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半导体生产设备

市场调查报告书

商品编码

1495559

物联网晶片组市场- 按硬体（处理器、连接IC、感测器、记忆体、逻辑装置等）、按功耗（小于1 W、1 - 3 W、3 - 5 W、5 - 10 W、超过10 ) W)，依最终用途产业，2024 - 2032 年预测

IoT Chipset Market - By Hardware (Processors, Connectivity ICs, Sensors, Memory Devices, Logic Devices, Others), By Power Consumption (Less than 1 W, 1 - 3 W, 3 - 5 W, 5 - 10 W, more than 10 W), By End-use Industry, Forecast 2024 - 2032

出版日期: 2024年03月26日 | 出版商:

Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3个工作天内

价格

简介目录

由于物联网设备在医疗保健、农业和智慧城市等各个领域的激增，预计 2024 年至 2032 年物联网晶片组市场规模的复合年增长率将超过 6.4%。半导体技术的突破性发展（例如小型化和能源效率）正在增强物联网晶片组的效能和功能。例如，2023 年 6 月，高通推出了两款晶片组 212S 和 9205S，促进透过地球同步卫星实现物联网的资料链路。这两款晶片组均支援 Qualcomm Aware 云端平台，可在离网、偏远地区实现即时资产追踪和装置管理。

对物联网基础设施和连接解决方案的投资不断增加，加上云端运算和边缘运算平台的日益普及，进一步增强了这些晶片组的吸引力。将人工智慧和机器学习演算法整合到物联网晶片组中还可以实现高级资料分析和自动化功能，推动物联网技术在不同应用中的采用。

物联网晶片组产业分为硬体、功耗、最终用途产业和地区。

基于硬件，由于对处理物联网设备产生的大量资料的高效能运算能力的需求激增，预计到 2032 年，处理器领域的行业份额复合年增长率将超过 6%。半导体技术的重大进步，包括开发强大且节能的处理器，正在增强物联网晶片组的处理能力。物联网应用日益复杂以及对即时资料处理的需求不断增长也刺激了产品需求。

预计从2024 年到2032 年，航空航太和国防最终用途领域的物联网晶片组市场将以令人称讚的速度增长。和安全性。对即时资料分析、远端监控和预测性维护的需求不断增长，正在推动物联网晶片组在国防应用中的整合。感测器技术和通讯系统的快速进步也将加速航空航太和国防领域的产品部署。

从地区来看，由于智慧城市计画、工业自动化和互联医疗保健解决方案的日益普及，欧洲物联网晶片组市场预计在 2024 年至 2032 年间将以超过 6.5% 的复合年增长率强劲增长。支持性政府政策的推出正在促进物联网的部署，例如研发资金和创建物联网友善的监管框架的措施。领先半导体製造商的存在和该行业的创新也正在推动区域市场的扩张。

产业生态系统分析
供应商格局
利润率分析
技术与创新格局
专利分析
重要新闻和倡议
监管环境
衝击力
- 成长动力
  - 智慧家庭对互联设备的需求不断增长
  - 工业自动化中越来越多地采用物联网技术
  - 穿戴式装置日益普及
  - 物流和供应链管理中对物联网解决方案的需求不断增长
  - 人们对智慧零售解决方案的兴趣日益浓厚
- 产业陷阱与挑战
  - 能量消耗
  - 成本和复杂性
成长潜力分析
波特的分析
PESTEL分析

第 4 章：竞争格局

介绍
公司市占率分析
竞争定位矩阵
战略展望矩阵

第 5 章：市场估计与预测：按硬体划分，2018 年 - 2032 年

主要趋势
处理器
连接IC
感应器
储存装置
逻辑元件
其他的

第 6 章：市场估计与预测：依功耗划分，2018 年 - 2032 年

主要趋势
小于1W
1 - 3 瓦
3-5瓦
5 - 10 瓦
10W以上

第 7 章：市场估计与预测：依最终用途产业，2018 - 2032 年

主要趋势
航太与国防
汽车与运输
BFSI
楼宇自动化
消费性电子产品
卫生保健
零售
製造业
石油和天然气
其他的

第 8 章：市场估计与预测：按地区划分，2018 年 - 2032 年

主要趋势
北美洲
- 我们
- 加拿大
欧洲
- 英国
- 德国
- 法国
- 义大利
- 西班牙
- 俄罗斯
- 欧洲其他地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 澳新银行
- 亚太地区其他地区
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地区
MEA
- 阿联酋
- 沙乌地阿拉伯
- 南非
- MEA 的其余部分

第 9 章：公司简介

Analog Devices Inc.
Cypress Semiconductor Corporation
Intel Corporation
Invensense Inc.
Mediatek Inc.
Microchip Technology Inc.
Nordic Semiconductor ASA
NXP Semiconductors NV
Qualcomm Technologies Inc.
Samsung Electronics Co. Ltd
Silicon Laboratories Inc.
STMicroelectronics NV
Texas Instruments Incorporated

简介目录

Product Code: 8727

IoT Chipset Market size is expected to depict over 6.4% CAGR from 2024 to 2032, due to the proliferation of IoT devices across various sectors, including healthcare, agriculture, and smart cities. Groundbreaking developments in semiconductor technology, like miniaturization and energy efficiency are enhancing the performance and capabilities of IoT chipsets. For instance, in June 2023, Qualcomm launched two chipsets, the 212S and the 9205S, facilitating data links via geostationary satellites for IoT. Both chipsets support the Qualcomm Aware cloud platform, enabling real-time asset tracking and device management in off-grid, remote areas.

The increasing investments in IoT infrastructure and connectivity solutions, coupled with the growing adoption of cloud computing and edge computing platforms are further accelerating the appeal of these chipsets. The integration of AI and machine learning algorithms into IoT chipsets is also enabling advanced data analytics and automation capabilities, driving the adoption of IoT technologies across diverse applications.

The IoT chipsets industry is bifurcated into hardware, power consumption, end-use industry, and region.

Based on hardware, the industry share from the processors segment is estimated to witness over 6% CAGR notable rate through 2032, driven by the surging demand for high-performance computing capabilities to process vast amounts of data generated by IoT devices. Significant advancements in semiconductor technology, including the development of powerful and energy-efficient processors are enhancing the processing capabilities of IoT chipsets. The increasing complexity of IoT applications and the rising need for real-time data processing is also spurring the product demand.

IoT chipsets market from the aerospace & defense end-use segment is estimated to rise at commendable rate from 2024 to 2032. This can be attributed to the increasing adoption of IoT technologies for enhancing aircraft performance, maintenance, and security. The ever-increasing demand for real-time data analytics, remote monitoring, and predictive maintenance are driving the integration of IoT chipsets in defense applications. Rapid advancements in sensor technologies and communication systems will also accelerate the product deployment in aerospace and defense sectors.

Regionally, the Europe IoT chipsets market is anticipated to experience robust growth at over 6.5% CAGR between 2024 and 2032, due to the increasing adoption of smart city initiatives, industrial automation, and connected healthcare solutions. The launch of supportive government policies is promoting IoT deployment, such as funding for R&D and initiatives to create IoT-friendly regulatory frameworks. The presence of leading semiconductor manufacturers and innovations in the sector are also driving the regional market expansion.

Chapter 1 Methodology & Scope

1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 IoT chipset industry 360 degree synopsis, 2018 - 2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Supplier landscape
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news & initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Increasing demand for connected devices in smart homes
  - 3.8.1.2 Growing adoption of IoT technology in industrial automation
  - 3.8.1.3 Rising popularity of wearable devices
  - 3.8.1.4 Growing demand for IoT solutions in logistics and supply chain management
  - 3.8.1.5 Growing interest in smart retail solutions
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Power consumption
  - 3.8.2.2 Cost and complexity
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Hardware, 2018 - 2032 (USD Billion)

5.1 Key trends
5.2 Processors
5.3 Connectivity ICs
5.4 Sensors
5.5 Memory devices
5.6 Logic devices
5.7 Others

Chapter 6 Market Estimates & Forecast, By Power Consumption, 2018 - 2032 (USD Billion)

6.1 Key trends
6.2 Less than 1 W
6.3 1 - 3 W
6.4. 3 - 5 W
6.5. 5 - 10 W
6.6 More than 10 W

Chapter 7 Market Estimates & Forecast, By End-Use Industry, 2018 - 2032 (USD Billion)

7.1 Key trends
7.2 Aerospace & Defense
7.3 Automotive & Transportation
7.4 BFSI
7.5 Building automation
7.6 Consumer electronics
7.7 Healthcare
7.8 Retail
7.9 Manufacturing
7.10 Oil & Gas
7.11 Others

Chapter 8 Market Estimates & Forecast, By Region, 2018 - 2032 (USD Billion)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Russia
- 8.3.7 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 Saudi Arabia
- 8.6.3 South Africa
- 8.6.4 Rest of MEA