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市场调查报告书
商品编码
1672644

3D IC 市场按最终用途领域、基板类型、製造流程、产品类型和地区划分 - 市场规模、份额、展望、机会分析，2020-2027 年

3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027
出版日期: | 出版商: Coherent Market Insights | 英文 140 Pages | 商品交期: 2-3个工作天内

价格
简介目录

预计2025年全球3D IC市场规模为198.4亿美元，2032年将达到736.6亿美元，2025年至2032年的年复合成长率(CAGR)为20.6%。

报告范围 报告详细信息
基准年 2024 2025 年市场规模 198.4亿美元
效能资料 从 2020 年到 2024 年 预测期 2025 至 2032 年
预测期：2025-2032年复合年增长率： 20.60% 2032 年价值预测 736.6亿美元
图：2025 年各地区 3D IC市场占有率（%）
3D IC 市场-IMG1

随着对更紧凑、更高性能电子设备的需求不断增加，全球 3D IC 市场正在经历强劲成长。 3D IC，又称3D体电路，是指将两个或多个IC晶片垂直组装堆迭在一起，并透过硅通孔（TSV）垂直连接，以减少布线长度，提高讯号传播速度。透过将许多组件整合到小体积中，设备可以变得更小。 3D IC 技术透过将硅片堆迭并整合到单一包装中来最大限度地提高晶片晶粒，有助于降低晶片成本。记忆体、图形、处理器和无线电电子设备等各种组件可以放置在单一模组中。 3D IC 的高频宽和低功耗特性正在推动各种应用的需求，包括家用电子电器、医疗设备和汽车产业。

市场动态：

全球 3D IC 市场受到高性能可携式消费性电子产品日益增长的需求所推动。对于外形规格小巧、功能增强的设备的需求推动了 3D IC 的需求。然而，生产 3D IC 的高製造成本对其广泛应用构成了挑战。设计和製造过程的复杂性增加了製造成本。商业机会在于自动驾驶汽车、扩增实境和虚拟实境设备中 3D IC 的新兴应用。使用 3D IC 技术整合逻辑晶片、记忆体和感测器组件有助于实现汽车中的高级驾驶辅助、导航和资讯娱乐服务。 3D IC 支援更高的频宽和更低的功耗，因此它们将更多地被用在对图形和处理要求较高的电池供电设备中。透过新材料和设计技术来降低製造成本的努力将进一步有助于解决这些障碍。

本研究的主要特点

  • 本报告对全球 3D IC 市场进行了详细分析，并以 2024 年为基准年，给出了预测期（2025-2032 年）的市场规模和年复合成长率（CAGR%）。
  • 它还强调了各个领域的潜在商机并说明了该市场的有吸引力的投资提案矩阵。
  • 它还提供了对市场驱动因素、限制因素、机会、新产品发布和核准、市场趋势、区域前景以及主要企业采用的竞争策略的重要见解。
  • 全球 3D IC 市场的主要企业是根据公司亮点、产品系列、关键亮点、财务表现和策略等参数进行的分析。
  • 本报告的见解将使负责人和企业经营团队能够就未来产品发布、新兴趋势、市场扩张和行销策略做出明智的决策。
  • 本研究报告针对该产业的各个相关人员，包括投资者、供应商、产品製造商、经销商、新进业者和财务分析师。
  • 相关人员可以透过用于分析全球 3D IC 市场的各种策略矩阵更轻鬆地做出决策。

目录

第一章 调查目的与前提条件

  • 研究目标
  • 先决条件
  • 简称

第二章 市场展望

  • 报告描述
    • 市场定义和范围
  • 执行摘要
  • Coherent Opportunity Map（COM）

第三章市场动态、法规与趋势分析

  • 市场动态
    • 驱动程式
    • 限制因素
    • 市场机会
  • 监管情景
  • 产业趋势
  • 合併和收购
  • 新系统推出/核准

第 4 章 COVID-19 疫情对 3D IC 市场的影响

  • 各地区的短期和长期影响
    • 北美洲
    • 欧洲
    • 亚太地区
    • 拉丁美洲
    • 中东和非洲

5. 2018 年至 2028 年全球 3D IC 市场依最终用途划分

  • 家电
  • 资讯和通讯技术
  • 交通运输（汽车和航太）
  • 军队
  • 其他（生物医学应用/研究与发展）

6. 2018 年至 2028 年全球 3D IC 市场依基板类型划分

  • 绝缘体上硅 (SOI)
  • 块状硅

7. 2018 年至 2028 年按製造流程分類的全球 3D IC 市场

  • 梁结晶
  • 晶圆键合技术
  • 硅外延生长
  • 固相结晶

8. 2018 年至 2028 年全球 3D IC 市场（依製程划分）

  • MEMS 和感测器
  • RF SiP
  • 光电子与成像
  • 记忆体（3D 堆迭）
  • 逻辑 (3D SIP/SOC)
  • HB LED

第 9 章。 2018 年至 2028 年全球 3D IC 市场（按地区）

  • 北美洲
  • 欧洲
  • 亚太地区
  • 拉丁美洲
  • 中东和非洲

第十章 竞争格局

  • 公司简介
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • MonolithIC 3D Inc.
    • XILINX, Inc.
    • Elpida Memory, Inc.
    • （Micron Technology, Inc.）
    • The 3M Company,
    • Ziptronix, Inc.
    • STATS ChipPAC Ltd.
    • United Microelectronics Corporation
    • Tezzaron Semiconductor Corporation

第 11 章 章节

  • 参考
  • 调查方法
简介目录
Product Code: CMI3941

Global 3d Ics Market is estimated to be valued at USD 19.84 Bn in 2025 and is expected to reach USD 73.66 Bn by 2032, growing at a compound annual growth rate (CAGR) of 20.6% from 2025 to 2032.

Report Coverage Report Details
Base Year: 2024 Market Size in 2025: USD 19.84 Bn
Historical Data for: 2020 To 2024 Forecast Period: 2025 To 2032
Forecast Period 2025 to 2032 CAGR: 20.60% 2032 Value Projection: USD 73.66 Bn
Figure. 3d Ics Market Share (%), By Region 2025
3D ICs Market - IMG1

The global 3D ICs market is witnessing robust growth with the rising demand for more compact and high-performance electronic devices. 3D ICs, also known as three-dimensional integrated circuits, refers to the vertical assembly of two or more IC chips stacked and connected vertically via through-silicon vias (TSVs) to reduce wire length and improve the signal propagation speeds. It enables device miniaturization by integrating more components in a small footprint. 3D ICs technology helps maximize chip density by stacking silicon dies and integrating them into one package which helps reduce the chip cost. It allows the placement of different components such as memory, graphics, processors, and radio electronics in one module. The higher bandwidth and low power consumption features associated with 3D ICs are fueling their demand for various applications across consumer electronics, medical devices, and automotive industries.

Market Dynamics:

The global 3D ICs market is driven by the increasing demand for high performance portable consumer electronics. The demand for devices with improved functionality in a compact form factor is propelling the need for 3D ICs. However, the high manufacturing cost associated with 3D ICs fabrication poses a challenge for widespread adoption. The complexity in the design and manufacturing process increases production costs. Opportunities lies in the emerging applications of 3D ICs in autonomous vehicles, augmented and virtual reality devices. The integration of logic chips, memory, and sensor components using 3D ICs technology can help enable advanced driver assistance, navigation, and infotainment services in vehicles. 3D ICs supports higher bandwidth and low-power consumption which will drive their adoption in battery-operated devices with graphics and processing-intensive requirements. efforts to lower manufacturing costs through new materials and design techniques will further help address barriers.

Key Features of the Study:

  • This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2025-2032), considering 2024 as the base year
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
  • It profiles key players in the global 3D ICs market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
  • Key companies covered as a part of this study include Amkor Technology, ASE Group, BeSang Inc., IBM Corporation, Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Micron Technology Inc., MonolithIC 3D ICs Inc., Samsung Electronics Co. Ltd., STATS ChipPAC Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company, Tezzaron Semiconductor, Toshiba Corporation, United Microelectronics Corporation, and Xilinx Inc.
  • Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
  • The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global 3D ICs market

Detailed Segmentation:

  • By Product Type
    • LED
    • Memories
    • MEMS
    • Sensor
    • Logic
    • Others
  • By Substrate Type
    • Silicon on Insulator (SOI)
    • Bulk Silicon
  • By Application
    • Information and Communication Technology
    • Military
    • Consumer Electronics
    • Others
  • By Region:
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East
    • Africa
  • Key Players Insights
    • Amkor Technology
    • ASE Group
    • BeSang Inc.
    • IBM Corporation
    • Intel Corporation
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • Micron Technology Inc.
    • MonolithIC 3D ICs Inc.
    • Samsung Electronics Co. Ltd.
    • STATS ChipPAC Ltd.
    • STMicroelectronics N.V.
    • Taiwan Semiconductor Manufacturing Company
    • Tezzaron Semiconductor
    • Toshiba Corporation
    • United Microelectronics Corporation
    • Xilinx Inc.

Table of Contents

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Market Snippet, By End-Use Sectors
    • Market Snippet, By Substrate Type
    • Market Snippet, By Fabrication Process
    • Market Snippet, By Process
    • Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
    • Restraints
    • Market Opportunities
  • Regulatory Scenario
  • Industry Trend
  • Merger and Acquisitions
  • New System Launch/Approval

4. Impact of COVID-19 Pandemic on 3D ICs Market

  • Short Term and Long Term Impact, By Region
    • North America
    • Europe
    • Asia Pacific
    • Latin America
    • Middle East and Africa

5. Global 3D ICs Market, By End- Use Sectors, 2018-2028 (US$ Billion)

  • Introduction
    • Market Share Analysis, 2020 and 2028 (%)
    • Segment Trends
  • Consumer electronics
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Information and communication technology
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Transport (automotive and aerospace)
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Military
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Others (Biomedical applications and R&D)
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)

6. Global 3D ICs Market, By Substrate Type, 2018-2028 (US$ Billion)

  • Introduction
    • Market Share Analysis, 2020 and 2028 (%)
    • Segment Trends
  • Silicon on insulator (SOI)
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Bulk silicon
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)

7. Global 3D ICs Market, By Fabrication Process, 2018-2028 (US$ Billion)

  • Introduction
    • Market Share Analysis, 2020 and 2028 (%)
    • Segment Trends
  • Beam re-crystallization
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Wafer bonding
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Silicon epitaxial growth
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Solid phase crystallization
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)

8. Global 3D ICs Market, By Process, 2018-2028 (US$ Billion)

  • Introduction
    • Market Share Analysis, 2020 and 2028 (%)
    • Segment Trends
  • MEMS and Sensor
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • RF SiP
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Optoelectronics and imaging
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Memories (3D Stacks)
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • Logic (3D Sip/Soc)
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)
  • HB LED
    • Introduction
    • Market Size and Forecast, 2021-2028, (US$ Billion)

9. Global 3D ICs Market, By Region, 2018-2028 (US$ Billion)

  • Introduction
    • Market Share Analysis, By Region, 2020 and 2028 (%)
  • North America
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
    • Market Share Analysis, By Country, 2020 and 2028 (%)
      • U.S.
      • Canada
  • Europe
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
    • Market Share Analysis, By Country, 2020 and 2028 (%)
      • U.K.
      • Germany
      • Italy
      • France
      • Russia
      • Rest of Europe
  • Asia Pacific
    • Regional Trends
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
    • Market Share Analysis, By Country, 2020 and 2028 (%)
      • India
      • Japan
      • ASEAN
      • Australia
      • South Korea
      • Rest of Asia Pacific
  • Latin America
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
    • Market Share Analysis, By Country, 2020 and 2028 (%)
      • Brazil
      • Argentina
      • Mexico
      • Rest of Latin America
  • Middle East and Africa
    • Regional Trends
    • Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
    • Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
    • Market Share Analysis, By Country, 2020 and 2028 (%)
      • GCC Countries
      • South Africa
      • Rest of the Middle East and Africa

10. Competitive Landscape

  • Company Profiles
    • Taiwan Semiconductor Manufacturing Company, Ltd
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • MonolithIC 3D Inc.
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • XILINX, Inc.
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • Elpida Memory, Inc.
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • (Micron Technology, Inc.)
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • The 3M Company,
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • Ziptronix, Inc.
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • STATS ChipPAC Ltd.
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • United Microelectronics Corporation
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates
    • Tezzaron Semiconductor Corporation
      • Company Overview
      • Product Portfolio
      • Financial Performance
      • Key Strategies
      • Recent Developments/Updates

11. Section

  • References
  • Research Methodology
  • About Us and Sales Contact