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市场调查报告书
商品编码
1789951
先进IC基板市场规模、份额及趋势分析报告:按类型、技术、应用、地区及细分市场预测,2025-2033年Advanced IC Substrates Market Size, Share & Trends Analysis Report By Type (Flip Chip Ball Grid Array (FCBGA) Substrates, Flip Chip Chip Scale Package (FCCSP) Substrates), By Technology, By Application, By Region, And Segment Forecasts, 2025 - 2033 |
先进IC基板市场概述
预计 2024 年全球先进 IC基板市场规模为 167.3 亿美元,到 2033 年将达到 372 亿美元,2025 年至 2033 年的复合年增长率为 9.4%。异质整合和基于小晶片的架构的采用率不断提高已成为全球先进 IC基板行业的一个主要趋势,推动了对更高密度的需求。
这些多层基板可在 AI、5G 和汽车应用中实现紧凑、节能和高性能的半导体封装。全球对电动车和清洁交通的推动极大地推动了对先进 IC基板的需求。碳化硅和氮化镓等宽能带隙半导体的采用正成为电动车动力传动系统和高压工业系统的核心。自从特斯拉等主要製造商在电动车逆变器中使用碳化硅以来,碳化硅得到了广泛的认可。其高电场阻力和热导率等优异性能使其成为苛刻的汽车环境的理想选择。这一转变得到了预测的支持,到 2030 年半导体将占高檔汽车总价值的 20% 以上,高于 2019 年的 4%。因此,对支援高压和高温性能的坚固基板材料的需求正在推动汽车领域的市场成长。
人工智慧应用的激增正在重塑半导体格局,并对封装和基板技术提出了更高的性能要求。人工智慧晶片现在需要更快的资料传输、更低的功耗和更好的热性能,这推动着业界开发更复杂的封装解决方案。国家先进封装製造计画已将人工智慧确定为需要在设备、电力传输和小晶片支援系统方面进行技术创新的关键驱动力。政府支持的投资正在加速这些领域的研究,预计未来五年将达到 1 亿美元。这些发展推动了对高密度、高热效率基板的需求,尤其是基板针对资料中心和边缘设备中以人工智慧为中心的硬体进行了最佳化的基板,从而推动了整体市场的成长。
半导体产业正在经历重大变革时期,向异质整合和基于晶片的系统结构转变。传统的单片式晶片设计正在被模组化晶片配置所取代,从而提高了产量比率并降低了成本。这种演进需要先进的 IC基板作为高效能互连平台,支援不同晶片之间的无缝通讯。研究预测,未来的封装将转向简化的层次结构,直接将晶片组装到基板,从而取代对中阶(如内插器)的需求。基板技术正在调整,包括嵌入被动和主动元件的硅芯和玻璃芯。这种架构转变使更有效率、可扩展且更具成本效益的半导体设计和製造成为可能,从而推动市场发展。
从基于晶圆的圆形製程向大面积面板级封装的转变正在重新定义基板製造製程。随着面板尺寸达到 650 毫米 x 650 毫米,製造商现在能够在每个週期内处理更多装置,从而显着提高产量并降低製造成本。这项发展将对行动电子产品、医疗穿戴式装置和柔性混合设备等高产量领域产生特别显着的影响。更大的面板还能将更复杂的设计整合到更薄的基板上,从而拓宽潜在的应用范围。
为因应近期供应链中断,一些政府正专注于先进积体电路基板的资源配置和国内生产。目前,美国对覆晶球栅阵列和覆晶晶片级封装等高阶基板的製造能力极低,而这些对于尖端晶片封装至关重要。作为《晶片与科学法案》的一部分,联邦政府已拨款近 3 亿美元用于建立国内产能。这些努力包括对新技术的投资,例如用于基板原型製作的增材製造和 3D 列印,目的是减少对海外供应商的依赖,为半导体行业建立更具弹性和安全的供应链。这些策略倡议透过确保持续获得先进封装技术并促进主要垂直市场的长期成长,为市场提供了支援。
Advanced IC Substrates Market Summary
The global advanced IC substrates market size was estimated at USD 16.73 billion in 2024, and is projected to reach USD 37.20 billion by 2033, growing at a CAGR of 9.4% from 2025 to 2033. The rising adoption of heterogeneous integration and chiplet-based architectures has emerged as a significant trend in the global advanced IC substrates industry, driving demand for high-density.
These multi-layer substrates enable compact, energy-efficient, and high-performance semiconductor packaging across AI, 5G, and automotive applications. The global push toward electric mobility and cleaner transportation is significantly boosting the demand for advanced IC substrates. The adoption of wide bandgap semiconductors such as silicon carbide and gallium nitride is becoming central to electric vehicle powertrains and high-voltage industrial systems. Silicon carbide has gained widespread traction since its use in electric vehicle inverters by major manufacturers like Tesla. Its superior properties, such as higher electric field tolerance and thermal conductivity, make it ideal for demanding automotive environments. This shift is further supported by projections that semiconductors will account for over 20 percent of a premium vehicle's total value by 2030, up from just four percent in 2019. As a result, demand for robust substrate materials that support high voltage and temperature performance is propelling the market growth in the automotive sector.
The surge in artificial intelligence applications is reshaping the semiconductor landscape, placing intense performance demands on packaging and substrate technologies. AI chips now require rapid data transfer, lower power consumption, and enhanced thermal performance, which is pushing the industry to develop more sophisticated packaging solutions. The National Advanced Packaging Manufacturing Program has identified artificial intelligence as a key driver requiring innovation in equipment, power delivery, and chiplet support systems. Government-backed investments are accelerating research in these areas, with expectations of one hundred million dollars in funding over the next five years. These developments are boosting the demand for high-density and thermally efficient substrates, particularly those optimized for AI-centric hardware in data centers and edge devices, thereby propelling the overall market growth.
The semiconductor industry is undergoing a major transformation as it shifts toward heterogeneous integration and chiplet-based system architectures. Traditional monolithic chip designs are being replaced with modular chiplet configurations that improve yield and lower costs. This evolution requires advanced IC substrates to serve as the high-performance interconnect platform supporting seamless communication between diverse chiplets. Research forecasts indicate that the future of packaging will move toward simplified hierarchy with direct chiplet-to-substrate assembly, replacing the need for intermediary layers like interposers. Substrate technologies are being adapted to include silicon and glass cores, along with embedded passive and active components. This architectural shift is boosting the market by enabling more efficient, scalable, and cost-effective semiconductor design and manufacturing.
The transition from round wafer-based processing to large area panel-level packaging is redefining the substrate manufacturing process. Panel sizes reaching up to six hundred fifty millimeters by six hundred fifty millimeters are enabling manufacturers to process more devices per cycle, significantly improving throughput and lowering production costs. This evolution is particularly impactful for high-volume sectors such as mobile electronics, medical wearables, and flexible hybrid devices. The use of larger panels also allows for the integration of more complex designs on thinner substrates, expanding the range of potential applications.
In response to recent supply chain disruptions, several governments are focusing on reshoring and domesticating the production of advanced IC substrates. The U.S. currently has minimal capacity to manufacture high-end substrates like Flip Chip Ball Grid Array or Flip Chip Chip Scale Package, which are critical to leading-edge chip packaging. As part of the CHIPS and Science Act, federal support totaling nearly three hundred million dollars is being directed toward building domestic capabilities. These efforts include investment in emerging technologies such as additive manufacturing and three-dimensional printing for substrate prototyping. The aim is to reduce dependence on foreign suppliers and establish a more resilient and secure supply network for the semiconductor industry. These strategic moves are boosting the market by ensuring consistent access to advanced packaging technologies and driving long-term growth across key verticals.
Global Advanced IC Substrates Market Report Segmentation
This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global advanced IC substrates market report based on type, technology, application, and region: