3D TSV 与 2.5D 全球市场

预计到 2030 年，全球3D TSV 和 2.5D 市场规模将达到 1,889 亿美元

2024年，全球3D TSV和2.5D市场规模估计为447亿美元，预计在分析期内（2024-2030年）将以27.2%的复合年增长率增长，到2030年将达到1889亿美元。 3D堆迭记忆体封装是本报告分析的细分市场之一，预计其复合年增长率将达到28.2%，到分析期结束时规模将达到780亿美元。 5D中介层封装细分市场在分析期间的复合年增长率预计为23.3%。

美国市场预计将达到 122 亿美元，中国市场复合年增长率将达到 35.8%

预计到2024年，美国的3D TSV和2.5D市场规模将达到122亿美元。预计到2030年，作为世界第二大经济体的中国市场规模将达到470亿美元，在2024-2030年的分析期内，复合年增长率将达到35.8%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为21.8%和24.5%。在欧洲，预计德国市场的复合年增长率约为22.9%。

全球3D TSV 和 2.5D 市场 - 主要趋势和驱动因素摘要

3D TSV 和 2.5D 封装如何重新定义半导体整合？

3D 硅通孔 (TSV) 和 2.5D 整合技术的出现正在重塑半导体格局，它们为先进晶片设计中提高性能、降低功耗和最小化尺寸提供了创新途径。与传统封装方法不同，3D TSV 允许使用蚀刻在硅晶片上的高长宽比孔将多个晶粒垂直堆迭，从而显着缩短互连长度并实现更快的讯号传输。这种垂直整合可以实现更高的频宽方法，将多个晶粒并排放置在内插器上，与 2D 封装相比，它具有更高的性能，同时解决了与全 3D 堆迭相关的散热和产量比率挑战。这些创新支援异质整合，使逻辑、记忆体、模拟甚至光子元件能够在紧凑、功能强大的模组中共存。从家用电子电器到航太，各行各业都在采用这些封装架构，以满足小型化需求，同时又不牺牲功耗或效能。使用硅通孔 (TSV) 将高频宽记忆体 (HBM) 与逻辑晶片整合就是一个很好的例子，它支援神经网路训练和 3D 渲染等资料密集型任务。随着晶片系统(SoC) 变得越来越复杂，单片微缩的限制正推动产业朝向先进封装迈进，将其作为摩尔定律的可行替代方案。透过解决讯号完整性问题并支援更高的 I/O 密度，TSV 和 2.5D 解决方案在半导体向更智慧、更紧凑、更节能的架构持续演进中发挥核心作用。

为什么科技巨头和代工厂都大力投资3D TSV和2.5D技术？

半导体代工厂、集成设备製造商和领先技术公司对3D TSV 和 2.5D 封装技术的积极投资源于数据驱动型经济对更快、更小、更节能设备日益增长的需求。这些先进的封装技术在频宽可扩展性、电源完整性和减小尺寸方面提供了明显的性能优势，使其成为人工智慧、机器学习、图形处理和 5G 基础设施的下一代晶片组所必需的。台积电、英特尔、三星和日月光等领先公司正在大力投资新的和扩建 TSV 蚀刻、晶圆键合技术和内插器製造设施。这些投资也是对日益增长的异质整合需求的策略性回应——将在不同製程节点上製造的不同功能单元整合到单一封装中，以实现最佳效能和成本效益。云端处理和边缘设备需要更低的延迟和更高的并行性，所有这些都可以透过 TSV 和中介层实现的高密度互连来实现。与扩大单一单晶粒相比，这些技术在组合更小、功能特定的晶片时还能提供显着的成本优势。采用由 TSV 和 2.5D 架构支援的基于小晶片的设计方法，进一步扩展了模组化高效能运算平台的商业性可行性。政府和国防组织也认识到确保下一代半导体供应链的战略重要性，并鼓励国内发展先进封装能力。产业伙伴关係、合资企业和研发合作正在加速创新，并实现大规模生产准备。随着材料、设备和熟练劳动力生态系统的成熟，投资重点正从实验转向全面部署。

哪些应用和市场推动了3D TSV 和 2.5D 的采用？

3D TSV 和 2.5D 技术的加速采用与高效能应用的爆炸性成长密切相关，这些应用需要更高的资料吞吐量、更低的延迟和更严格的功耗要求。在资料中心和云端基础架构中，这些技术用于创建强大的处理器和记忆体模组，以支援人工智慧训练、即时分析和虚拟等繁重的工作负载。部署在人工智慧和游戏应用中的图形处理单元 (GPU) 和张量处理单元 (TPU) 也极大地受益于 TSV 整合 HBM 带来的频宽和紧密耦合。在行动和消费性电子产品中，TSV 和 2.5D 可以在不牺牲运算能力的情况下实现更薄、更轻、更节能的装置。汽车产业开始采用这些技术来支援电动和自动驾驶汽车中不断增加的电子内容，尤其是在 ADAS（高级驾驶辅助系统）和资讯娱乐单元中。航太和国防领域正在利用 2.5D 和 3D 封装的可靠性和紧凑性，将其应用于太空、重量和性能受到严格限制的任务关键型应用。医疗设备和穿戴式装置也是新兴应用，TSV 技术能够将功能强大的晶片整合到小外形规格中，以实现诊断、监测和治疗功能。此外，边缘运算设备的需求日益增长，这些设备需要在分散式和受限环境中保持稳健的效能，这推动了人们对紧凑高效封装解决方案的兴趣。机器视觉系统、物联网感测器和工业机器人正在 TSV 和 2.5D 技术中寻求处理能力和空间效率的理想平衡。这些技术支援的基于晶片组的架构趋势正在提高设计灵活性，使製造商能够快速製作原型并针对利基市场客製化解决方案。随着这些不同产业持续向资料密集和人工智慧功能靠拢， 3D TSV 和 2.5D 封装的采用曲线预计将更加陡峭，从而增强其作为未来各产业创新关键推动者的作用。

推动3D TSV和2.5D市场成长的关键因素是什么？

3D TSV 和 2.5D 市场的成长受到多种因素的驱动，这些因素与不断发展的半导体设计需求、不断变化的消费者技术需求以及製造能力的进步直接相关。其中一个主要因素是，随着电晶体缩放接近其物理和经济极限，迫切需要克服传统平面缩放的限制。 3D 3D和 2.5D 整合提供了一种在不缩小节点的情况下提高效能的替代方法，可实现更高的 I/O 密度、改善讯号传输并降低功率损耗。另一个关键驱动因素是人工智慧和高效能运算工作负载的兴起。这些工作负载需要极高的记忆体频宽和低延迟，这可以透过 TSV 的 HBM 整合来实现。对异构运算的日益依赖（异构运算在单一封装内整合多个专用核心或小晶片）也在加速向这些先进封装格式的过渡。此外，行动装置、AR/ VR头戴装置和智慧型穿戴装置的激增正在推动对3D TSV 和 2.5D 可以提供的更小、更节能的晶片的需求。在汽车领域，电气化和自动化的发展推动了对适用于车载运算的小型、可靠、热效率高的晶片的需求。包括细间距 TSV 蚀刻、晶圆减薄和热感界面材料在内的製造流程的进步，使这些封装的量产更加可行且更具成本效益。行业标准和设计工具也日趋成熟，降低了整合复杂性并缩短了开发週期。此外，作为国家战略构想的一部分，区域化半导体供应链的地缘政治努力正在推动对先进封装设施的投资。晶片设计人员、外包半导体组装和测试 (OSAT) 以及电子设计自动化 (EDA) 工具提供者之间的协作正在简化从概念到商业部署的路径。最后，5G、边缘运算和 AI 的大规模融合正在创造对更智慧、整合度更高的硬体解决方案的持续需求，巩固了3D TSV 和 2.5D 技术作为下一波半导体创新基础组件的地位。

部分

封装类型（3D 堆迭记忆体封装、5D内插器封装、具有 TSV 的 CIS 封装、3D SoC 封装、其他封装类型）、最终用户（消费性电子最终用户、汽车最终用户、高效能运算与网路最终用户、其他最终用户）

受访公司范例

• Advanced Semiconductor Engineering（ASE）
• Amkor Technology
• Applied Materials
• Brewer Science
• Chipbond Technology Corp.
• Deca Technologies
• EV Group（EVG）
• Fraunhofer IZM
• GLOBALFOUNDRIES
• Huawei HiSilicon
• Intel Corporation
• Lam Research
• Samsung Electronics
• SK hynix
• SUSS MicroTec
• Taiwan Semiconductor Manufacturing Company（TSMC）
• Teledyne DALSA
• Texas Instruments
• Tokyo Electron Limited
• Xperi Inc.（includes Invensas）

人工智慧集成

全球产业分析师利用可操作的专家内容和人工智慧工具改变市场和竞争情报。

Global 特定产业产业SLM 的典型规范，而是建立了一个从世界各地专家收集的内容库，包括影片录影、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

全球产业分析师根据公司总部所在国家、製造地和进出口（成品和原始设备製造商）情况预测其竞争地位的变化。这种复杂而多面的市场动态预计将以多种方式影响竞争对手，包括销货成本(COGS) 上升、盈利下降、供应链重组以及其他微观和宏观市场动态。

目录

第一章调查方法

第二章执行摘要

• 市场概览
• 主要企业
• 市场趋势和驱动因素
• 全球市场展望

第三章市场分析

• 美国
• 加拿大
• 日本
• 中国
• 欧洲
• 法国
• 德国
• 义大利
• 英国
• 西班牙
• 俄罗斯
• 其他欧洲国家
• 亚太地区
• 澳洲
• 印度
• 韩国
• 其他亚太地区
• 拉丁美洲
• 阿根廷
• 巴西
• 墨西哥
• 其他拉丁美洲
• 中东
• 伊朗
• 以色列
• 沙乌地阿拉伯
• 阿拉伯聯合大公国
• 其他中东地区
• 非洲

第四章 竞赛

Global 3D TSV and 2.5D Market to Reach US$188.9 Billion by 2030

The global market for 3D TSV and 2.5D estimated at US$44.7 Billion in the year 2024, is expected to reach US$188.9 Billion by 2030, growing at a CAGR of 27.2% over the analysis period 2024-2030. 3D Stacked Memory Packaging, one of the segments analyzed in the report, is expected to record a 28.2% CAGR and reach US$78.0 Billion by the end of the analysis period. Growth in the 5D Interposer Packaging segment is estimated at 23.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$12.2 Billion While China is Forecast to Grow at 35.8% CAGR

The 3D TSV and 2.5D market in the U.S. is estimated at US$12.2 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$47.0 Billion by the year 2030 trailing a CAGR of 35.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 21.8% and 24.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 22.9% CAGR.

Global 3D TSV and 2.5D Market - Key Trends & Drivers Summarized

How Are 3D TSV and 2.5D Packaging Redefining Semiconductor Integration?

The emergence of 3D Through-Silicon Via (TSV) and 2.5D integration technologies is reshaping the semiconductor landscape by offering innovative pathways to enhance performance, reduce power consumption, and minimize form factor in advanced chip designs. Unlike traditional packaging methods, 3D TSV enables vertical stacking of multiple dies using high-aspect-ratio vias etched through silicon wafers, significantly shortening interconnect lengths and allowing faster signal transmission. This vertical integration results in higher bandwidth, improved latency, and better power efficiency, all of which are critical for applications such as high-performance computing, artificial intelligence, and data center operations. On the other hand, 2.5D packaging provides an intermediate approach, where multiple dies are placed side-by-side on an interposer, offering improved performance over 2D packaging while addressing the thermal and yield challenges associated with full 3D stacking. These innovations support heterogeneous integration, allowing logic, memory, analog, and even photonic components to coexist in a compact, high-functionality module. Industries ranging from consumer electronics to aerospace are increasingly adopting these packaging architectures to meet the demand for miniaturization without compromising power or performance. The integration of High Bandwidth Memory (HBM) with logic chips using TSVs is a prime example, enabling data-intensive tasks such as neural network training and 3D rendering. As system-on-chip (SoC) complexity grows, the limitations of monolithic scaling have pushed the industry toward advanced packaging as a viable alternative to Moore’s Law. TSV and 2.5D solutions address signal integrity issues and support higher I/O density, thereby playing a central role in the continued evolution of semiconductors toward more intelligent, compact, and power-efficient architectures.

Why Are Tech Giants and Foundries Heavily Investing in 3D TSV and 2.5D Technologies?

The aggressive investments by semiconductor foundries, integrated device manufacturers, and tech giants in 3D TSV and 2.5D packaging technologies are rooted in the escalating need for faster, smaller, and more energy-efficient devices in a data-driven economy. These advanced packaging techniques offer clear performance advantages in terms of bandwidth scalability, power integrity, and form factor reduction, making them indispensable in next-generation chipsets for artificial intelligence, machine learning, graphics processing, and 5G infrastructure. Major players such as TSMC, Intel, Samsung, and ASE are allocating significant capital towards building and expanding facilities equipped to handle TSV etching, wafer bonding, and interposer fabrication, all of which require highly specialized and precise processes. These investments are also strategic responses to the growing demand for heterogeneous integration, where different functional units fabricated on separate process nodes are assembled into a single package for optimal performance and cost-efficiency. Cloud computing and edge devices are pushing for ever-smaller latencies and greater parallelism, both of which are enabled by the high-density interconnects made possible through TSVs and interposers. These technologies also offer significant cost advantages when used to combine smaller, function-specific chips rather than scaling up a single, monolithic die. The adoption of chiplet-based design methodologies, supported by TSV and 2.5D architectures, is further expanding the commercial feasibility of modular, high-performance computing platforms. Governments and defense agencies are also incentivizing domestic capabilities in advanced packaging, recognizing the strategic importance of securing next-generation semiconductor supply chains. Industry partnerships, joint ventures, and R&D collaborations are accelerating technical innovation and enabling production readiness at scale. As the ecosystem for materials, equipment, and skilled labor matures, the focus of investment is shifting from experimentation to full-fledged deployment, driven by both the technical superiority and the commercial viability of these packaging formats.

What Applications and Markets Are Accelerating Adoption of 3D TSV and 2.5D?

The accelerating adoption of 3D TSV and 2.5D technologies is closely tied to the explosive growth of high-performance applications that demand increased data throughput, lower latency, and tighter power envelopes. In data centers and cloud infrastructure, these technologies are used to create powerful processors and memory modules that support high-volume workloads such as AI training, real-time analytics, and virtualization. Graphics processing units (GPUs) and tensor processing units (TPUs) deployed in AI and gaming applications also benefit greatly from the high memory bandwidth and close coupling made possible by TSV-integrated HBM. In mobile and consumer electronics, TSV and 2.5D are enabling thinner, lighter, and more energy-efficient devices without sacrificing computing capability. The automotive industry is beginning to adopt these technologies to support the increasing electronic content in electric and autonomous vehicles, particularly in advanced driver assistance systems (ADAS) and infotainment units. Aerospace and defense are leveraging the reliability and compactness of 2.5D and 3D packaging for mission-critical applications where space, weight, and performance are tightly constrained. Medical devices and wearables are another emerging application area, with TSVs enabling the integration of powerful chips into small form factors for diagnostic, monitoring, and therapeutic functions. Additionally, the growing demand for edge computing devices, which require robust performance in decentralized and often constrained environments, is boosting interest in compact and efficient packaging solutions. Machine vision systems, IoT sensors, and industrial robotics are finding in TSV and 2.5D the ideal balance between processing power and spatial efficiency. The trend toward chiplet-based architectures, supported by these technologies, is also unlocking design flexibility, allowing manufacturers to rapidly prototype and customize solutions for niche markets. As these diverse sectors continue to converge on more data-intensive and AI-enabled functionalities, the adoption curve for 3D TSV and 2.5D packaging is expected to steepen, reinforcing their role as key enablers of future innovation across industries.

What Are the Key Drivers Fueling Growth in the 3D TSV and 2.5D Market?

The growth in the 3D TSV and 2.5D market is driven by several factors directly tied to evolving semiconductor design needs, changing consumer technology demands, and advancements in manufacturing capabilities. One major driver is the urgent need to overcome the limitations of traditional planar scaling as transistor miniaturization approaches physical and economic limits. 3D TSV and 2.5D integration provide alternative pathways to performance enhancement without the need for smaller nodes, offering higher I/O density, improved signal transmission, and reduced power loss. Another key factor is the rise of AI and high-performance computing workloads, which necessitate extremely high memory bandwidth and low latency, achievable through HBM integration via TSVs. The increasing reliance on heterogeneous computing, where multiple specialized cores or chiplets are integrated within a single package, is also accelerating the shift toward these advanced packaging formats. Furthermore, the proliferation of mobile devices, AR/VR headsets, and smart wearables is driving the demand for compact and energy-efficient chips that 3D TSV and 2.5D can deliver. The automotive sector’s push toward electrification and autonomy is creating demand for compact, high-reliability, thermally efficient chips suitable for in-vehicle computation. Advancements in fabrication processes, such as fine-pitch TSV etching, wafer thinning, and thermal interface materials, are making high-volume manufacturing of these packages more feasible and cost-effective. Industry standards and design tools have also matured, reducing integration complexity and enabling faster development cycles. Additionally, geopolitical efforts to localize semiconductor supply chains are fueling investments in advanced packaging facilities as part of national strategic initiatives. Collaborative efforts between chip designers, OSATs (Outsourced Semiconductor Assembly and Test), and EDA (Electronic Design Automation) tool providers are streamlining the path from concept to commercial deployment. Finally, the convergence of 5G, edge computing, and AI at scale is creating a sustained demand for more intelligent and integrated hardware solutions, solidifying 3D TSV and 2.5D technologies as foundational components in the next wave of semiconductor innovation.

SCOPE OF STUDY:

The report analyzes the 3D TSV and 2.5D market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Packaging Type (3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging, Other Packaging Types); End-User (Consumer Electronics End-User , Automotive End-User, High Performance Computing & Networking End-User, Other End-Users)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Advanced Semiconductor Engineering (ASE)
• Amkor Technology
• Applied Materials
• Brewer Science
• Chipbond Technology Corp.
• Deca Technologies
• EV Group (EVG)
• Fraunhofer IZM
• GLOBALFOUNDRIES
• Huawei HiSilicon
• Intel Corporation
• Lam Research
• Samsung Electronics
• SK hynix
• SUSS MicroTec
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Teledyne DALSA
• Texas Instruments
• Tokyo Electron Limited
• Xperi Inc. (includes Invensas)

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Tariff Impact on Global Supply Chain Patterns
  • 3D TSV and 2.5D - Global Key Competitors Percentage Market Share in 2025 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • Surging Demand for Compact and High-Performance Chips Throws the Spotlight on 3D TSV and 2.5D Integration Technologies
  • Rising AI and HPC Workloads Propel Growth of Advanced Packaging Solutions Like 3D TSV and 2.5D ICs
  • Here's How Growing Complexity in Semiconductor Architectures Expands Addressable Market Opportunity for Heterogeneous Integration
  • Increased Data Bandwidth and Latency Requirements Drive Adoption of Through-Silicon Via (TSV) Solutions
  • Edge Computing and IoT Proliferation Strengthen the Business Case for Power-Efficient 2.5D Packaging Designs
  • Here's the Story: Data Centers and Cloud Providers Turning to 2.5D and 3D TSV to Meet Thermal and Density Challenges
  • Advancements in Interposer Technology Sustain Growth Momentum for 2.5D Integration in GPUs and Networking Chips
  • Cost vs. Performance Trade-Offs Propel Hybrid Approaches Combining 2.5D Packaging with 3D TSV Elements
  • Miniaturization Trends Across Mobile and Wearables Markets Drive Demand for High-Density 3D TSV Structures
  • Yield Improvement and Design Tool Advancements Mitigate Historical Challenges and Drive Broader Market Adoption
  • High-Speed Interconnect Needs in AI Accelerators and ASICs Spur Use of 2.5D Solutions with Integrated Silicon Interposers
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World 3D TSV and 2.5D Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 3: World Historic Review for 3D TSV and 2.5D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 4: World 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for 3D Stacked Memory Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 6: World Historic Review for 3D Stacked Memory Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 7: World 16-Year Perspective for 3D Stacked Memory Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for 5D Interposer Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 9: World Historic Review for 5D Interposer Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 10: World 16-Year Perspective for 5D Interposer Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for CIS with TSV Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 12: World Historic Review for CIS with TSV Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 13: World 16-Year Perspective for CIS with TSV Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for 3D SoC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 15: World Historic Review for 3D SoC Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 16: World 16-Year Perspective for 3D SoC Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for Other Packaging Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 18: World Historic Review for Other Packaging Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 19: World 16-Year Perspective for Other Packaging Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for Consumer Electronics End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 21: World Historic Review for Consumer Electronics End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 22: World 16-Year Perspective for Consumer Electronics End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 23: World Recent Past, Current & Future Analysis for Automotive End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 24: World Historic Review for Automotive End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 25: World 16-Year Perspective for Automotive End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 26: World Recent Past, Current & Future Analysis for High Performance Computing & Networking End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 27: World Historic Review for High Performance Computing & Networking End-User by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 28: World 16-Year Perspective for High Performance Computing & Networking End-User by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 29: World Recent Past, Current & Future Analysis for Other End-Users by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 30: World Historic Review for Other End-Users by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 31: World 16-Year Perspective for Other End-Users by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

• UNITED STATES
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 32: USA Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 33: USA Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 34: USA 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 35: USA Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 36: USA Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 37: USA 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• CANADA
  • TABLE 38: Canada Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 39: Canada Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 40: Canada 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 41: Canada Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 42: Canada Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 43: Canada 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• JAPAN
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 44: Japan Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 45: Japan Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 46: Japan 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 47: Japan Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 48: Japan Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 49: Japan 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• CHINA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 50: China Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 51: China Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 52: China 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 53: China Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 54: China Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 55: China 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• EUROPE
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 56: Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 57: Europe Historic Review for 3D TSV and 2.5D by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 58: Europe 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
  • TABLE 59: Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 60: Europe Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 61: Europe 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 62: Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Europe Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 64: Europe 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• FRANCE
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 65: France Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 66: France Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 67: France 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 68: France Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 69: France Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 70: France 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• GERMANY
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 71: Germany Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 72: Germany Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 73: Germany 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 74: Germany Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 75: Germany Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 76: Germany 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ITALY
  • TABLE 77: Italy Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 78: Italy Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 79: Italy 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 80: Italy Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Italy Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 82: Italy 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• UNITED KINGDOM
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 83: UK Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 84: UK Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 85: UK 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 86: UK Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 87: UK Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 88: UK 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• SPAIN
  • TABLE 89: Spain Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 90: Spain Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 91: Spain 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 92: Spain Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 93: Spain Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 94: Spain 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• RUSSIA
  • TABLE 95: Russia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 96: Russia Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 97: Russia 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 98: Russia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 99: Russia Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 100: Russia 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF EUROPE
  • TABLE 101: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 102: Rest of Europe Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 103: Rest of Europe 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 104: Rest of Europe Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 105: Rest of Europe Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 106: Rest of Europe 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ASIA-PACIFIC
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 108: Asia-Pacific Historic Review for 3D TSV and 2.5D by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 109: Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
  • TABLE 110: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 111: Asia-Pacific Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 112: Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 113: Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 114: Asia-Pacific Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 115: Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• AUSTRALIA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
  • TABLE 116: Australia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 117: Australia Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 118: Australia 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 119: Australia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 120: Australia Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 121: Australia 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• INDIA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
  • TABLE 122: India Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 123: India Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 124: India 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 125: India Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 126: India Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 127: India 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• SOUTH KOREA
  • TABLE 128: South Korea Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 129: South Korea Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 130: South Korea 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 131: South Korea Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 132: South Korea Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 133: South Korea 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF ASIA-PACIFIC
  • TABLE 134: Rest of Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 135: Rest of Asia-Pacific Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 136: Rest of Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 137: Rest of Asia-Pacific Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 138: Rest of Asia-Pacific Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 139: Rest of Asia-Pacific 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• LATIN AMERICA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
  • TABLE 140: Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 141: Latin America Historic Review for 3D TSV and 2.5D by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 142: Latin America 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
  • TABLE 143: Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 144: Latin America Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 145: Latin America 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 146: Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 147: Latin America Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 148: Latin America 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ARGENTINA
  • TABLE 149: Argentina Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 150: Argentina Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 151: Argentina 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 152: Argentina Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 153: Argentina Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 154: Argentina 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• BRAZIL
  • TABLE 155: Brazil Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 156: Brazil Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 157: Brazil 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 158: Brazil Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 159: Brazil Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 160: Brazil 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• MEXICO
  • TABLE 161: Mexico Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 162: Mexico Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 163: Mexico 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 164: Mexico Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 165: Mexico Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 166: Mexico 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF LATIN AMERICA
  • TABLE 167: Rest of Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 168: Rest of Latin America Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 169: Rest of Latin America 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 170: Rest of Latin America Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 171: Rest of Latin America Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 172: Rest of Latin America 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• MIDDLE EAST
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
  • TABLE 173: Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 174: Middle East Historic Review for 3D TSV and 2.5D by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 175: Middle East 16-Year Perspective for 3D TSV and 2.5D by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
  • TABLE 176: Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 177: Middle East Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 178: Middle East 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 179: Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 180: Middle East Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 181: Middle East 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• IRAN
  • TABLE 182: Iran Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 183: Iran Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 184: Iran 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 185: Iran Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 186: Iran Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 187: Iran 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• ISRAEL
  • TABLE 188: Israel Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 189: Israel Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 190: Israel 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 191: Israel Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 192: Israel Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 193: Israel 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• SAUDI ARABIA
  • TABLE 194: Saudi Arabia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 195: Saudi Arabia Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 196: Saudi Arabia 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 197: Saudi Arabia Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 198: Saudi Arabia Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 199: Saudi Arabia 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• UNITED ARAB EMIRATES
  • TABLE 200: UAE Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 201: UAE Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 202: UAE 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 203: UAE Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 204: UAE Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 205: UAE 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• REST OF MIDDLE EAST
  • TABLE 206: Rest of Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 207: Rest of Middle East Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 208: Rest of Middle East 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 209: Rest of Middle East Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 210: Rest of Middle East Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 211: Rest of Middle East 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030
• AFRICA
  • 3D TSV and 2.5D Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
  • TABLE 212: Africa Recent Past, Current & Future Analysis for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 213: Africa Historic Review for 3D TSV and 2.5D by Packaging Type - 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 214: Africa 16-Year Perspective for 3D TSV and 2.5D by Packaging Type - Percentage Breakdown of Value Sales for 3D Stacked Memory Packaging, 5D Interposer Packaging, CIS with TSV Packaging, 3D SoC Packaging and Other Packaging Types for the Years 2014, 2025 & 2030
  • TABLE 215: Africa Recent Past, Current & Future Analysis for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 216: Africa Historic Review for 3D TSV and 2.5D by End-user - Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 217: Africa 16-Year Perspective for 3D TSV and 2.5D by End-user - Percentage Breakdown of Value Sales for Consumer Electronics End-User, Automotive End-User, High Performance Computing & Networking End-User and Other End-Users for the Years 2014, 2025 & 2030

IV. COMPETITION