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市场调查报告书
商品编码
1887068
EUV光刻市场规模、占有率、成长及全球产业分析:依类型、应用和地区划分的洞察,以及2024年至2032年的预测EUV Lithography Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032 |
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随着半导体製造商加速向7nm以下先进製程节点转型,全球EUV光刻市场正经历快速的技术和商业扩张。据估计,2024年全球市场规模将达到111.9亿美元。在半导体代工厂、整合装置製造商和先进消费性电子产品强劲需求的推动下,预计2025年市场规模将达到121.6亿美元,并在2032年进一步成长至242.3亿美元,预测期内复合年增长率(CAGR)为10.35%。在强大的研发生态系统和世界领先的光刻设备製造商的支持下,欧洲在2024年以44.15%的市占率引领全球市场。
极紫外光刻技术对于实现先进的半导体製造至关重要,尤其是在生产特征尺寸小于7奈米的晶片方面。极紫外光(EUV)的使用能够实现硅晶圆上更精确的图案化,使製造商能够提高电晶体密度并延续摩尔定律。 EUV设备在处理器、储存晶片以及用于人工智慧系统、5G基础设施、资料中心和高效能消费性电子设备的超高速电子元件的生产中起着至关重要的作用。
生成式人工智慧的影响
生成式人工智慧正在透过优化图案布局、提高模拟精度和增强缺陷检测能力来变革半导体製造流程。 EUV光刻技术从人工智慧辅助建模中获益匪浅,这可以降低製造变异性、缩短生产週期并提高晶圆良率。随着半导体公司采用先进的人工智慧驱动自动化技术,将人工智慧整合到光刻图案设计中有望进一步加速市场扩张。
市场推动因素
推动EUV微影技术普及的主要推动因素是积体电路日益增长的复杂性。先进的处理器和记忆体架构需要超精细的结构和高密度电晶体,而这只有透过EUV微影技术才能实现。对5nm、3nm以及新兴的3nm以下製程的投资不断增长,使EUV成为半导体创新的核心。
此外,资料中心、云端运算和高效能运算的扩张正在推动对下一代储存装置(例如NAND快闪记忆体和DRAM)的需求。 EUV能够提供先进储存结构所需的精度和可扩充性。诸如台积电和ASML合作扩大EUV产能等策略合作表明,基于EUV的大规模生产转型正在进行中。
市场限制因子
儘管EUV光刻技术具有诸多优势,但仍面临诸多挑战。设备极为昂贵,成本是传统微影设备的数倍。 EUV组件,例如光罩、薄膜和高能量光源,製造流程复杂且成本高昂。中小型代工厂在采用EUV技术时面临资金限制,而全球范围内专用组件的短缺也造成了瓶颈。
此外,掩模完整性、薄膜耐久性和无缺陷图案化等挑战仍在阻碍EUV技术的广泛应用。然而,产业创新正在逐步解决这些问题。
市场机会
全球半导体製造投资的不断增长以及资料中心的快速发展为EUV光刻系统带来了巨大的机会。随着消费性电子产品、汽车电子产品和人工智慧设备对高性能且节能的晶片的需求日益增长,EUV微影技术已成为先进节点製造的关键。预计对下一代高数值孔径(NA)极紫外光刻(EUV)技术的研发投入增加,将进一步提高图形精度,实现更精细的结构,并增强其长期市场前景。
依装置类型
到2024年,光源细分市场将占最大的市场占有率,达到42.12%,这主要得益于高功率EUV光刻系统的创新。由于对高精度半导体图形和7奈米以下结构的需求不断增长,预计掩模细分市场将实现最快成长。
依最终使用者
到2024年,市场将由整合元件製造商(IDM)主导,他们利用EUV技术实现高密度、高性能晶片。预计到 2025 年,IDM 厂商将维持 55.77% 的市占率。同时,在主要公司加速向 EUV 光刻技术转型以进行商用晶片生产的推动下,晶圆代工厂预计将呈现最高的复合年增长率 (CAGR),达到 12.27%。
欧洲 - 引领市场
欧洲引领全球需求,预计到 2024 年市场规模将达到 49.4 亿美元。该地区受益于强大的半导体研发生态系统和大规模投资,例如英特尔在德国和波兰投资数十亿美元的晶片製造项目。
亚太地区
亚太地区是成长最快的地区,预计到 2025 年市场规模将达到 34 亿美元,这主要得益于台积电、三星和中芯国际等厂商大规模采用 EUV 技术。
北美
预计到 2025 年,北美市场规模将达到 18 亿美元,这主要得益于对人工智慧晶片和先进运算技术的需求不断增长。
The global EUV lithography market is entering a phase of rapid technological and commercial expansion as semiconductor manufacturers increasingly shift toward advanced nodes below 7nm. According to 2024 estimates, the global market was valued at USD 11.19 billion. With strong demand from semiconductor foundries, integrated device manufacturers, and advanced consumer electronics, the market is projected to reach USD 12.16 billion in 2025 and further expand to USD 24.23 billion by 2032, reflecting a CAGR of 10.35% during the forecast period. Europe led the global landscape with a 44.15% share in 2024, supported by robust R&D ecosystems and world-leading lithography equipment manufacturers.
EUV lithography is essential for enabling advanced semiconductor fabrication, particularly in producing chips with feature sizes below 7 nanometers. By using extreme ultraviolet light, the technology enables more precise patterning on silicon wafers, allowing manufacturers to increase transistor density and extend Moore's Law. EUV tools are critical in producing processors, memory chips, and ultra-fast electronics used in AI systems, 5G infrastructure, data centers, and high-performance consumer devices.
Impact of Generative AI
Generative AI is transforming semiconductor manufacturing processes by optimizing pattern layouts, enhancing simulation accuracy, and improving defect detection. EUV lithography benefits significantly from AI-assisted modeling, which reduces manufacturing variability, shortens production cycles, and increases wafer yield rates. As semiconductor companies adopt advanced AI-driven automation, the integration of AI into lithography pattern design will continue to accelerate market expansion.
Market Drivers
The primary driver of EUV lithography adoption is the increasing complexity of integrated circuits. Advanced processors and memory architectures demand ultra-fine geometries and higher transistor densities, which are only achievable through EUV lithography. Growing investment in 5nm, 3nm, and emerging sub-3nm nodes places EUV at the center of semiconductor innovation.
Furthermore, the expansion of data centers, cloud computing, and high-performance computing intensifies demand for next-generation memory devices such as NAND Flash and DRAM. EUV enables the precision and scalability required for advanced memory structures. Strategic collaborations-such as TSMC's partnership with ASML to expand EUV capacity-highlight the ongoing shift toward EUV-enabled mass production.
Market Restraints
Despite its advantages, EUV lithography faces major barriers. The equipment is extremely expensive, costing several times more than conventional lithography tools. EUV components-including masks, pellicles, and high-energy light sources-are highly complex and costly to manufacture. Smaller foundries face financial limitations in adopting EUV technology, and global shortages of specialized components have caused installation bottlenecks.
Additionally, challenges in mask integrity, pellicle durability, and achieving defect-free patterns continue to slow full-scale adoption, although industry innovations are gradually resolving these issues.
Market Opportunities
Expanding global investment in semiconductor fabrication and the rapid growth of data centers provide significant opportunities for EUV lithography systems. As consumer electronics, automotive electronics, and AI-enabled devices require powerful and energy-efficient chips, EUV lithography becomes indispensable for manufacturing advanced nodes. Increasing R&D funding for next-generation High-NA EUV technology will further enhance pattern accuracy and enable even smaller geometries, strengthening long-term market prospects.
By Equipment Type
The light source segment held the largest share in 2024 at 42.12%, driven by innovations in high-power EUV generation systems. Masks are expected to register the fastest growth due to rising demand for high-precision semiconductor patterns and sub-7nm structures.
By End-User
Integrated Device Manufacturers (IDMs) dominated the market in 2024, leveraging EUV to deliver high-density, high-performance chips. IDMs are projected to hold 55.77% of the market in 2025. Foundries will exhibit the highest CAGR of 12.27%, as leading players increasingly transition to EUV for commercial chip production.
Europe - Market Leader
Europe led global demand with a valuation of USD 4.94 billion in 2024. The region benefits from strong semiconductor R&D ecosystems and major investments such as Intel's multi-billion-dollar chip manufacturing projects in Germany and Poland.
Asia Pacific
Asia Pacific is the fastest-growing region, expected to reach USD 3.40 billion in 2025, driven by TSMC, Samsung, and SMIC's extensive EUV deployments.
North America
North America is projected to reach USD 1.80 billion in 2025, supported by rising demand for AI chips and advanced computing technologies.
Competitive Landscape
ASML remains the exclusive producer of EUV systems globally, giving it a dominant position in the market. Other major players-Samsung, Canon, KLA, Nikon, ZEISS, and Advantest-play critical roles in optics, metrology, and inspection systems. Continuous product innovations, strategic alliances, and High-NA EUV developments will define the competitive landscape through 2032.
Segmentation By Equipment
By End-user
By Region
Companies Profiled in the Report ASML (Netherlands), Samsung Electronics Co. Ltd. (South Korea), Canon Inc. (Japan), KLA Corporation (U.S.), NTT Advanced Technology Corporation (Japan), Nikon Corporation (China), ZEISS Group (Germany), ADVANTEST CORPORATION (Japan), SUSS MicroTec SE (Germany)