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市场调查报告书
商品编码
1747741

全球半导体抛光垫片市场

Semiconductor Polishing Pads
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 164 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球半导体抛光垫片市场规模将达到 12 亿美元

全球半导体抛光垫片市场规模预计在2024年为8.516亿美元，预计到2030年将达到12亿美元，在2024-2030年的分析期内，复合年增长率为5.8%。作为本报告分析的细分市场之一，硬质CMP垫片预计将实现6.7%的复合年增长率，并在分析期结束时达到7.971亿美元。软质CMP垫片细分市场的复合年增长率预计在分析期间为4.3%。

美国市场规模估计为 2.239 亿美元，中国市场预期复合年增长率为 5.6%

美国半导体抛光垫片市场规模预计2024年达到2.239亿美元。预计到2030年，作为世界第二大经济体的中国市场规模将达到1.91亿美元，在2024-2030年的分析期内，复合年增长率为5.6%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为5.3%和4.9%。在欧洲，预计德国市场的复合年增长率为4.6%。

全球「半导体抛光垫片」市场—主要趋势与驱动因素摘要

为什么抛光垫片是尖端表面精加工的关键？

半导体抛光垫片是化学机械平坦化 (CMP) 製程中的关键耗材。随着对更小、更快、更强大的晶片的需求不断增长，对完美晶圆表面形貌的要求也空前高涨。抛光垫片垫片与研磨液和修整剂搭配使用，去除多余的材料，而不会刮伤或污染晶圆。它们的性能在 FEOL 和 BEOL 製程中都至关重要，因为它直接影响晶粒产量比率、线宽控制和平坦化精度。

多区域和特殊垫片重新定义精度和寿命？

抛光垫片正在快速发展，以满足新装置架构的细微要求。先进的CMP製程如今采用多垫片和凹槽垫片，以实现更佳的浆料分布、更稳定的去除速率和更卓越的终点检测。微孔和奈米结构垫片表面的引入，旨在改善表面接触，且不会引入缺陷。对于3D NAND和先进的互连技术，垫片必须能够适应更深的层级和多样化的物料输送，包括钨、​​铜和电介质复合材料。这些应用要求垫片具有较长的使用寿命，并且在高晶圆数量下也能保持稳定的性能。此外，垫片的设计必须针对单晶圆CMP和批量工具进行定制，并具有不同的下压力分布。随着抛光製程的选择性和应用针对性越来越强，垫片市场正朝着高性能、低污染和製程优化的产品方向发展。

永续性推动下一波垫片创新？

环境问题和总拥有成本 (TCO) 压力正在推动晶圆厂寻求更永续、更持久的抛光垫片。供应商正在开发需要更少浆料、提供更长修整间隔并降低整体製程成本的抛光垫片。可回收的垫片材料和废弃物减少系统也在开发中。抛光盘无需过度抛光即可延长垫片表面的均匀性，这正在成为专注于降低成本和产量比率的晶圆厂的标准配置。使用 RFID 或光学扫描的整合式垫片监控系统使晶圆厂能够即时追踪垫片的磨损并优化使用週期。这些创新不仅可以减少对环境的影响，还可以减少因过早更换垫片而导致的营运中断。随着晶圆厂推动绿色製造并提高利润率，抛光垫片设计正在成为永续半导体製造的关键槓桿。

推动全球半导体抛光垫片市场成长的因素是什么？

全球半导体抛光垫片市场的成长受到多种因素的推动，包括节点缩小、3D 架构和晶圆吞吐量的提高。随着晶片製造商向 3nm 及以下发展，平坦化在逻辑、记忆体和混合讯号设备上变得更加关键。 3D NAND 和先进封装技术的爆炸性增长透过增加每个晶圆的 CMP 步骤数来推动对高性能垫片的需求。中国大陆、韩国、美国和台湾的工厂快速扩张导致垫片消费量大幅增加。同时，CMP 在化合物半导体和功率 IC 製造中的应用日益广泛，正在将市场扩展到新的领域。随着工厂对每个晶圆的成本、製程产量比率和环境合规性的日益重视，它们青睐具有耐用性、生态浆体相容性和精确製程控制的垫片。拥有成熟的垫片-浆体协同效应和长期OEM关係的供应商尤其适合引领市场。

部分

类型（硬式CMP垫片、软式CMP垫片）；应用（300M晶圆、200M晶圆、其他应用）

受访公司范例（值得关注的32家公司）

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel（a DuPont company）
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口（成品和原始OEM）来预测其竞争地位的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括人为提高销货成本、盈利下降、供应链重组以及其他微观和宏观市场动态。

全球产业分析师密切关注来自全球顶尖首席经济学家（14,949位）、智库（62家）以及贸易和产业协会（171家）的专家的意见，以评估其对生态系统的影响并应对新的市场现实。我们追踪了来自每个主要国家的专家和经济学家对关税及其对本国影响的看法。

全球产业分析师预计，这场动盪将在未来2-3个月内逐渐平息，新的世界秩序将更加清晰地建立。全球产业分析师正在即时追踪这些事态发展。

2025年4月：谈判阶段

在4月的报告中，我们将探讨关税对全球整体市场的影响，并提供区域市场调整。我们的预测是基于历史数据和不断变化的市场影响因素。

2025年7月：最终关税调整

在各国宣布最终重置后，客户将在 7 月收到免费更新，最终更新将包含明确的关税影响分析。

相互和双边贸易及关税影响分析：

美国<>中国<>墨西哥<>加拿大<>欧盟<>日本<>印度<>其他176个国家

领先的产业经济学家：全球产业分析师知识库追踪了 14,949 位经济学家，其中包括来自民族国家、智库、贸易和产业协会、大型企业以及各领域专家的最具影响力的首席经济学家，他们共用了这场前所未有的全球经济状况模式转移的影响。我们超过 16,491 份报告大多遵循基于里程碑的两阶段发布计划。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他地区

第四章 竞赛

简介目录
Product Code: MCP35727

Global Semiconductor Polishing Pads Market to Reach US$1.2 Billion by 2030

The global market for Semiconductor Polishing Pads estimated at US$851.6 Million in the year 2024, is expected to reach US$1.2 Billion by 2030, growing at a CAGR of 5.8% over the analysis period 2024-2030. Hard CMP Pads, one of the segments analyzed in the report, is expected to record a 6.7% CAGR and reach US$797.1 Million by the end of the analysis period. Growth in the Soft CMP Pads segment is estimated at 4.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$223.9 Million While China is Forecast to Grow at 5.6% CAGR

The Semiconductor Polishing Pads market in the U.S. is estimated at US$223.9 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$191.0 Million by the year 2030 trailing a CAGR of 5.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.3% and 4.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.6% CAGR.

Global "Semiconductor Polishing Pads" Market - Key Trends & Drivers Summarized

Why Are Polishing Pads at the Heart of Advanced Chip Surface Finishing?

Semiconductor polishing pads are crucial consumables used in Chemical Mechanical Planarization (CMP), a process that ensures ultra-flat wafer surfaces before lithography and metal layer deposition. With rising demand for smaller, faster, and more powerful chips, the need for flawless wafer topography has never been greater. Polishing pads-typically made from polyurethane or composite materials-must balance surface uniformity, durability, and chemical compatibility across dozens of CMP steps per wafer. In logic, memory, and power semiconductors alike, even a few nanometers of surface deviation can degrade device performance. Pads must work in tandem with slurries and conditioners to remove excess material without scratching or contaminating the wafer. Their performance directly impacts die yield, line-width control, and planarization accuracy, making them indispensable across both FEOL and BEOL processes.

Are Multi-Zone and Specialty Pads Redefining Precision and Lifespan?

Polishing pads are evolving rapidly to meet the nuanced requirements of newer device architectures. Advanced CMP processes now use multi-zone or grooved pads that provide better slurry distribution, consistent removal rates, and superior endpoint detection. Micro-porous and nanostructured pad surfaces are being introduced to improve surface contact without generating defects. In 3D NAND and advanced interconnects, pads must handle deeper layers and varied materials like tungsten, copper, or dielectric composites. These applications require longer pad life and stable performance over high wafer counts. Additionally, pad design is being customized to suit single-wafer CMP tools and batch tools with different downforce profiles. As polishing becomes more selective and application-specific, the pad market is witnessing a shift toward high-performance, low-contamination, and process-optimized products.

Can Sustainability and Process Efficiency Drive the Next Wave of Pad Innovation?

Environmental considerations and total cost of ownership (TCO) pressures are pushing fabs to seek more sustainable and longer-lasting polishing pads. Vendors are developing pads that require less slurry and offer longer dressing intervals, reducing overall process costs. Recyclable pad materials and waste-reduction systems are also in development. Conditioning disks that prolong pad surface consistency without aggressive abrasion are becoming standard in fabs focused on cost savings and yield enhancement. Integrated pad monitoring systems-using RFID or optical scanning-allow fabs to track pad wear in real time and optimize usage cycles. These innovations not only reduce environmental impact but also lower operational interruptions caused by premature pad replacement. As fabs push for green manufacturing alongside better margins, polishing pad design is becoming a key lever in sustainable semiconductor fabrication.

What’s Driving Growth in the Global Semiconductor Polishing Pad Market?

The growth in the global semiconductor polishing pads market is driven by several factors including node shrinkage, 3D architectures, and higher wafer throughput. As chipmakers move to 3nm and beyond, planarization becomes more critical across logic, memory, and mixed-signal devices. The explosive growth of 3D NAND and advanced packaging technologies is increasing the number of CMP steps per wafer, amplifying demand for high-performance pads. Rapid fab expansions across China, South Korea, the U.S., and Taiwan are scaling up pad consumption volumes significantly. At the same time, increasing adoption of CMP in compound semiconductor and power IC production is expanding the market into new verticals. The growing emphasis on cost per wafer, process yield, and environmental compliance is driving fabs to favor pads that offer durability, compatibility with eco-slurries, and precise process control. Vendors with proven pad-slurry synergy and long-standing OEM relationships are particularly well-positioned for market leadership.

SCOPE OF STUDY:

The report analyzes the Semiconductor Polishing Pads market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Hard CMP Pads, Soft CMP Pads); Application (300M Wafer, 200Mm Wafer, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 32 Featured) -

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel (a DuPont company)
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Polishing Pads - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased CMP Complexity in Advanced Nodes Drives Innovation in Pad Material Design
    • Growth in 3D NAND and FinFET Architectures Spurs Demand for High-Performance Polishing Pads
    • Rising Focus on Surface Defect Reduction Strengthens Business Case for Next-Gen Pads
    • Integration with Low-k and Ultra Low-k Materials Requires Customized Pad Properties
    • Advanced Packaging Trends Propel Demand for Planarization Pads in Wafer-Level Processing
    • Push for Cost-Effective Consumables Expands Market for Long-Life, Reconditionable Pads
    • Eco-Friendly and Low Particle Generation Pads Gain Traction Amid Regulatory Pressure
    • CMP Process Optimization in Smart Fabs Throws Spotlight on Pad-Wafer Interaction Models
    • Increase in CMP Tool Installations Worldwide Drives Volume Growth in Pad Consumption
    • Collaborative Development Between Pad and Slurry Vendors Enhances Process Synergies
    • Growing Use in MEMS and Sensor Wafer Fabrication Opens New Market Frontiers
    • R&D in Nanocomposite Pads Expands Performance Capabilities in Ultrafine Planarization
    • Global Supply Chain Diversification Creates New Opportunities for Regional Pad Manufacturers
    • AI and Machine Learning Integration in CMP Tools Spurs Demand for Predictable Pad Behavior
    • Emergence of Advanced Interconnect Materials Propels Innovation in Application-Specific Pads
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Polishing Pads Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Hard CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Soft CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for 300M Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for 200Mm Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 20: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 21: USA Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: USA 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 23: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: Canada Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: Canada 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Japan Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Japan 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: China 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 41: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe Historic Review for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: Europe 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 53: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: France Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: France 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 56: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 59: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Germany Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: Germany 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 65: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Italy Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Italy 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 71: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: UK Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: UK 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 74: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 77: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Rest of Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 83: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 89: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Rest of World Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION