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市场调查报告书
商品编码
1518644

2024-2032 年按类型（FC BGA、FC CSP）、应用（消费电子、汽车和运输、IT 和电信等）和地区分類的先进 IC 基板市场报告

Advanced IC Substrate Market Report by Type (FC BGA, FC CSP), Application (Consumer Electronics, Automotive and Transportation, IT and Telecom, and Others), and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 139 Pages | 商品交期: 2-3个工作天内

价格

2023年，全球先进IC载板市场规模达100亿美元。对高效能电子设备的需求不断增长，越来越多地采用更小、更轻、更节能的设备，以及资料中心和云端运算服务数量的增加是推动市场的一些主要因素。

先进的积体电路 (IC) 基板是关键组件，也是电子设备内安装和互连 IC 的基础。它利用先进的材料和技术来提供最佳的电气性能、热管理和信号完整性。它旨在满足智慧型手机、平板电脑、电脑和其他电子设备中高效能应用的特定要求。由于它有助于提供增强的连接性、降低的功耗和高效的散热，全球对先进 IC 基板的需求正在不断增长。

目前，越来越多地采用先进的 IC 基板，因为它使复杂的电子系统能够无缝运行，对市场产生了积极的影响。此外，第五代（5G）技术的不断兴起，以及人工智慧（AI）的日益普及，正在加强市场的成长。除此之外，对能够适应更高资料传输速率和更复杂处理任务的先进 IC 基板的需求不断增长，这提供了良好的市场前景。此外，工业应用中对远端控制电气设备的需求不断增长，为行业投资者提供了利润丰厚的成长机会。除此之外，消费者对扩增实境 (AR)、虚拟实境 (VR) 和高清 (HD) 显示器等先进功能的偏好不断增加，也促进了市场的成长。此外，全球物联网（IoT）设备的利用率不断上升正在推动市场的成长。

先进 IC 载板市场趋势/驱动因素：

对高性能电子设备的需求不断增长

对智慧型手机、平板电脑、个人电脑 (PC)、穿戴式装置和笔记型电脑等先进电子设备的需求不断增长，推动了市场的成长。此外，消费者越来越喜欢有助于提供无缝多工、高速连接和增强图形性能的电子设备。他们还采用为个人提供沉浸式体验的设备。除此之外，对能够容纳强大处理器、记忆体模组和通讯组件整合的先进 IC 基板的需求也在增加。因此，製造商正在投资具有优化电气通路和讯号完整性的基板，以确保高效的资料传输和最小的延迟。

小型化日益普及

个人对更小、更轻、更节能的设备的需求不断增长，加上小型化在全球的日益普及，正在支撑市场的成长。与此相适应，对紧凑且高密度的先进 IC 基板的需求不断增加。除此之外，这些基板还可以堆迭多层组件并减少设备的占地面积，同时保持最佳功能。在单一基板上整合各种组件的能力提高了效率，降低了讯号干扰的风险，并提高了整体设备性能，这提供了积极的市场前景。

资料中心数量不断增加

全球资料中心和云端运算服务数量的不断增加正在推动市场的成长。企业和个人越来越依赖云端运算、巨量资料分析和线上服务来储存和管理大量资讯。资料中心拥有无数的伺服器、储存系统和网路设备，会产生大量热量。因此，需要有效的散热以防止过热并确保不间断运作。除此之外，先进的 IC 基板还提供增强的热管理能力和散热特性，有助于维持这些系统的可靠性和使用寿命。此外，对能够有效管理热量的高性能基材的需求不断增长，也推动了市场的成长。

目录

第一章：前言

第 2 章：范围与方法

  • 研究目的
  • 利害关係人
  • 资料来源
    • 主要资源
    • 二手资料
  • 市场预测
    • 自下而上的方法
    • 自上而下的方法
  • 预测方法

第 3 章：执行摘要

第 4 章：简介

  • 概述
  • 主要行业趋势

第 5 章：全球先进 IC 载板市场

  • 市场概况
  • 市场业绩
  • COVID-19 的影响
  • 市场预测

第 6 章：市场区隔：按类型

  • FC球栅阵列
    • 市场走向
    • 市场预测
  • 光纤通讯光热发电
    • 市场走向
    • 市场预测

第 7 章：市场区隔：按应用

  • 消费性电子产品
    • 市场走向
    • 市场预测
  • 汽车和交通
    • 市场走向
    • 市场预测
  • 资讯科技和电信
    • 市场走向
    • 市场预测
  • 其他的
    • 市场走向
    • 市场预测

第 8 章：市场区隔：按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太
    • 中国
    • 日本
    • 印度
    • 韩国
    • 澳洲
    • 印尼
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙
    • 俄罗斯
    • 其他的
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 其他的
  • 中东和非洲
    • 市场走向
    • 市场细分：按国家/地区
    • 市场预测

第 9 章：SWOT 分析

  • 概述
  • 优势
  • 弱点
  • 机会
  • 威胁

第 10 章：价值链分析

第 11 章：波特五力分析

  • 概述
  • 买家的议价能力
  • 供应商的议价能力
  • 竞争程度
  • 新进入者的威胁
  • 替代品的威胁

第 12 章：价格分析

第13章：竞争格局

  • 市场结构
  • 关键参与者
  • 关键参与者简介
    • ASE Group
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Fujitsu Limited
    • Ibiden Co. Ltd.
    • JCET Group Co. Ltd
    • Kinsus Interconnect Technology Corp.
    • Korea Circuit Co. Ltd.
    • KYOCERA Corporation
    • LG Innotek Co. Ltd.
    • Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
    • TTM Technologies Inc.
    • Unimicron Technology Corporation (United Microelectronics Corporation)
Product Code: SR112024A5612

The global advanced IC substrate market size reached US$ 10.0 Billion in 2023. Looking forward, the market is expected to reach US$ 16.5 Billion by 2032, exhibiting a growth rate (CAGR) of 5.6% during 2024-2032. The growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and increasing number of data centers and cloud computing services are some of the major factors propelling the market.

An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.

At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.

Advanced IC Substrate Market Trends/Drivers:

Rising demand for high-performance electronic devices

The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.

Increasing popularity of miniaturization

The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.

Growing number of data centers

The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.

Advanced IC Substrate Industry Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country levels for 2024-2032. Our report has categorized the market based on type and application.

Breakup by Type:

FC BGA

FC CSP

FC BGA represents the largest market segment

The report has provided a detailed breakup and analysis of the market based on the type. This includes FC BGA and FC CSP. According to the report, FC BGA represented the largest segment. FC BGA is a packaging technology that facilitates the connection of integrated circuits directly to the substrate and enhances performance. In FC BGA, the IC is flipped, and its active side is connected to the substrate using tiny solder balls, which serve as conductive connections. This configuration offers numerous advantages, such as shorter signal paths, improved electrical performance, and enhanced thermal dissipation due to direct contact with the substrate. FC BGA technology is particularly advantageous in high-density applications where space is limited, such as smartphones, tablets, and high-performance computing systems.

Breakup by Application:

Consumer Electronics

Automotive and Transportation

IT and Telecom

Others

Consumer electronics accounts for the majority of the market share

The report has provided a detailed breakup and analysis of the market based on the application. This includes consumer electronics, automotive and transportation, IT and telecom, and others. According to the report, consumer electronics represented the largest segment. Consumer electronics comprises a wide range of devices, such as smartphones, laptops, tablets, gaming consoles, and wearable gadgets. Advanced IC substrates play a vital role in enhancing the performance and functionality of these devices. In consumer electronics, these substrates enable the integration of powerful processors, memory modules, and connectivity components and ensure seamless multitasking, high-speed data transfer, and immersive user experiences. Additionally, these substrates support advanced features, such as high-definition displays, augmented reality (AR), and artificial intelligence (AI). The rising demand for sleeker designs and extended battery life with efficient thermal management and optimized power consumption is propelling the growth of the market.

Breakup by Region:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.

Competitive Landscape:

Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.

The report has provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

ASE Group

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Fujitsu Limited

Ibiden Co. Ltd.

JCET Group Co. Ltd

Kinsus Interconnect Technology Corp.

Korea Circuit Co. Ltd.

KYOCERA Corporation

LG Innotek Co. Ltd.

Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)

TTM Technologies Inc.

Unimicron Technology Corporation (United Microelectronics Corporation)

Recent Developments:

In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.

In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.

In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.

Key Questions Answered in This Report

  • 1. What was the size of the global advanced IC substrate market in 2023?
  • 2. What is the expected growth rate of the global advanced IC substrate market during 2024-2032?
  • 3. What are the key factors driving the global advanced IC substrate market?
  • 4. What has been the impact of COVID-19 on the global advanced IC substrate market?
  • 5. What is the breakup of the global advanced IC substrate market based on the type?
  • 6. What is the breakup of the global advanced IC substrate market based on the application?
  • 7. What are the key regions in the global advanced IC substrate market?
  • 8. Who are the key players/companies in the global advanced IC substrate market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Advanced IC Substrate Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 FC BGA
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 FC CSP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Application

  • 7.1 Consumer Electronics
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Automotive and Transportation
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IT and Telecom
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 ASE Group
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
    • 13.3.2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Fujitsu Limited
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 Financials
      • 13.3.3.4 SWOT Analysis
    • 13.3.4 Ibiden Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
      • 13.3.4.4 SWOT Analysis
    • 13.3.5 JCET Group Co. Ltd
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Kinsus Interconnect Technology Corp.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 Financials
    • 13.3.7 Korea Circuit Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 KYOCERA Corporation
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
      • 13.3.8.4 SWOT Analysis
    • 13.3.9 LG Innotek Co. Ltd.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 TTM Technologies Inc.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
      • 13.3.11.4 SWOT Analysis
    • 13.3.12 Unimicron Technology Corporation (United Microelectronics Corporation)
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials

List of Figures

  • Figure 1: Global: Advanced IC Substrate Market: Major Drivers and Challenges
  • Figure 2: Global: Advanced IC Substrate Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Advanced IC Substrate Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Advanced IC Substrate Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Advanced IC Substrate Market: Breakup by Application (in %), 2023
  • Figure 6: Global: Advanced IC Substrate Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Advanced IC Substrate (FC BGA) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Advanced IC Substrate (FC BGA) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Advanced IC Substrate (FC CSP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Advanced IC Substrate (FC CSP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Advanced IC Substrate (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Advanced IC Substrate (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Advanced IC Substrate (Automotive and Transportation) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Advanced IC Substrate (Automotive and Transportation) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Advanced IC Substrate (IT and Telecom) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Advanced IC Substrate (IT and Telecom) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Advanced IC Substrate (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Advanced IC Substrate (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: North America: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: North America: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: United States: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: United States: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Canada: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Canada: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Asia-Pacific: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Asia-Pacific: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: China: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: China: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Japan: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Japan: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: India: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: India: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: South Korea: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: South Korea: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Australia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Australia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Indonesia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Indonesia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Europe: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Europe: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Germany: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Germany: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: France: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: France: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United Kingdom: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United Kingdom: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Italy: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Italy: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Spain: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Spain: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Russia: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Russia: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Latin America: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Latin America: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Brazil: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Brazil: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Mexico: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Mexico: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Others: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Others: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Middle East and Africa: Advanced IC Substrate Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Middle East and Africa: Advanced IC Substrate Market: Breakup by Country (in %), 2023
  • Figure 67: Middle East and Africa: Advanced IC Substrate Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Global: Advanced IC Substrate Industry: SWOT Analysis
  • Figure 69: Global: Advanced IC Substrate Industry: Value Chain Analysis
  • Figure 70: Global: Advanced IC Substrate Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Advanced IC Substrate Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Advanced IC Substrate Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Advanced IC Substrate Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 4: Global: Advanced IC Substrate Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Advanced IC Substrate Market: Competitive Structure
  • Table 6: Global: Advanced IC Substrate Market: Key Players