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半导体生产设备硅晶圆

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1474055

全球碳化硅晶圆抛光市场 - 2024-2031

Global SiC Wafer Polishing Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 187 Pages | 商品交期: 最快1-2个工作天内

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简介目录

概述

全球SiC晶圆抛光市场2023年达3亿美元，预计2031年将达38亿美元，2024-2031年预测期间复合年增长率为37.3%。

电力电子、汽车、电信和再生能源等各行业越来越多地采用碳化硅半导体元件，有助于推动预测期内的市场成长。 SiC 晶圆具有卓越的电气性能和耐用性，对于製造高性能电力电子装置、射频元件和感测器至关重要。全球电动车普及率的激增推动了对碳化硅晶圆和抛光基板的需求。基于 SiC 的电力电子装置由于其效率和快速切换能力，对于电动车动力传动系统和充电基础设施至关重要。

主要参与者不断增长的併购策略有助于推动预测期内的市场成长。例如，2021年12月2日，Soitec收购了NovaSiC，有助于加强SiC晶圆技术。新闻稿称，此次收购使 Soitec 能够推动电动车和工业应用电源系统半导体的开发。收购 NovaSiC 并整合其在晶圆、抛光和回收方面的专业知识，为 Soitec 带来了最新的技术构建模组，以提供最佳的最终产品，并为我们的 SmartSiC 产品线的工业化阶段做好准备。

北美是市场的主导地区，因为在消费者永续交通环境法规的推动下，美国和加拿大电动车的采用率不断上升。 SiC 晶圆在製造电力电子元件（例如电动车传动系统中使用的逆变器和转换器）方面发挥着重要作用。不断扩大的电动车产业推动了该地区对优质碳化硅晶圆服务的需求。风能和太阳能等大量财政资源已投入北美的再生能源领域。由于碳化硅电力电子元件具有出色的耐温度变化能力，因此非常适合再生能源系统。随着再生能源产业的发展，北美地区涉及功率转换和能源管理的应用对碳化硅晶圆的需求日益增长。

动力学

全球电动车 (EV) 采用率上升

先进的电力电子元件对于电动车的推进系统、电池管理和充电基础设施至关重要。与传统的硅基功率元件相比，碳化硅功率元件具有多种优势，例如更高的效率、更快的开关时间和更好的热性能。随着电动车使用量的增加，用于生产高功率和高频电源模组、逆变器和车载充电器的碳化硅晶圆和抛光组件的需求量越来越大。根据Virta Global给出的资料，2021年全球电动车销量为67.5亿辆，2022年电动车销量将成长100亿辆。中国是电动车销量的主导地区，2022 年销量约 138 亿辆。

使用基于碳化硅的电力电子装置可以提高电动车的整体效率和续航里程。 SiC 晶圆用于电力转换器和逆变器，以改善再生煞车、降低电力转换过程中的能量损失，并在不牺牲效率的情况下允许更高的工作温度。这些效率优势推动了电动车市场中基于 SiC 的解决方案的成长，这些优势转化为更长的行驶里程、更长的电池寿命和更高的车辆性能。

电力电子和半导体装置越来越多地采用 SiC 晶圆

由于其卓越的品质，包括低开关损耗、高导热性和高击穿电压，SiC 晶圆在电力电子领域很受欢迎。由于这些特性，基于 SiC 的功率元件非常高效，并且可以在更高的温度和功率密度下运作。随着产业对节能解决方案的需求日益增加，电力电子元件中碳化硅晶圆的使用增加了对精确抛光的需求，以确保这些设备的最佳效率和可靠性。汽车产业，尤其是电动车和混合动力车，其车载充电基础设施、电池管理系统和传动系统严重依赖基于碳化硅的电力电子设备。

基于碳化硅的功率元件有利于再生能源领域，因为它们为风能和储能等系统提供高效的能量转换和功率调节。 SiC 晶圆可为再生能源系统提供更高的转换效率、更低的损耗并提高供电可靠性。全球再生能源专案的扩张推动了对各种应用的抛光碳化硅晶圆的需求。

初始投资高

SiC 晶圆抛光所需的机械和设备，例如抛光垫、计量仪器和化学机械平坦化系统，需要大量的财务投资。专业工具对于精确实现半导体产业所需的表面光滑度和平整度至关重要。 SiC 晶圆抛光通常需要具有调节湿度和颗粒水平的无尘室条件，以防止污染并确保製程的可重复性。初始投资费用随着无尘室设施的维护和建立而增加，其中包括暖通空调系统、过滤装置和持续的无尘室维护。

SiC 晶圆抛光中使用的磨料和抛光垫是消耗品，会增加营运费用。采购符合行业标准和製程要求的高品质材料和消耗品会增加抛光设施的初始投资和持续营运成本。操作 SiC 晶圆抛光设备需要熟练的技术人员、工程师和操作员，他们具有材料科学、半导体製造、抛光技术和计量方面的专业知识。培训人员和建立一支能够操作和维护复杂抛光系统的合格劳动力团队意味着额外的成本和人力资本投资。

The rising adoption of SiC-based semiconductor devices in various industries like power electronics, automotive, telecommunications and renewable energy help to boost market growth over the forecast period. SiC wafers are essential for manufacturing high-performance power electronics, Radio Frequency components and sensors due to their superior electrical properties and durability. The surge in electric vehicle adoption globally is fueling the demand for SiC wafers and polished substrates. SiC-based power electronics are crucial for EV drivetrains and charging infrastructure due to their efficiency and fast-switching capabilities.

Growing merger and acquisition strategies by the major key players help to boost market growth over the forecast period. For instance, on December 02, 2021, Soitec, acquired NovaSiC which helps to strengthen SiC wafer technology. The acquisition allows Soitec to drive the development of semiconductors for power supply systems in electromobility and industrial applications, a press release reads. The acquisition of NovaSiC and the integration of its expertise in wafering, polishing and reclaiming brings the latest technology building block for Soitec to deliver an optimal final product and prepare the industrialization phase of our SmartSiC product line.

North America is the dominating region in the market due to the growing adoption of electric vehicles is on the rise in U.S. and Canada driven by consumer environmental regulations for sustainable transportation. SiC wafers play an important role in manufacturing power electronics components like inverters and converters used in EV drivetrains. The demand in the region for superior SiC wafer services is fueled by the expanding EV industry. Significant financial resources like wind and solar energy, have been poured into renewable energy sources in North America. Because of their remarkable resistance to temperature changes, SiC-based power electronics are a good fit for renewable energy systems. SiC wafers are growing increasingly in demand in North America for applications involving power conversion and energy management as the renewable energy industry develops.

Dynamics

Rise in Electric Vehicle (EV) Adoption Globally

Advanced power electronics components are crucial to the propulsion systems, battery management and charging infrastructure of electric vehicles. Compared to their conventional silicon-based counterparts, SiC-based power devices provide several benefits, such as increased efficiency, faster switching instances and better thermal performance. SiC wafers and polished components, which are used for producing high-power and high-frequency power modules, inverters and onboard chargers, are becoming increasingly in demand as EV usage rises. According to the data given by Virta Global in 2021, 6.75 Billion EVs were sold globally and in 2022, EV sales increased by 10 Billion. China is a dominating region in the sales of EV accounted around sales of around 13.8 Billion cars in 2022.

The overall efficiency and range of electric automobiles are enhanced using SiC-based power electronics. SiC wafers are used in power converters and inverters to improve regenerative braking, lower energy losses during power conversion and allow for greater operating temperatures without sacrificing efficiency. The growth of SiC-based solutions in the EV market is being driven by these efficiency benefits, which translate into longer driving ranges, better battery life and greater vehicle performance.

Growing Adoption of SiC Wafers in Power Electronics and Semiconductor Devices

Due to its remarkable qualities, which include low switching losses, high thermal conductivity and high breakup voltage, SiC wafers are popular in power electronics. Because of these characteristics, SiC-based power devices are very efficient and can function at greater temperatures and power densities. The use of SiC wafers in power electronics increases the need for accurate polishing to guarantee the best efficiency and reliability of these devices as industries demand increasingly power-efficient solutions. The automobile industry and EVs and HEVs in particular, is significantly dependent on SiC-based power electronics for its onboard charging infrastructure, battery management systems and drivetrains.

SiC-based power devices are beneficial to the renewable energy sector because they offer efficient energy conversion and power conditioning for systems including wind and energy storage. SiC wafers offer greater conversion efficiencies, lower losses and increased reliability in power supply for renewable energy systems. The need for polished SiC wafers intended for various applications has been driven by the expansion of renewable energy projects globally.

High Initial Investment

The machinery and equipment needed for SiC wafer polishing, such as as polishing pads, metrology instruments and Chemical-Mechanical Planarization systems, interest a substantial financial investment. The specialist tools are essential for achieving precisely the surface smoothness and flatness demanded by the semiconductor industry. Cleanroom conditions with regulated humidity and particle levels are frequently required for the polishing of SiC wafers to prevent contamination and guarantee process repeatability. The initial investment expenses increase with the maintenance and establishment of cleanroom facilities, which include HVAC systems, filtration units and ongoing cleanroom maintenance.

Abrasives and polishing pads used in SiC wafer polishing are consumables that contribute to operational expenses. Procuring high-quality materials and consumables that meet industry standards and process requirements adds to the initial investment and ongoing operational costs for polishing facilities. Operating SiC wafer polishing equipment requires skilled technicians, engineers and operators with expertise in materials science, semiconductor manufacturing, polishing techniques and metrology. Training personnel and building a qualified workforce capable of operating and maintaining sophisticated polishing systems represent additional costs and investment in human capital.

Segment Analysis

The global SiC wafer polishing market is segmented based on process, product, application and region.

Growing Adoption of Mechanical SiC Wafer Polishing process Globally

Based on the Process, the SiC wafer polishing market is segmented into mechanical, chemical-mechanical, electropolishing, chemical, plasma-assisted and others.

Mechanical polishing processes, such as chemical-mechanical planarization and grinding, result in superior surface quality compared to other polishing methods. The mechanical action removes surface defects and contaminants, producing smooth, uniform and defect-free SiC wafer surfaces. High-quality surfaces are essential for semiconductor device fabrication and electronic components. Mechanical polishing techniques offer precise control over material removal rates, surface flatness, roughness parameters and thickness uniformity. Manufacturers can achieve tight tolerances and specifications required for SiC wafers used in high-performance semiconductor devices, Micro-Electro-Mechanical Systems, sensors, power electronics and photonic applications. The ability to control polishing parameters enhances product quality and reliability.

The growing major key player's demand for the Mechanical SiC Wafer Polishing method helps to boost segment growth over the ofrecast period. F0r instance, on July 06, 2023, Revasum announced the launch of a 200 mm conversion kit for their flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) platform. The 6EZ has proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field.

Geographical Penetration

North America is Dominating the Hardware Products Market

Innovation in technology focuses on North America, particularly in the semiconductor and materials industries. Leading businesses, academic institutions and research centres that propel the development of SiC wafer polishing technologies are based in the area. Global demand for SiC wafers with superior quality and performance is met by constant innovation. With a concentration on power electronics, RF devices and high-frequency applications, North America has a strong semiconductor field. High-power and high-frequency semiconductors utilized in data centers, renewable energy systems, automobile electronics and aerospace applications are made possible by SiC wafers. The need for SiC wafer polishing services is fueled by the existence of significant OEMs and semiconductor firms in North America.

Growing product launches by the major key players in the region help to boost regional segment growth over the forecast period. For instance, on February 21, 2023, Amtech Systems, Inc. booked the 20th new OnTrak double-sided wafer scrubber system sold into SiC manufacturing applications. The product booking came from an existing Entrepix OnTrak customer in North America. The new OnTrak double-sided scrubber is suitable for compound semiconductor applications with configurations for 100-200mm wafers and accommodation for even smaller wafers with custom-designed carriers.

Competitive Landscape

The major global players in the market include Kemnet International, Entegris, Ijin Diamond, Fujimi Corporation, Saint-Gobain, JSR Corporation, Engis Corporation, Ferro Corporation, 3M and DuPont Incorporated.

COVID-19 Impact Analysis

The globally epidemic of health Global supply chains, particularly those about minerals and semiconductor manufacture, were impacted by the COVID-19 epidemic. The disruption resulted in difficulties in obtaining components and raw materials required for SiC wafer polishing operations. The distribution and fabrication of SiC wafers were impacted by lower capacity for production. The demand for SiC wafers and associated items fluctuated as a result of the pandemic. Demand decreased as a result of manufacturing firms cutting back on activities as a result of lockdowns. However, the demand for SiC wafers for applications including power electronics, renewable energy and telecommunications showed indications of revival as sectors adjusted to remote labor and digitalization trends increased.

The pandemic's impact varied across different end-user industries of SiC wafers.For instance, SiC wafer sales for automotive electronics and power modules were first impacted by a decline in demand in the automobile sector. However, as these sectors adapted to remote work, digital connection and sustainable energy solutions, the demand for SiC wafers surged in areas including data centers, telecommunications and renewable energy. During the pandemic, certain semiconductor manufacturers revamped their manufacturing processes to concentrate on vital parts and technology required for medical equipment, healthcare devices and pandemic response initiatives. The supply of SiC wafers for non-essential applications and production volumes were momentarily impacted by this change in manufacturing priorities.

Russia-Ukraine War Impact Analysis

One of the major producers of raw materials and minerals such as silicon carbide, is Ukraine. Supply networks might be disrupted by the war, which could cause shortages or delays in the availability of SiC wafers for polishing. The operations and production schedules of businesses in the SiC wafer polishing sector may be impacted by this interruption. Price volatility in raw materials specifically silicon carbide caused by supply chain disruptions. Price fluctuations for raw materials can have an effect on SiC wafer polishing firms' manufacturing costs, which could result in changes to product pricing and profit margins.

Customers, producers and investors in the SiC wafer polishing industry are hesitant due to the instability and unpredictability brought on by the conflict between Ukraine and Russia. Market growth is impacted if businesses postpone plans for growth, research and development expenditures or the introduction of new products until the geopolitical environment stabilizes. The European and Eurasian markets, respectively, include Russia and Ukraine. Any disruptions in these regions can influence the regional demand for SiC wafer polishing products. Changes in regional demand patterns can affect market dynamics, competition and pricing strategies for SiC wafer polishing companies operating in these areas.

By Process

Mechanical
Chemical-Mechanical
Electropolishing
Chemical
Plasma-Assisted
Others

By Product

Abrasive Powders
Polishing Pads
Diamond Slurries
Colloidal Silica Suspensions

By Application

Power Electronics
LED
Sensors and Detectors
RF and Microwave Devices

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

On May 22, 2020, Sumitomo Electric Industries, Ltd. launched a SiC 150mm diameter single crystal substrate CrystEra for power devices. The new product is used in the production of Sumitomo SiC epitaxial wafer EpiEra. Semiconductor devices are used for various applications such as power transmission, automotive, train, solar power, home appliances and other sectors.
On March 28, 2022, Showa Denko launched mass production of 6-inch sic single crystal wafers in the market with a diameter of 6 inches which are used as materials for SiC epitaxial wafers to be installed and processed into SiC-based power semiconductors.
On December 02, 2021, Soitec, a manufacturer and designer of semiconductor materials acquired NovaSiC, a technology company specialized in polishing and reclaiming wafers on silicon carbide, to accelerate the company's technology development and strengthen its positioning on the industrial and automotive markets.

Why Purchase the Report?

To visualize the global SiC wafer polishing market segmentation based on process, product, application and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of SiC wafer polishing market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global SiC wafer polishing market report would provide approximately 62 tables, 57 figures and 187 Pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Process
3.2.Snippet by Product
3.3.Snippet by Application
3.4.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Rise in Electric Vehicle (EV) Adoption Globally
  - 4.1.1.2.Growing Adoption of SiC Wafers in Power Electronics and Semiconductor Devices
- 4.1.2.Restraints
  - 4.1.2.1.High Initial Investment
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Process

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 7.1.2.Market Attractiveness Index, By Process
7.2.Mechanical*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Chemical-Mechanical
7.4.Electropolishing
7.5.Chemical
7.6.Plasma-Assisted
7.7.Others

8.By Product

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 8.1.2.Market Attractiveness Index, By Product
8.2.Abrasive Powders*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Polishing Pads
8.4.Diamond Slurries
8.5.Colloidal Silica Suspensions

9.By Application

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 9.1.2.Market Attractiveness Index, By Application
9.2.Power Electronics*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.LED
9.4.Sensors and Detectors
9.5.RF and Microwave Devices

10.By Region

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2.Market Attractiveness Index, By Region
10.2.North America
- 10.2.1.Introduction
- 10.2.2.Key Region-Specific Dynamics
- 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1.U.S.
  - 10.2.6.2.Canada
  - 10.2.6.3.Mexico
10.3.Europe
- 10.3.1.Introduction
- 10.3.2.Key Region-Specific Dynamics
- 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1.Germany
  - 10.3.6.2.UK
  - 10.3.6.3.France
  - 10.3.6.4.Italy
  - 10.3.6.5.Spain
  - 10.3.6.6.Rest of Europe
10.4.South America
- 10.4.1.Introduction
- 10.4.2.Key Region-Specific Dynamics
- 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1.Brazil
  - 10.4.6.2.Argentina
  - 10.4.6.3.Rest of South America
10.5.Asia-Pacific
- 10.5.1.Introduction
- 10.5.2.Key Region-Specific Dynamics
- 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
- 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1.China
  - 10.5.6.2.India
  - 10.5.6.3.Japan
  - 10.5.6.4.Australia
  - 10.5.6.5.Rest of Asia-Pacific
10.6.Middle East and Africa
- 10.6.1.Introduction
- 10.6.2.Key Region-Specific Dynamics
- 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Process
- 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
- 10.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Application

11.Competitive Landscape

11.1.Competitive Scenario
11.2.Market Positioning/Share Analysis
11.3.Mergers and Acquisitions Analysis

12.Company Profiles

12.1.Kemnet International*
- 12.1.1.Company Overview
- 12.1.2.Product Portfolio and Description
- 12.1.3.Financial Overview
- 12.1.4.Key Developments
12.2.Entegris
12.3.Ijin Diamond
12.4.Fujimi Corporation
12.5.Saint-Gobain
12.6.JSR Corporation
12.7.Engis Corporation
12.8.Ferro Corporation
12.9.3M
12.10.DuPont Incorporated

LIST NOT EXHAUSTIVE