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市场调查报告书
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1577118

2030 年 3D IC 市场预测：按组件、类型、应用、最终用户和地区分類的全球分析

3D IC Market Forecasts to 2030 - Global Analysis By Component (Through Glass Via, Through-Silicon Via and Silicon Interposer), Type, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC的数据，2024年全球3D IC市场规模为197.3亿美元，预计在预测期内将以20.9%的复合年增长率成长，到2030年达到616.2亿美元。

3D IC（3D积体电路）是最尖端科技垂直堆迭多个半导体装置层以提高效能和功能。与放置在单一平面上的传统 2D IC 不同， 3D IC 利用垂直互连，可实现更快的资料传输和更低的讯号延迟。3D积体电路 (3D IC) 透过多层堆迭主动元件来提高效能并减少占用空间，从而为现代电子产品带来显着优势。

不断增长的资料中心和云端处理

资料中心对更高性能和能效的要求越来越高，而 3D IC 透过多层堆迭硅晶圆并使组件更紧密地结合在一起，提供了引人注目的解决方案。这可以减少延迟并提高频宽。此外，3D IC 支援异质整合，允许将不同类型的晶片组合到一个封装中，以优化功能和功耗。随着云端处理服务的扩展，对可扩展和高效能运算解决方案的需求正在推动 3D IC 技术的投资和创新。

温度控管问题

温度控管问题极大地阻碍了3D积体电路的发展和性能。 3D架构垂直堆迭晶体管，这增加了元件密度并在有限的空间内产生更多热量。有效的散热非常重要，因为温度控管不当可能导致过热、可靠性降低和效能下降。传统的冷却方法可能无法跟上 3D IC 的小型化步伐，需要先进的热界面材料、微流体冷却系统和增强传热技术等创新解决方案。

汽车应用的采用率提高

随着车辆越来越依赖先进的电子设备来实现自动驾驶、资讯娱乐系统和高级驾驶辅助系统 (ADAS) 等功能，对更小、更高性能组件的需求也不断增加。 3D IC 技术允许垂直堆迭多个半导体层，从而减少占地面积并改善温度控管。这种整合可以加快资料处理速度并提高能源效率，这对于现代车辆所需的复杂计算至关重要。

监管和标准化挑战

3D 积体电路 (IC) 的进步面临重大的监管和标准化挑战，阻碍了其广泛采用。由于 3D IC 技术采用了多层垂直堆迭电路，因此确保各个元件之间的相容性和互通性至关重要。目前，还没有普遍接受的标准来管理设计方法、製造流程和测试通讯协定。然而，此类衝突可能会使不同製造商之间的合作变得复杂，导致成本增加和上市时间延迟。

COVID-19 的影响：

COVID-19 大流行对3D积体电路 (IC) 产业产生了重大影响，凸显了脆弱性和机会。供应链中断导致半导体材料和组件的生产延迟，导致成本增加和前置作业时间延长。随着製造商努力应对劳动力短缺和工厂停工的问题，考虑到在紧凑外形规格中提高性能的潜力，3D IC 等先进封装解决方案的紧迫性变得更加明显。疫情期间远端工作和数位服务的激增加速了对依赖先进半导体技术的高效能运算和资料中心的需求。

硅穿孔电极(TSV) 领域预计将在预测期内成为最大的领域。

透过实现多个半导体晶粒之间的垂直互连，预计穿通孔 (TSV) 细分市场将在预测期内成为最大的细分市场。这种创新方法可实现紧凑的设计，并显着缩短讯号必须传播的距离，从而提高性能和能源效率。 TSV 可实现更高的资料传输速率和频宽，对于需要高速通讯的应用（例如高效能运算、图形处理和进阶行动装置）至关重要。此外，使用 TSV 的晶片 3D 堆迭可优化空间，从而在更小的占地面积内实现更多功能。

预计汽车业在预测期内复合年增长率最高。

由于对先进电子功能、性能改进和车辆小型化的需求不断增加，预计汽车行业在预测期内将出现最高的复合年增长率。 3D IC允许多个电路层垂直堆迭，大幅提高空间效率和电源管理。该技术旨在将感测、处理和通讯等各种功能整合到一个小封装中，这对于 ADAS（高级驾驶员辅助系统）、资讯娱乐和电动车 (EV) 管理等应用至关重要。此外，3D IC 还有助于实现高频宽和低延迟，这对于自动驾驶系统中的即时资料处理和决策至关重要。

占比最大的地区：

由于北美地区能够将记忆体和处理功能无缝地结合在一个晶片内，因此预计在预测期内将占据最大的市场份额。透过将记忆体直接堆迭在逻辑组件之上，製造商可以实现更高的频宽和密度，同时保持紧凑的设计。随着北美继续引领半导体技术发展，对记忆体和逻辑整合的关注可能会促进科技巨头和新兴企业之间的合作以及进一步的进步。这种演变不仅将提高电子设备的性能，还将将该地区置于全球半导体创新的前沿，并确保其在快速发展的技术环境中保持竞争力。

复合年增长率最高的地区：

预计欧洲地区在预测期内将保持盈利成长。透过制定严格的安全、环境影响和性能标准，这些法规可确保 3D IC 技术的创新能满足更广泛的永续性目标。这不仅可以增强消费者和产业相关人员之间的信任，还可以鼓励对研发的投资。对标准化的重视提高了设备之间的互通性，为更有效率的製造流程并缩短新产品的上市时间铺平了道路。欧洲各国政府也透过奖励半导体产业的本地生产和创新来优先考虑数位主权，以帮助该地区在全球范围内保持竞争力。

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目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章 全球 3D IC 市场：依组件分类

  • 玻璃通孔 (TGV)
  • 穿透硅通孔(TSV)
  • 硅中介层

第六章 全球 3D IC 市场：依类型

  • 单片3D
  • 堆迭 3d

第七章 全球 3D IC 市场：依应用分类

  • 航太
  • 成像和光电
  • 感应器
  • 其他用途

第 8 章 全球 3D IC 市场：依最终用户划分

  • 通讯
  • 家电
  • 车
  • 医疗设备
  • 其他最终用户

第9章全球3D IC市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第10章 主要进展

  • 合约、伙伴关係、协作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十一章 公司概况

  • ASE Group
  • Infineon Technologies
  • Intel Corporation
  • Keyence Corporation
  • NXP Semiconductors
  • Qualcomm Incorporated
  • Renesas Electronics
  • Siliconware Precision Industries
  • Synopsys
  • United Microelectronics Corporation
Product Code: SMRC27429

According to Stratistics MRC, the Global 3D IC Market is accounted for $19.73 billion in 2024 and is expected to reach $61.62 billion by 2030 growing at a CAGR of 20.9% during the forecast period. A 3D IC, or three-dimensional integrated circuit, is a cutting-edge technology that stacks multiple layers of semiconductor devices vertically to enhance performance and functionality. Unlike traditional 2D ICs, which are laid out on a single plane, 3D ICs utilize vertical interconnections, enabling faster data transfer and reduced signal delay. Three-dimensional integrated circuits (3D ICs) offer significant advantages in modern electronics by stacking multiple layers of active components, leading to enhanced performance and reduced footprint.

Market Dynamics:

Driver:

Growing data centers and cloud computing

As the demand for higher performance and energy efficiency escalates in data centers, 3D ICs provide a compelling solution by stacking multiple layers of silicon wafers, enabling closer proximity of components. This reduces latency and improves bandwidth, crucial for handling massive data loads efficiently. Additionally, 3D ICs allow for heterogeneous integration, where different types of chips can be combined in a single package, optimizing functionality and power usage. As cloud computing services expand, the need for scalable, high-performance computing solutions drives investment and innovation in 3D IC technology.

Restraint:

Thermal management issues

Thermal management issues significantly hinder the development and performance of 3D integrated circuits. As transistors are stacked vertically in 3D architectures, the density of components increases, leading to higher heat generation in a confined space. Effective heat dissipation becomes critical, as inadequate thermal management can result in overheating, reduced reliability and lower performance. Traditional cooling methods may not be sufficient for the compactness of 3D ICs, necessitating innovative solutions such as advanced thermal interface materials, microfluidic cooling systems, or enhanced thermal conduction techniques.

Opportunity:

Rising adoption in automotive applications

As vehicles become increasingly reliant on advanced electronics for features like autonomous driving, infotainment systems, and advanced driver-assistance systems (ADAS), the demand for compact and high-performance components grows. 3D IC technology allows for vertical stacking of multiple semiconductor layers, reducing the footprint and improving thermal management. This integration leads to faster data processing and improved power efficiency, essential for the complex computations required in modern vehicles.

Threat:

Regulatory and standardization challenges

The advancement of 3D integrated circuits (ICs) faces significant regulatory and standardization challenges that hinder their widespread adoption. As 3D IC technology incorporates multiple layers of circuitry stacked vertically, ensuring compatibility and interoperability among various components is crucial. Currently, there is a lack of universally accepted standards governing design methodologies, manufacturing processes, and testing protocols. However, this inconsistency complicates collaboration among different manufacturers and can lead to increased costs and time-to-market delays.

Covid-19 Impact:

The COVID-19 pandemic significantly impacted the 3D integrated circuit (IC) industry, highlighting both vulnerabilities and opportunities. Supply chain disruptions caused delays in the production of semiconductor materials and components, leading to increased costs and longer lead times. As manufacturers grappled with labor shortages and factory shutdowns, the urgency for advanced packaging solutions like 3D ICs became more pronounced, given their potential for enhanced performance in compact form factors. The surge in remote work and digital services during the pandemic accelerated demand for high-performance computing and data centers, which rely on advanced semiconductor technologies.

The Through-Silicon Via (TSV) segment is expected to be the largest during the forecast period

Through-Silicon Via (TSV) segment is expected to be the largest during the forecast period by enabling vertical interconnections between multiple semiconductor dies. This innovative approach allows for a compact design, significantly reducing the distance that signals must travel, thereby improving performance and energy efficiency. TSVs facilitate higher data transfer rates and bandwidth, crucial for applications demanding rapid communication, such as high-performance computing, graphics processing and advanced mobile devices. Additionally, the 3D stacking of chips with TSVs optimizes space, allowing for more functionality within a smaller footprint.

The Automotive segment is expected to have the highest CAGR during the forecast period

Automotive segment is expected to have the highest CAGR during the forecast period due to the growing demands for advanced electronic features, enhanced performance and miniaturization in vehicles. 3D ICs allow for multiple layers of circuitry to be stacked vertically, significantly improving space efficiency and power management. This technology facilitates the integration of various functions-such as sensing, processing and communication-within a single compact package, which is crucial for applications like advanced driver-assistance systems (ADAS), infotainment, and electric vehicle (EV) management. Moreover, 3D ICs contribute to higher bandwidth and lower latency, essential for real-time data processing and decision-making in autonomous driving systems.

Region with largest share:

North America region is anticipated to command the largest share of the market over the extrapolated period by enabling the seamless combination of memory and processing functions within a single chip. By stacking memory directly on top of logic components, manufacturers can achieve higher bandwidth and density while maintaining compact designs. As North America continues to lead in semiconductor technology development, the focus on Memory and Logic Integration will drive further advancements, fostering collaboration between tech giants and startups. This evolution not only enhances the performance of electronic devices but also positions the region at the forefront of global semiconductor innovation, ensuring it remains competitive in a rapidly advancing technological landscape.

Region with highest CAGR:

Europe region is poised to hold profitable growth during the projected period. By establishing stringent standards for safety, environmental impact, and performance, these regulations ensure that innovations in 3D IC technology align with broader sustainability goals. This not only fosters trust among consumers and industry stakeholders but also encourages investment in research and development. The emphasis on standardization enhances interoperability among devices, paving the way for more efficient manufacturing processes and reduced time-to-market for new products. As European governments also prioritize digital sovereignty, they incentivize local production and innovation in the semiconductor sector, ensuring that the region remains competitive on a global scale.

Key players in the market

Some of the key players in 3D IC market include ASE Group, Infineon Technologies, Intel Corporation, Keyence Corporation, NXP Semiconductors, Qualcomm Incorporated, Renesas Electronics, Siliconware Precision Industries, Synopsys and United Microelectronics Corporation.

Key Developments:

In November 2023, Samsung Electronics is gearing up to introduce a new advanced 3D chip packaging technology named SAINT in a bid to viral Taiwan semiconductor manufacturing company's market dominance.

In February 2023, Cadence and UMC collaborated on a hybrid bonding reference flow for 3D-ICs. UMC intends to launch hybrid bonding solutions that are suitable for edge AI, image processing, and wireless communication across a broad range of technology nodes.

In October 2022, TSMC's 3DFabricTM offerings, including the integrated fan-out (InFO), chip-on-wafer-on-substrate (TSMC-SoICTM), and system-on-integrated chips (TSMC-SoICTM), have been certified by the leading Cadence(R) IntegrityTM 3D-IC platform and have met all reference design flow criteria. Cadence supports TSMC 3DbloxTM as part of the collaboration to accelerate the development of advanced multi-die packages for 5G, artificial intelligence, mobile, and hyperscale computing.

In March 2022, Amkor Technology, a company based in South Korea teamed up with the TSMC OIP 3D Fabric. With a first chance to use TSMC's 3D Fabric tech, new partners of the 3D Fabric Alliance can move their products forward at the same time as TSMC.

Components Covered:

  • Through Glass Via (TGV)
  • Through-Silicon Via (TSV)
  • Silicon Interposer

Types Covered:

  • Monolithic 3D
  • Stacked 3D

Applications Covered:

  • Aerospace
  • Imaging and Optoelectronics
  • Sensors
  • Other Applications

End Users Covered:

  • Telecommunications
  • Consumer Electronics
  • Automotive
  • Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global 3D IC Market, By Component

  • 5.1 Introduction
  • 5.2 Through Glass Via (TGV)
  • 5.3 Through-Silicon Via (TSV)
  • 5.4 Silicon Interposer

6 Global 3D IC Market, By Type

  • 6.1 Introduction
  • 6.2 Monolithic 3D
  • 6.3 Stacked 3D

7 Global 3D IC Market, By Application

  • 7.1 Introduction
  • 7.2 Aerospace
  • 7.3 Imaging and Optoelectronics
  • 7.4 Sensors
  • 7.5 Other Applications

8 Global 3D IC Market, By End User

  • 8.1 Introduction
  • 8.2 Telecommunications
  • 8.3 Consumer Electronics
  • 8.4 Automotive
  • 8.5 Medical Devices
  • 8.6 Other End Users

9 Global 3D IC Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 ASE Group
  • 11.2 Infineon Technologies
  • 11.3 Intel Corporation
  • 11.4 Keyence Corporation
  • 11.5 NXP Semiconductors
  • 11.6 Qualcomm Incorporated
  • 11.7 Renesas Electronics
  • 11.8 Siliconware Precision Industries
  • 11.9 Synopsys
  • 11.10 United Microelectronics Corporation

List of Tables

  • Table 1 Global 3D IC Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 3 Global 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 4 Global 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 5 Global 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 6 Global 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 7 Global 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 8 Global 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 9 Global 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 10 Global 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 11 Global 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 12 Global 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 13 Global 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 14 Global 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 15 Global 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 16 Global 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 17 Global 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 18 Global 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 19 Global 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 20 North America 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 21 North America 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 22 North America 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 23 North America 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 24 North America 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 25 North America 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 26 North America 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 27 North America 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 28 North America 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 29 North America 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 30 North America 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 31 North America 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 32 North America 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 33 North America 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 34 North America 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 35 North America 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 36 North America 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 37 North America 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 38 North America 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 39 Europe 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 40 Europe 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 41 Europe 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 42 Europe 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 43 Europe 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 44 Europe 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 45 Europe 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 46 Europe 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 47 Europe 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 48 Europe 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 49 Europe 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 50 Europe 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 51 Europe 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 52 Europe 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 53 Europe 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 54 Europe 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 55 Europe 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 56 Europe 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 57 Europe 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 58 Asia Pacific 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 59 Asia Pacific 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 60 Asia Pacific 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 61 Asia Pacific 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 62 Asia Pacific 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 63 Asia Pacific 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 64 Asia Pacific 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 65 Asia Pacific 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 66 Asia Pacific 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 67 Asia Pacific 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 68 Asia Pacific 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 69 Asia Pacific 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 70 Asia Pacific 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 71 Asia Pacific 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 72 Asia Pacific 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 73 Asia Pacific 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 74 Asia Pacific 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 75 Asia Pacific 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 76 Asia Pacific 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 77 South America 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 78 South America 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 79 South America 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 80 South America 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 81 South America 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 82 South America 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 83 South America 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 84 South America 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 85 South America 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 86 South America 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 87 South America 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 88 South America 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 89 South America 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 90 South America 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 91 South America 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 92 South America 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 93 South America 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 94 South America 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 95 South America 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 96 Middle East & Africa 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 97 Middle East & Africa 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 98 Middle East & Africa 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 99 Middle East & Africa 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 100 Middle East & Africa 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 101 Middle East & Africa 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 102 Middle East & Africa 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 103 Middle East & Africa 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 104 Middle East & Africa 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 105 Middle East & Africa 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 106 Middle East & Africa 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 107 Middle East & Africa 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 108 Middle East & Africa 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 109 Middle East & Africa 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 110 Middle East & Africa 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 111 Middle East & Africa 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 112 Middle East & Africa 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 113 Middle East & Africa 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 114 Middle East & Africa 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)