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市场调查报告书
商品编码
1722993
先进IC载板市场规模、份额、趋势及预测(按类型、应用及地区),2025-2033年Advanced IC Substrate Market Size, Share, Trends and Forecast by Type, Application, and Region, 2025-2033 |
2024年全球先进IC载板市场规模达105.8亿美元。展望未来,预计2033年市场规模将达到172.6亿美元,2025-2033年期间的成长率(CAGR)为5.31%。 2024 年,亚太地区将占据市场主导地位。市场主要受到对高效能电子设备日益增长的需求、更小、更轻、更节能设备的日益普及以及全球资料中心和云端运算服务数量的不断增加的推动。
先进的积体电路 (IC) 基板是电子设备内安装和互连 IC 的基础,是关键组件。它利用先进的材料和技术来提供最佳的电气性能、热管理和信号完整性。它旨在满足智慧型手机、平板电脑、电脑和其他电子设备中高效能应用程式的特定要求。由于它有助于提供增强的连接性、降低功耗和高效散热,全球对先进 IC 基板的需求正在上升。
目前,先进 IC 基板的采用率不断提高,因为它能够实现复杂电子系统的无缝运行,从而对市场产生了积极影响。此外,第五代(5G)技术的兴起以及人工智慧(AI)的日益普及,正在加强市场的成长。除此之外,对能够适应更高资料传输速率和更复杂处理任务的先进IC基板的需求不断增长,为市场前景提供了良好的前景。此外,工业应用中对远端控制电气设备的需求不断增长,为行业投资者提供了丰厚的成长机会。除此之外,消费者对扩增实境 (AR)、虚拟实境 (VR) 和高清 (HD) 显示器等高级功能的日益偏好也促进了市场的成长。此外,全球物联网 (IoT) 设备的使用率不断提高,正在推动市场的成长。
对高性能电子设备的需求不断增长
对智慧型手机、平板电脑、个人电脑 (PC)、穿戴式装置和笔记型电脑等先进电子设备的需求不断增长,促进了市场的成长。此外,消费者越来越喜欢能够提供无缝多工、高速连接和增强图形性能的电子设备。他们也采用了能为个人提供沉浸式体验的设备。除此之外,对于能够容纳强大处理器、记忆体模组和通讯组件整合的先进 IC 基板的需求也在增加。因此,製造商正在投资具有最佳化电路和讯号完整性的基板,以确保以最小的延迟实现高效的资料传输。
小型化日益普及
人们对更小、更轻、更节能的设备的需求不断增长,加上全球小型化日益普及,推动了市场的成长。与此相符的是,对紧凑和高密度先进IC载板的需求也不断增加。除此之外,这些基板还可以堆迭多层组件,减少设备占用空间,同时保持最佳功能。在单一基板上整合各种组件的能力可以提高效率,降低讯号干扰的风险,并改善整体设备性能,这为市场前景带来了积极的前景。
资料中心数量不断增长
全球资料中心和云端运算服务数量的不断增加正在推动市场的成长。企业和个人越来越依赖云端运算、巨量资料分析和线上服务来储存和管理大量资讯。资料中心拥有无数的伺服器、储存系统和网路设备,这些设备会产生大量热量。为此,需要有效的散热来防止过热并确保不间断运作。除此之外,先进的 IC 基板还具有增强的热管理能力和散热性能,有助于维持这些系统的可靠性和使用寿命。此外,对能够有效管理热量的高性能基板的需求不断增加,也促进了市场的成长。
The global advanced IC substrate market size reached USD 10.58 Billion in 2024. Looking forward, the market is expected to reach USD 17.26 Billion by 2033, exhibiting a growth rate (CAGR) of 5.31% during 2025-2033. Asia Pacific currently dominates the market in 2024. The market is primarily driven by the growing demand for high-performance electronic devices, rising adoption of smaller, lighter, and more energy-efficient devices, and the increasing number of data centers and cloud computing services across the globe.
An advanced integrated circuit (IC) substrate is a crucial component that serves as a foundation for mounting and interconnecting ICs within electronic devices. It utilizes advanced materials and technologies to provide optimal electrical performance, thermal management, and signal integrity. It is designed to meet the specific requirements of high-performance applications that are found in smartphones, tablets, computers, and other electronic devices. As it assists in offering enhanced connectivity, reduced power consumption, and efficient heat dissipation, the demand for advanced IC substrates is rising across the globe.
At present, the increasing adoption of advanced IC substrate, as it enables the seamless functioning of intricate electronic systems, is influencing the market positively. Moreover, the rising emergence of fifth-generation (5G) technology, along with the increasing adoption of artificial intelligence (AI), is strengthening the growth of the market. Apart from this, the growing demand for advanced IC substrates that can accommodate higher data transfer rates and more complex processing tasks is offering a favorable market outlook. Additionally, the rising need for remote-controlled electrical equipment in industrial applications is offering lucrative growth opportunities to industry investors. Besides this, the increasing consumer preferences for advanced features, such as augmented reality (AR), virtual reality (VR), and high-definition (HD) displays, are contributing to the growth of the market. In addition, the rising utilization of the Internet of Things (IoT) devices around the world is impelling the growth of the market.
Rising demand for high-performance electronic devices
The rising demand for advanced electronic devices, such as smartphones, tablets, personal computers (PCs), wearable devices, and laptops, is contributing to the growth of the market. In addition, consumers are increasingly preferring electronic devices that assist in providing seamless multitasking, high-speed connectivity, and enhanced graphics performance. They are also adopting devices that provide immersive experiences to individuals. Apart from this, there is an increase in the demand for advanced IC substrates that can accommodate the integration of powerful processors, memory modules, and communication components. As a result, manufacturers are investing in substrates with optimized electrical pathways and signal integrity that ensure efficient data transfer with minimal latency.
Increasing popularity of miniaturization
The increasing demand for smaller, lighter, and more energy-efficient devices among individuals, along with the rising popularity of miniaturization around the world, is supporting the growth of the market. In line with this, there is a rise in the need for compact and high-density advanced IC substrates. Besides this, these substrates benefit by enabling the stacking of multiple layers of components and reducing the footprint of devices while maintaining optimal functionality. The ability to integrate various components on a single substrate enhances efficiency, reduces the risk of signal interference, and improves the overall device performance, which is offering a positive market outlook.
Growing number of data centers
The rising number of data centers and cloud computing services across the globe is bolstering the growth of the market. Businesses and individuals rely increasingly on cloud computing, big data analysis, and online services for storing and managing vast volumes of information. Data centers have countless servers, storage systems, and networking equipment that generate substantial heat. In line with this, there is a need for efficient thermal dissipation to prevent overheating and ensure uninterrupted operation. Besides this, advanced IC substrates offer enhanced thermal management capabilities and heat-spreading properties that assist in maintaining the reliability and longevity of these systems. Furthermore, the increasing demand for high-performance substrates that can manage heat effectively is strengthening the growth of the market.
FC BGA represents the largest market segment
Consumer electronics accounts for the majority of the market share
Asia Pacific exhibits a clear dominance, accounting for the largest advanced IC substrate market share
The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.
Asia Pacific held the biggest market share due to the presence of improved manufacturing units. In line with this, the rising demand for innovative electronic devices among individuals is bolstering the growth of the market in the Asia Pacific region. Moreover, favorable government initiatives in the region are supporting the growth of the market. Apart from this, the rising popularity of automotive electronics due to the increasing demand for electric vehicles (EVs) is contributing to the growth of the market in the region.
Major players are consistently investing in research and development (R&D) activities to develop advanced IC substrate materials and technologies. This includes exploring novel materials with improved thermal conductivity, signal integrity, and electrical performance to cater to high-performance applications. Additionally, semiconductor manufacturers and consumer electronics companies are engaging in collaboration that enables the exchange of expertise, technology, and resources, that is leading to the development of tailored solutions that meet specific market needs. Besides this, companies are constantly refining their manufacturing processes to enhance the precision, scalability, and cost-efficiency of producing advanced IC substrates. This includes adopting advanced technologies, such as lithography, laser drilling, and advanced packaging techniques.
In 2023, LG Innotek unveiled the latest FC-BGA for the first time at the 'CES 2023'. It is highly integrated, multi layered, large scaled, and has fine patterning and a lot of micro vias.
In 2021, Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software to generate two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.
In 2021, AT&S AG, one of the leading manufacturers of high-end printed circuit boards and IC substrates, announced the development of a new production site for IC substrates in Southeast Asia, subject to the approval of the Supervisory Board.