查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1457076

半导体后端设备市场：2024年至2029年预测

Semiconductor Back-End Equipment Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 135 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

半导体后端设备市场预计复合年增长率为8.11%，市场规模从2022年的861.93亿美元增加到2029年的1487.56亿美元。

该市场预计将扩大，不仅由于笔记型电脑、数位相机和智慧型手机等电子产品的功能进步，而且由于对小型设备的需求不断增加。随着 IC 设计变得更加复杂并且需要将更多的半导体产品推向市场来製造 IC，对半导体的需求正在稳步增长。半导体用于 IC 开发，以降低成本、加快批量生产并提高成品的营运价值。

半导体生产有前端製程和后端製程。后处理是半导体製造中在晶圆上定义电路之后发生的步骤。过程中有几个步骤可以确保半导体晶片的功能、可靠性、性能和耐用性。每个步骤都需要一组特定的工具来实现极其精细的分析和功能。因此，公司透过提供半导体铸造厂和製造设施所需的产品和服务来满足对此类设备的需求。全球半导体需求的不断增长正在推动整个工业部门的生产规模，从而带动半导体后端设备市场。

对半导体的高需求

由于最终用户应用的扩大，全球对半导体的需求正在增加。为了满足产品开发和製造需求，年轻的新兴企业依赖 ODM（原始设计製造商）和 OSAT（外包半导体组装和测试）服务供应商。世界各国政府都将重点放在半导体的国内生产上，以减少对外国供应商的依赖。各国政府欢迎知名製造商的直接投资计划，并提供优惠的法规。

例如，2022 年 2 月，印度宣布 Vedanta 与富士康、ISMC 以及新加坡 IGSS Ventures 等公司建立合作关係，总价值达 200 亿美元。这些公司希望在该国设立显示器工厂和半导体生产设施。 2022年9月，半导体园区及相关设施将在喀拉拉邦建成。对半导体和工业装置的需求不断增长预计将推动半导体后端设备市场的成长。

增加水质检测设备的使用

晶圆测试是在称为晶圆探测器的测试工具的帮助下完成的。晶圆探针台是一种自动测试设备，用于在半导体製造和生产中对晶圆进行电气测试。使用光学和电子束测试技术测试晶圆的不规则性和缺陷，以防止日后出现可靠性问题。然后进行晶圆测试和切割，以检查电路操作和讯号响应，然后将晶圆切成单独的晶片。随着市场上的公司开拓新的晶圆测试系统，晶圆测试的需求将增加，带动半导体后端设备市场。

製造业需求不断成长

半导体晶圆、IC晶片、记忆体晶片、电路和其他零件是使用半导体製造设备製造的。在製造过程的早期阶段，使用硅晶圆製造设备。晶片加工设备的范例包括微影术设备、蚀刻设备、化学气相沉积设备、测量设备和製程/品管设备。半导体製造设备市场的成长预计将受到不同终端用户对分立元件、功率半导体和高功率模组日益增长的需求的推动。此外，随着客户越来越偏好较小的产品，将半导体整合到单一晶片上的趋势日益增长。在这种情况下，该装置的主要用途是将半导体元件组装到一个晶片中。

对黏合设备的需求不断增加

对效率、处理能力和小尺寸半导体晶片的需求不断增长，推动了对半导体键合设备的需求，也是预测期内市场的驱动力。前端製程的显着进步也导致对半导体键合设备的需求增加。对黏合设备解决方案的需求也受到其他应用和尖端封装技术投资的推动。例如，2022 年 3 月，英特尔公司在欧盟半导体价值链上投资了 800 亿欧元，其中包括尖端封装技术。此外，生产商正专注于加强生产后端机械和半导体製造设备（SME）所需的半导体。例如，据透露，全球领先的电源和连接解决方案供应商Qorvo已获得半导体製造设备（SME）许可。

亚太地区在预测期内将经历指数级增长

亚太半导体后端设备市场预计将在预测期内快速成长。国内主要供应商的策略投资和成熟半导体产业的成长预计将推动市场。随着晶片消费的增加，预计未来四年亚太半导体市场规模将是美洲的三倍以上。

此外，5G技术的采用推动了半导体製造设备市场的发展，从而增加了该地区对半导体晶片的需求。预计 5G 技术将显着改善全球数位基础设施。

重要市场公告

  • 2023年8月，领先的半导体代工厂台积电开始向多家尖端封装设备供应商新订单。谷登精工、Apic Yamada、Disco、Scientech等供应商已与该公司合作。
  • 2022年6月，美国晶圆製造设备製造商Lam Research于2023年6月宣布推出Coronaus DX。该设备可以一步在晶圆的两个边缘沉积一层独特的保护涂层，有助于防止先进半导体製造过程中可能出现的缺陷和损坏。这项创新为采用以前不可能的先进逻辑、封装和晶片製造流程打开了大门。这些发展预计也将影响先进后端硬体的进步。

目录

第一章 简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章半导体后端设备市场：依製程分类

  • 介绍
  • 晶圆测试
  • 黏合
  • 切丁
  • 测量
  • 组装包装

第六章 半导体后端设备市场：依地区划分

  • 介绍
  • 北美洲
  • 南美洲
  • 欧洲
  • 中东/非洲
  • 亚太地区

第七章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第八章 公司简介

  • ASML Holding
  • Applied Materials
  • Lam Research
  • S firm Applied Materials Inc（Tokyo Electron Limited）
  • KLA Corporation
  • Onto Innovation Inc
  • SCREEN Holdings Co Ltd
  • Teradyne Inc
  • Japan Industrial Partners（Toshiba Corporation）
简介目录
Product Code: KSI061614890

The semiconductor back-end equipment market is expected to grow at a CAGR of 8.11%, reaching a market size of US$148.756 billion in 2029 from US$86.193 billion in 2022.

The market is expected to grow as a result of the increasing demand for small devices as well as functional advancements in electronic goods like laptops, digital cameras, smartphones, and others. Since IC designs are becoming more complex and more semiconductor products must be introduced to the market to manufacture ICs, the demand for semiconductors is increasing steadily. Semiconductors are used in I.C. development because they lower costs, speed up mass production, and increase the operational value of the finished product.

There are two processes involved in the production of semiconductors that are front-end and back-end. Back-end processing is the step-in semiconductor production that comes after the circuit definition on the wafer. To guarantee the functionality, dependability, performance, and durability of the semiconductor chips, several stages are included in the processes. For conducting analysis and function at incredibly minute levels, each process needs a particular set of tools. Therefore, businesses provide the goods and services needed by semiconductor foundries and manufacturing facilities to meet the demand for such equipment. The rising worldwide demand for semiconductors across the industrial sector has boosted their production scale which will drive the semiconductor back-end equipment market.

High demand for semiconductors

The global demand for semiconductors is increasing owing to growing end-user applications. To satisfy the demands for product development and manufacturing, younger, emerging companies rely on Original Design Manufacturers (ODMs) and Outsourced Semiconductor Assembly and Test (OSAT) service providers. Governments around the world are focusing on domestic semiconductor production to reduce their reliance on foreign vendors. They welcome direct investment programs from well-known manufacturers and provide favourable regulations.

For instance, in February 2022, India announced partnerships from companies like Vedanta with Foxconn, ISMC, and the Singapore-based IGSS venture totalling USD 20 billion. These businesses want to establish display fabs and semiconductor production facilities in the nation. In September 2022, a semiconductor park and related facilities will be built in Kerala according to plans developed collaboratively by Keltron, the Center for Development of Advanced Computing (C-DAC), the Electronic and Semiconductor Association (ESA), and the Vikram Sarabhai Space Center (VSSC) (ESA). As the semiconductor demand and industry setup increase it will boost the semiconductor back-end equipment market growth.

Increasing use of water testing equipment

The wafer testing is carried out with the assistance of wafer probers, which are pieces of test tools. A wafer probe is an automatic test device used in the creation and production of semiconductors to electrically test wafers. To prevent reliability concerns later, the wafer is inspected for any irregularities or defects using optical inspection and electron-beam inspection techniques. Following that is the wafer test and dicing, which checks the circuit's operation and signal responses before slicing the wafer into individual dice. The increasing development of new wafer testing systems by the market players will increase the demand for wafer testing and hence will boost the semiconductor back-end equipment market

Rising need in the manufacturing industry

Semiconductor wafers, IC chips, memory chips, circuits, and other components are made with semiconductor manufacturing equipment. Early in the manufacturing process, silicon wafer manufacturing equipment is used. Photolithography tools, etching machines, chemical vapour deposition machines, measurement machines, and process/quality control apparatus are examples of wafer processing equipment. The growth of the semiconductor manufacturing equipment market is anticipated to be driven by the growing need for discrete devices, power semiconductors, and high-power modules for diverse end users. Moreover, the trend of combining semiconductors onto a single chip is growing as customers' preferences for small-sized products grow. In this case, the main application of this equipment is the assembly of semiconductor parts into a single chip.

Increasing demand for bonding equipment

The growing need for semiconductor chips with greater efficiency, processing power, and smaller footprints is driving demand for semiconductor bonding equipment, which will propel the market during the forecast period. The substantial advancements in front-end processes have also led to an increase in the need for semiconductor bonding equipment. The need for bonding equipment solutions is also fueled by investments in other applications and state-of-the-art packaging technologies. For example, Intel Corp. invested EUR 80 billion in March 2022 throughout the European Union's semiconductor value chain, including state-of-the-art packaging technologies. In addition, producers are focusing on enhancing the semiconductors required for the production of back-end machinery and semiconductor manufacturing equipment (SME). For example, it was disclosed that Qorvo, a major worldwide supplier of power and connectivity solutions, had licensed

Asia Pacific is witnessing exponential growth during the forecast period.

During the forecast period, the Asia-Pacific Semiconductor Back-End Equipment Market is anticipated to grow at a rapid pace. Strategic investments from major domestic suppliers and the growth of the established semiconductor industry are expected to propel the market. The Asia-Pacific semiconductor market is anticipated to more than triple in size from that of the Americas over the next four years as chip consumption rises.

Additionally, the introduction of 5G technology has increased demand for semiconductor chips in the region by boosting the market for equipment used in semiconductor manufacturing. It is predicted that 5G technology will significantly improve the digital infrastructure globally.

Market key launches

  • In August 2023, Leading semiconductor foundry TSMC started placing new orders with various suppliers of cutting-edge packaging equipment. Suppliers including Gudeng Precision Industrial, Apic Yamada, Disco, and Scientech have been collaborating with the company. The company's choice to interact with equipment suppliers is indicative of its continuous endeavours to improve its advanced packaging capacities.
  • In June 2022, the US wafer fabrication equipment manufacturer Lam Research introduced Coronus DX in June 2023. This device can deposit a proprietary protective film on both wafer edges in a single step, helping to prevent defects and damage that can arise during advanced semiconductor manufacturing. This innovation opens the door for the adoption of previously unfeasible advanced logic, packaging, and chip production processes. It is also expected that these developments will have an impact on the advancement of sophisticated back-end hardware.

Segmentation:

By Procedure

  • Wafer Testing
  • Bonding
  • Dicing
  • Metrology
  • Assembly Packaging

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • UK
  • France
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Australia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key Benefits to the Stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Processes

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR BACK-END EQUIPMENT MARKET, BY PROCEDURE

  • 5.1. Introduction
  • 5.2. Wafer Testing
    • 5.2.1. Market Trends and Opportunities
    • 5.2.2. Growth Prospects
    • 5.2.3. Geographic Lucrativeness
  • 5.3. Bonding
    • 5.3.1. Market Trends and Opportunities
    • 5.3.2. Growth Prospects
    • 5.3.3. Geographic Lucrativeness
  • 5.4. Dicing
    • 5.4.1. Market Trends and Opportunities
    • 5.4.2. Growth Prospects
    • 5.4.3. Geographic Lucrativeness
  • 5.5. Metrology
    • 5.5.1. Market Trends and Opportunities
    • 5.5.2. Growth Prospects
    • 5.5.3. Geographic Lucrativeness
  • 5.6. Assembly Packing
    • 5.6.1. Market Trends and Opportunities
    • 5.6.2. Growth Prospects
    • 5.6.3. Geographic Lucrativeness

6. SEMICONDUCTOR BACK-END EQUIPMENT MARKET, BY GEOGRAPHY

  • 6.1. Introduction
  • 6.2. North America
    • 6.2.1. By Procedure
    • 6.2.2. By Country
      • 6.2.2.1. USA
        • 6.2.2.1.1. Market Trends and Opportunities
        • 6.2.2.1.2. Growth Prospects
      • 6.2.2.2. Canada
        • 6.2.2.2.1. Market Trends and Opportunities
        • 6.2.2.2.2. Growth Prospects
      • 6.2.2.3. Mexico
        • 6.2.2.3.1. Market Trends and Opportunities
        • 6.2.2.3.2. Growth Prospects
  • 6.3. South America
    • 6.3.1. By Procedure
    • 6.3.2. By Country
      • 6.3.2.1. Brazil
        • 6.3.2.1.1. Market Trends and Opportunities
        • 6.3.2.1.2. Growth Prospects
      • 6.3.2.2. Argentina
        • 6.3.2.2.1. Market Trends and Opportunities
        • 6.3.2.2.2. Growth Prospects
      • 6.3.2.3. Others
        • 6.3.2.3.1. Market Trends and Opportunities
        • 6.3.2.3.2. Growth Prospects
  • 6.4. Europe
    • 6.4.1. By Procedure
    • 6.4.2. By Country
      • 6.4.2.1. Germany
        • 6.4.2.1.1. Market Trends and Opportunities
        • 6.4.2.1.2. Growth Prospects
      • 6.4.2.2. UK
        • 6.4.2.2.1. Market Trends and Opportunities
        • 6.4.2.2.2. Growth Prospects
      • 6.4.2.3. France
        • 6.4.2.3.1. Market Trends and Opportunities
        • 6.4.2.3.2. Growth Prospects
      • 6.4.2.4. Spain
        • 6.4.2.4.1. Market Trends and Opportunities
        • 6.4.2.4.2. Growth Prospects
      • 6.4.2.5. Others
        • 6.4.2.5.1. Market Trends and Opportunities
        • 6.4.2.5.2. Growth Prospects
  • 6.5. Middle East and Africa
    • 6.5.1. By Procedure
    • 6.5.2. By Country
      • 6.5.2.1. Saudi Arabia
        • 6.5.2.1.1. Market Trends and Opportunities
        • 6.5.2.1.2. Growth Prospects
      • 6.5.2.2. UAE
        • 6.5.2.2.1. Market Trends and Opportunities
        • 6.5.2.2.2. Growth Prospects
      • 6.5.2.3. Others
        • 6.5.2.3.1. Market Trends and Opportunities
        • 6.5.2.3.2. Growth Prospects
  • 6.6. Asia Pacific
    • 6.6.1. By Procedure
    • 6.6.2. By Country
      • 6.6.2.1. China
        • 6.6.2.1.1. Market Trends and Opportunities
        • 6.6.2.1.2. Growth Prospects
      • 6.6.2.2. Japan
        • 6.6.2.2.1. Market Trends and Opportunities
        • 6.6.2.2.2. Growth Prospects
      • 6.6.2.3. South Korea
        • 6.6.2.3.1. Market Trends and Opportunities
        • 6.6.2.3.2. Growth Prospects
      • 6.6.2.4. India
        • 6.6.2.4.1. Market Trends and Opportunities
        • 6.6.2.4.2. Growth Prospects
      • 6.6.2.5. Australia
        • 6.6.2.5.1. Market Trends and Opportunities
        • 6.6.2.5.2. Growth Prospects
      • 6.6.2.6. Others
        • 6.6.2.6.1. Market Trends and Opportunities
        • 6.6.2.6.2. Growth Prospects

7. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 7.1. Major Players and Strategy Analysis
  • 7.2. Market Share Analysis
  • 7.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 7.4. Competitive Dashboard

8. COMPANY PROFILES

  • 8.1. ASML Holding
  • 8.2. Applied Materials
  • 8.3. Lam Research
  • 8.4. S firm Applied Materials Inc (Tokyo Electron Limited)
  • 8.5. KLA Corporation
  • 8.6. Onto Innovation Inc
  • 8.7. SCREEN Holdings Co Ltd
  • 8.8. Teradyne Inc
  • 8.9. Japan Industrial Partners (Toshiba Corporation)