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市场调查报告书
商品编码
1449665

装载埠模组市场：按装载端口模组类型、按自动化水准、按最终用户行业、按通讯介面、按晶圆尺寸、按应用、按清洁级别、按建筑材料、按地区

Load Port Module Market, By Type of Load Port Module, By Automation Level, By End-User Industry, By Communication Interface, By Wafer Size, By Application, By Cleanliness Level, By Component Material, By Geography
出版日期: | 出版商: Coherent Market Insights | 英文 160 Pages | 商品交期: 2-3个工作天内

价格
简介目录

装载埠模组市场规模预计到2024年将达到4.451亿美元，到2031年将达到7.949亿美元，2024年至2031年的年复合成长率为8.6%。

报告范围 报告详情
基准年 2023年 2023/2024年市场规模 4.451 亿美元
实际资料 2019-2023 预测期 2024-2031
预测期间2023/2024 至2030/2031年年复合成长率： 8.60% 2030/2031价值预测 7.949 亿美元
图 1.2024年装载埠模组的全球市场占有率（%）（依地区）
装载埠模组市场-IMG1

市场动态

对半导体装置的需求不断成长、半导体製造、自动化和工业 4.0 的进步预计将在预测期内推动全球装载埠模组市场的成长。此外，对产量比率提高的关注预计也将推动预测期内全球装载埠模组市场的成长。先进材料的采用、智慧技术的整合以及特定应用的客製化预计将为预测期内的全球装​​载端口模组市场提供成长机会。

然而，高初始投资、整合复杂性、维护和停机时间预计将阻碍预测期内全球装载埠模组市场的成长。

本研究的主要特点

  • 本报告详细分析了全球装载埠模组市场，并提供了以2023年为基准年的预测期（2024-2031）的市场规模和年复合成长率（CAGR%）。
  • 揭示了各个细分市场的潜在商机，并为该市场说明了一系列有吸引力的投资提案。
  • 提供了有关市场促进因素、限制因素、机会、新产品发布和核准、市场趋势、区域前景、主要企业采取的竞争策略等的重要见解。
  • 根据公司亮点、产品系列、主要亮点、财务表现和策略等参数，介绍了全球装载埠模组市场的主要企业。
  • 本报告的见解使行销人员和经营团队负责人就未来的产品发布、类型升级、市场扩张和行销策略做出明智的决策。
  • 全球装载埠模组市场报告满足该行业的各种相关人员，例如投资者、供应商、产品製造商、经销商、新进入者和财务分析师。
  • 相关人员可以透过用于分析全球装载埠模组市场的各种策略矩阵来促进他们的决策。

目录：

第1章 研究目的与前提

  • 研究目标
  • 先决条件
  • 简称

第2章 市场展望

  • 报告说明
    • 市场定义和范围
  • 执行摘要
  • Coherent Opportunity Map（COM）

第3章 市场动态、法规及趋势分析

  • 市场动态
    • 促进因素
  • 半导体装置需求增加
  • 半导体製造的进步
  • 自动化与工业4.0
  • 致力于提高产量
    • 机会
  • 采用先进材料
  • 智慧科技融合
  • 针对特定应用的客製化
  • 注意能源效率
    • 抑制因素
  • 初期投资高
  • 整合复杂度
  • 维护和停机
  • 主要亮点
  • 监管场景
  • 最近的趋势
  • 产品发布/核准
  • PEST分析
  • 波特的分析
  • 合併、收购和合作

第4章 全球装载埠模组市场 - 冠状病毒（COVID-19）大流行的影响

  • 新型冠状病毒感染疾病（COVID-19）的流行病学
  • 供需面分析
  • 经济影响

第5章 全球装载埠模组市场，依装载埠模组类型，2019-2031

  • Front-Opening Unified Pod (FOUP)
  • Front-Opening Individual Pod (FOIP)
  • Front-Opening Shipping Box (FOSB)

第6章 全球装载埠模组市场，依自动化程度分类，2019-2031

  • 手动装载埠模组
  • 半自动装载埠模组
  • 全自动装载埠模组

第7章 全球装载埠模组市场，依最终用户产业分类，2019-2031年

  • 半导体製造
  • 电子设备製造

第8章 2019-2031年全球装载埠模组市场，依晶圆尺寸

  • 200mm负载口模组
  • 300mm负载口模组
  • 其他

第9章 全球装载埠模组市场，依通讯介面，2019-2031

  • SECS/GEM
  • 其他

第10章 全球装载埠模组市场，依应用，2024-2031年

  • 晶圆运输
  • 晶圆储存

第11章 全球装载模组市场，依清洁等级分类，2019-2031年

  • 高真空装载埠模组
  • 标准装载埠模组

第12章 全球装载模组市场，依构成材料，2019-2031

  • 不銹钢装载埠模组
  • 铝製装载埠模组

第13章 全球装载埠模组市场，依地区，2019-2031

  • 北美洲
  • 美国
  • 加拿大
  • 欧洲
  • 德国
  • 英国
  • 西班牙
  • 法国
  • 义大利
  • 俄罗斯
  • 欧洲其他地区
  • 亚太地区
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲
  • ASEAN
  • 其他亚太地区
  • 拉丁美洲
  • 巴西
  • 阿根廷
  • 墨西哥
  • 其他拉丁美洲
  • 中东、非洲
  • 海湾合作理事会国家
  • 以色列
  • 南非
  • 北非
  • 中部非洲
  • 其他中东、非洲

第14章 竞争格局

  • 公司简介
    • Brooks Automation Inc.
    • Entegris, Inc.
    • Tokyo Electron Limited（TEL）
    • Lam Research Corporation
    • ASML Holding NV
    • Applied Materials, Inc.
    • Hitachi High-Tech Corporation
    • AMAT Applied Materials AG
    • KLA Corporation
    • Mattson Technology, Inc.
    • Tokyo Seimitsu Co., Ltd.（Accretech）
    • Advantest Corporation
    • Ultratech（acquired by Veeco Instruments Inc.）
    • MKS Instruments, Inc.
    • Novellus Systems（acquired by Lam Research Corporation）

第15章

  • 参考
  • 调查方法
  • 关于出版商
简介目录
Product Code: CMI6119

The Load port module market size is valued at US$ 445.1 Million in 2024 and is expected to reach US$ 794.9 million by 2031, exhibiting a compound annual growth rate (CAGR) of 8.6% from 2024 to 2031.

Report Coverage Report Details
Base Year: 2023 Market Size in 2023/2024: US$ 445.1 Mn
Historical Data for: 2019 to 2023 Forecast Period: 2024 - 2031
Forecast Period 2023/2024 to 2030/2031 CAGR: 8.60% 2030/2031 Value Projection: US$ 794.9 Mn
Figure 1. Global Load Port Module Market Share (%), By Region, 2024
Load Port Module Market - IMG1

Market Dynamics

Increasing demand for semiconductor devices, advancements in semiconductor manufacturing, and automation and industry 4.0 is anticipated to drive growth of the global load port module market over the forecast period. Moreover, focus on yield enhancement is also expected to boost growth of the global load port module market over the forecast period. Adoption of advanced materials, integration of smart technologies, and customization for specific applications is expected to create growth opportunities for the global load port module market during the forecast period.

However, high initial investment, integration complexity, and maintenance and downtime are expected to hamper growth of the global load port module market over the forecast period.

Key features of the study:

  • This report provides in-depth analysis of the global load port module market, and provides market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2024-2031), considering 2023 as the base year.
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players.
  • It profiles key players in the global load port module market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies.
  • Key companies covered as a part of this study include Brooks Automation Inc., Entegris, Inc., Tokyo Electron Limited (TEL), Lam Research Corporation, ASML Holding N.V., Applied Materials, Inc., Hitachi High-Tech Corporation, AMAT Applied Materials AG, KLA Corporation, Mattson Technology, Inc., Tokyo Seimitsu Co., Ltd. (Accretech), Advantest Corporation, Ultratech (acquired by Veeco Instruments Inc.), MKS Instruments, Inc., Novellus Systems (acquired by Lam Research Corporation).
  • Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics.
  • Global load port module market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global load port module market.

Detailed Segmentation:

  • Load Port Module Market, By Type of Load Port Module:
    • Front-Opening Unified Pod (FOUP)
    • Front-Opening Individual Pod (FOIP)
    • Front-Opening Shipping Box (FOSB)
  • Load Port Module Market, By Market Automation Level:
    • Manual Load Port Module
    • Semi-Automated Load Port Module
    • Fully Automated Load Port Module
  • Load Port Module Market, By End User Industry:
    • Semiconductor Manufacturing
    • Electronics Manufacturing
  • Load Port Module Market, By Communication Interface:
    • SECS/GEM
    • Others
  • Load Port Module Market, By Wafer Size:
    • 200mm Load Port Module
    • 300mm Load Port Module
    • Others
  • Load Port Module Market, By Application:
    • Wafer Transportation
    • Wafer Storage
  • Load Port Module Market, By Cleanliness Level:
    • High Vacuum Load Port Module
    • Standard Load Port Module
  • Load Port Module Market, By Component Material:
    • Stainless Steel Load Port Module
    • Aluminum Load Port Module
  • Load Port Module Market, By Region:
    • North America
    • Latin America
    • Europe
    • Asia Pacific
    • Middle East & Africa
  • Top Companies in the Global Load Port Module Market:
    • Brooks Automation Inc.
    • Entegris, Inc.
    • Tokyo Electron Limited (TEL)
    • Lam Research Corporation
    • ASML Holding N.V.
    • Applied Materials, Inc.
    • Hitachi High-Tech Corporation
    • AMAT Applied Materials AG
    • KLA Corporation
    • Mattson Technology, Inc.
    • Tokyo Seimitsu Co., Ltd. (Accretech)
    • Advantest Corporation
    • Ultratech (acquired by Veeco Instruments Inc.)
    • MKS Instruments, Inc.
    • Novellus Systems (acquired by Lam Research Corporation)

Table of Contents:

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Global Load Port Module Market Snippet, By Type of Load Port Module
    • Global Load Port Module Market Snippet, By Automation Level
    • Global Load Port Module Market Snippet, By End User Industry
    • Global Load Port Module Market Snippet, By Communication Interface
    • Global Load Port Module Market Snippet, By Wafer Size
    • Global Load Port Module Market Snippet, By Application
    • Global Load Port Module Market Snippet, By Cleanliness Level
    • Global Load Port Module Market Snippet, By Component Material
    • Global Load Port Module Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
  • Increasing demand for semiconductor devices
  • Advancements in semiconductor manufacturing
  • Automation and industry 4.0
  • Focus on yield enhancement
    • Opportunities
  • Adoption of advanced materials
  • Integration of smart technologies
  • Customization for specific applications
  • Focus on energy efficiency
    • Restrains
  • High initial investment
  • Integration complexity
  • Maintenance and downtime
  • Key Highlights
  • Regulatory Scenario
  • Recent Trends
  • Product Launches/Approvals
  • PEST Analysis
  • PORTER's Analysis
  • Merger, Acquisitions, and Collaborations

4. Global Load Port Module Market- Impact of Coronavirus (COVID-19) Pandemic

  • COVID-19 Epidemiology
  • Supply Side and Demand Side Analysis
  • Economic Impact

5. Global Load Port Module Market, By Type of Load Port Module, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019- 2031
    • Segment Trends
  • Front-Opening Unified Pod (FOUP)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Front-Opening Individual Pod (FOIP)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Front-Opening Shipping Box (FOSB)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million

6. Global Load Port Module Market, By Automation Level, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Manual Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Semi-Automated Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Fully Automated Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

7. Global Load Port Module Market, By End User Industry, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Semiconductor Manufacturing
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Electronics Manufacturing
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

8. Global Load Port Module Market, By Wafer Size, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • 200mm Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • 300mm Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Others
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

9. Global Load Port Module Market, By Communication Interface, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • SECS/GEM
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Others
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

10. Global Load Port Module Market, By Application, 202417-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Wafer Transportation
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Wafer Storage
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

11. Global Load Port Module Market, By Cleanliness Level, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • High Vacuum Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Standard Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

12. Global Load Port Module Market, By Component Material, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Stainless Steel Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Aluminum Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

13. Global Load Port Module Market, By Region, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, By Sub-region, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, For Sub-region, 2018 -2031
    • Country Trends
  • North America
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Type of Load Port Module, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Automation Level, 2024-2031,(US$ Million
    • Market Size and Forecast, and Y-o-Y Growth, By End User Industry, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Communication Interface, 2024-2031,(US$ Million
    • Market Size and Forecast, and Y-o-Y Growth, By Wafer Size, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2024-2031,(US$ Million
    • Market Size and Forecast, and Y-o-Y Growth, By Cleanliness Level, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Component Material, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Country, 2024-2031,(US$ Million)
  • US
  • Canada
  • Europe
  • Germany
  • UK
  • Spain
  • France
  • Italy
  • Russia
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • ASEAN
  • Rest of Asia Pacific
  • Latin America
  • Brazil
  • Argentina
  • Mexico
  • Rest of Latin America
  • Middle East & Africa
  • GCC Countries
  • Israel
  • South Africa
  • North Africa
  • Central Africa
  • Rest of Middle East & Africa

14. Competitive Landscape

  • Company Profile
    • Brooks Automation Inc.
  • Company Highlights
  • Product Portfolio
  • Key Developments
  • Financial Performance
  • Strategies
    • Entegris, Inc.
    • Tokyo Electron Limited (TEL)
    • Lam Research Corporation
    • ASML Holding N.V.
    • Applied Materials, Inc.
    • Hitachi High-Tech Corporation
    • AMAT Applied Materials AG
    • KLA Corporation
    • Mattson Technology, Inc.
    • Tokyo Seimitsu Co., Ltd. (Accretech)
    • Advantest Corporation
    • Ultratech (acquired by Veeco Instruments Inc.)
    • MKS Instruments, Inc.
    • Novellus Systems (acquired by Lam Research Corporation)
  • Analyst Views

15. Section

  • References
  • Research Methodology
  • About us