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市场调查报告书
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半导体晶圆抛光和研磨设备市场，按应用、最终用户、国家和地区划分 - 2024-2032 年行业分析、市场规模、市场份额和预测

Semiconductor Wafer Polishing and Grinding Equipment Market, By Application, By End-user, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2024-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 302 Pages | 商品交期: 2-3个工作天内

价格
简介目录

报告要点

2023年半导体晶圆抛光研磨设备市值为4.096亿美元，2024年至2032年复合年增长率为4.20%。

半导体晶圆抛光研磨设备市场-市场动态

消费性电子产品需求不断成长

对消费性电子产品的需求增加正在推动半导体晶圆抛光和研磨设备市场的成长。随着智慧型手机、平板电脑和智慧家居设备的普及，对支援该技术的创新半导体的需求也不断增长。这些半导体是在硅晶片上製造的，需要精密抛光和研磨以确保最佳性能和纯度。推动更小、更快、更节能的设备需要日益复杂和高品质的半导体生产工艺，从而导致对先进抛光和研磨设备的投资增加。此外，5G 和物联网等即将推出的技术也推动了需求。

半导体晶圆抛光和研磨设备市场-关键见解

根据我们的研究分析师分享的分析，预计全球市场在预测期内（2024-2032）每年将以 4.20% 左右的复合年增长率成长

根据应用细分，300毫米细分市场目前在半导体晶圆抛光和研磨设备市场占据主导地位。

根据最终用户细分，记忆体製造商的市场预计将大幅成长。

从地区来看，北美是 2023 年最大的收入来源。

半导体晶圆抛光和研磨设备市场-細項分析：

全球半导体晶圆抛光和研磨设备市场根据应用、最终用户和地区进行细分。

根据应用，市场分为三个部分：200 毫米、300 毫米和小于 200 毫米。 300毫米细分市场目前在半导体晶圆抛光和研磨设备市场占据主导地位，主要是因为对更高厚度晶圆的需求，因为更大尺寸的晶圆确保了生产过程中产量和效率的提高。 300毫米广泛应用于更多应用领域，例如微处理器、记忆体晶片等，因此是需求量大的产业。

根据最终用户，市场分为三类：IDM、代工厂和记忆体製造商。由于从消费性电子产品到企业级资料中心等各种应用对更大记忆体容量和更快资料处理速度的需求不断增长，预计记忆体製造商市场将在评估期内快速成长。 DRAM 和 NAND 快闪记忆体等储存晶片对于提高不同电子设备的效能和操作至关重要。为了实现最大产量和性能，这些记忆体组件必须使用非常精确且可靠的晶圆抛光和研磨技术来製造。在云端运算、巨量资料和连网设备激增等趋势的推动下，全球资料消耗和产生持续增长，对储存晶片的需求预计将增加，从而需要使用专用设备来实现其製造。

半导体晶圆抛光研磨设备市场-地理洞察

从地理来看，该市场分布在北美、拉丁美洲、欧洲、亚太地区、中东和非洲。这些地区根据进行商业活动的国家进一步划分。由于该地区存在重要的行业参与者，北美目前在市场上占据主导地位。此外，汽车应用中对功率半导体积体电路的需求不断增长，以及对电力基础设施的重大投资，可能会在整个预测期内推动北美市场的扩张。

预计亚太地区市场将显着发展。各种设备类型的应用数量不断增加推动了这一增长。此外，随着公司寻求更有效率和创新的製造技术，无晶圆厂半导体产业的不断整合预计将在未来几年推动市场成长。

半导体晶圆抛光研磨设备市场-竞争格局：

半导体晶圆抛光和研磨设备市场竞争激烈，许多主要参与者占据了该行业的主导地位。主要参与者包括 ALLIED HIGH TECH PRODUCTS, INC、Applied Materials Inc.、ASM International NV 和 Axus Technology，这些公司专注于半导体製造的製程控制和良率管理。 DISCO Corporation 和 Struers A/S 等其他公司也提供精密研磨和抛光的专用设备。各种应用（例如消费性电子产品和汽车技术）对更高性能半导体的要求推动了上述参与者之间的竞争。

最新进展：

2023年3月，半导体生产设备供应商DISCO公司发明了一款支援8吋晶圆的全自动划片机，现已上市。

目录

第一章：半导体晶圆抛光和研磨设备市场概述

  • 研究范围
  • 市场预估年份

第 2 章：执行摘要

  • 市场片段
    • 半导体晶圆抛光和研磨设备市场片段（按应用）
    • 最终用户的半导体晶圆抛光和研磨设备市场片段
    • 按国家/地区分類的半导体晶圆抛光和研磨设备市场片段
    • 按地区分類的半导体晶圆抛光和研磨设备市场片段
  • 竞争洞察

第 3 章：半导体晶圆抛光和研磨设备主要市场趋势

  • 半导体晶圆抛光和研磨设备市场驱动因素
    • 市场驱动因素的影响分析
  • 半导体晶圆抛光研磨设备市场限制
    • 市场限制影响分析
  • 半导体晶圆抛光研磨设备市场机会
  • 半导体晶圆抛光研磨设备市场未来趋势

第 4 章：半导体晶圆抛光和研磨设备产业研究

  • PEST分析
  • 波特五力分析
  • 成长前景图
  • 规范架构分析

第 5 章：半导体晶圆抛光和研磨设备市场：地缘政治紧张局势升级的影响

  • COVID-19 大流行的影响
  • 俄罗斯-乌克兰战争的影响
  • 中东衝突的影响

第 6 章：半导体晶圆抛光与研磨设备市场格局

  • 2023年半导体晶圆抛光研磨设备市占率分析
  • 按主要製造商分類的故障数据
    • 既定玩家分析
    • 新兴玩家分析

第 7 章：半导体晶圆抛光和研磨设备市场 - 按应用

  • 概述
    • 按应用分類的细分市场占有率分析
    • 200毫米
    • 300毫米
    • 小于200毫米

第 8 章：半导体晶圆抛光和研磨设备市场 - 按下最终用户

  • 概述
    • 按最终用户分類的细分市场占有率分析
    • 整合装置製造商
    • 铸造厂
    • 记忆体厂商

第 9 章：半导体晶圆抛光和研磨设备市场 - 按地区划分

  • 介绍
    • 按地理位置分類的细分市场占有率分析
  • 北美洲
    • 概述
    • 北美半导体晶圆抛光研磨设备主要製造商
    • 北美市场规模和预测（按国家）
    • 北美市场规模和预测（按应用）
    • 北美市场规模和预测（按最终用户）
    • 我们
    • 加拿大
  • 欧洲
    • 概述
    • 欧洲半导体晶圆抛光和研磨设备主要製造商
    • 欧洲市场规模和预测（按国家）
    • 欧洲市场规模和预测（按应用）
    • 欧洲市场规模和预测（按最终用户）
    • 德国
    • 义大利
    • 英国
    • 法国
    • 俄罗斯
    • 荷兰
    • 瑞典
    • 波兰
    • 欧洲其他地区
  • 亚太地区 (APAC)
    • 概述
    • 亚太地区半导体晶圆抛光研磨设备主要製造商
    • 亚太地区市场规模与预测（按国家）
    • 亚太地区市场规模与预测（按应用）
    • 亚太地区市场规模和预测（按最终用户）
    • 印度
    • 中国
    • 日本
    • 韩国
    • 澳洲
    • 泰国
    • 印尼
    • 菲律宾
    • 亚太地区其他地区
  • 拉丁美洲
    • 概述
    • 拉丁美洲半导体晶圆抛光和研磨设备主要製造商
    • 拉丁美洲市场规模与预测（按国家）
    • 拉丁美洲市场规模与预测（按应用）
    • 拉丁美洲市场规模和预测（按最终用户）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥伦比亚
    • 拉丁美洲其他地区
  • 中东和非洲
    • 概述
    • 中东和非洲半导体晶圆抛光研磨设备主要製造商
    • 中东和非洲市场规模及预测（按国家）
    • 中东和非洲市场规模及预测（按应用）
    • 中东和非洲市场规模和预测（按最终用户）
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 以色列
    • 土耳其
    • 阿尔及利亚
    • 埃及
    • MEA 的其余部分

第10章：主要供应商分析-半导体晶圆抛光研磨设备产业

  • 竞争仪表板
    • Competitive Benchmarking
    • Competitive Positioning
  • 公司简介
    • ALLIED HIGH TECH PRODUCTS, INC
    • Applied Materials Inc
    • ASM International NV
    • Axus Technology
    • G and N GmbH
    • Gigamat Technologies Inc
    • KLA Corp
    • Lapmaster Wolters
    • DISCO Corp
    • Logitech Ltd.
    • Okamoto Corp
    • S Cubed
    • Revasum Inc
    • S3 Alliance
    • Tokyo Electron Ltd
    • TOKYO SEIMITSU CO. LTD
    • ULTRA TEC Manufacturing Inc
    • Amtech Systems Inc.
    • UNITED GRINDING North America, Inc.
    • Ebara Corp.
    • Others

第 11 章：360 度分析师视角

第 12 章：附录

  • 研究方法
  • 参考
  • 缩写
  • 免责声明
  • 联络我们
简介目录
Product Code: ANV4491

REPORT HIGHLIGHT

The Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 409.6 million in 2023 and expanded at a CAGR of 4.20% from 2024 to 2032.

Semiconductor wafer polishing and grinding equipment are used during the semiconductor wafer manufacturing process to obtain the needed surface flatness and smoothness. This equipment removes defects and prepares wafers for subsequent processing and manufacture of semiconductor devices.

Semiconductor Wafer Polishing and Grinding Equipment Market- Market Dynamics

Increasing demand for consumer electronics

Increased demand for consumer electronics is driving the growth of the Semiconductor Wafer Polishing and Grinding Equipment Market. As the popularity of smartphones, tablets, and smart home gadgets grows, so does the demand for innovative semiconductors that power this technology. These semiconductors are made on silicon wafers, which require precision polishing and grinding to assure peak performance and purity. The push for smaller, quicker, and more energy-efficient devices necessitates increasingly complex and high-quality semiconductor production processes, resulting in increased investment in advanced polishing and grinding equipment. Furthermore, upcoming technologies like as 5G and IoT drive up demand.

Semiconductor Wafer Polishing and Grinding Equipment Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 4.20% over the forecast period (2024-2032)

Based on Application segmentation, the 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market.

Based on End-user segmentation, The memory manufacturers' market is predicted to increase substantially.

In terms of region, North America was the largest revenue generator in 2023.

Semiconductor Wafer Polishing and Grinding Equipment Market- Segmentation Analysis:

The Global Semiconductor Wafer Polishing and Grinding Equipment Market is segmented on the basis of Application, End-user, and Region.

The market is segmented into three segments according to application: 200 mm, 300 mm, and Less than 200 mm. The 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market mainly because of the demand for wafers in higher thicknesses, as larger-sized wafers ensure improved yields and efficiency in production processes. The 300 mm is widely used in more applications, such as microprocessors, memory chips, etc. Hence, it is a highly in-demand industry.

The market is divided into three categories based on End-user: IDM, Foundries, and Memory manufacturers. The memory manufacturers market is expected to grow rapidly over the assessment period, driven by rising demand for bigger memory capacity and quicker data processing rates in a wide range of applications, from consumer electronics to enterprise-level data centres. Memory chips, such as DRAM and NAND flash, are essential for improving the performance and operation of different electronic devices. To achieve maximum yield and performance, these memory components must be manufactured using very precise and dependable wafer polishing and grinding techniques. Global data consumption and generation continue to rise, fueled by trends such as cloud computing, big data, and the proliferation of connected devices, and the demand for memory chips is expected to rise, necessitating the use of specialised equipment to enable their manufacturing.

Semiconductor Wafer Polishing and Grinding Equipment Market- Geographical Insights

Geographically, this market is distributed over North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. These regions are further split based on the nations bringing commerce. North America currently dominates the market, owing to the presence of significant industry players in the area. Furthermore, rising demand for power semiconductor integrated circuits in automotive applications, as well as major investments in electric infrastructure, are likely to fuel market expansion in North America throughout the forecast period.

Asia-Pacific is predicted to develop significantly in the market. The rising number of applications for various equipment kinds drives this growth. Furthermore, increasing consolidation in the fabless semiconductor industry is expected to drive market growth in the future years as companies seek more efficient and innovative manufacturing techniques.

Semiconductor Wafer Polishing and Grinding Equipment Market- Competitive Landscape:

The Semiconductor Wafer Polishing and Grinding Equipment market is highly competitive, with a number of key players dominating the industry. Major players include ALLIED HIGH TECH PRODUCTS, INC, Applied Materials Inc., ASM International NV, and Axus Technology, which focus on process control and yield management in semiconductor fabrication. Other companies like DISCO Corporation and Struers A/S also offer specialised equipment for precision grinding and polishing. The requirements of higher performance semiconductors in various applications - such as consumer electronics and automotive technologies - drive the competition among the players listed above.

Recent Developments:

In March 2023, DISCO Corporation, a supplier of semiconductor production equipment, invented a completely automated dicing saw that supports 8-inch wafers, which is now available on the market.

SCOPE OF THE REPORT

This report's scope includes the following important market segments:

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • ALLIED HIGH-TECH PRODUCTS, INC
  • Applied Materials Inc
  • ASM International NV
  • Axus Technology
  • G and N GmbH
  • Gigamat Technologies Inc
  • KLA Corp
  • Lapmaster Wolters
  • DISCO Corp
  • Logitech Ltd.
  • Okamoto Corp
  • S Cubed
  • Revasum Inc
  • S3 Alliance
  • Tokyo Electron Ltd
  • TOKYO SEIMITSU CO. LTD
  • ULTRA TEC Manufacturing Inc
  • Amtech Systems Inc.
  • UNITED GRINDING North America, Inc.
  • Ebara Corp.
  • Others

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

  • 200 mm
  • 300 mm
  • Less than 200 mm

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY END-USER- MARKET ANALYSIS, 2019 - 2032

  • IDM
  • Foundries
  • Memory manufacturers

GLOBAL SEMICONDUCTOR WAFER POLISHING AND GRINDING EQUIPMENT MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • United Arab Emirates
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Semiconductor Wafer Polishing and Grinding Equipment Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Application
    • 2.1.2. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by End-user
    • 2.1.3. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Country
    • 2.1.4. Semiconductor Wafer Polishing and Grinding Equipment Market Snippet by Region
  • 2.2. Competitive Insights

3. Semiconductor Wafer Polishing and Grinding Equipment Key Market Trends

  • 3.1. Semiconductor Wafer Polishing and Grinding Equipment Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Semiconductor Wafer Polishing and Grinding Equipment Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Semiconductor Wafer Polishing and Grinding Equipment Market Opportunities
  • 3.4. Semiconductor Wafer Polishing and Grinding Equipment Market Future Trends

4. Semiconductor Wafer Polishing and Grinding Equipment Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Semiconductor Wafer Polishing and Grinding Equipment Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Semiconductor Wafer Polishing and Grinding Equipment Market Landscape

  • 6.1. Semiconductor Wafer Polishing and Grinding Equipment Market Share Analysis, 2023
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Semiconductor Wafer Polishing and Grinding Equipment Market - By Application

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Application, 2023 & 2032 (%)
    • 7.1.2. 200 mm
    • 7.1.3. 300 mm
    • 7.1.4. Less than 200 mm

8. Semiconductor Wafer Polishing and Grinding Equipment Market - By End-user

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By End-user, 2023 & 2032 (%)
    • 8.1.2. IDM
    • 8.1.3. Foundries
    • 8.1.4. Memory manufacturers

9. Semiconductor Wafer Polishing and Grinding Equipment Market- By Geography

  • 9.1. Introduction
    • 9.1.1. Segment Share Analysis, By Geography, 2023 & 2032 (%)
  • 9.2. North America
    • 9.2.1. Overview
    • 9.2.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in North America
    • 9.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.2.4. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.2.5. North America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.2.6. U.S.
      • 9.2.6.1. Overview
      • 9.2.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.2.6.3. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.2.6.4. U.S. Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.2.7. Canada
      • 9.2.7.1. Overview
      • 9.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.2.7.3. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.2.7.4. Canada Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.3. Europe
    • 9.3.1. Overview
    • 9.3.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Europe
    • 9.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.3.4. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.3.5. Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.6. Germany
      • 9.3.6.1. Overview
      • 9.3.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.6.3. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.6.4. Germany Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.7. Italy
      • 9.3.7.1. Overview
      • 9.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.7.3. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.7.4. Italy Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.8. United Kingdom
      • 9.3.8.1. Overview
      • 9.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.8.3. United Kingdom Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.8.4. United Kingdom Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.9. France
      • 9.3.9.1. Overview
      • 9.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.9.3. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.9.4. France Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.10. Russia
      • 9.3.10.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.10.2. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.10.3. Russia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.11. Netherlands
      • 9.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.11.2. Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.11.3. Netherlands Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.12. Sweden
      • 9.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.12.2. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.12.3. Sweden Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.13. Poland
      • 9.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.13.2. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.13.3. Poland Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.3.14. Rest of Europe
      • 9.3.14.1. Overview
      • 9.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.3.14.3. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.3.14.4. Rest of the Europe Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.4. Asia Pacific (APAC)
    • 9.4.1. Overview
    • 9.4.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Asia Pacific
    • 9.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.4.4. Asia Pacific Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.4.5. Asia Pacific Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.6. India
      • 9.4.6.1. Overview
      • 9.4.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.6.3. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.6.4. India Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.7. China
      • 9.4.7.1. Overview
      • 9.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.7.3. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.7.4. China Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.8. Japan
      • 9.4.8.1. Overview
      • 9.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.8.3. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.8.4. Japan Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.9. South Korea
      • 9.4.9.1. Overview
      • 9.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.9.3. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.9.4. South Korea Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.10. Australia
      • 9.4.10.1. Overview
      • 9.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.10.3. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.10.4. Australia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.11. Thailand
      • 9.4.11.1. Overview
      • 9.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.11.3. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.11.4. Thailand Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.12. Indonesia
      • 9.4.12.1. Overview
      • 9.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.12.3. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.12.4. Indonesia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.13. Philippines
      • 9.4.13.1. Overview
      • 9.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.13.3. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.13.4. Philippines Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.4.14. Rest of APAC
      • 9.4.14.1. Overview
      • 9.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.4.14.3. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.4.14.4. Rest of APAC Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.5. Latin America
    • 9.5.1. Overview
    • 9.5.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Latin America
    • 9.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.5.4. Latin America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.5.5. Latin America Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.6. Brazil
      • 9.5.6.1. Overview
      • 9.5.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.6.3. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.6.4. Brazil Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.7. Mexico
      • 9.5.7.1. Overview
      • 9.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.7.3. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.7.4. Mexico Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.8. Argentina
      • 9.5.8.1. Overview
      • 9.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.8.3. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.8.4. Argentina Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.9. Colombia
      • 9.5.9.1. Overview
      • 9.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.9.3. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.9.4. Colombia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.5.10. Rest of LATAM
      • 9.5.10.1. Overview
      • 9.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.5.10.3. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.5.10.4. Rest of LATAM Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
  • 9.6. Middle East and Africa
    • 9.6.1. Overview
    • 9.6.2. Semiconductor Wafer Polishing and Grinding Equipment Key Manufacturers in Middle East and Africa
    • 9.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 9.6.4. Middle East and Africa Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
    • 9.6.5. Middle East and Africa Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.6. Saudi Arabia
      • 9.6.6.1. Overview
      • 9.6.6.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.6.3. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.6.4. Saudi Arabia Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.7. United Arab Emirates
      • 9.6.7.1. Overview
      • 9.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.7.3. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.7.4. United Arab Emirates Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.8. Israel
      • 9.6.8.1. Overview
      • 9.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.8.3. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.8.4. Israel Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.9. Turkey
      • 9.6.9.1. Overview
      • 9.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.9.3. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.9.4. Turkey Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.10. Algeria
      • 9.6.10.1. Overview
      • 9.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.10.3. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.10.4. Algeria Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.11. Egypt
      • 9.6.11.1. Overview
      • 9.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.11.3. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.11.4. Egypt Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)
    • 9.6.12. Rest of MEA
      • 9.6.12.1. Overview
      • 9.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 9.6.12.3. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
      • 9.6.12.4. Rest of MEA Market Size and Forecast, By End-user, 2019 - 2032 (US$ Million)

10. Key Vendor Analysis- Semiconductor Wafer Polishing and Grinding Equipment Industry

  • 10.1. Competitive Dashboard
    • 10.1.1. Competitive Benchmarking
    • 10.1.2. Competitive Positioning
  • 10.2. Company Profiles
    • 10.2.1. ALLIED HIGH TECH PRODUCTS, INC
    • 10.2.2. Applied Materials Inc
    • 10.2.3. ASM International NV
    • 10.2.4. Axus Technology
    • 10.2.5. G and N GmbH
    • 10.2.6. Gigamat Technologies Inc
    • 10.2.7. KLA Corp
    • 10.2.8. Lapmaster Wolters
    • 10.2.9. DISCO Corp
    • 10.2.10. Logitech Ltd.
    • 10.2.11. Okamoto Corp
    • 10.2.12. S Cubed
    • 10.2.13. Revasum Inc
    • 10.2.14. S3 Alliance
    • 10.2.15. Tokyo Electron Ltd
    • 10.2.16. TOKYO SEIMITSU CO. LTD
    • 10.2.17. ULTRA TEC Manufacturing Inc
    • 10.2.18. Amtech Systems Inc.
    • 10.2.19. UNITED GRINDING North America, Inc.
    • 10.2.20. Ebara Corp.
    • 10.2.21. Others

11. 360 Degree Analyst View

12. Appendix

  • 12.1. Research Methodology
  • 12.2. References
  • 12.3. Abbreviations
  • 12.4. Disclaimer
  • 12.5. Contact Us