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半导体封装设备市场规模、占有率、成长及全球产业分析：依类型、应用和地区划分的洞察与预测（2024-2032 年）

Semiconductor Assembly and Packaging Equipment Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032
出版日期: | 出版商: Fortune Business Insights Pvt. Ltd. | 英文 140 Pages | 商品交期: 请询问到货日

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半导体封装设备市场成长驱动因素

由于对先进半导体封装的需求激增、数位转型的推进以及电子製造技术的快速发展，全球半导体封装设备市场正在加速成长。根据行业估计，该市场预计将在 2024 年达到 90.2 亿美元，2025 年增长至 97.2 亿美元，并在 2032 年飙升至 174.4 亿美元，预测期内复合年增长率 (CAGR) 为 8.72%。 2024 年，亚太地区将以 59.09% 的市占率引领全球市场，这主要得益于中国、台湾、韩国和日本强大的製造业生态系统。

随着汽车、通讯、消费性电子和云端运算等产业对更高效能和更小尺寸的需求不断增长，半导体封装技术也持续发展。包括 2.5D/3D IC、晶圆级封装和系统级封装 (SiP) 在内的先进封装解决方案正在变革组装工艺，并推动对用于键合、封装、减薄和测试的高精度设备的强劲需求。

市场趋势：人工智慧和高效能运算正在重塑封装需求

全球向人工智慧加速器、高效能运算 (HPC) 和资料中心处理器的转型，正在创造对先进封装结构的空前需求。人工智慧工作负载需要高频宽、低延迟和高密度互连设计——这些特性只有透过 2.5D/3D 封装、晶片整合和高频宽记忆体 (HBM) 才能实现。这些先进架构高度依赖精密晶片键合、混合键合和扇出型封装技术。因此，半导体製造商和OSAT（外包组装服务提供者）正积极投资于能够支援异质整合和超细间距互连的尖端封装设备。

市场驱动因素：电动车的扩张和半导体需求的激增

电动车 (EV) 产业的快速发展是半导体封装创新的主要催化剂。电动车需要高性能、高能效的晶片来实现电池管理、ADAS（高级驾驶辅助系统）、资讯娱乐和动力系统控制。这推动了对SiC和GaN功率装置、高散热性能封装以及稳健的模组级组件的需求。诸如晶圆上晶片、倒装晶片键合和功率模组封装等技术对于现代电动车应用至关重要，从而推动了对客製化组装和封装设备的需求。

此外，受供应链中断和国家安全考量的驱动，全球对国内半导体生产的投资正在推动新型封装设施的建设。诸如美国 "晶片法案" (CHIPS Act)、欧洲 "晶片法案" (European Chips Act) 以及中国的 "中国製造2025" 计画等政策，显着推动了封装和测试能力的扩张，直接支撑了设备需求。

市场限制因素：高额资本投入

儘管成长强劲，但先进半导体封装设备的高昂成本构成了市场挑战。向2.5D/3D封装、扇出型晶圆级封装(WLP)和混合键结的过渡需要对精密机械、无尘室设施和熟练劳动力进行大量投资。这些资本密集需求限制了中小型OSAT（外包封装和测试服务）公司的进入，从而促进了行业整合，并加剧了对大型IDM（垂直整合半导体製造商）和资金雄厚的封装供应商的依赖。

市场机会：在地化生产与政府诱因

半导体製造在地化是未来最重要的机会之一。北美、欧洲和亚洲各国政府正提供财政奖励措施，以加强其国内半导体生态系统。印度、马来西亚和越南等国凭藉着成本优势和不断扩大的技术人才储备，正成为新建封装工厂的首选地点。预计这些趋势将推动全球对新一代晶片键合机、引线键合机和晶圆级封装设备的需求。

区域展望：亚太地区领先，北美和欧洲加速发展

亚太地区

亚太地区仍是规模最大、成长最快的地区，预计到2024年将达到53.3亿美元，这主要得益于强大的製造业集群和政府激励措施。预计到2025年，中国将达到27.8亿美元，而印度和日本预计将分别达到5.6亿美元和4.5亿美元。

北美

在 "晶片法案" （CHIPS Act）投资的推动下，预计北美地区到 2025 年的投资额将达到 19.6 亿美元，其中美国将占 13.6 亿美元。先进封装技术（EMIB、3D 堆迭和晶片组架构）正在迅速发展。

欧洲

预计欧洲地区到 2025 年的投资额将达到 14.1 亿美元，其中德国（5.3 亿美元）、法国（1.1 亿美元）和英国（2.4 亿美元）位居前列。投资与电动车需求和工业自动化密切相关。

中东和非洲

预计中东和非洲 (MEA) 地区到 2025 年的投资额将达到 3.1 亿美元，受益于不断扩展的数位基础设施和人工智慧驱动的区域项目。

依类型、应用、最终用途行业和地区划分

目录

第一章：引言

第二章：摘要整理

第三章：市场动态

  • 宏观与微观经济指标
  • 驱动因素、限制因素、机会与趋势
  • 生成式人工智慧的影响

第四章：竞争格局

  • 主要公司采用的商业策略
  • 主要公司的综合SWOT分析
  • 全球半导体组装和封装设备主要公司（前3-5名）的市场占有率和排名（2024年）

章节5 全球半导体组装与封装设备市场规模估算与预测（依细分市场划分，2019-2032 年）

  • 主要发现
  • 依类型
    • 晶片键合机
    • 引线键合机
    • 封装设备
    • 其他
  • 依应用
    • IDM
    • OSAT
  • 依最终用途行业
    • 消费性电子
    • 汽车电子
    • 工业电子
    • 医疗设备
    • 航空航太与国防
    • 其他
  • 依地区
    • 北美
    • 欧洲
    • 亚太
    • 中东和非洲
    • 南美

章节第六章 北美半导体封装设备市场规模估算与预测（依细分市场划分，2019-2032 年）

  • 依国家划分
    • 美国
    • 加拿大
    • 墨西哥

第七章：南美洲半导体封装设备市场规模估算与预测（依细分市场划分，2019-2032 年）

  • 依国家划分
    • 巴西
    • 阿根廷
    • 南美洲其他地区

第八章：欧洲半导体封装设备市场规模估算与预测（依细分市场划分，2019-2032 年）

  • 依国家/地区
    • 英国
    • 德国
    • 法国
    • 义大利
    • 欧洲其他地区

第九章：亚太地区半导体封装设备市场规模估计与预测（依细分市场划分，2019-2032 年）

  • 依国家划分
    • 中国
    • 印度
    • 日本
    • 韩国
    • 亚太其他地区

第十章：中东与非洲半导体封装设备市场规模估计与预测（依细分市场划分，2019-2032 年）

  • 依国家划分
    • 海湾合作委员会
    • 南非
    • 中东其他地区非洲

第十一章：十大公司简介

  • 库利克和索法工业公司 (Kulicke and Soffa Industries, Inc.)
  • ASMPT
  • 贝西 (Besi)
  • 东和株式会社 (TOWA Corporation)
  • 新川电气株式会社 (SHINKAWA Electric Co., Ltd.)
  • 花美光 (Hana Micron)
  • SUSS MicroTec SE
  • ASM国际 (ASM International)
  • 迪斯可株式会社 (Disco Corporation)
  • 艾德万斯特株式会社 (Advantest Corporation)

第十二章：要点总结

Product Code: FBI112669

Growth Factors of semiconductor assembly and packaging equipment Market

The global semiconductor assembly and packaging equipment market is witnessing accelerated expansion, driven by the surging need for advanced semiconductor packaging, ongoing digital transformation, and rapid advancements in electronics manufacturing. As per industry estimates, the market reached USD 9.02 billion in 2024, is projected to grow to USD 9.72 billion in 2025, and ultimately surge to USD 17.44 billion by 2032, advancing at a CAGR of 8.72% over the forecast period. In 2024, Asia Pacific dominated the global market with a 59.09% share, owing to strong manufacturing ecosystems in China, Taiwan, South Korea, and Japan.

Semiconductor packaging continues to evolve as industries such as automotive, telecommunications, consumer electronics, and cloud computing demand higher performance and miniaturization. Advanced packaging solutions like 2.5D/3D ICs, wafer-level packaging, and system-in-package (SiP) are transforming assembly processes, driving strong demand for high-precision equipment used in bonding, encapsulation, thinning, and testing.

Market Trends: AI and High-Performance Computing Reshape Packaging Needs

The global shift toward AI accelerators, high-performance computing (HPC), and data center processors is creating unprecedented demand for sophisticated packaging architectures. AI workloads require high bandwidth, low latency, and dense interconnect designs-capabilities uniquely provided by 2.5D/3D packaging, chiplet integration, and High-Bandwidth Memory (HBM). These advanced architectures rely heavily on precision die bonding, hybrid bonding, and fan-out packaging technologies. As a result, semiconductor manufacturers and OSATs are investing aggressively in leading-edge packaging equipment capable of supporting heterogeneous integration and ultra-fine pitch interconnects.

Market Drivers: EV Expansion and Semiconductor Demand Surge

The rapid acceleration of the Electric Vehicle (EV) industry is a major catalyst for semiconductor packaging innovation. EVs require powerful, energy-efficient chips for battery management, ADAS, infotainment, and powertrain control. This drives demand for SiC and GaN power devices, high-thermal-performance packaging, and robust module-level assembly. Technologies such as chip-on-wafer, flip-chip bonding, and power module packaging are essential in modern EV applications, boosting the demand for tailored assembly and packaging equipment.

Additionally, global investments in domestic semiconductor production-spurred by supply chain disruptions and national security considerations-are prompting new packaging facility developments. Programs like the U.S. CHIPS Act, European Chips Act, and China's Made in China 2025 are fueling massive expansions in assembly and testing capacity, directly supporting equipment demand.

Market Restraints: High Capital Requirements

Despite strong growth, the market faces challenges due to the high cost of advanced semiconductor packaging equipment. Transitioning to 2.5D/3D packaging, fan-out WLP, and hybrid bonding requires substantial investment in precision machinery, cleanroom infrastructure, and skilled labor. These capital-intensive requirements limit participation from small and mid-tier OSATs, contributing to industry consolidation and dependence on large IDMs and well-funded packaging providers.

Market Opportunities: Localization and Government Incentives

Localization of semiconductor manufacturing presents one of the most significant opportunities for the future. Governments across North America, Europe, and Asia are offering financial incentives to strengthen domestic semiconductor ecosystems. Countries such as India, Malaysia, and Vietnam are emerging as preferred hubs for new packaging facilities due to cost advantages and expanding technical talent pools. These developments are expected to boost global demand for next-generation die bonders, wire bonders, and wafer-level packaging equipment.

Regional Outlook: Asia Pacific Leads, North America and Europe Accelerate

Asia Pacific

Asia Pacific remains the largest and fastest-growing region, valued at USD 5.33 billion in 2024, supported by strong manufacturing clusters and government incentives. China is projected to reach USD 2.78 billion in 2025, while India and Japan are expected to reach USD 0.56 billion and USD 0.45 billion, respectively.

North America

Driven by CHIPS Act investments, North America is projected to reach USD 1.96 billion in 2025, with the U.S. accounting for USD 1.36 billion. Advanced packaging technologies-EMIB, 3D stacking, and chiplet architecture-are expanding rapidly.

Europe

Europe is forecast to hit USD 1.41 billion in 2025, led by Germany (USD 0.53 billion), France (USD 0.11 billion), and the U.K. (USD 0.24 billion). Investments align with EV demand and industrial automation.

Middle East & Africa

MEA is expected to reach USD 0.31 billion in 2025, benefiting from growing digital infrastructure and AI-driven regional projects.

Conclusion

With semiconductor demand surging across AI systems, EVs, 5G networks, and advanced electronics, the assembly and packaging equipment market is positioned for strong long-term growth. Rising from USD 9.72 billion in 2025 to USD 17.44 billion by 2032, the industry will continue evolving through automation, heterogeneous integration, and global manufacturing expansion-maintaining Asia Pacific's leadership while North America and Europe accelerate investment momentum.

Segmentation Type, Application, End-Use Industry and Region

Segmentation By Type

  • Die Bonders
  • Wire Bonders
  • Packaging Equipment
  • Others

By Application

  • IDMs
  • OSAT

By End-Use Industry

  • Consumer Electronics
  • Automotive Electronics
  • Industrial Electronics
  • Medical Devices
  • Aerospace and Defense
  • Others

By Region

  • North America (By Type, By Application, By End-Use Industry, and By Country)
    • U.S. (By Type)
    • Canada (By Type)
    • Mexico (By Type)
  • Europe (By Type, By Application, By End-Use Industry, and By Country)
    • U.K. (By Type)
    • Germany (By Type)
    • France (By Type)
    • Italy (By Type)
    • Rest of Europe
  • Asia Pacific (By Type, By Application, By End-Use Industry, and By Country)
    • China (By Type)
    • Japan (By Type)
    • India (By Type)
    • South Korea (By Type)
    • Rest of Asia Pacific
  • Middle East & Africa (By Type, By Application, By End-Use Industry, and By Country)
    • GCC (By Type)
    • South Africa (By Type)
    • Rest of the Middle East & Africa
  • South America (By Type, By Application, By End-Use Industry, and By Country)
    • Brazil (By Type)
    • Argentina (By Type)
    • Rest of South America

Companies Profiled in the Report Kulicke and Soffa Industries, Inc., Besi, TOWA Corporation, SHINKAWA Electric Co., Ltd., Hana Micron, SUSS MicroTec SE, ASMPT (Singapore), ASM International (U.S.), Disco Corporation, Advantest Corporation

Table of Content

1. Introduction

  • 1.1. Definition, By Segment
  • 1.2. Research Methodology/Approach
  • 1.3. Data Sources

2. Executive Summary

3. Market Dynamics

  • 3.1. Macro and Micro Economic Indicators
  • 3.2. Drivers, Restraints, Opportunities and Trends
  • 3.3. Impact of Generative AI

4. Competition Landscape

  • 4.1. Business Strategies Adopted by Key Players
  • 4.2. Consolidated SWOT Analysis of Key Players
  • 4.3. Global Semiconductor Assembly And Packaging Equipment Key Players (Top 3 - 5) Market Share/Ranking, 2024

5. Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 5.1. Key Findings
  • 5.2. By Type (USD)
    • 5.2.1. Die Bonders
    • 5.2.2. Wire Bonders
    • 5.2.3. Packaging Equipment
    • 5.2.4. Others
  • 5.3. By Application (USD)
    • 5.3.1. IDMs
    • 5.3.2. OSAT
  • 5.4. By End-Use Industry (USD)
    • 5.4.1. Consumer Electronics
    • 5.4.2. Automotive Electronics
    • 5.4.3. Industrial Electronics
    • 5.4.4. Medical Devices
    • 5.4.5. Aerospace and Defense
    • 5.4.6. Others
  • 5.5. By Region (USD)
    • 5.5.1. North America
    • 5.5.2. Europe
    • 5.5.3. Asia Pacific
    • 5.5.4. Middle East & Africa
    • 5.5.5. South America

6. North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 6.1. Key Findings
  • 6.2. By Type (USD)
    • 6.2.1. Die Bonders
    • 6.2.2. Wire Bonders
    • 6.2.3. Packaging Equipment
    • 6.2.4. Others
  • 6.3. By Application (USD)
    • 6.3.1. IDMs
    • 6.3.2. OSAT
  • 6.4. By End-Use Industry (USD)
    • 6.4.1. Consumer Electronics
    • 6.4.2. Automotive Electronics
    • 6.4.3. Industrial Electronics
    • 6.4.4. Medical Devices
    • 6.4.5. Aerospace and Defense
    • 6.4.6. Others
  • 6.5. By Country (USD)
    • 6.5.1. United States
      • 6.5.1.1. By Type (USD)
    • 6.5.2. Canada
      • 6.5.2.1. By Type (USD)
    • 6.5.3. Mexico
      • 6.5.3.1. By Type (USD)

7. South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 7.1. Key Findings
  • 7.2. By Type (USD)
    • 7.2.1. Die Bonders
    • 7.2.2. Wire Bonders
    • 7.2.3. Packaging Equipment
    • 7.2.4. Others
  • 7.3. By Application (USD)
    • 7.3.1. IDMs
    • 7.3.2. OSAT
  • 7.4. By End-Use Industry (USD)
    • 7.4.1. Consumer Electronics
    • 7.4.2. Automotive Electronics
    • 7.4.3. Industrial Electronics
    • 7.4.4. Medical Devices
    • 7.4.5. Aerospace and Defense
    • 7.4.6. Others
  • 7.5. By Country (USD)
    • 7.5.1. Brazil
      • 7.5.1.1. By Type (USD)
    • 7.5.2. Argentina
      • 7.5.2.1. By Type (USD)
    • 7.5.3. Rest of South America

8. Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 8.1. Key Findings
  • 8.2. By Type (USD)
    • 8.2.1. Die Bonders
    • 8.2.2. Wire Bonders
    • 8.2.3. Packaging Equipment
    • 8.2.4. Others
  • 8.3. By Application (USD)
    • 8.3.1. IDMs
    • 8.3.2. OSAT
  • 8.4. By End-Use Industry (USD)
    • 8.4.1. Consumer Electronics
    • 8.4.2. Automotive Electronics
    • 8.4.3. Industrial Electronics
    • 8.4.4. Medical Devices
    • 8.4.5. Aerospace and Defense
    • 8.4.6. Others
  • 8.5. By Country (USD)
    • 8.5.1. U.K.
      • 8.5.1.1. By Type (USD)
    • 8.5.2. Germany
      • 8.5.2.1. By Type (USD)
    • 8.5.3. France
      • 8.5.3.1. By Type (USD)
    • 8.5.4. Italy
      • 8.5.4.1. By Type (USD)
    • 8.5.5. Rest of Europe

9. Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 9.1. Key Findings
  • 9.2. By Type (USD)
    • 9.2.1. Die Bonders
    • 9.2.2. Wire Bonders
    • 9.2.3. Packaging Equipment
    • 9.2.4. Others
  • 9.3. By Application (USD)
    • 9.3.1. IDMs
    • 9.3.2. OSAT
  • 9.4. By End-Use Industry (USD)
    • 9.4.1. Consumer Electronics
    • 9.4.2. Automotive Electronics
    • 9.4.3. Industrial Electronics
    • 9.4.4. Medical Devices
    • 9.4.5. Aerospace and Defense
    • 9.4.6. Others
  • 9.5. By Country (USD)
    • 9.5.1. China
      • 9.5.1.1. By Type (USD)
    • 9.5.2. India
      • 9.5.2.1. By Type (USD)
    • 9.5.3. Japan
      • 9.5.3.1. By Type (USD)
    • 9.5.4. South Korea
      • 9.5.4.1. By Type (USD)
    • 9.5.5. Rest of Asia Pacific

10. Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 10.1. Key Findings
  • 10.2. By Type (USD)
    • 10.2.1. Die Bonders
    • 10.2.2. Wire Bonders
    • 10.2.3. Packaging Equipment
    • 10.2.4. Others
  • 10.3. By Application (USD)
    • 10.3.1. IDMs
    • 10.3.2. OSAT
  • 10.4. By End-Use Industry (USD)
    • 10.4.1. Consumer Electronics
    • 10.4.2. Automotive Electronics
    • 10.4.3. Industrial Electronics
    • 10.4.4. Medical Devices
    • 10.4.5. Aerospace and Defense
    • 10.4.6. Others
  • 10.5. By Country (USD)
    • 10.5.1. GCC
      • 10.5.1.1. By Type (USD)
    • 10.5.2. South Africa
      • 10.5.2.1. By Type (USD)
    • 10.5.3. Rest of MEA

11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)

  • 11.1. Kulicke and Soffa Industries, Inc.
    • 11.1.1. Overview
      • 11.1.1.1. Key Management
      • 11.1.1.2. Headquarters
      • 11.1.1.3. Offerings/Business Segments
    • 11.1.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.1.2.1. Employee Size
      • 11.1.2.2. Past and Current Revenue
      • 11.1.2.3. Geographical Share
      • 11.1.2.4. Business Segment Share
      • 11.1.2.5. Recent Developments
  • 11.2. ASMPT
    • 11.2.1. Overview
      • 11.2.1.1. Key Management
      • 11.2.1.2. Headquarters
      • 11.2.1.3. Offerings/Business Segments
    • 11.2.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.2.2.1. Employee Size
      • 11.2.2.2. Past and Current Revenue
      • 11.2.2.3. Geographical Share
      • 11.2.2.4. Business Segment Share
      • 11.2.2.5. Recent Developments
  • 11.3. Besi
    • 11.3.1. Overview
      • 11.3.1.1. Key Management
      • 11.3.1.2. Headquarters
      • 11.3.1.3. Offerings/Business Segments
    • 11.3.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.3.2.1. Employee Size
      • 11.3.2.2. Past and Current Revenue
      • 11.3.2.3. Geographical Share
      • 11.3.2.4. Business Segment Share
      • 11.3.2.5. Recent Developments
  • 11.4. TOWA Corporation
    • 11.4.1. Overview
      • 11.4.1.1. Key Management
      • 11.4.1.2. Headquarters
      • 11.4.1.3. Offerings/Business Segments
    • 11.4.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.4.2.1. Employee Size
      • 11.4.2.2. Past and Current Revenue
      • 11.4.2.3. Geographical Share
      • 11.4.2.4. Business Segment Share
      • 11.4.2.5. Recent Developments
  • 11.5. SHINKAWA Electric Co., Ltd.
    • 11.5.1. Overview
      • 11.5.1.1. Key Management
      • 11.5.1.2. Headquarters
      • 11.5.1.3. Offerings/Business Segments
    • 11.5.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.5.2.1. Employee Size
      • 11.5.2.2. Past and Current Revenue
      • 11.5.2.3. Geographical Share
      • 11.5.2.4. Business Segment Share
      • 11.5.2.5. Recent Developments
  • 11.6. Hana Micron
    • 11.6.1. Overview
      • 11.6.1.1. Key Management
      • 11.6.1.2. Headquarters
      • 11.6.1.3. Offerings/Business Segments
    • 11.6.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.6.2.1. Employee Size
      • 11.6.2.2. Past and Current Revenue
      • 11.6.2.3. Geographical Share
      • 11.6.2.4. Business Segment Share
      • 11.6.2.5. Recent Developments
  • 11.7. SUSS MicroTec SE
    • 11.7.1. Overview
      • 11.7.1.1. Key Management
      • 11.7.1.2. Headquarters
      • 11.7.1.3. Offerings/Business Segments
    • 11.7.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.7.2.1. Employee Size
      • 11.7.2.2. Past and Current Revenue
      • 11.7.2.3. Geographical Share
      • 11.7.2.4. Business Segment Share
      • 11.7.2.5. Recent Developments
  • 11.8. ASM International
    • 11.8.1. Overview
      • 11.8.1.1. Key Management
      • 11.8.1.2. Headquarters
      • 11.8.1.3. Offerings/Business Segments
    • 11.8.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.8.2.1. Employee Size
      • 11.8.2.2. Past and Current Revenue
      • 11.8.2.3. Geographical Share
      • 11.8.2.4. Business Segment Share
      • 11.8.2.5. Recent Developments
  • 11.9. Disco Corporation
    • 11.9.1. Overview
      • 11.9.1.1. Key Management
      • 11.9.1.2. Headquarters
      • 11.9.1.3. Offerings/Business Segments
    • 11.9.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.9.2.1. Employee Size
      • 11.9.2.2. Past and Current Revenue
      • 11.9.2.3. Geographical Share
      • 11.9.2.4. Business Segment Share
      • 11.9.2.5. Recent Developments
  • 11.10. Advantest Corporation
    • 11.10.1. Overview
      • 11.10.1.1. Key Management
      • 11.10.1.2. Headquarters
      • 11.10.1.3. Offerings/Business Segments
    • 11.10.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.10.2.1. Employee Size
      • 11.10.2.2. Past and Current Revenue
      • 11.10.2.3. Geographical Share
      • 11.10.2.4. Business Segment Share
      • 11.10.2.5. Recent Developments

12. Key Takeaways

List of Tables

  • Table 1: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 2: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 3: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 4: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 5: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Region, 2019 - 2032
  • Table 6: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 7: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 8: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 9: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 10: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 11: U.S. Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 12: Canada Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 13: Mexico Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 14: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 15: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 16: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 17: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 18: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 19: U.K. Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 20: Germany Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 21: France Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 22: Italy Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 23: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 24: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 25: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 26: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 27: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 28: China Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 29: Japan Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 30: India Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 31: South Korea Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 32: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 33: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 34: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 35: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 36: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 37: GCC Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 38: South Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 39: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 40: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 41: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 42: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 43: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 44: Brazil Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 45: Argentina Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032

List of Figures

  • Figure 1: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 2: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 3: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 4: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 5: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Region, 2024 and 2032
  • Figure 6: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 7: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 8: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 9: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 10: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 11: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 12: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 13: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 14: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 15: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 16: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 17: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 18: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 19: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 20: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 21: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 22: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 23: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 24: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 25: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 26: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 27: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 28: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 29: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 30: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 31: Global Semiconductor Assembly And Packaging Equipment Key Players' Market Share/Ranking (%), 2024