查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1818069

2032年半导体晶圆抛光和研磨设备市场预测：按设备类型、晶圆尺寸、技术节点、半导体类型、应用和地区的全球分析

Semiconductor Wafer Polishing and Grinding Equipment Market Forecasts to 2032 - Global Analysis By Equipment Type, Wafer Size, Technology Node, Semiconductor Type, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的数据，全球半导体晶圆抛光和研磨设备市场预计在 2025 年达到 29.9432 亿美元，到 2032 年将达到 47.1464 亿美元，预测期内的复合年增长率为 6.7%。

半导体晶圆抛光和研磨设备由先进的工具组成，旨在在半导体製造过程中精炼晶圆表面。抛光製程可去除多余的材料并实现均匀的厚度，而抛光过程可确保微电子技术所必需的超光滑、无缺陷的表面。这些设备在提高晶圆可靠性、提高生产效率和实现精确的电路图形化发挥关键作用。确保表面平整度和均匀性有助于确保整个製造链中精确的微影术、蚀刻和整体半导体装置的性能。

家电需求增加

智慧型装置、穿戴式装置和物联网家用电器的普及，推动了对高精度、高效能先进半导体晶圆的需求。随着消费者对更薄、更快、更节能电子产品的期望不断提升，製造商正在投资尖端抛光和研磨设备，以满足严格的设计规范。 CMP（化学机械抛光）和超精密研磨系统等技术已成为奈米级表面均匀性的关键。新兴趋势包括整合基于人工智慧的製程控制和即时缺陷检测，以提高产量比率和产量。 3D封装和晶片架构等关键技术的发展进一步推动了对晶圆级精加工设备的需求。

维护复杂性

维护半导体晶圆抛光和研磨设备需要复杂的校准、频繁的零件更换以及专业的技术知识。晶圆精加工製程所需的精度意味着即使是轻微的错位也可能导致代价高昂的缺陷和生产延误。多区域压力控制和自动化浆料管理等技术使日常维护更加复杂。预测性维护和远距离诊断等新兴趋势有助于减少停机时间，但需要大量的前期投资。关键挑战包括与旧有系统的兼容性以及持续的操作员培训。这些运作负担通常会阻碍小型晶圆厂和代工厂大规模采用先进设备。

汽车半导体需求不断成长

晶圆抛光和研磨设备对于製造符合汽车级规格的功率元件、感测器和微控制器至关重要。碳化硅 (SiC) 和氮化镓 (GaN) 晶圆加工等技术需要专门的化学机械抛光 (CMP) 和抛光系统来确保热稳定性和电气性能。新兴趋势包括将人工智慧 (AI) 融入製程优化，以及采用化合物半导体的混合抛光技术。电动车平台的标准化和高级驾驶辅助系统 (ADAS) 的扩展等关键发展正在加速汽车工厂的设备升级。这种转变为精密晶圆加工解决方案提供了一条利润丰厚的成长路径。

技术快速淘汰

随着节点尺寸的缩小和新材料的涌现，旧有系统难以满足不断变化的效能和整合需求。混合键结、背面减薄和先进的CMP製程等技术要求设备持续升级。异构整合和基于晶片集的设计等新兴趋势正在重塑晶圆精加工需求。关键发展包括2.5D/3D封装和量子计算原型设计的兴起，这些技术需要超精密的表面处理。这种快速发展增加了资本风险，并缩短了设备製造商和用户的投资回报週期。

COVID-19的影响

疫情扰乱了全球半导体供应链，导致设备交付放缓，工厂扩张受阻。然而，远距办公、数位基础设施和医疗用电子设备的激增，再次引发了对晶圆加工产能的迫切需求。自动化抛光系统和远端监控工具等技术已广泛应用，以支援保持社交距离的工作。新兴趋势包括增加对国内工厂的投资以及关键半导体生产的回流。政府推出的晶片製造奖励策略和设备零件的战略储备等关键倡议，有助于稳定市场。

化学机械抛光 (CMP) 工具市场预计将在预测期内成为最大的市场

预计化学机械抛光 (CMP) 工具领域将在预测期内占据最大的市场份额，这得益于其在实现先进半导体元件多层平面化方面的关键作用。 CMP 技术对于 FinFET、3D NAND 和超薄几何逻辑晶片的製造至关重要。新兴趋势包括浆料优化、增强的端点检测以及与人工智慧主导的流程分析的整合。混合 CMP 系统和环保耗材等关键发展正在重塑设备设计和营运效率。多重图形化和先进微影术的日益复杂化进一步提升了 CMP 在晶圆製造中的重要性。因此，CMP 工具将继续占据抛光和研磨设备市场的最大份额。

预计预测期内铸造部分将以最高的复合年增长率成长。

预计在预测期内，晶圆代工领域将实现最高成长率，这得益于半导体製造外包需求的激增和先进节点能力的提升。这些工厂正在迅速采用下一代抛光和研磨工具，以支援逻辑、记忆体和混合讯号装置的大量生产。晶圆层次电子构装、背面抛光和用于先进互连的化学机械抛光 (CMP) 等技术正在成为尖端晶圆代工厂的标准。新兴趋势包括基于人工智慧的产量比率优化、模组化工具配置和即时缺陷映射。 5nm 和 3nm 製程节点的扩展以及与无厂半导体公司的策略合作伙伴关係等关键发展正在刺激设备升级。

比最大的地区

预计亚太地区将在预测期内占据最大的市场份额，这得益于中国大陆、台湾、韩国和日本强大的半导体製造生态系统。该地区的主导地位得益于积极的工厂扩张、政府激励措施以及消费性电子和汽车行业的强劲需求。先进的化学机械抛光 (CMP)、晶圆减薄和自动抛光系统等技术正在该地区的工厂中广泛应用。新兴趋势包括供应链的垂直整合和智慧製造平台的采用。中国大陆致力于实现半导体自给自足以及台湾在先进节点领域的领先地位等关键发展正在塑造该地区的设备需求。

复合年增长率最高的地区

预计北美将在预测期内实现最高的复合年增长率，这得益于其国内半导体製造和创新中心的战略投资。该地区越来越多地采用抛光和研磨工具来支援先进封装、人工智慧晶片和国防半导体。用于异构整合的化学机械抛光 (CMP)、用于射频设备的晶圆级抛光以及支援人工智慧的製程控制等技术正日益普及。新兴趋势包括工厂回流倡议、晶圆厂现代化以及公私研发合作。 《晶片法案》(CHIPS Act) 的资助、晶圆代工厂产能的扩张以及与设备供应商的合作等关键发展正在推动成长。

免费客製化服务

此报告的订阅者可以选择以下免费自订选项之一：

  • 公司简介
    • 全面分析其他市场参与者（最多 3 家公司）
    • 主要企业的SWOT分析（最多3家公司）
  • 区域细分
    • 根据客户兴趣对主要国家进行的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 数据分析
    • 数据检验
    • 研究途径
  • 研究材料
    • 主要研究资料
    • 次级研究资讯来源
    • 先决条件

第三章市场走势分析

  • 驱动程式
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 新兴市场
  • COVID-19的影响

第四章 波特五力分析

  • 供应商的议价能力
  • 买方的议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争对手之间的竞争

5. 全球半导体晶圆抛光研磨设备市场（依设备类型）

  • 晶圆研磨机
  • 晶圆磨床
  • 化学机械抛光 (CMP) 工具
  • 整合研磨机和抛光机系统
  • 边缘研磨和斜角抛光设备

6. 全球半导体晶圆抛光研磨设备市场（依晶圆尺寸）

  • 150毫米或更小
  • 200 mm
  • 300 mm
  • 450毫米或以上

7. 全球半导体晶圆抛光研磨设备市场（依技术节点）

  • 先进节点（10nm及以下）
  • 传统节点（10 奈米以上）

8. 全球半导体晶圆抛光和研磨设备市场（以半导体类型类型）

  • 记忆体（DRAM、NAND）
  • 逻辑和 SoC
  • 类比和混合讯号
  • 功率元件

9. 全球半导体晶圆抛光研磨设备市场（依应用）

  • 晶圆代工厂
  • 层间绝缘膜
  • 整合设备製造商 (IDM)
  • 先进封装设施
  • 记忆体製造商
  • 其他的

第十章全球半导体晶圆抛光和研磨设备市场（按地区）

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲地区

第十一章 重大进展

  • 协议、伙伴关係、合作和合资企业
  • 收购与合併
  • 新产品发布
  • 业务扩展
  • 其他关键策略

第十二章 公司概况

  • DISCO Corporation
  • Lapmaster Wolters GmbH
  • Tokyo Seimitsu Co., Ltd.
  • Entrepix, Inc.
  • Applied Materials, Inc.
  • Koyo Machinery Co., Ltd.
  • Ebara Corporation
  • Hantop Intelligence Tech Co., Ltd.
  • Revasum, Inc.
  • G&N Genauigkeits Maschinenbau Nurnberg GmbH
  • Komatsu NTC Ltd.
  • Logitech Ltd.
  • Okamoto Machine Tool Works Co., Ltd.
  • Pureon AG
  • CMP-Tec Inc.
Product Code: SMRC31032

According to Stratistics MRC, the Global Semiconductor Wafer Polishing and Grinding Equipment Market is accounted for $2994.32 million in 2025 and is expected to reach $4714.64 million by 2032 growing at a CAGR of 6.7% during the forecast period. Semiconductor wafer polishing and grinding equipment comprises advanced tools designed to refine wafer surfaces during semiconductor fabrication. Grinding processes eliminate surplus material and achieve consistent thickness, while polishing ensures ultra-smooth, defect-free finishes essential for microelectronics. These machines play a crucial role in enhancing wafer reliability, boosting production efficiency, and enabling accurate circuit patterning. By ensuring surface flatness and uniformity, they support precise lithography, etching, and overall semiconductor device performance in the manufacturing chain.

Market Dynamics:

Driver:

Rising demand for consumer electronics

The proliferation of smart devices, wearables, and IoT-enabled appliances is intensifying the need for advanced semiconductor wafers with high precision and performance. As consumer expectations shift toward thinner, faster, and more energy-efficient electronics, manufacturers are investing in cutting-edge polishing and grinding equipment to meet stringent design specifications. Technologies such as CMP (Chemical Mechanical Polishing) and ultra-fine grinding systems are becoming essential for achieving nanoscale surface uniformity. Emerging trends include integration of AI-based process control and real-time defect detection to enhance yield and throughput. Key developments like 3D packaging and chiplet architectures are further driving demand for wafer-level finishing tools.

Restraint:

Complexity in maintenance

Maintaining semiconductor wafer polishing and grinding equipment involves intricate calibration, frequent part replacements, and specialized technical expertise. The precision required in wafer finishing processes means even minor misalignments can lead to costly defects and production delays. Technologies such as multi-zone pressure control and automated slurry management add layers of complexity to routine servicing. Emerging trends like predictive maintenance and remote diagnostics are helping mitigate downtime but require significant upfront investment. Key challenges include compatibility with legacy systems and the need for continuous operator training. These operational burdens often deter smaller fabs and foundries from adopting advanced equipment at scale.

Opportunity:

Rising demand for automotive semiconductors

Wafer polishing and grinding tools are critical for producing power devices, sensors, and microcontrollers that meet automotive-grade standards. Technologies such as SiC and GaN wafer processing require specialized CMP and grinding systems to ensure thermal stability and electrical performance. Emerging trends include integration of AI in process optimization and adoption of hybrid polishing techniques for compound semiconductors. Key developments like EV platform standardization and ADAS expansion are accelerating equipment upgrades across automotive fabs. This transformation presents a lucrative growth avenue for precision wafer processing solutions.

Threat:

Rapid technological obsolescence

As node sizes shrink and new materials emerge, legacy systems struggle to meet evolving performance and integration requirements. Technologies such as hybrid bonding, backside thinning, and advanced CMP formulations demand continuous equipment upgrades. Emerging trends like heterogeneous integration and chiplet-based designs are reshaping wafer finishing needs. Key developments include the rise of 2.5D/3D packaging and quantum computing prototypes, which require ultra-precise surface preparation. This rapid evolution increases capital risk and shortens ROI timelines for equipment manufacturers and users alike.

Covid-19 Impact

The pandemic disrupted global semiconductor supply chains, delaying equipment deliveries and halting fab expansions. However, the surge in remote work, digital infrastructure, and medical electronics created renewed urgency for wafer processing capacity. Technologies such as automated polishing systems and remote monitoring tools gained traction to support socially distanced operations. Emerging trends include increased investment in domestic fabs and reshoring of critical semiconductor production. Key developments like government-backed stimulus for chip manufacturing and strategic stockpiling of equipment components helped stabilize the market.

The chemical mechanical polishing (CMP) tools segment is expected to be the largest during the forecast period

The chemical mechanical polishing (CMP) tools segment is expected to account for the largest market share during the forecast period, due to its critical role in achieving planarization across multiple layers of advanced semiconductor devices. CMP technologies are indispensable for fabricating FinFETs, 3D NAND, and logic chips with ultra-thin geometries. Emerging trends include slurry optimization, endpoint detection enhancements, and integration with AI-driven process analytics. Key developments such as hybrid CMP systems and eco-friendly consumables are reshaping tool design and operational efficiency. The growing complexity of multi-patterning and advanced lithography is further reinforcing CMP's centrality in wafer fabrication. As a result, CMP tools continue to command the largest share of the polishing and grinding equipment market.

The foundries segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the foundries segment is predicted to witness the highest growth rate, driven by surging demand for outsourced semiconductor manufacturing and advanced node capabilities. These facilities are rapidly adopting next-gen polishing and grinding tools to support high-volume production of logic, memory, and mixed-signal devices. Technologies such as wafer-level packaging, backside grinding, and CMP for advanced interconnects are becoming standard in leading-edge foundries. Emerging trends include AI-based yield optimization, modular tool configurations, and real-time defect mapping. Key developments like the expansion of 5nm and 3nm process nodes and strategic partnerships with fabless firms are fueling equipment upgrades.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by robust semiconductor manufacturing ecosystems in China, Taiwan, South Korea, and Japan. The region's dominance is underpinned by aggressive fab expansions, government incentives, and strong demand from consumer electronics and automotive sectors. Technologies such as advanced CMP, wafer thinning and automated grinding systems are widely deployed across regional fabs. Emerging trends include vertical integration of supply chains and adoption of smart manufacturing platforms. Key developments like China's push for semiconductor self-sufficiency and Taiwan's leadership in advanced nodes are shaping regional equipment demand.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strategic investments in domestic semiconductor manufacturing and innovation hubs. The region is witnessing increased deployment of polishing and grinding tools to support advanced packaging, AI chips, and defense-grade semiconductors. Technologies such as CMP for heterogeneous integration, wafer-level grinding for RF devices, and AI-enabled process control are gaining traction. Emerging trends include reshoring initiatives, fab modernization, and public-private R&D collaborations. Key developments like CHIPS Act funding, expansion of foundry capacity, and partnerships with equipment vendors are accelerating growth.

Key players in the market

Some of the key players profiled in the Semiconductor Wafer Polishing and Grinding Equipment Market include DISCO Corporation, Lapmaster Wolters GmbH, Tokyo Seimitsu Co., Ltd., Entrepix, Inc., Applied Materials, Inc., Koyo Machinery Co., Ltd., Ebara Corporation, Hantop Intelligence Tech Co., Ltd., Revasum, Inc., G&N Genauigkeits Maschinenbau Nurnberg GmbH, Komatsu NTC Ltd., Logitech Ltd., Okamoto Machine Tool Works Co., Ltd., Pureon AG, and CMP-Tec Inc.

Key Developments:

In August 2025, DISCO announced it has been selected by Watson Farley & Williams (WFW), a prominent Global 200 law firm, as the firm's strategic partner for ediscovery technology and services to support its growing international disputes practice and client base.

In January 2024, KOYO Machinery USA merges with JTEKT Machinery Americas. Koyo Machinery USA will be integrated into JTEKT Machinery's range of products, services, and customer support operations. This merger is an extension of JTEKT Corporation's global brand unification initiative launched in 2021 which is designed to strategically reshape the company for increased efficiency and greater synergy between group companies.

Equipment Types Covered:

  • Wafer Grinding Machines
  • Wafer Polishing Machines
  • Chemical Mechanical Polishing (CMP) Tools
  • Integrated Grinder-Polisher Systems
  • Edge-Grinding and Bevel-Polishing Equipment

Wafer Sizes Covered:

  • <=150 mm
  • 200 mm
  • 300 mm
  • 450 mm and Above

Technology Nodes Covered:

  • Advanced Nodes (<=10 nm)
  • Legacy Nodes (>10 nm)

Semiconductor Types Covered:

  • Memory (DRAM, NAND)
  • Logic & SoC
  • Analog & Mixed Signal
  • Power Devices

Applications Covered:

  • Foundries
  • Interlevel Dielectric Materials
  • Integrated Device Manufacturers (IDMs)
  • Advanced Packaging Facilities
  • Memory Manufacturers
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Equipment Type

  • 5.1 Introduction
  • 5.2 Wafer Grinding Machines
  • 5.3 Wafer Polishing Machines
  • 5.4 Chemical Mechanical Polishing (CMP) Tools
  • 5.5 Integrated Grinder-Polisher Systems
  • 5.6 Edge-Grinding and Bevel-Polishing Equipment

6 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Wafer Size

  • 6.1 Introduction
  • 6.2 <=150 mm
  • 6.3 200 mm
  • 6.4 300 mm
  • 6.5 450 mm and Above

7 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Technology Node

  • 7.1 Introduction
  • 7.2 Advanced Nodes (<=10 nm)
  • 7.3 Legacy Nodes (>10 nm)

8 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Semiconductor Type

  • 8.1 Introduction
  • 8.2 Memory (DRAM, NAND)
  • 8.3 Logic & SoC
  • 8.4 Analog & Mixed Signal
  • 8.5 Power Devices

9 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Application

  • 9.1 Introduction
  • 9.2 Foundries
  • 9.3 Interlevel Dielectric Materials
  • 9.4 Integrated Device Manufacturers (IDMs)
  • 9.5 Advanced Packaging Facilities
  • 9.6 Memory Manufacturers
  • 9.7 Other Applications

10 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 DISCO Corporation
  • 12.2 Lapmaster Wolters GmbH
  • 12.3 Tokyo Seimitsu Co., Ltd.
  • 12.4 Entrepix, Inc.
  • 12.5 Applied Materials, Inc.
  • 12.6 Koyo Machinery Co., Ltd.
  • 12.7 Ebara Corporation
  • 12.8 Hantop Intelligence Tech Co., Ltd.
  • 12.9 Revasum, Inc.
  • 12.10 G&N Genauigkeits Maschinenbau Nurnberg GmbH
  • 12.11 Komatsu NTC Ltd.
  • 12.12 Logitech Ltd.
  • 12.13 Okamoto Machine Tool Works Co., Ltd.
  • 12.14 Pureon AG
  • 12.15 CMP-Tec Inc.

List of Tables

  • Table 1 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Equipment Type (2024-2032) ($MN)
  • Table 3 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Grinding Machines (2024-2032) ($MN)
  • Table 4 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Polishing Machines (2024-2032) ($MN)
  • Table 5 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Chemical Mechanical Polishing (CMP) Tools (2024-2032) ($MN)
  • Table 6 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Integrated Grinder-Polisher Systems (2024-2032) ($MN)
  • Table 7 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Edge-Grinding and Bevel-Polishing Equipment (2024-2032) ($MN)
  • Table 8 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Size (2024-2032) ($MN)
  • Table 9 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By <=150 mm (2024-2032) ($MN)
  • Table 10 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 200 mm (2024-2032) ($MN)
  • Table 11 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 300 mm (2024-2032) ($MN)
  • Table 12 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 450 mm and Above (2024-2032) ($MN)
  • Table 13 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Technology Node (2024-2032) ($MN)
  • Table 14 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Advanced Nodes (<=10 nm) (2024-2032) ($MN)
  • Table 15 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Legacy Nodes (>10 nm) (2024-2032) ($MN)
  • Table 16 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Semiconductor Type (2024-2032) ($MN)
  • Table 17 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Memory (DRAM, NAND) (2024-2032) ($MN)
  • Table 18 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Logic & SoC (2024-2032) ($MN)
  • Table 19 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Analog & Mixed Signal (2024-2032) ($MN)
  • Table 20 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Power Devices (2024-2032) ($MN)
  • Table 21 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Application (2024-2032) ($MN)
  • Table 22 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Foundries (2024-2032) ($MN)
  • Table 23 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Interlevel Dielectric Materials (2024-2032) ($MN)
  • Table 24 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
  • Table 25 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Advanced Packaging Facilities (2024-2032) ($MN)
  • Table 26 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Memory Manufacturers (2024-2032) ($MN)
  • Table 27 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Other Applications (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.