Corporation by signing a letter of intent. This collaboration aims to jointly advance the business of 2.5D (Chip on Wafer on Substrate)/3D advanced packaging. PTI will guide its customers to leverage WEC's silicon Interposer, DRAM, and Flash to enable heterogeneous integration and cater to the market's demand for high-bandwidth and high-performance computing services.

* October 2023 - ASE Technology Holding Co. Ltd launched its Integrated Design Ecosystem (IDE), a collaborative design toolset. This toolset is designed to enhance advanced package architecture across the VIPack platform systematically. This innovative approach enables a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory. It can be achieved by integrating them using 2.5D or advanced fanout structures.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Semiconductor Industry Outlook
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Bargaining Power of Suppliers
    • 4.3.2 Bargaining Power of Buyers
    • 4.3.3 Threat of New Entrants
    • 4.3.4 Threat of Substitutes
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Industry Value Chain Analysis
  • 4.5 Assessment of the Impact of COVID-19 Pandemic on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increased Applications of Semiconductors in Automotive
    • 5.1.2 Advancement in Semiconductor Packaging Due to Trends like 5G
  • 5.2 Market Restraints
    • 5.2.1 Vertical Integration is One of the Significant Concerns of OSAT Players

6 MARKET SEGMENTATION

  • 6.1 By Service Type
    • 6.1.1 Packaging
    • 6.1.2 Testing
  • 6.2 By Type of Packaging
    • 6.2.1 Ball Grid Array (BGA) Packaging
    • 6.2.2 Chip Scale Packaging (CSP)
    • 6.2.3 Stacked Die Packaging
    • 6.2.4 Multi Chip Packaging
    • 6.2.5 Quad Flat and Dual-inline Packaging
  • 6.3 By Application
    • 6.3.1 Communication
    • 6.3.2 Consumer Electronics
    • 6.3.3 Automotive
    • 6.3.4 Computing and Networking
    • 6.3.5 Industrial
    • 6.3.6 Other Applications
  • 6.4 By Geography
    • 6.4.1 United States
    • 6.4.2 China
    • 6.4.3 Taiwan
    • 6.4.4 South Korea
    • 6.4.5 Malaysia
    • 6.4.6 Singapore
    • 6.4.7 Japan

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles*
    • 7.1.1 ASE Technology Holding Co. Ltd
    • 7.1.2 Amkor Technology Inc.
    • 7.1.3 Powertech Technology Inc.
    • 7.1.4 ChipMOS Technologies Inc.
    • 7.1.5 King Yuan Electronics Co. Ltd
    • 7.1.6 Formosa Advanced Technologies Co. Ltd
    • 7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd
    • 7.1.8 UTAC Holdings Ltd
    • 7.1.9 Lingsen Precision Industries Ltd
    • 7.1.10 Tongfu Microelectronics Co.
    • 7.1.11 Chipbond Technology Corporation
    • 7.1.12 Hana Micron Inc.
    • 7.1.13 Integrated Micro-electronics Inc.
    • 7.1.14 Tianshui Huatian Technology Co. Ltd
  • 7.2 Vendor Share Analysis

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS