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市场调查报告书
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1775578

3D积体电路市场 - 2025年至2030年预测

Three-Dimensional Integrated Circuit Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 142 Pages | 商品交期: 最快1-2个工作天内

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简介目录

3D积体电路市场预计将从 2025 年的 128.99 亿美元成长到 2030 年的 206.81 亿美元，复合年增长率为 9.90%。

3D积体电路市场趋势：

3D 积体电路 (IC) 是透过垂直堆迭晶粒或晶圆并透过硅通孔 (TSV) 或铜互连 (Cu-Cu) 连接它们而构成的金属氧化物半导体 (MOS) 电子装置，与 2D 方法相比，它能够在更小的占用空间内以更低的功耗还获得更高的性能，同时能够实现更高的灵活性，从而获得更高的灵活性，从而获得更高的灵活性，同时实现更高的灵活性，从而获得更高的灵活性，从而实现更高的灵活性，从而实现更高的灵活性，从而实现更高的频宽，从而获得更高的灵活性，从而实现更高的异质整合。

加大研发投入已成为多家公司的策略发展方向，从而推动了产业规模的显着扩张。此外，技术的显着进步预计将推动3D IC市场的发展。人工智慧 (AI)、物联网 (IoT)、穿戴式电子产品、扩增实境/虚拟实境 (AR/VR) 和高效能电脑的蓬勃发展，正加速3D IC的需求成长。

三维积体电路市场細項分析：

感测器是用于测量压力、位置、温度和加速度等特性并提供回馈的设备。感测器，也称为换能器，是现代数据采集系统的基本组成部分之一。其应用范围广泛，包括洪水和水位监测系统、环境监测、交通监控、人工照明节能、远端系统监控和设备故障诊断、精密农业和动物追踪。

目前，医疗保健、汽车和製造业等各种垂直应用正在推动市场发展。这些应用增强了感测器的功能。因此，预计感测器市场将呈指数级增长，从而推动对 3D IC 的需求。感测器中的 3D IC 使其比常规 IC 更具技术优势。此外，物联网的兴起以及对更先进的筛检和感测技术的强劲需求预计将以可观的速度扩大市场需求。

推动3D积体电路市场成长的因素：

3D IC 领域研究和创新的不断增加正在推动市场成长。 AR/VR、人工智慧、物联网和高性能电脑等创新技术的日益普及正在推动 3D IC 的使用，预计 3D IC 将随着第四次工业革命而成长。加强研发和创新是许多公司保持竞争优势的首要任务。许多公司正在进行策略性併购，以保持领先地位。 2021 年 2 月，ASM Pacific Technology 与 EV Group 签署了共同开发契约(JDA)，共同开发用于 3D IC/异构整合应用的晶粒到晶圆混合键合解决方案。晶粒到晶圆混合键合是使用小晶片技术将系统晶片(SoC) 装置重新设计为 3D 堆迭晶片的关键製程。该技术将来自不同製程节点的晶片组合在一起，为 5G、高效能运算 (HPC) 和人工智慧 (AI) 等新兴应用提供支援。

此外，技术的进步也导致了全球专利和版权数量的增加。 2022年8月，GBT Technologies Inc. 收到美国专利商标局 (USPTO) 的颁发通知，继续申请一项关于3D、多平面积体电路设计和製造技术的专利申请。这是该公司第二次申请3D、MP晶片结构的专利。这项原创创新为积体电路设计和製造提供了一种新颖的方法，使尖端的类比、数位和混合型积体电路能够整合在硅晶片上。

该专利旨在提供能够降低成本和能耗的设计，同时生产高性能的精密微晶片。这些技术旨在实现在更小尺寸的硅片上进行设计和製造。预计此类创新和研究将在预测期内推动市场显着成长。

三维积体电路企业：

  • Taiwan Semiconductor Manufacturing Company
  • Invensas Corporation
  • Amkor Technology Inc.
  • Xilinx, Inc.
  • Tezzaron Semiconductor Corporation

目录

第一章执行摘要

第二章市场概述

  • 市场概览
  • 市场定义
  • 调查范围
  • 市场区隔

第三章 经营状况

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策法规
  • 策略建议

第四章 技术展望

5. 3D积体电路市场（按技术）

  • 介绍
  • 单片
  • 晶圆上晶圆
  • 晶粒上晶片
  • 晶粒

6. 3D积体电路市场（依应用）

  • 介绍
  • MEMS
  • 储存装置
  • 感应器
  • 其他的

7. 3D积体电路市场（按地区）

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 印尼
    • 泰国
    • 其他的

第八章竞争格局及分析

  • 主要企业和策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第九章：公司简介

  • Taiwan Semiconductor Manufacturing Company
  • Invensas Corporation
  • Amkor Technology Inc.
  • Xilinx, Inc.
  • Tezzaron Semiconductor Corporation
  • Aveni Inc.
  • JCET Group
  • STMicroelectronics
  • Advanced Semiconductor Engineering Inc.（ASE）
  • IBM

第十章 附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061610416

The Three-Dimensional Integrated Circuit Market is expected to grow from US$12.899 billion in 2025 to US$20.681 billion in 2030, at a CAGR of 9.90%.

Three-Dimensional Integrated Circuit Market Trends:

3D integrated circuits (ICs) are metal oxide semiconductor (MOS) electronic devices constructed by stacking silicon dies or wafers vertically and connecting them through-silicon vias (TSVs) or copper connections (Cu-Cu), achieving performance improvements at lower power consumption with a smaller footprint compared to two-dimensional methods. Further, it has a high bandwidth and heterogeneous integration providing greater flexibility.

Growing investment in R&D has been a strategic development for several companies. It has broadened the scope to the industry. Further, with the significant advancement of technology, 3D IC will propel the 3DIC market. The increasing advent of artificial intelligence (AI), Internet of Things (IoT), wearable electronics, AR/VR, and high-performing computers will be snowballing the demand for 3D IC.

Three-Dimensional Integrated Circuit Market Segment Analysis:

A sensor is a device used to measure a property, such as pressure, position, temperature, or acceleration, and respond with feedback. Also known as transducers, sensors are one of the fundamental building blocks of modern data acquisition systems. They have a wide range of applications from flood & water level monitoring systems, environmental monitoring, traffic monitoring & controlling, energy saving in artificial lighting, remote system monitoring & equipment fault diagnostics, and precision agriculture & animal tracking.

These diverse applications across several industry verticals like healthcare, automotive, and manufacturing industries, among others, are driving the market ahead in the current period. It makes the functioning of the sensor superior and better. Hence, the sensors market is projected to grow at an exponential rate, driving demand for 3-D IC. A 3-D IC in sensors gives the sensor a technological edge over a normal IC. Furthermore, the rise in IoT and superior demand for better screening and sensing technology is anticipated to expand the market demand at a significant pace.

Three-Dimensional Integrated Circuit Market Growth Drivers:

Growing research and innovation in 3D IC is driving the market growth. Increasing adoption of innovative technologies like AR/VR, Artificial Intelligence, IoT, and high-performing computers is propelling the use of 3D ICs. This is anticipated to grow with the fourth industrial revolution. Increasing R&D and innovation is a top priority for several companies to stay in the game. Companies are entering into strategic mergers and acquisitions to stay at the top of the game. In February 2021, ASM Pacific Technology and EV Group entered into a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a crucial process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology. This technology combines chips with various process nodes to power new applications like 5G, high-performance computing (HPC), and artificial intelligence (AI).

Further, increasing technology is also increasing the patents and copyrights worldwide. In August 2022, GBT Technologies Inc. received an issue notification from the United States Patent and Trademark Office (USPTO) for its 3D, Multi-Planar IC design and manufacturing technology continuation patent application. This is the second patent application for its 3D, MP microchip architecture. The original innovation offered a novel approach to integrated circuit design and production that allows for the integration of cutting-edge analog, digital, and mixed-type ICs on a silicon wafer.

The current patent aims to provide a design to reduce the cost and energy and produce sophisticated microchips with higher performance. These techniques aim to make it possible to design and manufacture them on silicon with a smaller footprint. Such innovation and research are anticipated to significantly boost the market in the forecast period.

Three-Dimensional Integrated Circuit Companies:

  • Taiwan Semiconductor Manufacturing Company
  • Invensas Corporation
  • Amkor Technology Inc.
  • Xilinx, Inc.
  • Tezzaron Semiconductor Corporation

Three-Dimensional Integrated Circuit Market Segmentation:

By Technology

  • Monolithic
  • Wafer on Water
  • Die on Wafer
  • Die on Die

By Application

  • MEMS
  • Storage Device
  • Sensors
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indoensia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study
  • 2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY TECHNOLOGY

  • 5.1. Introduction
  • 5.2. Monolithic
  • 5.3. Wafer on Water
  • 5.4. Die on Wafer
  • 5.5. Die on Die

6. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY APPLICATION

  • 6.1. Introduction
  • 6.2. MEMS
  • 6.3. Storage Device
  • 6.4. Sensors
  • 6.5. Others

7. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. North America
    • 7.2.1. USA
    • 7.2.2. Canada
    • 7.2.3. Mexico
  • 7.3. South America
    • 7.3.1. Brazil
    • 7.3.2. Argentina
    • 7.3.3. Others
  • 7.4. Europe
    • 7.4.1. Germany
    • 7.4.2. France
    • 7.4.3. United Kingdom
    • 7.4.4. Spain
    • 7.4.5. Others
  • 7.5. Middle East and Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. Others
  • 7.6. Asia Pacific
    • 7.6.1. China
    • 7.6.2. India
    • 7.6.3. Japan
    • 7.6.4. South Korea
    • 7.6.5. Indonesia
    • 7.6.6. Thailand
    • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. Taiwan Semiconductor Manufacturing Company
  • 9.2. Invensas Corporation
  • 9.3. Amkor Technology Inc.
  • 9.4. Xilinx, Inc.
  • 9.5. Tezzaron Semiconductor Corporation
  • 9.6. Aveni Inc.
  • 9.7. JCET Group
  • 9.8. STMicroelectronics
  • 9.9. Advanced Semiconductor Engineering Inc. (ASE)
  • 9.10. IBM

10. APPENDIX

  • 10.1. Currency
  • 10.2. Assumptions
  • 10.3. Base and Forecast Years Timeline
  • 10.4. Key Benefits for the Stakeholders
  • 10.5. Research Methodology
  • 10.6. Abbreviations