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OSAT（半导体组装和测试外包）市场：趋势、机会和竞争分析 [2024-2030]

Outsourced Semiconductor Assembly and Testing (OSAT) Market: Trends, Opportunities and Competitive Analysis [2024-2030]
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

OSAT（半导体组装和测试外包）市场趋势和预测

到 2030 年，全球 OSAT 市场预计将达到 514 亿美元，2024 年至 2030 年复合年增长率为 4.5%。该市场的主要驱动力是增加电子产品中的半导体含量以提供更高的功能和性能，对智慧型手机和互联网连接设备、安全、导航、燃油效率和减少排放的需求不断增长，以及汽车中电子含量的增加。全球半导体组装和测试 (OSAT) 外包市场的未来前景广阔，汽车、通讯、运算和网路、消费性电子和工业领域都蕴藏着机会。

  • Lucintel 预测，由于全球对通讯基础设施和电子产品的需求不断增长，装配和包装在预测期内仍将是最大的细分市场。
  • 在该市场中，由于 5G 技术的接受度提高以及智慧电视、平板电脑和智慧型手机的消费增加，消费性电子领域预计将录得最高成长。
  • 由于物联网的日益普及、每辆车电子含量的增加以及中国、台湾和印度等国家工业自动化的扩展，预计亚太地区将在预测期内实现最高的成长。

预计亚太地区的成长最快。

1.美国：Amkor Technology, Inc. 和 ASE Technology Holding Co., Ltd. 等公司正在推动美国OSAT 市场的创新。半导体产业协会 (SIA) 等倡议促进了半导体製造领域的合作与研究。美国政府透过国防部 (DoD) 和国家科学基金会 (NSF) 等机构支持半导体研究和发展。

2.台湾：日月光（ASE）和硅品精密工业股份有限公司（SPIL）等台湾公司是全球领先的半导体製造商。 (SPIL) 和其他台湾公司在全球 OSAT 市场上处于领先地位。工业发展委员会 (IDB) 等政府倡议支持半导体产业的成长和竞争力。台湾半导体研究院（TSRI）促进半导体技术的研究与发展。

3.中国：中国OSAT企业如江苏长电科技有限公司（JCET）和天水华天科技有限公司正快速扩张。 「中国製造2025」计画等政府倡议旨在增强半导体产业的能力。工业和资讯化部 (MIIT) 为半导体製造提供支援。

4. 韩国：Amkor Technology Korea Inc. 和 Powertech Technology Inc. (PTI) 等韩国公司是 OSAT 市场的主要参与者。韩国半导体工业协会 (KSIA) 等政府倡议促进工业成长和创新。产业通商资源部 (MOTIE) 支持半导体开发倡议。

5.新加坡：新加坡的OSAT公司，例如Global Foundries Singapore Pte. Ltd.和UTAC Holdings Ltd.，为全球市场做出了巨大贡献。新加坡经济发展局 (EDB) 等政府倡议支持半导体製造领域的投资和人才发展。美国国家研究基金会 (NRF) 资助半导体研发计划。

OSAT 市场：按细分市场

本研究按服务类型、封装类型、应用和地区对全球 OSAT 市场进行了预测，如下：

OSAT市场的最新趋势

  • 对先进封装解决方案的需求不断增长：由于对扇出晶圆层次电子构装(FOWLP) 和 3D 封装技术等先进封装解决方案的需求不断增长，OSAT 市场不断增长。这些技术可实现半导体装置的更高性能、更小尺寸和异质整合。
  • 投资产能扩张：OSAT 供应商正在投资产能扩张，以满足对半导体封装和检测服务不断增长的需求。日月光科技控股有限公司 (ASE Technology Holding Co.) 和 Amkor Technology 等公司正在提高产量并采购先进设备，以满足行业需求。
  • 检测设备的技术进步：OSAT公司正在采用先进的检测设备和方法来提高半导体检测製程的效率、准确性和可靠性。自动测试处理系统和高速测试解决方案等创新正在增强 OSAT 供应商的能力。
  • 专注于异质整合和系统整合：OSAT供应商越来越多地参与异质整合和系统级封装，提供将多个晶片、感测器和被动元件整合到单一封装中的服务。这一趋势与汽车、物联网和人工智慧等应用中对整合解决方案不断增长的需求相吻合。
  • 采用尖端材料和製程：OSAT 供应商正在采用先进材料和製造流程来满足 5G、边缘运算和高效能运算等新兴应用的要求。先进基板材料、晶圆级晶片级封装（WLCSP）和系统级封装（SiP）等技术在市场上越来越受欢迎。

目录

第一章执行摘要

第二章 全球 OSAT 市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球OSAT市场趋势（2018-2023）与预测（2024-2030）
  • 按服务类型
    • 组装/包装
    • 检查
  • 按包装类型
    • 焊接线
    • 覆晶
    • 晶圆级
    • 其他的
  • 按用途
    • 车
    • 通讯
    • 运算网路
    • 消费性电子产品
    • 产业

第四章 2017-2028年市场趋势及预测分析：分地区

  • 全球 OSAT 市场：按地区
  • 北美OSAT市场
    • 按服务类型
    • 按用途
  • 欧洲OSAT市场
    • 按服务类型
    • 按用途
  • 亚太OSAT市场
    • 按服务类型
    • 按用途
  • 其他地区OSAT市场
    • 按服务类型
    • 按用途

第五章 竞争分析

  • 产品系列分析
  • 业务整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按服务类型
    • 按包装类型
    • 按用途
    • 按地区
  • 全球OSAT市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球 OSAT 市场产能
    • 全球 OSAT 市场的合併、收购和合资企业
    • 认证和许可

第七章主要企业概况

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI（Powertech Technology Inc.）
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS .
简介目录

Outsourced Semiconductor Assembly and Testing Market Trends and Forecast

The future of the global outsourced semiconductor assembly and testing (OSAT) market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial industries. The global outsourced semiconductor assembly and testing market is expected to reach an estimated $51.4 billion by 2030 with a CAGR of 4.5% from 2024 to 2030. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

  • Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.
  • Within this market, consumer electronics segment is projected to record the highest growth due to growing acceptance of 5G technologies and increasing consumption of smart televisions, tablets, and smartphones.
  • Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Asia Pacific is expected to witness the highest growth

1. United States: Companies like Amkor Technology, Inc. and ASE Technology Holding Co., Ltd. drive innovation in the US OSAT market. Initiatives such as the Semiconductor Industry Association (SIA) promote collaboration and research in semiconductor manufacturing. The US government supports semiconductor R&D through agencies like the Department of Defense (DoD) and the National Science Foundation (NSF).

2. Taiwan: Taiwanese companies, including Advanced Semiconductor Engineering, Inc. (ASE) and Siliconware Precision Industries Co., Ltd. (SPIL), lead the global OSAT market. Government initiatives like the Industrial Development Bureau (IDB) support the semiconductor industry's growth and competitiveness. Taiwan Semiconductor Research Institute (TSRI) promotes R&D in semiconductor technologies.

3. China: Chinese OSAT companies like Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) and Tianshui Huatian Technology Co., Ltd. are expanding rapidly. Government initiatives such as the "Made in China 2025" plan aim to strengthen the semiconductor industry's capabilities. The Ministry of Industry and Information Technology (MIIT) provides support for semiconductor manufacturing.

4. South Korea: South Korean companies like Amkor Technology Korea Inc. and Powertech Technology Inc. (PTI) are prominent players in the OSAT market. Government initiatives like the Korea Semiconductor Industry Association (KSIA) promote industry growth and innovation. The Ministry of Trade, Industry and Energy (MOTIE) supports semiconductor development initiatives.

5. Singapore: Singaporean OSAT companies, including GlobalFoundries Singapore Pte. Ltd. and UTAC Holdings Ltd., contribute significantly to the global market. Government initiatives such as the Singapore Economic Development Board (EDB) support semiconductor manufacturing investments and talent development. The National Research Foundation (NRF) funds semiconductor research and development projects.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Outsourced Semiconductor Assembly and Testing Market (OSAT) by Segment

The study includes a forecast for the global outsourced semiconductor assembly and testing market by service type, packaging type, application, and region, as follows:

OSAT Market by Service Type [Value ($B) Shipment Analysis from 2018 to 2030]:

  • Assembly & Packaging
  • Testing

OSAT Market by Packaging Type [Value ($B) Shipment Analysis from 2018 to 2030]:

  • Wire Bond
  • Flip Chip
  • Wafer Level
  • Others

OSAT Market by Application [Value ($B) Shipment Analysis from 2018 to 2030]:

  • Automotive
  • Telecommunications
  • Computing & Networking
  • Consumer Electronics
  • Industrial

OSAT Market by Region [Value ($B) Shipment Analysis from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Outsourced Semiconductor Assembly and Testing (OSAT) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies outsourced semiconductor assembly and testing companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the outsourced semiconductor assembly and testing companies profiled in this report includes.

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI (Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS

Recent Developments in OSAT Market

  • Rising Demand for Advanced Packaging Solutions: The OSAT market is experiencing growth driven by increasing demand for advanced packaging solutions such as fan-out wafer-level packaging (FOWLP) and 3D packaging technologies. These technologies enable higher performance, miniaturization, and heterogeneous integration in semiconductor devices.
  • Investments in Capacity Expansion: OSAT providers are investing in capacity expansion to meet the growing demand for semiconductor packaging and testing services. Companies like ASE Technology Holding Co. and Amkor Technology are ramping up production facilities and acquiring advanced equipment to support the industry's needs.
  • Technological Advancements in Test Equipment: OSAT companies are adopting advanced test equipment and methodologies to improve efficiency, accuracy, and reliability in semiconductor testing processes. Innovations such as automated test handling systems and high-speed test solutions are enhancing the capabilities of OSAT providers.
  • Focus on Heterogeneous Integration and System Integration: OSAT vendors are increasingly involved in heterogeneous integration and system-level packaging, offering services that combine multiple chips, sensors, and passive components into a single package. This trend aligns with the growing demand for integrated solutions in applications such as automotive, IoT, and artificial intelligence.
  • Adoption of Advanced Materials and Processes: OSAT providers are adopting advanced materials and manufacturing processes to address the requirements of emerging applications such as 5G, edge computing, and high-performance computing. Technologies like advanced substrate materials, wafer-level chip-scale packaging (WLCSP), and system-in-package (SiP) are gaining traction in the market.

Features of the OSAT Market

  • Market Size Estimates:Outsourced semiconductor assembly and testing market size estimation in terms of value ($B)
  • Trend And Forecast Analysis:Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
  • Segmentation Analysis:Outsourced semiconductor assembly and testing market size by various segments, such as by service type, packaging type, application, and region
  • Regional Analysis:Outsourced semiconductor assembly and testing market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities:Analysis on growth opportunities in different by service type, packaging type, application, and regions for the outsourced semiconductor assembly and testing market.
  • Strategic Analysis:This includes M&A, new product development, and competitive landscape for the outsourced semiconductor assembly and testing market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the outsourced semiconductor assembly and testing (OSAT) market size?

Answer: The global outsourced semiconductor assembly and testing (OSAT) market is expected to reach an estimated $51.4 billion by 2030.

Q2. What is the growth forecast for the OSAT market?

Answer: The global outsourced semiconductor assembly and testing market is expected to grow with a CAGR of 4.5% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the OSAT market?

Answer: The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Q4. What are the major segments for OSAT market?

Answer: The future of the outsourced semiconductor assembly and testing market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial application industries.

Q5. Who are the key outsourced semiconductor assembly and testing companies?

Answer: Some of the key outsourced semiconductor assembly and testing companies are as follows:

  • Advanced Semiconductor
  • Amkor
  • Jiangsu Changjiang Electronics Technology
  • Siliconware Precision Industries
  • PTI (Powertech Technology Inc.)
  • United test and assembly center
  • King Yuan Electronics
  • ChipMOS

Q6. Which OSAT segment will be the largest in future?

Answer:Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.

Q7. In outsourced semiconductor assembly and testing market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1. What are some of the most promising, high-growth opportunities for the global outsourced semiconductor assembly and testing market by service type (assembly & packaging and testing), packaging type (wire bond, flip chip, wafer level, and others), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Outsourced Semiconductor Assembly and Testing Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2: Global Outsourced Semiconductor Assembly and Testing Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Outsourced Semiconductor Assembly and Testing Market by Service Type
    • 3.3.1: Assembly & Packaging
    • 3.3.2: Testing
  • 3.4: Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type
    • 3.4.1: Wire Bond
    • 3.4.2: Flip Chip
    • 3.4.3: Wafer Level
    • 3.4.4: Others
  • 3.5: Global Outsourced Semiconductor Assembly and Testing Market by Application
    • 3.5.1: Automotive
    • 3.5.2: Telecommunications
    • 3.5.3: Computing & Networking
    • 3.5.4: Consumer Electronics
    • 3.5.5: Industrial

4. Market Trends and Forecast Analysis by Region from 2017-2028

  • 4.1: Global Outsourced Semiconductor Assembly and Testing Market by Region
  • 4.2: North American Outsourced Semiconductor Assembly and Testing Market
    • 4.2.1: North American Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.2.2: North American Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.3: European Outsourced Semiconductor Assembly and Testing Market
    • 4.3.1: European Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.3.2: European Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.4: APAC Outsourced Semiconductor Assembly and Testing Market
    • 4.4.1: APAC Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.4.2: APAC Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
  • 4.5: ROW Outsourced Semiconductor Assembly and Testing Market
    • 4.5.1: ROW Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
    • 4.5.2: ROW Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Service Type
    • 6.1.2: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Packaging Type
    • 6.1.3: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Application
    • 6.1.5: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Region
  • 6.2: Emerging Trends in the Global Outsourced Semiconductor Assembly and Testing Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Outsourced Semiconductor Assembly and Testing Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Outsourced Semiconductor Assembly and Testing Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor
  • 7.2: Amkor
  • 7.3: Jiangsu Changjiang Electronics Technology
  • 7.4: Siliconware Precision Industries
  • 7.5: PTI (Powertech Technology Inc.)
  • 7.6: United test and assembly center
  • 7.7: King Yuan Electronics
  • 7.8: ChipMOS .