市场调查报告书
商品编码
1450088
2024-2028年全球半导体晶圆抛光研磨设备市场Global Semiconductor Wafer Polishing and Grinding Equipment Market 2024-2028 |
预计2023-2028年半导体晶圆抛光研磨设备市场将成长4.4201亿美元,预测期内复合年增长率为4.06%。
该报告包括对半导体晶圆抛光和研磨设备市场的整体分析、市场规模和预测、趋势、成长动力、挑战以及涵盖约 25 家供应商的供应商分析。
它提供了对当前市场状况、最新趋势和驱动因素以及整体市场环境的最新分析。该市场是由半导体元件的小型化、对新製造工厂的投资增加以及对长期最终用户客户的激励和折扣所推动的。
市场范围 | |
---|---|
基准年 | 2024年 |
结束年份 | 2028年 |
预测期 | 2024-2028 |
成长动力 | 加速度 |
2024年与前一年同期比较 | 3.94% |
复合年增长率 | 4.06% |
增量 | 44201万美元 |
这项研究指出,NEMS 的使用日益增多是推动未来几年半导体晶圆抛光和研磨设备市场成长的关键因素之一。此外,超大规模积体电路的成长和向 3D 结构的过渡将带来巨大的市场需求。
The semiconductor wafer polishing and grinding equipment market is forecasted to grow by USD 442.01 mn during 2023-2028, accelerating at a CAGR of 4.06% during the forecast period. The report on the semiconductor wafer polishing and grinding equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by emergence of miniaturized semiconductor components, growing investment in new fabrication plants, and incentives and discounts for long-term customers of end-users.
Technavio's semiconductor wafer polishing and grinding equipment market is segmented as below:
Market Scope | |
---|---|
Base Year | 2024 |
End Year | 2028 |
Series Year | 2024-2028 |
Growth Momentum | Accelerate |
YOY 2024 | 3.94% |
CAGR | 4.06% |
Incremental Value | $442.01mn |
By Application
By End-user
By Geographical Landscape
This study identifies the increasing use of NEMS as one of the prime reasons driving the semiconductor wafer polishing and grinding equipment market growth during the next few years. Also, growth of ULSI and transition toward 3D structures will lead to sizable demand in the market.
The report on the semiconductor wafer polishing and grinding equipment market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor wafer polishing and grinding equipment market vendors that include ALLIED HIGH TECH PRODUCTS, INC, Amtech Systems Inc., Applied Materials Inc., ASM International NV, Axus Technology, DISCO Corp., G and N GmbH, Gigamat Technologies Inc, KLA Corp., Lapmaster Wolters, Logitech Ltd., Okamoto Corp, Revasum Inc., S Cubed, S3 Alliance., Tokyo Electron Ltd., TOKYO SEIMITSU CO. LTD, ULTRA TEC Manufacturing Inc., UNITED GRINDING North America, Inc., and Ebara Corp.. Also, the semiconductor wafer polishing and grinding equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
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