全球半导体晶圆代工厂产业的发展:2021年～2022年(预约定购)

2021年的全球晶圆代工厂产业的出货收益，比2020年增加26.0％达1,101亿美金。由于2020年第3季的半导体晶片的旺盛需求，发生晶片不足。因此，主要製造Logic晶片的大晶圆代工厂的2021年的销售额增加。

本报告提供全球半导体晶圆代工厂产业调查，主要企业的策略验证加上2021年的晶圆代工厂产业概观，2022年的家电产品的需求减少，俄罗斯、乌克兰战争，中国的封锁等影响产业的要素和事件调查，揭示产业今后的趋势和展望。

目录

第1章 发展概要

• 2021年享受了成长的全球晶圆代工厂产业
• 2021年全球前十名晶圆代工厂排行榜
• 2021年的晶圆代工厂产业的发展

第2章 主要晶圆代工厂的发展

• TSMC
• Samsung
• UMC
• PSMC
• Vanguard
• SMIC
• GlobalFoundries

第3章 2022年的全球晶圆代工厂产业的发展

• 随着积极的生产能力扩大计划，供给过剩的疑虑浮现
• Intel的晶圆代工厂事业的进入改变产业形势的展望

第4章 彙整

附录

企业一览

Shipment value of the global foundry industry reached US$110.1 billion in 2021, up 26.0% compared to 2020. The strong demand for semiconductor chips from the third quarter of 2020 led to the chip shortage. This boosted sales of leading foundries that make mainly logic chips in 2021. This report provides an overview of the foundry industry in 2021 while examining strategies of major players; looks into factors and incidents impacting the industry such as the decline in demand for consumer electronics products in 2022, the Russia-Ukraine war, and the lockdown in China; identify future trends and prospects of the industry.

Table of Contents

1. Development Overview

• 1.1. Global Foundry Industry Enjoys Growth in 2021
• 1.2. Global Top 10 Foundry Rankings 2021
• 1.3. Development of the Foundry Industry in 2021

2. Development of Leading Foundries

• 2.1. TSMC
• 2.2. Samsung
• 2.3. UMC
• 2.4. PSMC
• 2.5. Vanguard
• 2.6. SMIC
• 2.7. GlobalFoundries

3. Development of the Global Foundry Industry in 2022

• 3.1. Oversupply Concerns Emerging Following Active Capacity Expansion Plans
• 3.2. Intel’s Entry to Foundry Business Changing Industry Landscape

4. Conclusion

Appendix

List of Companies

List of Tables

• Table 1: Global Top 10 Foundry Rankings 2021
• Table 2: Major Expansion Plans of Leading Foundries in 2021
• Table 3: New Capacity Expansion Plans of Leading Foundry in China, 2022~2023

List of Figures

• Figure 1: Changes in Gross Profit Margins of Leading Foundries, 2021
• Figure 2: TSMC's Revenue by Application, 2020 vs. 2021
• Figure 3: UMC's Revenue by Application, 2020 vs. 2021
• Figure 4: PSMC's Revenue by Application, 2020 vs. 2021
• Figure 5: Vanguard's Revenue by Application, 2020 vs. 2021
• Figure 6: SMIC's Revenue by Application, 2020 vs. 2021
• Figure 7: GlobalFoundries' Revenue by Application, 2020 3Q~2021 4Q
• Figure 8: Illustration of Intel' Open Chiplet Platform

Companies covered

• Amazon
• AMD
• Apple
• ARM
• ASE
• ASMC
• AUO
• Broadcom
• DB HiTek
• Denso
• GlobalFoundries
• Google
• Huahong Group
• Intel
• Mediatek
• Meta
• Microsoft
• Nexchip
• Nvidia
• Oppo
• PSMC
• Qualcomm
• Samsung
• SMIC
• Sony
• Tower
• TSMC
• UMC
• Vanguard
• Vivo
• WIN Semiconductor
• Xiaomi