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全球半导体製造设备市场：市场份额、市场预测
市场调查报告书
商品编码
1266872

全球半导体製造设备市场：市场份额、市场预测

Global Semiconductor Equipment: Markets, Market Shares and Market Forecasts
出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3个工作天内

价格

本报告审视了全球半导体设备市场，提供了对 27 个行业中每个行业的分析以及 49 家主要供应商的概况。

内容

第一章介绍

第 2 章半导体行业驱动因素

  • 介绍
  • 铸造厂
    • 代工资本投资趋势
    • 代工收入增长
    • 代工市场份额
    • 代工收入增长
    • 全球铸造市场趋势：按应用分类
    • 按客户类型划分的全球铸造市场趋势
    • 按设备划分的全球代工市场趋势
    • 铸造技术线宽路线图
    • 按线宽划分的产能趋势
    • 产能比率：按地区
  • 动态随机存取存储器
    • DRAM 当前和未来的产能：按製造商分类
    • DRAM 收入需求预测：按应用分类
    • DRAM 市场份额
    • DRAM 资本投资
  • 与非
    • NAND 收入需求预测：按应用
    • NAND 市场份额
    • 3D NAND 产能
  • 中国
    • 中国半导体基础设施
    • 中国半导体市场
    • 中国集成电路生产
    • 中国集成电路消费
    • 中国 IC 生产/消费比率
    • 中国 IC 进口要求
    • 中国集成电路的供需
    • 中国 IC 晶圆厂产能
    • 中国 IC 晶圆厂产能：按地区
    • 中国的 8 英寸和 12 英寸晶圆厂和代工厂
    • 按晶圆尺寸划分的中国 IC 晶圆厂产能
    • 中国 IC 製造能力：按形状分类
    • 中国 IC 产量：按类型分类

第3章市场业务部门份额及预测

  • AMHS 市场份额和预测
  • CMP 市场份额和预测
  • 清洁市场份额和预测
    • 等离子条
    • 喷雾处理器
    • 湿站
  • 沉积市场份额和预测
    • ALD
    • 外延
    • 有机化学气相沉积
    • LPCVD（无管）
    • LPCVD（管）
    • 化学气相沉积
    • 物理气相沉积
  • 离子注入市场份额和预测
    • 高电流
    • 高能量
    • 中电流
  • 光刻市场份额和预测
    • 直写电子束光刻
    • 掩模製造光刻
    • 步进器
  • 氧化/扩散市场份额和预测
  • 光刻胶工艺（卡车）市场份额及预测
  • RTP 市场份额和预测
  • 等离子蚀刻市场份额和预测
    • 电介质
    • 电导率
  • 过程控制市场份额和预测
    • 光刻计量
    • 薄膜测量
    • 晶圆检查和缺陷审查
  • 晶圆级封装市场份额和预测

第 4 章美国半导体设备供应商 - 概况

  • 应用材料
  • Axcelis 技术
  • KLA-Tencor
  • 林研究
  • 纳米学
  • 鲁道夫科技
  • 维科

第 5 章欧洲半导体设备供应商 - 概况

  • 爱思强
  • ASM 国际
  • 阿斯麦
  • 卡尔蔡司
  • 康泰克
  • 电动汽车集团
  • LPE
  • 迈克罗尼克
  • 新星测量仪器
  • 欧瑞康/Evatec
  • Semilab

第 6 章亚洲半导体设备供应商 - 概况

  • Advantest
  • Canon
  • Canon Anelva
  • Daifuku
  • Ebara
  • Eugene Technology
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • JEOL
  • Jusung Engineering
  • KC Tech
  • Lasertec
  • Murata Machinery
  • Nikon
  • Nippon Sanso
  • Nissin Ion Equipment
  • NuFlare Technology
  • PSK
  • Screen Semiconductor Solutions
  • SEMES
  • SEN
  • TES
  • Tokyo Electron
  • Tokyo Seimitsu
  • Topcon Technohouse
  • Toray Engineering
  • Ulvac
  • Ushio
  • Wonik IPS

Semiconductor manufacturers are accelerating their shrinkage roadmap. The demand for semiconductor equipment is largely driven by the additional tools required to migrate chip designs to leading-edge nodes. With capacity-driven capex slowing down, semiconductor equipment demand may be unaffected if chipmakers are moving more aggressively to the leading-edge nodes.

China will further accelerate its semiconductor roadmap and capacity-building progress: China has been actively expanding its semiconductor-production capacity and manufacturing facilities. There has been no significant disruption to China's semiconductor industry during the COVID-19 outbreak. For example, Wuhan-based Yangtze Memory Technologies (YMTC) continued operations throughout the lockdown. China currently spends about $5bn on wafer-fab equipment and it can help to offset any potential capex cut from the large chipmakers if it believes its current progress justifies additional investment.

The semiconductor equipment industry's revenue is highly sensitive to the type of chips that are driving demand. The level of semiconductor capex spent by chipmakers: Semiconductor equipment players' revenues are highly sensitive to the capex of chipmakers, such as foundry/logic players (Intel, Taiwan Semiconductor Manufacturing Company, Samsung LSI) and memory players (Micron, SK Hynix and Samsung).

General demand and types of chips required: New semiconductor equipment is required more in making leading-edge chips and computationally intense applications, such as application processors, server chips and CPUs.

The demand for semiconductor equipment is largely driven by the additional tools required for chipmakers to migrate to leading-edge nodes. This is especially the case because ALD tools are required more in foundry and logic chip manufacturing processes. Foundry and logic players are, compared with memory manufacturers, more committed to their shrinkage roadmaps and are therefore more likely to invest in advanced tools, such as ALD.

This report describes the semiconductor equipment markets for 27 different sectors and profiles 49 leading equipment suppliers in the U.S., Europe, and Asia. Market shares for each company for each sector are presented.

Table of Contents

Chapter 1 Introduction

Chapter 2 Semiconductor Industry Driving Forces

  • 2.1. Introduction
  • 2.2. Foundries
    • 2.2.1. Foundry Capex Trends
    • 2.2.2. Foundry Revenue Growth
    • 2.2.3. Foundry Market Share
    • 2.2.4. Revenue Growth by Foundry
    • 2.2.5. Global Foundry Market Trend by Application
    • 2.2.6. Global Foundry Market Trend by Customer Type
    • 2.2.7. Global Foundry Market Trend by Device
    • 2.2.8. Foundry Technology Linewidth Roadmap
    • 2.2.9. Capacity trend by linewidth
    • 2.2.10. Capacity ratio by region
  • 2.3. DRAM
    • 2.3.1. Present and Future Capacity of DRAM by Manufacturer
    • 2.3.2. DRAM Revenue Demand Forecast By Application
    • 2.3.3. DRAM Market Shares
    • 2.3.4. DRAM Capex
  • 2.4. NAND
    • 2.4.1. NAND Revenue Demand Forecast By Applications
    • 2.4.2. NAND Market Shares
    • 2.4.3. 3D NAND Capacity
  • 2.5. China
    • 2.5.1. China's Semiconductor Infrastructure
    • 2.5.2. China's Semiconductor Market
    • 2.5.3. China's IC Production
    • 2.5.4. China's IC Consumption
    • 2.5.5. China's IC Production/Consumption Ratio
    • 2.5.6. China's IC Import Requirements
    • 2.5.7. China's IC Supply/Demand
    • 2.5.8. China's IC Fab Capacity
    • 2.5.9. China's IC Fab Capacity by Region
    • 2.5.10. China's 8- And 12-Inch Fabs and Foundries
    • 2.5.11. China's IC Fab Capacity by Wafer Size
    • 2.5.12. China's IC Fab Capacity by Geometry
    • 2.5.13. China's IC Production by Type

Chapter 3 Market Business Sectors Shares and Forecast

  • 3.1. AMHS Market Shares and Forecast
  • 3.2. CMP Market Shares and Forecast
  • 3.3. Clean Market Shares and Forecast
    • 3.3.1. Plasma Strip
    • 3.3.2. Spray Processors
    • 3.3.3. Wet Stations
  • 3.4. Deposition Market Shares and Forecast
    • 3.4.1. ALD
    • 3.4.2. Epitaxy
    • 3.4.3. MOCVD
    • 3.4.4. LPCVD (non-tube)
    • 3.4.5. LPCVD (tube)
    • 3.4.6. PECVD
    • 3.4.7. PVD
  • 3.5. Ion Implantation Market Shares and Forecast
    • 3.5.1. High-Current
    • 3.5.2. High-Energy
    • 3.5.3. Medium-Current
  • 3.6. Lithography Market Shares and Forecast
    • 3.6.1. Direct-Write E-Beam Lithography
    • 3.6.2. Mask-Making Lithography
    • 3.6.3. Steppers
  • 3.7. Oxidation/Diffusion Market Shares and Forecast
  • 3.8. Photoresist Processing (Track) Market Shares and Forecast
  • 3.9. RTP Market Shares and Forecast
  • 3.10. Plasma Etch Market Shares and Forecast
    • 3.10.1. Dielectric
    • 3.10.2. Conductive
  • 3.11. Process Control Market Shares and Forecast
    • 3.11.1. Lithography Metrology
    • 3.11.2. Thin-Film Metrology
    • 3.11.3. Wafer Inspection and Defect Review
  • 3.12. Wafer-Level Packaging Market Shares and Forecast

Chapter 4 U.S. Semiconductor Equipment Suppliers - Profiles

  • 4.1. Applied Materials
    • 4.1.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.1.2. Company Profile
    • 4.1.3. Company Financials
  • 4.2. Axcelis Technologies
    • 4.1.2. Business Sectors Covered In The Market Analysis Chapter
    • 4.2.2. Company Profile
    • 4.2.3. Company Financials
  • 4.3. KLA-Tencor
    • 4.3.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.3.2. Company Profile
    • 4.3.3. Company Financials
  • 4.4. Lam Research
    • 4.4.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.4.2. Company Profile
    • 4.4.3. Company Financials
  • 4.5. Nanometrics
    • 4.5.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.5.2. Company Profile
    • 4.5.3. Company Financials
  • 4.6. Rudolph Technologies
    • 4.6.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.6.2. Company Profile
    • 4.6.3. Company Financials
  • 4.7. Veeco
    • 4.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 4.7.2. Company Profile
    • 4.7.3. Company Financials

Chapter 5 European Semiconductor Equipment Suppliers - Profiles

  • 5.1. Aixtron
    • 5.1.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.1.2. Company Profile
    • 5.1.3. Company Financials
  • 5.2. ASM International
    • 5.2.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.2.2. Company Profile
    • 5.2.3. Company Financials
  • 5.3. ASML
    • 5.3.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.3.2. Company Profile
    • 5.3.3. Company Financials
  • 5.4. Carl Zeiss
    • 5.4.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.4.2. Company Profile
    • 5.4.3. Company Financials
  • 5.5. Camtek
    • 5.5.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.5.2. Company Profile
    • 5.5.3. Company Financials
  • 5.6. EV Group
    • 5.6.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.6.2. Company Profile
    • 5.6.3. Company Financials
  • 5.7. LPE
    • 5.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.7.2. Company Profile
    • 5.7.3. Company Financials
  • 5.8. Mycronic
    • 5.8.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.8.2. Company Profile
    • 5.8.3. Company Financials
  • 5.9. Nova Measuring Instruments
    • 5.9.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.9.2. Company Profile
    • 5.9.3. Company Financials
  • 5.10. Oerlikon / Evatec
    • 5.10.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.10.2. Company Profile
    • 5.10.3. Company Financials
  • 5.11. Semilab
    • 5.11.1. Business Sectors Covered In The Market Analysis Chapter
    • 5.11.2. Company Profile
    • 5.11.3. Company Financials

Chapter 6 Asian Semiconductor Equipment Suppliers - Profiles

  • 6.1. Advantest
    • 6.1.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.1.2. Company Profile
    • 6.1.3. Company Financials
  • 6.2. Canon
    • 6.2.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.2.2. Company Profile
    • 6.2.3. Company Financials
  • 6.3. Canon Anelva
    • 6.3.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.3.2. Company Profile
    • 6.3.3. Company Financials
  • 6.4. Daifuku
    • 6.4.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.4.2. Company Profile
    • 6.4.3. Company Financials
  • 6.5. Ebara
    • 6.5.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.5.2. Company Profile
    • 6.5.3. Company Financials
  • 6.6. Eugene Technology
    • 6.6.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.6.2. Company Profile
    • 6.6.3. Company Financials
  • 6.7. Hitachi High-Technologies
    • 6.7.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.7.2. Company Profile
    • 6.7.3. Company Financials
  • 6.8. Hitachi Kokusai Electric
    • 6.8.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.8.2. Company Profile
    • 6.8.3. Company Financials
  • 6.9. JEOL
    • 6.9.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.9.2. Company Profile
    • 6.9.3. Company Financials
  • 6.10. Jusung Engineering
    • 6.10.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.10.2. Company Profile
    • 6.10.3. Company Financials
  • 6.11. KC Tech
    • 6.11.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.11.2. Company Profile
    • 6.11.3. Company Financials
  • 6.12. Lasertec
    • 6.12.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.12.2. Company Profile
    • 6.12.3. Company Financials
  • 6.13. Murata Machinery
    • 6.13.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.13.2. Company Profile
    • 6.13.3. Company Financials
  • 6.14. Nikon
    • 6.14.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.14.2. Company Profile
    • 6.14.3. Company Financials
  • 6.15. Nippon Sanso
    • 6.15.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.15.2. Company Profile
    • 6.15.3. Company Financials
  • 6.16. Nissin Ion Equipment
    • 6.16.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.16.2. Company Profile
    • 6.16.3. Company Financials
  • 6.17. NuFlare Technology
    • 6.17.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.17.2. Company Profile
    • 6.17.3. Company Financials
  • 6.18. PSK
    • 6.18.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.18.2. Company Profile
    • 6.18.3. Company Financials
  • 6.19. Screen Semiconductor Solutions
    • 6.19.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.19.2. Company Profile
    • 6.19.3. Company Financials
  • 6.20. SEMES
    • 6.20.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.20.2. Company Profile
    • 6.20.3. Company Financials
  • 6.21. SEN
    • 6.21.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.21.2. Company Profile
    • 6.21.3. Company Financials
  • 6.22. TES
    • 6.22.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.22.2. Company Profile
    • 6.22.3. Company Financials
  • 6.23. Tokyo Electron
    • 6.23.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.23.2. Company Profile
    • 6.23.3. Company Financials
  • 6.24. Tokyo Seimitsu
    • 6.24.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.24.2. Company Profile
    • 6.24.3. Company Financials
  • 6.25. Topcon Technohouse
    • 6.25.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.25.2. Company Profile
    • 6.25.3. Company Financials
  • 6.26. Toray Engineering
    • 6.26.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.26.2. Company Profile
    • 6.26.3. Company Financials
  • 6.27. Ulvac
    • 6.27.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.27.2. Company Profile
    • 6.27.3. Company Financials
  • 6.28. Ushio
    • 6.28.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.28.2. Company Profile
    • 6.28.3. Company Financials
  • 6.29. Wonik IPS
    • 6.29.1. Business Sectors Covered In The Market Analysis Chapter
    • 6.29.2. Company Profile
    • 6.29.3. Company Financials

LIST OF TABLES

  • 2.1. Foundry Capex ($ Billions) And Shares (%)
  • 2.2. Foundry Forecast
  • 2.3. Pure Play Foundry Revenue Shares
  • 2.4. Global Foundry Market By Application
  • 2.5. Global Foundry Market By Customer Type
  • 2.6. Global Foundry Market By Device Type
  • 2.7. Technology Roadmaps For China Foundries
  • 2.8. Global Foundry Market By Linewidth
  • 2.9. Foundry Capacity By Region
  • 2.10. DRAM Wafer Capacity Forecast by Fab - Wafers
  • 2.11. DRAM Bit Growth Demand Forecast by Application
  • 2.12. DRAM Revenue Demand Forecast by Application
  • 2.13. DRAM Market Shares
  • 2.14. DRAM Capex Forecast by Company
  • 2.15. NAND Wafer Capacity by Company Fab
  • 2.16. NAND Bit Growth Supply Forecast by Company
  • 2.17. NAND Bit Growth Demand Forecast by Application
  • 2.18. NAND Market Shares
  • 2.19. 3D NAND Wafer Capacity Forecast by Fab
  • 2-20. Capex Forecast By Memory And Other Ic Manufacturers
  • 2-21. China's 8- And 12-Inch Fabs and Foundries
  • 3.1. AMHS Market Forecast
  • 3.2. CMP Market Forecast
  • 3.3. Plasma Strip Market Forecast
  • 3.4. Spray Processors Market Forecast
  • 3.5. Wet Stations Market Forecast
  • 3.6. ALD Market Forecast
  • 3.7. Epitaxy Market Forecast
  • 3.8. MOCVD Market Forecast
  • 3.9. LPCVD (non-tube) Market Forecast
  • 3.10. LPCVD (tube) Market Forecast
  • 3.11. PECVD Market Forecast
  • 3.12. PVD Market Forecast
  • 3.13. High-Current Ion Implantation Market Forecast
  • 3.14. High-Voltage Ion Implantation Market Forecast
  • 3.15. Medium-Current Ion Implantation Market Forecast
  • 3.16. Direct-Write E-Beam Lithography Market Forecast
  • 3.17. Mask-Making Lithography Market Forecast
  • 3.18. Steppers Market Forecast
  • 3.19. Oxidation Market Forecast
  • 3.20. Photoresist Processing (Track) Market Forecast
  • 3.21. RTP Market Forecast
  • 3.22. Dielectric Etch Market Forecast
  • 3.23. Conductive Etch Market Forecast
  • 3.24. Lithography Metrology Market Forecast
  • 3.25. Thin-Film Metrology Market Forecast
  • 3.26. Wafer Inspection and Defect Review Market Forecast
  • 3.27. Wafer-Level Packaging Market Forecast

LIST OF FIGURES

  • 2.1. China's IC Production Forecast
  • 2.2. China's IC Consumption
  • 2.3. China's IC Production/Consumption Ratio
  • 2.4. China's IC Import Requirements
  • 2.5. China's IC Supply/Demand
  • 2.6. China's IC Fab Capacity
  • 2.7. China's IC Fab Capacity by Region
  • 2.8. China's IC Fab Capacity by Wafer Size
  • 2.9. China's IC Fab Capacity by Geometry
  • 2.10. China's IC Production by Type
  • 3.1. AMHS Market Shares
  • 3.2. CMP Market Shares
  • 3.3. Plasma Strip Market Shares
  • 3.4. Spray Processors Market Shares
  • 3.5. Wet Stations Market Shares
  • 3.6. ALD Market Shares
  • 3.7. Epitaxy Market Shares
  • 3.8. MOCVD Market Shares
  • 3.9. LPCVD (non-tube) Market Shares
  • 3.10. LPCVD (tube) Market Shares
  • 3.11. PECVD Market Shares
  • 3.12. PVD Market Shares
  • 3.13. High-Current Ion Implantation Market Shares
  • 3.14. High-Voltage Ion Implantation Market Shares
  • 3.15. Medium-Current Ion Implantation Market Shares
  • 3.16. Direct-Write E-Beam Lithography Market Shares
  • 3.17. Mask-Making Lithography Market Shares
  • 3.18. Steppers Market Shares
  • 3.19. Oxidation Market Shares
  • 3.20. Photoresist Processing (Track) Market Shares
  • 3.21. RTP Market Shares
  • 3.22. Dielectric Etch Market Shares
  • 3.23. Conductive Etch Market Shares
  • 3.24. Lithography Metrology Market Shares
  • 3.25. Thin-Film Metrology Market Shares
  • 3.26. Wafer Inspection and Defect Review Market Shares
  • 3.27. Wafer-Level Packaging Market Shares