查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1914419

半导体CMP抛光垫市场按类型、材质、应用和最终用户划分 - 全球预测（2026-2032年）

Semiconductor CMP Polishing Pad Market by Type, Material, Application, End User - Global Forecast 2026-2032
出版日期: | 出版商: 360iResearch | 英文 198 Pages | 商品交期: 最快1-2个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

2025 年半导体 CMP 抛光垫市场价值为 9.0356 亿美元，预计到 2026 年将成长至 9.5799 亿美元，复合年增长率为 6.87%，到 2032 年将达到 14.3867 亿美元。

关键市场统计数据
基准年 2025 9.0356亿美元
预计年份：2026年 9.5799亿美元
预测年份 2032 1,438,670,000 美元
复合年增长率 (%) 6.87%

随着半导体节点的不断改进，表面控制要求也日益提高，因此了解CMP抛光垫在晶圆平坦化和製程重复性方面发挥的关键作用至关重要。

化学机械抛光 (CMP) 抛光垫在现代半导体製造中发挥着至关重要的作用，支持全球在不断缩小的光刻节点上实现平坦表面的努力。由于晶圆需要经过多次抛光步骤，因此抛光垫的机械轮廓、材料成分和表面形貌会显着影响晶圆内部的均匀性、缺陷率和整体拥有成本。因此，工程师和製程负责人将抛光垫的选择视为一个多维优化问题，需要在去除率稳定性、凹陷、腐蚀和抛光液相容性之间取得平衡。

抛光垫微结构、表面处理和供应链协作的进步如何重塑晶圆製造生态系统对化学机械抛光 (CMP) 性能的预期

近年来，CMP抛光垫技术和商业性格局的变革源于整个製造生态系统中技术压力和营运重点的融合。首先，异质整合和先进封装的发展趋势增加了抛光的复杂性，迫使抛光垫製造商设计出具有更均匀微观结构和更长使用寿命的表面。因此，製程工程师现在要求抛光垫能够在长时间运作中保持更严格的去除率控制，同时减少颗粒的产生。

2025 年的关税将使供应链多样化，并影响垫认证实践，从而导致重大的营运应对措施和策略采购转变。

2025年实施的关税政策变更和贸易措施对半导体耗材和设备（包括CMP抛光垫）产生了多方面的营运影响。影响原材料、中间组件和某些成品的关税迫使采购部门重新评估供应商组成和总到岸成本模型。事实上，各组织已透过加快双源采购策略和验证可在不同区域供应链网路中生产的替代抛光垫配方来应对这一变化。

一个严谨的细分框架，将焊盘类型、目标材料、装置应用和最终用户采购行为与技术和商业性驱动因素联繫起来。

精确的细分框架有助于技术领导者和采购团队针对不同的製程环境选择合适的化学机械抛光 (CMP) 抛光垫。按类型划分，抛光垫可分为传统结构抛光垫和固定磨料抛光垫（磨料颗粒封装在聚合物基体中）。每种类型在去除率稳定性、平面度控制和调理频率方面各有优势。考虑到目标材料的不同，抛光垫在抛光铜互连线、氧化物介质和钨结构时表现出不同的特性，因此，抛光垫配方和表面形貌要求会根据目标材料对抛光液化学性质的机械和化学响应而变化。

区域采购、认证週期和支援模式会影响晶圆厂和供应商如何优先考虑焊盘性能、物流以及全球生产基地间的协同开发。

区域趋势影响筹资策略、认证时间表以及对本地供应商生态系统的重视程度。在美洲，製造业投资和成熟的生产节点产能通常会催生对针对成熟製程平台优化的焊盘的需求，促使采购团队在兼顾国内采购和全球供应商伙伴关係的同时，维持成本效益和技术支援。在欧洲、中东和非洲，法规环境和区域化的供应链网路影响认证流程，从而促进与能够提供快速回应的技术服务和物流解决方案的本地供应商的合作。

决定CMP抛光垫生态系竞争优势的因素包括：供应商技术服务、专有抛光垫微观结构与协作开发模式

抛光垫供应商的竞争格局围绕着技术差异化、现场支援能力以及能够减少客户认证流程阻力的伙伴关係。领先的供应商正在投资建设应用工程团队，这些团队与晶圆厂的製程工程师直接合作，根据特定的抛光液态化学成分和目标材料调整抛光垫的纹理、硬度分布和孔隙结构。这些技术服务与产品性能一样，越来越受到客户的重视，因为它们可以缩短认证週期并降低推出风险。

为製程、采购和工程负责人提供切实可行的措施，以降低焊盘供应风险、延长耗材寿命、加快认证速度，同时确保产量比率。

产业领导者应采取整合策略，将焊盘认证、采购和製程管理结合，以加速节点升级并保障产量比率。首先，投资与多家供应商的联合认证项目，以建立替代方案并减少对单一供应商的依赖。并行认证流程使晶圆厂能够缩短产能推出週期，并在供应中断的情况下保持生产连续性。其次，优先考虑具有延长焊盘寿命和减少颗粒物优势的焊盘配方和处理技术，从而在不牺牲性能的前提下实现成本节约。

透过严谨的调查方法，结合与一级製造商的互动、对供应商工程师的访谈以及技术文献的综合分析，我们获得了关于实用CMP抛光垫的宝贵见解。

本研究结合了与化学机械抛光（CMP）製程工程师、采购主管和供应商技术团队的直接对话，以及对技术文献、专利揭露和设备整合案例研究的系统性回顾，旨在全面了解抛光垫的动态特性。主要资讯收集着重于製程层面的效能指标（去除率控制、晶圆内均匀性、缺陷模式和保养週期），而供应商访谈则探讨了生产可扩展性、品质系统和现场支援模式。这些定性资讯与工程研究和已发布的製造最佳实践进行了交叉比对，以检验技术趋势和新兴材料的选择。

技术和商业性优先事项的趋同要求，需要一种系统级的焊盘策略，以实现一致的平坦化、低缺陷率和更稳健的製造流程。

化学机械抛光（CMP）抛光垫是材料工程和半导体製造经济的关键交会点，近期趋势凸显了技术和商业领域整合决策的必要性。抛光垫微结构技术和固定磨料选择的进步为减少凹陷和提高均匀性提供了有希望的途径，但这些必须与精密的抛光垫预处理技术和抛光液优化相结合。同时，采用柔软性的区域筹资策略和与供应商建立合作关係，可以降低关税风险和供应链中断的风险。

目录

第一章：序言

第二章调查方法

  • 研究设计
  • 研究框架
  • 市场规模预测
  • 数据三角测量
  • 调查结果
  • 调查前提
  • 调查限制

第三章执行摘要

  • 首席主管观点
  • 市场规模和成长趋势
  • 2025年市占率分析
  • FPNV定位矩阵，2025
  • 新的商机
  • 下一代经营模式
  • 产业蓝图

第四章 市场概览

  • 产业生态系与价值链分析
  • 波特五力分析
  • PESTEL 分析
  • 市场展望
  • 上市策略

第五章 市场洞察

  • 消费者洞察与终端用户观点
  • 消费者体验基准
  • 机会地图
  • 分销通路分析
  • 价格趋势分析
  • 监理合规和标准框架
  • ESG与永续性分析
  • 中断和风险情景
  • 投资报酬率和成本效益分析

第六章：美国关税的累积影响，2025年

第七章：人工智慧的累积影响，2025年

8. 半导体CMP抛光垫市场按类型划分

  • 传统垫
  • 固定式研磨垫

9. 半导体CMP抛光垫市场（依材料分类）

  • 铜
  • 氧化物
  • 钨

10. 半导体CMP抛光垫市场（依应用领域划分）

  • 逻辑装置
  • 储存装置
    • DRAM
    • NAND快闪记忆体

11. 半导体CMP抛光垫市场（依最终用户划分）

  • 铸造厂
  • IDM
  • OSAT

12. 半导体CMP抛光垫市场（依地区划分）

  • 美洲
    • 北美洲
    • 拉丁美洲
  • 欧洲、中东和非洲
    • 欧洲
    • 中东
    • 非洲
  • 亚太地区

第十三章 半导体CMP抛光垫市场（依组别划分）

  • ASEAN
  • GCC
  • EU
  • BRICS
  • G7
  • NATO

14. 各国半导体CMP抛光垫市场

  • 美国
  • 加拿大
  • 墨西哥
  • 巴西
  • 英国
  • 德国
  • 法国
  • 俄罗斯
  • 义大利
  • 西班牙
  • 中国
  • 印度
  • 日本
  • 澳洲
  • 韩国

第十五章：美国半导体CMP抛光垫市场

第十六章 中国半导体CMP抛光垫市场

第十七章 竞争格局

  • 市场集中度分析，2025年
    • 浓度比（CR）
    • 赫芬达尔-赫希曼指数 (HHI)
  • 近期趋势及影响分析，2025 年
  • 2025年产品系列分析
  • 基准分析，2025 年
  • BASF SE
  • Cabot Microelectronics Corporation
  • Dow Inc.
  • DuPont de Nemours, Inc.
  • Entegris, Inc.
  • Fujibo Co., Ltd.
  • Hitachi Chemical Co., Ltd.
  • Pureon AG
  • Shin-Etsu Chemical Co., Ltd.
  • Thomas West Incorporated
  • Tokyo Ohka Kogyo Co., Ltd.
  • Tosoh Corporation
Product Code: MRR-AE420CB13C68

The Semiconductor CMP Polishing Pad Market was valued at USD 903.56 million in 2025 and is projected to grow to USD 957.99 million in 2026, with a CAGR of 6.87%, reaching USD 1,438.67 million by 2032.

KEY MARKET STATISTICS
Base Year [2025] USD 903.56 million
Estimated Year [2026] USD 957.99 million
Forecast Year [2032] USD 1,438.67 million
CAGR (%) 6.87%

Understanding the pivotal role of CMP polishing pads in wafer planarization and process reproducibility as semiconductor nodes demand tighter surface control

Chemical mechanical planarization (CMP) polishing pads occupy a foundational role in modern semiconductor manufacturing by supporting global efforts to achieve planar surfaces at increasingly fine lithographic nodes. As wafers progress through multiple polishing steps, the pad's mechanical profile, material composition, and surface topography materially influence within-wafer uniformity, defectivity rates, and total cost of ownership. Engineers and process owners thus treat pad selection as a multidimensional optimization problem that balances removal rate stability against dishing, erosion, and slurry compatibility.

Over recent development cycles, polishing pad technologies have evolved to address the competing pressures of reduced feature sizes and heterogeneous integration. Fixed abrasive pads and conventional polymeric pads present distinct trade-offs between planarity control and consumable lifecycle. Meanwhile, tighter specifications for copper, oxide, and tungsten interconnect polishing have elevated the need for application-specific pad formulations and conditioning protocols. Consequently, pad performance now interlinks with slurry chemistry design, end-point detection systems, and automated conditioning systems, creating an ecosystem-level approach to CMP performance.

Given this context, stakeholders across foundries, integrated device manufacturers, and outsourced semiconductor assembly and test providers prioritize pad reliability, supplier technical support, and process reproducibility. These priorities reflect a broader industry preference for predictable process windows that minimize rework, maximize yield stability, and support accelerated node transitions.

How advances in pad microarchitecture, conditioning, and supply-chain collaboration are reshaping CMP performance expectations across wafer fabrication ecosystems

Recent transformative shifts in CMP polishing pad technology and commercial dynamics stem from converging technological pressures and operational priorities across fabrication ecosystems. First, the drive toward heterogeneous integration and advanced packaging has increased polishing complexity, motivating pad manufacturers to engineer surfaces with more consistent microstructure and improved conditioning lifecycles. As a result, process engineers now demand pads that deliver narrower variability in removal rates while reducing particle generation over extended runs.

Second, innovation in pad materials and fixed abrasive architectures has accelerated. Fixed abrasive pads, which embed abrasive particles within the pad matrix, have gained attention for certain metal and dielectric applications where localized control can reduce dishing and erosion. At the same time, refinements in conventional pad chemistry and pore structure aim to improve slurry transport and reduce entrapment risks, which mitigates defectivity. These material-level changes often occur in tandem with advanced conditioning equipment that preserves pad surface topography with more predictable conditioning cycles.

Third, supply-chain resilience and strategic sourcing have become core considerations for procurement and operations teams. The need to optimize inventory strategies and qualification timelines has pushed collaboration between pad suppliers and fabricators, with an emphasis on accelerated qualification protocols and in-situ monitoring to shorten ramp-up times. Collectively, these shifts highlight an industry moving from component-centric procurement to integrated process partnerships that prioritize long-term reproducibility and risk mitigation.

Consequential operational responses and strategic sourcing shifts driven by 2025 tariff measures that influenced supply-chain diversification and pad qualification practices

Tariff policy changes and trade measures implemented in 2025 introduced layered operational consequences for semiconductor consumables and equipment, including CMP polishing pads. Tariffs that affect raw materials, intermediate components, and certain finished goods forced procurement teams to re-evaluate supplier footprints and total landed cost models. In practice, organizations responded by accelerating dual-sourcing strategies and by qualifying alternative pad formulations that could be manufactured within different regional supply networks.

Beyond immediate sourcing reactions, tariff-driven cost pressure amplified focus on pad longevity and process efficiency. Process engineers increased scrutiny on pad conditioning cycles and defect mitigation practices to offset elevated input costs. Consequently, engineering teams prioritized process windows that reduced pad consumption per wafer and extended usable pad life while preserving planarity and defect control. This pragmatic response reflects a recognition that operational optimization can serve as a hedge against external tariff volatility.

Moreover, tariff impacts encouraged closer collaboration between consumable suppliers and end users to redesign packaging, adjust minimum order quantities, and locate finishing steps closer to fabrication hubs when feasible. These adjustments often required rework of qualification matrices and tighter coordination across supply-chain stakeholders. Collectively, the 2025 tariff environment catalyzed a shift toward more geographically diversified procurement and process adaptations intended to protect yield and support continuity of advanced-node manufacturing.

A rigorous segmentation framework that maps pad types, target materials, device applications, and end-user procurement behaviors to technical and commercial decision drivers

A precise segmentation framework helps technical leaders and procurement teams navigate CMP pad selection across distinct process contexts. When viewed by type, the landscape splits into conventional pad architectures and fixed abrasive pad designs that embed abrasive particles within a polymeric matrix; each path offers different advantages for removal-rate stability, planarity control, and conditioning frequency. Considering material targets emphasizes that pad behavior differs when polishing copper interconnects, oxide dielectrics, or tungsten features, and therefore pad formulation and surface topography requirements vary with the target material's mechanical and chemical response to slurry chemistries.

From an application perspective, pad selection depends on whether the primary focus is logic device fabrication or memory device production, with memory device polishing further differentiated by device class, including DRAM and NAND Flash, each of which imposes distinct tolerance and defectivity expectations. Finally, end-user segmentation clarifies commercial and qualification dynamics because foundries, integrated device manufacturers (IDMs), and outsourced semiconductor assembly and test providers (OSATs) operate under differing procurement cycles, scale requirements, and qualification tolerances. Together, these segmentation lenses guide how process engineers prioritize pad performance, qualification timelines, and supplier partnerships to achieve consistent wafer-level outcomes.

Regional sourcing, qualification rhythms, and support models that influence how fabs and suppliers prioritize pad performance, logistics, and co-development across global production hubs

Regional dynamics shape sourcing strategies, qualification timelines, and the emphasis placed on local supplier ecosystems. In the Americas, fabrication investment and mature-node capacity often create demand for pads optimized for established process platforms, while procurement teams balance domestic sourcing with global supplier partnerships to preserve cost efficiency and technical support. In Europe, Middle East & Africa, the regulatory environment and localized supply networks influence qualification pathways and encourage collaboration with regional suppliers who can provide responsive technical services and logistics solutions.

In Asia-Pacific, a dense concentration of advanced fabs and aggressive node transitions places a premium on pads that deliver repeatable performance at scale, alongside strong field support and rapid qualification cycles. This regional intensity also drives closer integration between pad manufacturers and fabs, with co-development projects and on-site support teams becoming common. Across regions, stakeholders increasingly consider the implications of logistics, lead-time variability, and regional tariff exposures when designing sourcing strategies, making geographic agility an essential component of resilient CMP supply planning.

How supplier technical services, proprietary pad microstructures, and collaborative development models define competitive advantage in the CMP polishing pad ecosystem

The competitive environment for polishing pad suppliers centers on technical differentiation, field support capabilities, and partnerships that reduce qualification friction for customers. Leading suppliers invest in application engineering teams that work directly with fab process engineers to adapt pad textures, hardness profiles, and pore structures to specific slurry chemistries and target materials. These technical services shorten qualification cycles and reduce ramp risk, which customers increasingly value alongside product-level performance.

Strategic partnerships and supply agreements now emphasize collaborative development, with suppliers offering joint problem-solving around conditioning strategies and in-situ monitoring to extend pad life and reduce defectivity. Intellectual property around pad microstructure design, fabrication processes, and conditioning tooling contributes to competitive advantage, as does the capacity to deliver consistent product quality at commercial volumes. Meanwhile, aftermarket services such as on-site training, rapid replacement logistics, and tailored performance analytics create additional differentiation, enabling suppliers to move beyond a transactional model toward long-term process stewardship.

Practical actions for process, procurement, and engineering leaders to de-risk pad supply, extend consumable life, and accelerate qualification while safeguarding yield

Industry leaders should adopt an integrated strategy that aligns pad qualification, procurement, and process control to accelerate node transitions while protecting yield. First, invest in joint qualification programs with multiple suppliers to establish fallback options and reduce single-source exposure. By running parallel qualification streams, fabs can shorten ramp cycles and maintain continuity if supply disruptions occur. Second, prioritize pad formulations and conditioning regimes that demonstrably extend usable pad life and reduce particle generation, enabling cost mitigation without sacrificing performance.

Third, deepen technical partnerships with suppliers by co-developing pad surface microstructures and conditioning protocols that match slurry chemistries to specific copper, oxide, or tungsten processes. This co-engineering approach reduces rework and improves first-pass yields. Fourth, align procurement practices with regional logistics realities to mitigate tariff and lead-time risks; consider localized finishing or assembly steps to limit cross-border exposure. Finally, establish measurable KPIs around within-wafer uniformity, defectivity attributable to pad performance, and pad lifespan, and use those KPIs to drive continuous improvement and supplier accountability. These actions will strengthen resilience while enabling more predictable, scalable polishing outcomes.

A rigorous methodology blending primary fabrication engagement, supplier technical interviews, and engineering literature synthesis to produce actionable CMP pad insights

This research synthesis combines primary engagement with CMP process engineers, procurement leads, and supplier technical teams alongside a structured review of engineering literature, patent disclosures, and equipment integration case studies to construct a balanced view of polishing pad dynamics. Primary insight gathering focused on process-level performance criteria-removal rate control, within-wafer uniformity, defectivity patterns, and conditioning lifecycle-while supplier interviews explored production scalability, quality systems, and field-support models. These qualitative inputs were triangulated with engineering studies and publicly available fabrication best practices to validate technical trends and emergent material choices.

Analytical rigor was applied through cross-functional review cycles that involved subject-matter experts in materials science, process integration, and supply-chain management. Wherever possible, findings emphasize observable operational responses and engineering trade-offs rather than speculative projections. The methodology privileges reproducible process metrics and documented qualification experiences to ensure recommendations remain actionable for fab managers, procurement executives, and R&D teams seeking to align pad selection with broader fabrication objectives.

Converging technical and commercial priorities point toward system-level pad strategies that enable consistent planarization, lower defectivity, and more resilient fabrication operations

CMP polishing pads represent a critical junction between materials engineering and semiconductor manufacturing economics, and recent developments underscore the need for integrated decision-making across technical and commercial domains. Technological advances in pad microarchitecture and fixed abrasive options offer compelling pathways to reduce dishing and improve uniformity, but they must be matched with refined conditioning practices and slurry optimization. Simultaneously, procurement strategies that incorporate regional sourcing flexibility and collaborative supplier relationships mitigate tariff exposure and supply-chain disruption risk.

In conclusion, the path to sustained CMP performance rests on treating pads as part of a broader process system rather than as isolated consumables. By aligning co-development, qualification, and operational KPIs, fabs can achieve more predictable planarity, lower defectivity, and longer pad lifecycles. These outcomes in turn support higher yields and smoother node transitions, equipping manufacturers to meet the increasing demands of advanced logic and memory device production with greater confidence.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Definition
  • 1.3. Market Segmentation & Coverage
  • 1.4. Years Considered for the Study
  • 1.5. Currency Considered for the Study
  • 1.6. Language Considered for the Study
  • 1.7. Key Stakeholders

2. Research Methodology

  • 2.1. Introduction
  • 2.2. Research Design
    • 2.2.1. Primary Research
    • 2.2.2. Secondary Research
  • 2.3. Research Framework
    • 2.3.1. Qualitative Analysis
    • 2.3.2. Quantitative Analysis
  • 2.4. Market Size Estimation
    • 2.4.1. Top-Down Approach
    • 2.4.2. Bottom-Up Approach
  • 2.5. Data Triangulation
  • 2.6. Research Outcomes
  • 2.7. Research Assumptions
  • 2.8. Research Limitations

3. Executive Summary

  • 3.1. Introduction
  • 3.2. CXO Perspective
  • 3.3. Market Size & Growth Trends
  • 3.4. Market Share Analysis, 2025
  • 3.5. FPNV Positioning Matrix, 2025
  • 3.6. New Revenue Opportunities
  • 3.7. Next-Generation Business Models
  • 3.8. Industry Roadmap

4. Market Overview

  • 4.1. Introduction
  • 4.2. Industry Ecosystem & Value Chain Analysis
    • 4.2.1. Supply-Side Analysis
    • 4.2.2. Demand-Side Analysis
    • 4.2.3. Stakeholder Analysis
  • 4.3. Porter's Five Forces Analysis
  • 4.4. PESTLE Analysis
  • 4.5. Market Outlook
    • 4.5.1. Near-Term Market Outlook (0-2 Years)
    • 4.5.2. Medium-Term Market Outlook (3-5 Years)
    • 4.5.3. Long-Term Market Outlook (5-10 Years)
  • 4.6. Go-to-Market Strategy

5. Market Insights

  • 5.1. Consumer Insights & End-User Perspective
  • 5.2. Consumer Experience Benchmarking
  • 5.3. Opportunity Mapping
  • 5.4. Distribution Channel Analysis
  • 5.5. Pricing Trend Analysis
  • 5.6. Regulatory Compliance & Standards Framework
  • 5.7. ESG & Sustainability Analysis
  • 5.8. Disruption & Risk Scenarios
  • 5.9. Return on Investment & Cost-Benefit Analysis

6. Cumulative Impact of United States Tariffs 2025

7. Cumulative Impact of Artificial Intelligence 2025

8. Semiconductor CMP Polishing Pad Market, by Type

  • 8.1. Conventional Pad
  • 8.2. Fixed Abrasive Pad

9. Semiconductor CMP Polishing Pad Market, by Material

  • 9.1. Copper
  • 9.2. Oxide
  • 9.3. Tungsten

10. Semiconductor CMP Polishing Pad Market, by Application

  • 10.1. Logic Devices
  • 10.2. Memory Devices
    • 10.2.1. Dram
    • 10.2.2. Nand Flash

11. Semiconductor CMP Polishing Pad Market, by End User

  • 11.1. Foundries
  • 11.2. Idms
  • 11.3. Osats

12. Semiconductor CMP Polishing Pad Market, by Region

  • 12.1. Americas
    • 12.1.1. North America
    • 12.1.2. Latin America
  • 12.2. Europe, Middle East & Africa
    • 12.2.1. Europe
    • 12.2.2. Middle East
    • 12.2.3. Africa
  • 12.3. Asia-Pacific

13. Semiconductor CMP Polishing Pad Market, by Group

  • 13.1. ASEAN
  • 13.2. GCC
  • 13.3. European Union
  • 13.4. BRICS
  • 13.5. G7
  • 13.6. NATO

14. Semiconductor CMP Polishing Pad Market, by Country

  • 14.1. United States
  • 14.2. Canada
  • 14.3. Mexico
  • 14.4. Brazil
  • 14.5. United Kingdom
  • 14.6. Germany
  • 14.7. France
  • 14.8. Russia
  • 14.9. Italy
  • 14.10. Spain
  • 14.11. China
  • 14.12. India
  • 14.13. Japan
  • 14.14. Australia
  • 14.15. South Korea

15. United States Semiconductor CMP Polishing Pad Market

16. China Semiconductor CMP Polishing Pad Market

17. Competitive Landscape

  • 17.1. Market Concentration Analysis, 2025
    • 17.1.1. Concentration Ratio (CR)
    • 17.1.2. Herfindahl Hirschman Index (HHI)
  • 17.2. Recent Developments & Impact Analysis, 2025
  • 17.3. Product Portfolio Analysis, 2025
  • 17.4. Benchmarking Analysis, 2025
  • 17.5. BASF SE
  • 17.6. Cabot Microelectronics Corporation
  • 17.7. Dow Inc.
  • 17.8. DuPont de Nemours, Inc.
  • 17.9. Entegris, Inc.
  • 17.10. Fujibo Co., Ltd.
  • 17.11. Hitachi Chemical Co., Ltd.
  • 17.12. Pureon AG
  • 17.13. Shin-Etsu Chemical Co., Ltd.
  • 17.14. Thomas West Incorporated
  • 17.15. Tokyo Ohka Kogyo Co., Ltd.
  • 17.16. Tosoh Corporation

LIST OF FIGURES

  • FIGURE 1. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 2. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SHARE, BY KEY PLAYER, 2025
  • FIGURE 3. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET, FPNV POSITIONING MATRIX, 2025
  • FIGURE 4. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 7. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY REGION, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 9. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY GROUP, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 10. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2025 VS 2026 VS 2032 (USD MILLION)
  • FIGURE 11. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, 2018-2032 (USD MILLION)
  • FIGURE 12. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, 2018-2032 (USD MILLION)

LIST OF TABLES

  • TABLE 1. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 2. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 3. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY CONVENTIONAL PAD, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY CONVENTIONAL PAD, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY CONVENTIONAL PAD, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY FIXED ABRASIVE PAD, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY FIXED ABRASIVE PAD, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY FIXED ABRASIVE PAD, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COPPER, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COPPER, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COPPER, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY OXIDE, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY OXIDE, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY OXIDE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TUNGSTEN, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TUNGSTEN, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TUNGSTEN, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY LOGIC DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY LOGIC DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY LOGIC DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY DRAM, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY DRAM, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY DRAM, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY NAND FLASH, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY NAND FLASH, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY NAND FLASH, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY FOUNDRIES, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY FOUNDRIES, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY FOUNDRIES, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY IDMS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY IDMS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY IDMS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY OSATS, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY OSATS, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY OSATS, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY REGION, 2018-2032 (USD MILLION)
  • TABLE 44. AMERICAS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY SUBREGION, 2018-2032 (USD MILLION)
  • TABLE 45. AMERICAS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 46. AMERICAS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 47. AMERICAS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 48. AMERICAS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 49. AMERICAS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 50. NORTH AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 51. NORTH AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 52. NORTH AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 53. NORTH AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 54. NORTH AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 55. NORTH AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 56. LATIN AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 57. LATIN AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 58. LATIN AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 59. LATIN AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 60. LATIN AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 61. LATIN AMERICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 62. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY SUBREGION, 2018-2032 (USD MILLION)
  • TABLE 63. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 64. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 65. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 66. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 67. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 68. EUROPE SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 69. EUROPE SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 70. EUROPE SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 71. EUROPE SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 72. EUROPE SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 73. EUROPE SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 74. MIDDLE EAST SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 75. MIDDLE EAST SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 76. MIDDLE EAST SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 77. MIDDLE EAST SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 78. MIDDLE EAST SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 79. MIDDLE EAST SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 80. AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 81. AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 82. AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 83. AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 84. AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 85. AFRICA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 86. ASIA-PACIFIC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 87. ASIA-PACIFIC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 88. ASIA-PACIFIC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 89. ASIA-PACIFIC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 90. ASIA-PACIFIC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 91. ASIA-PACIFIC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 92. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY GROUP, 2018-2032 (USD MILLION)
  • TABLE 93. ASEAN SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 94. ASEAN SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 95. ASEAN SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 96. ASEAN SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 97. ASEAN SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 98. ASEAN SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 99. GCC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 100. GCC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 101. GCC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 102. GCC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 103. GCC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 104. GCC SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 105. EUROPEAN UNION SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 106. EUROPEAN UNION SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 107. EUROPEAN UNION SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 108. EUROPEAN UNION SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 109. EUROPEAN UNION SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 110. EUROPEAN UNION SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 111. BRICS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 112. BRICS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 113. BRICS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 114. BRICS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 115. BRICS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 116. BRICS SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 117. G7 SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 118. G7 SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 119. G7 SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 120. G7 SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 121. G7 SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 122. G7 SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 123. NATO SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 124. NATO SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 125. NATO SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 126. NATO SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 127. NATO SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 128. NATO SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 129. GLOBAL SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY COUNTRY, 2018-2032 (USD MILLION)
  • TABLE 130. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 131. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 132. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 133. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 134. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 135. UNITED STATES SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)
  • TABLE 136. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, 2018-2032 (USD MILLION)
  • TABLE 137. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY TYPE, 2018-2032 (USD MILLION)
  • TABLE 138. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MATERIAL, 2018-2032 (USD MILLION)
  • TABLE 139. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY APPLICATION, 2018-2032 (USD MILLION)
  • TABLE 140. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY MEMORY DEVICES, 2018-2032 (USD MILLION)
  • TABLE 141. CHINA SEMICONDUCTOR CMP POLISHING PAD MARKET SIZE, BY END USER, 2018-2032 (USD MILLION)