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1474071

全球半导体和 IC 封装材料市场 - 2024-2031

Global Semiconductor and IC Packaging Materials Market - 2024-2031

出版日期: 2024年05月02日 | 出版商:

DataM Intelligence | 英文 195 Pages | 商品交期: 最快1-2个工作天内

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简介目录

概述

全球半导体和IC封装材料市场2023年达到431亿美元，预计2031年将达937亿美元，2024-2031年预测期间复合年增长率为10.2%。

电子硬体的发展需要使用能够提供出色效能、速度和频宽的运算能力，同时保持低延迟和功耗。先进封装技术非常适合满足这些不同的效能期望和先进的异质整合要求，使企业能够利用高速运算、人工智慧和 5G 不断变化的需求。

由于对高效能运算、物联网和 5G 设备的需求增加，主要半导体封装供应商的收入显着成长。 Amkor 的计算部门由资料中心、基础设施、PC/笔记型电脑和储存组成，占总销售额的20%，高于2022 年第二季的18%。推动了市场需求。

到2023年，北美预计将成为主导地区，约占全球半导体和IC封装材料市场的35%。该地区不断增长的投资可能会推动对半导体封装材料的需求。例如，德州仪器(TI) 于2022 年2 月宣布，到2031 年将在美国半导体晶片製造领域投资数十亿美元。亿美元。

动力学

高性能半导体的技术进步

预计半导体产业在预测期内将大幅成长。半导体和 IC 基板、键合线、晶片连接材料和陶瓷封装都是任何电子设备的重要组件。这些材料有助于开发速度更快、更可靠且功耗更低的高性能积体电路。

半导体技术的快速突破提振了市场需求。 2021 年 12 月，在冠状病毒造成毁灭性后果后，印度政府批准了一项 100 亿美元的激励计划，以加强半导体产业。这些因素将鼓励半导体和 IC 封装材料的使用，从而促进市场成长。

消费性电子产品的需求不断成长

由于数位化的不断发展和技术突破，消费性电子产品的需求量很大。电气设备的小型化需要将积体电路合併到多晶片模组中。半导体和 IC 封装材料有助于缩小外形尺寸，同时提高可靠性和性能。

此外，领先企业对突破性技术的持续研发投资和包装系统营运效率的提高推动了市场向前发展。例如，2021 年 5 月，英特尔宣布对其 Rio Rancho 工厂投资 35 亿美元，以支援先进的 3D 封装和製造技术 Foveros。这些因素将影响半导体和积体电路封装材料的市场需求。

成本高

积体电路生产的原料成本高、製程复杂是限制市场发展的重要因素。半导体和IC封装材料的高成本限制了它们的使用，对市场产生了负面影响。此外，由于 IC 的复杂性，晶圆製造成本明显更高。

半导体封装单元的设计、开发和实施需要大量初始投资，以满足汽车、消费性电子、医疗保健、IT 和电信以及航空航太和国防等广泛行业的需求。晶片及积体电路封装多样化，图案复杂，影响整体成本，导致半导体及IC封装材料市场扩张有限。

The growth of electronic hardware needs the use of computational power capable of delivering great performance, speed and bandwidth while maintaining low latency and power consumption. Advance packaging technologies are ideally adapted to fulfill these different performance expectations and the advanced heterogeneous integration requirements, thus allowing enterprises to capitalize on the shifting demands of high-speed computing, artificial intelligence and 5G.

Major semiconductor packaging vendors are seeing significant revenue growth due to increased demand for high-performance computing, IoT and 5G devices. Amkor's computing division, consisting of data center, infrastructure, PC/laptop and storage, accounted for 20% of total sales, up from 18% in the second quarter of 2022. Government-implemented initiatives accelerate the shift toward car electrification, driving market demand.

In 2023, North America is expected to be the dominant region with about 35% of the global semiconductor and IC packaging materials market. Growing investments in the region are likely to drive up demand for semiconductor packaging materials. For example, Texas Instruments announced in February 2022 that it will invest billions of dollars in semiconductor chip manufacture in U.S. through 2031. Texas Instruments announced intentions to invest US$ 3.5 billion per year in semiconductor chip manufacturing in U.S. until 2025.

Dynamics

Technological Advancements for High-Performance Semiconductors

The semiconductor sector is expected to increase significantly during the forecast period. semiconductor and IC substrates, bonding wires, die attach materials and ceramic packaging are all essential components of any electronic device. The materials aid in the development of high-performance integrated circuits that are faster, more reliable and require less power.

Rapid technological breakthroughs in semiconductors boost market demand. In December 2021, the Indian government authorized a US$ 10 billion incentive plan to strengthen the semiconductor industry following the coronavirus's devastating consequences. The factors would encourage the usage of semiconductor and IC packaging materials, which would boost market growth.

Rising Demand for Consumer Electronics

Consumer electronics are in high demand as a result of growing digitization and technical breakthroughs. Miniaturization of electrical equipment necessitates the incorporation of integrated circuits into multi-chip modules. Semiconductor & IC packaging materials contribute by allowing for a reduced form factor with increased reliability and performance.

Furthermore, leading players' ongoing R&D investments in breakthrough technologies and improved operational efficiency of packaging systems propel the market forward. For example, in May 2021, Intel announced a US$ 3.5 billion investment in its Rio Rancho facility to support Foveros, an advanced 3D packaging and manufacturing technology. The factors will impact the semiconductor and integrated circuit packaging materials market demand.

High Costs

The raw materials high costs and the intricate process of integrated circuit production are important factors that limit market development. High cost of semiconductor and IC packaging materials limits their usage which negatively affects the market. Also, the wafer manufacturing cost is significantly higher because of the complexities of ICs.

A significant initial investment is required in the design, development and implementation of semiconductor packaging units to cater to a wide range of industries like automotive, consumer electronics, healthcare, IT & telecommunications and aerospace & defense. The overall cost gets affected by the packaging of diverse chips and integrated circuits with complicated patterning resulting in limited expansion of the semiconductor and IC packaging materials market.

Segment Analysis

The global semiconductor and IC packaging materials market is segmented based on type, technology, end-user and region.

Rising Consumer Electronics Drives the Segment Growth

Wafer-level packaging is expected to be the dominant segment with over 30% of the market during the forecast period 2024-2031. The increasing need for consumer electronics, the requirement for high-performance computing and the benefits of wafer-level packaging, including as energy efficiency, ultra-thinness and compact form factor, are driving the segment's growth.

In July 2021, JCET Group announced the formal launch of XDFOITM, a unique technology for ultra-high-density wafer-level packaging that will provide cost-effective options with maximum integration, high-density connectivity and excellent durability for a variety of chipsets. Such improvements would accelerate the expansion of the wafer-level packaging segment, increasing market demand.

Geographical Penetration

Rising Demand for High-Performance ICs in Asia-Pacific

Asia-Pacific is the dominant region in the global semiconductor and IC packaging materials market covering more than 35% of the market. The rising semiconductor sector, demand for high-performance integrated circuits and ongoing R&D initiatives by leading manufacturers are driving market expansion in this region. Taiwan Semiconductor Manufacturing Co. revealed in September 2021 that it was working on a new advanced small-outline packaging technology for the development of miniaturized systems.

Japan also has a large presence in the semiconductor and electronics industries, as it is home to some of the most important integrated circuit chip manufacturers. According to WSTS, Japan's semiconductor sector income increased by 14.2% in 2022 and is predicted to rise higher in the next years. The nation's packaging demand is increasing mostly because of the country's tremendous improvements in the semiconductor and integrated chip industries.

Competitive Landscape

The major global players in the market include Intel, Amkor Technology, Deca Technologies, Siemens, Samsung, Advanced Semiconductor Engineering Inc, Taiwan Semiconductor Manufacturing Company, Microchip Technology, Synapse Electronique and FlipChip International LLC.

COVID-19 Impact Analysis

The COVID-19 epidemic compelled manufacturing industries to rethink their traditional production procedures, primarily driving digital change and smart manufacturing practices throughout production lines. In accordance to the Semiconductor Industry Association, global semiconductor sales are estimated to reach US$ 515.1 billion in 2023. Semiconductors are critical components of electrical gadgets and the sector is extremely competitive.

The year-on-year drop rate in 2023 was 10.3%, with a rapid recovery projected in 2024. Notable semiconductor chip manufacturers include Intel and Samsung Electronics, with Intel producing US$ 58.4 billion and Samsung producing US$ 65.6 billion in semiconductor sales in 2022, putting them among the greatest businesses in terms of semiconductor sector revenues.

Russia-Ukraine War Impact

The Russia-Ukraine conflict has the potential to worsen semiconductor supply chain concerns and chip shortages that have plagued the industry. The greatest threat is to the supply of certain raw materials required in semiconductor manufacture, such as neon and palladium. With Ukraine as a major source of rare gases like neon, used in the manufacture of semiconductor fab lasers and Russia as a significant supplier of rare metals like palladium, there are concerns about the load on semiconductor chip supply chains.

Ukrainian enterprises, such as Cryoin, play an important role in the semiconductor supply chain. The companies produce specialty gases such as neon, helium, xenon and krypton, as well as their isotopes. The lack of semiconductors will have a domino effect and businesses such as the automotive sector, electrical appliances, cell phones and more will face an increase in costs and a collapse in production.

By Type

Organic Substrates
Bonding Wires
Leadframes
Ceramic Packages
Die Attach Materials
Thermal Interface Materials
Solder Balls
Encapsulation Resins
Others

By Technology

Grid Array
Wafer-level Packaging
Small-outline Package (SOP)
Flat no-leads Packages
Dual In-line Packages
3D Packaging
Others

By End-User

Consumer Electronics
Automotive
Healthcare
IT & Telecommunication
Aerospace and Defense
Others

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- Germany
- UK
- France
- Italy
- Russia
- Rest of Europe
South America
- Brazil
- Argentina
- Rest of South America
Asia-Pacific
- China
- India
- Japan
- Australia
- Rest of Asia-Pacific
Middle East and Africa

Key Developments

In June 2021, Samsung revealed an updated collection of chipsets for its next-generation 5G solutions and products, which include Compact Macro, Massive MIMO radios and baseband units, which was commercially available in 2022.
In February 2021, Siemens Digital Industries Software and Advanced Semiconductor Engineering, Inc. recently revealed their collaboration to analyze complicated integrated circuit package assemblies that interact in a single system.

Why Purchase the Report?

To visualize the global semiconductor and IC packaging materials market segmentation based on type, technology, end-user and region, as well as understand key commercial assets and players.
Identify commercial opportunities by analyzing trends and co-development.
Excel data sheet with numerous data points of semiconductor and IC packaging materials market-level with all segments.
PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
Product mapping available as excel consisting of key products of all the major players.

The global semiconductor and IC packaging materials market report would provide approximately 62 tables, 65 figures and 195 pages.

Target Audience 2024

Manufacturers/ Buyers
Industry Investors/Investment Bankers
Research Professionals
Emerging Companies

1.Methodology and Scope

1.1.Research Methodology
1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

3.1.Snippet by Type
3.2.Snippet by Technology
3.3.Snippet by End-User
3.4.Snippet by Region

4.Dynamics

4.1.Impacting Factors
- 4.1.1.Drivers
  - 4.1.1.1.Technological Advancements for High-Performance Semiconductors
  - 4.1.1.2.Rising Demand for Consumer Electronics
- 4.1.2.Restraints
  - 4.1.2.1.High Costs
- 4.1.3.Opportunity
- 4.1.4.Impact Analysis

5.Industry Analysis

5.1.Porter's Five Force Analysis
5.2.Supply Chain Analysis
5.3.Pricing Analysis
5.4.Regulatory Analysis
5.5.Russia-Ukraine War Impact Analysis
5.6.DMI Opinion

6.COVID-19 Analysis

6.1.Analysis of COVID-19
- 6.1.1.Scenario Before COVID-19
- 6.1.2.Scenario During COVID-19
- 6.1.3.Scenario Post COVID-19
6.2.Pricing Dynamics Amid COVID-19
6.3.Demand-Supply Spectrum
6.4.Government Initiatives Related to the Market During Pandemic
6.5.Manufacturers Strategic Initiatives
6.6.Conclusion

7.By Type

7.1.Introduction
- 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 7.1.2.Market Attractiveness Index, By Type
7.2.Organic Substrates*
- 7.2.1.Introduction
- 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
7.3.Bonding Wires
7.4.Leadframes
7.5.Ceramic Packages
7.6.Die Attach Materials
7.7.Thermal Interface Materials
7.8.Solder Balls
7.9.Encapsulation Resins
7.10.Others

8.By Technology

8.1.Introduction
- 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 8.1.2.Market Attractiveness Index, By Technology
8.2.Grid Array*
- 8.2.1.Introduction
- 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
8.3.Wafer-level Packaging
8.4.Small-outline Package (SOP)
8.5.Flat no-leads Packages
8.6.Dual In-line Packages
8.7.3D Packaging
8.8.Others

9.By End-User

9.1.Introduction
- 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 9.1.2.Market Attractiveness Index, By End-User
9.2.Consumer Electronics*
- 9.2.1.Introduction
- 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
9.3.Automotive
9.4.Healthcare
9.5.IT & Telecommunication
9.6.Aerospace and Defense
9.7.Others

10.By Region

10.1.Introduction
- 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
- 10.1.2.Market Attractiveness Index, By Region
10.2.North America
- 10.2.1.Introduction
- 10.2.2.Key Region-Specific Dynamics
- 10.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.2.6.1.U.S.
  - 10.2.6.2.Canada
  - 10.2.6.3.Mexico
10.3.Europe
- 10.3.1.Introduction
- 10.3.2.Key Region-Specific Dynamics
- 10.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.3.6.1.Germany
  - 10.3.6.2.UK
  - 10.3.6.3.France
  - 10.3.6.4.Italy
  - 10.3.6.5.Russia
  - 10.3.6.6.Rest of Europe
10.4.South America
- 10.4.1.Introduction
- 10.4.2.Key Region-Specific Dynamics
- 10.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.4.6.1.Brazil
  - 10.4.6.2.Argentina
  - 10.4.6.3.Rest of South America
10.5.Asia-Pacific
- 10.5.1.Introduction
- 10.5.2.Key Region-Specific Dynamics
- 10.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
- 10.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
  - 10.5.6.1.China
  - 10.5.6.2.India
  - 10.5.6.3.Japan
  - 10.5.6.4.Australia
  - 10.5.6.5.Rest of Asia-Pacific
10.6.Middle East and Africa
- 10.6.1.Introduction
- 10.6.2.Key Region-Specific Dynamics
- 10.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Type
- 10.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
- 10.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

11.Competitive Landscape

11.1.Competitive Scenario
11.2.Market Positioning/Share Analysis
11.3.Mergers and Acquisitions Analysis

12.Company Profiles

12.1.Intel*
- 12.1.1.Company Overview
- 12.1.2.Product Portfolio and Description
- 12.1.3.Financial Overview
- 12.1.4.Key Developments
12.2.Amkor Technology
12.3.Deca Technologies
12.4.Siemens
12.5.Samsung
12.6.Advanced Semiconductor Engineering Inc
12.7.Taiwan Semiconductor Manufacturing Company
12.8.Microchip Technology
12.9.Synapse Electronique
12.10.FlipChip International LLC

LIST NOT EXHAUSTIVE

13.Appendix

13.1.About Us and Services
13.2.Contact Us

02-2729-4219

+886-2-2729-4219

License/价格

全球半导体和 IC 封装材料市场 - 2024-2031

Global Semiconductor and IC Packaging Materials Market - 2024-2031

目录

第 1 章：方法与范围

第 2 章：定义与概述

第 3 章：执行摘要

第 4 章：动力学

第 5 章：产业分析

第 6 章：COVID-19 分析

第 7 章：按类型

第 8 章：按技术

第 9 章：最终用户

第 10 章：按地区

第 11 章：竞争格局

第 12 章：公司简介

第 13 章：附录