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市场调查报告书
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1540729

6G 无线技术半导体的成长机会

Growth Opportunities in Semiconductors for 6G Wireless Technology

出版日期: | 出版商: Frost & Sullivan | 英文 68 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

人工智慧晶片组和化合物半导体发挥变革性作用,实现下一代蜂窝无线电技术营运和经济目标

无线通讯系统依靠 PA 、 LNA 和收发器(统称为 RF FEM)等半导体组件来处理无线电单元 (RU)、基频单元 (BBU) 和网路核心之间的讯号,以确保客户接收到讯号。资料的无线讯号。

通讯系统依赖其他半导体组件,例如天线积体电路 (IC)、包络追踪器、微处理器、类比设备和光学组件来根据需要处理讯号。儘管技术从 2G 发展到 5G,但无线通讯中使用的半导体类型并没有太大变化。然而,对半导体元件的性能要求不断提高。因此,设计、材料、製造和封装技术随着每一代新一代无线通讯的发展而发展。

随着5G无线技术进入部署阶段,产业领导者已开始讨论下一代无线技术(6G)的发展,预计于2030年开始早期商业化。 6G 的到来标誌着通讯的新时代,它提供了超越资料的新服务。这项研究重点关注边缘的分散式和联合学习、边缘和核心之间的协作推理、终端设备的自主能力、利用人工智慧开发以人性化的通讯服务、通讯通讯、运算、感测、控制等几个接取网路。

为了开发 6G,产业相关人员正在共同努力规划每个子技术的组件和构建块,以促进下一代无线技术的发展。与相关人员的早期讨论已经达成共识,需要具有高效能功能(运算和射频)的先进半导体来实现高速资料传输和高频率。

目录

策略要务

  • 为什么成长如此困难?
  • The Strategic Imperative 8(TM)
  • 关键策略要务对 6G 半导体产业的影响
  • 成长机会推动Growth Pipeline Engine(TM)

6G 半导体成长机会分析 - 6G 概述

  • 主要发现
  • 分析范围
  • 6G - 蜂窝演进概述和理想的 6G 网路特性
  • 为什么是6G?为什么是现在?
  • 6G商用蓝图
  • 6G - 整合技术蓝图
  • 生长促进因子
  • 成长抑制因素
  • 6G生态系统

6G半导体成长机会分析-AI处理器半导体

  • 为什么人工智慧处理器对于 6G 至关重要
  • 将 AI 融入 RAN 打造通讯的未来 - ORAN 基础设施
  • 6G网路基础设施中的人工智慧——AI-RAN的兴起
  • 边缘运算
  • 6G 中的边缘人工智慧—潜在应用领域
  • 6G 网路中边缘 AI 晶片组的重点关注领域
  • 了解当前处理器以评估 6G 要求 -主要企业和产品
  • 6G 中的 AI – 如何决定运算效能要求
  • 硅光电(SiPh) 的到来
  • 6G网路人工智慧半导体的区域竞争力
  • 使 6G 技术成为现实的显着发展、倡议、活动和合作
  • 半导体公司对人工智慧的重大投资
  • 6G人工智慧半导体生态系统
  • 未来五年预估的研究活动
  • 6G 中的人工智慧—网路安全和永续性的重要性

6G 半导体的成长机会 - RF Semiconductors

成长机会领域 - 按地区分類的 6G 研究计划

成长机会宇宙 - 6G 半导体必不可少的关键应用及其背景

  • 6G 半导体 - 机会背景,依主要应用分类:AV/智慧製造
  • 6G 半导体 - 机会背景,按主要应用划分:医疗保健、智慧城市
  • 应用简介-工业元宇宙
  • 应用简介 - 行动性

成长机会宇宙

  • 成长机会 1 - 核心与边缘的认知智能
  • 成长机会 2 – 专用晶片组
  • 成长机会3-利用政府资金与政策
  • 材料清单
  • 免责声明
简介目录
Product Code: K979-30

AI Chipsets and Compound Semiconductors Will Play a Transformational Role, Enabling the Operational and Economic Targets of Next-gen Cellular Wireless Technology

Wireless communication systems rely on semiconductor components, such as PAs, LNAs, and transceivers (together known as RF FEMs), to process signals to and from the radio unit (RU), baseband unit (BBU), and the network core to ensure customers receive the radio signals that carry the data and services.

The communication system relies on other semiconductor components, such as antenna integrated circuits (ICs), envelope trackers, microprocessors, analog devices, and optical components, to process signals as necessary. The type of semiconductors that wireless telecom communication uses has not changed much with the 2G to 5G evolution of technologies. However, the semiconductor components' performance requirements have increased. Hence, the designs, materials, manufacturing, and packaging technologies have evolved with each new wireless communication generation.

Because 5G wireless technology is in the deployment stage, industry leaders have begun discussions about developing the next-gen wireless technology (6G) and plan to begin early commercialization in 2030. The dawn of 6G will represent a new era of communication that will provide new services beyond data. The study discusses distributed and federated learning at the edge, co-inferencing between edge and core, autonomous functioning of end devices, the development of AI-powered human-centric telecom services, joint communication, computing, sensing, and control, and several other concepts, which represent a transformation from radio access network (RAN) architecture to services.

To develop 6G, industry stakeholders are collaborating to plan the components and building blocks of each sub-technology that will lead to the development of the next-gen wireless technology. Initial stakeholder discussions are leading to an understanding that advanced semiconductors with high-performance capabilities (in computing and RF) will be necessary to enable high-speed data transfer and operate at high frequencies.

  • This analysis aims to understand the changes expected in 6G wireless communication from a context of the semiconductor industry, with specific focus on RAN, and the edge.
  • From a component perspective, the analysis focuses on the AI-processors, and the key RF components required at the network RAN and the edge.
  • The analysis does not cover the changes expected in discrete, analog, memory, optical, and sensing products.
  • It aims to provide a qualitative view based on the developments during the study period and is subject to change in the future.
  • It does not aim to provide a quantitative overview of the market potential.

Table of Contents

Strategic Imperatives

  • Why is it Increasingly Difficult to Grow?
  • The Strategic Imperative 8™
  • The Impact of the Top 3 Strategic Imperatives on the 6G Semiconductors Industry
  • Growth Opportunities Fuel the Growth Pipeline Engine™

Growth Opportunity Analysis in Semiconductors for 6G-6G Overview

  • Primary Findings
  • Scope of Analysis
  • 6G-Overview of Cellular Evolution and Desired 6G Network Characteristics
  • Why 6G? Why Now?
  • 6G Roadmap to Commercialization
  • 6G-Integrated Technology Roadmap
  • Growth Drivers
  • Growth Restraints
  • 6G Ecosystem

Growth Opportunity Analysis in Semiconductors for 6G-AI-Processor Semiconductors

  • Why are AI Processors Critical for 6G?
  • Infusing AI into RAN for the Future of Telecom-Open Radio Access Network (ORAN) Infrastructure
  • AI in 6G Network Infrastructure-Emergence of AI-RAN
  • Edge Computing
  • Edge AI in 6G-Potential Application Universe
  • Primary Focus Areas for Edge AI Chipsets in the 6G Network
  • Understanding Current Processors to Evaluate 6G Requirements- Primary Companies and Products
  • AI in 6G-How to Determine Compute Performance Requirements
  • The Coming of Silicon Photonics (SiPh)
  • Regional Competency of AI Semiconductors for 6G Networking
  • Notable Developments, Initiatives, Activities, and Collaborations to Realize 6G Technology
  • Notable Investments in AI by Semiconductor Companies
  • The AI-Semiconductor Ecosystem for 6G
  • Expected Research Efforts in the Next 5 Years
  • AI in 6G-The Significance of Cybersecurity and Sustainability

6G Semiconductor Growth Opportunity-RF Semiconductors

  • RF Semiconductors in 6G-Enabling 100 GHz and Higher Operational Frequencies
  • RF Semiconductors in 6G-Process Node Trajectory
  • RF Semiconductors in 6G-Exploring Materials Beyond Si
  • RF Semiconductors in 6G-Exploring Materials Beyond Si: GaN
  • RF Semiconductors in 6G-Exploring Materials Beyond Si: InP
  • RF Semiconductors in 6G-Advanced Packaging Technologies
  • RF Semiconductors in 6G-GaN and InP Gaining R&D Traction for Application in Next-gen Wireless Technology
  • RF in 6G-Primary Products Enabling the Research and Development of 6G
  • RF in 6G Investments and R&D Initiatives that Semiconductor Companies Have Announced
  • RF in 6G-Primary Regional Initiatives and Investments
  • RF in 6G-Ultra-wide Bandgap (UWBG) Semiconductors
  • The AI Semiconductor Ecosystem in 6G

Growth Opportunity Universe-6G Research Initiatives by Region

  • 6G Research and Collaboration Initiatives by Primary Regions
  • 6G Patent Applications by Region (2019-2021)

Growth Opportunity Universe-Key Applications and Context of the imperative for 6G Semiconductors

  • Semiconductors for 6G-Context of Opportunities by Primary Applications: AVs and Smart Manufacturing
  • Semiconductors for 6G-Context of Opportunity by Primary Applications: Healthcare and Smart Cities
  • Application Profile-Industry Metaverse
  • Application Profile-Mobility

Growth Opportunity Universe

  • Growth Opportunity 1-Cognitive Intelligence at the Core and Edge
  • Growth Opportunity 2-Application-specific Chipsets
  • Growth Opportunity 3-Leverage Government Funding and Policies
  • List of Exhibits
  • Legal Disclaimer