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市场调查报告书
商品编码
1747794

全球 PCB 中的 IC基板市场

IC Substrates in PCBs
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 276 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年，全球 PCB 中的 IC基板市场规模将达到 175 亿美元

全球PCB（印刷电路板）IC基板市场规模预计在2024年为87亿美元，预计到2030年将达到175亿美元，2024年至2030年的复合年增长率为12.3%。本报告分析的细分市场之一FC BGA（全快闪球栅阵列）预期复合年增长率为10.7%，到分析期末达到109亿美元。 FC CSP（全快闪晶片级封装）细分市场在分析期间的复合年增长率预计为15.5%。

美国市场预计将成长至 24 亿美元，中国市场的复合年增长率将达到 16.3%

预计到2024年，美国积体电路（IC）基板（PCB）市场规模将达24亿美元。作为世界第二大经济体的中国，预计2030年市场规模将达到36亿美元，在2024-2030年的分析期间内，复合年增长率为16.3%。其他值得关注的区域市场包括日本和加拿大，预计在分析期间内，这两个市场的复合年增长率分别为9.1%和10.9%。在欧洲，预计德国市场的复合年增长率约为9.7%。

全球 PCB 市场 IC基板- 主要趋势与驱动因素总结

为什么IC基板会成为下一代PCB设计的支柱？

积体电路 (IC)基板在印刷电路基板(PCB) 中扮演着越来越重要的角色，是半导体晶片与更广泛电路组件之间的关键介面。这些基板提供机械支撑并实现高密度电气互连，使其成为先进运算、消费性电子、通讯、汽车电子等领域晶片封装的关键材料。与传统 PCB 不同，IC基板的设计旨在满足高性能晶片的需求，包括小型化、散热、讯号完整性和多层布线。因此，它们在许多半导体应用中正日益取代导线架和陶瓷封装。

随着高效能运算 (HPC)、5G 基础设施和系统级封装 (SiP) 架构的日益普及，IC基板已成为现代电子设计的基本要素。半导体封装正在从被动机壳演变为系统性能的主动组件，而 IC基板能够在越来越小的尺寸内实现垂直堆迭、电力传输和讯号传输。这种转变源于消费者和工业界对更快、更薄、更节能设备的需求，而这些设备都依赖先进的基板技术，以便无缝整合到多层 PCB 环境中。

哪些技术进步正在重塑 PCB 系统中 IC基板的功能？

IC基板市场正经历材料科学、微型化和製造精度的创新浪潮。其中一个主要趋势是从传统的FR4基板，由于其卓越的性能和可靠性，正成为CPU、GPU和AI加速器等先进节点封装的事实上的标准。

高密度互连 (HDI) 和嵌入式走线基板(ETS) 技术的进步进一步增强了 IC基板在 PCB 组件中的作用。这些技术能够在不影响电气性能的情况下实现更高的层数、超细间距布线和小型化。覆晶封装、扇出型晶圆级封装 (FOWLP) 和晶片整合也正在重塑基板设计，因为它们要求在单一封装内支援多晶片和多功能。为了满足这些要求，製造商正在投资先进的雷射钻孔、光刻和检测系统，以确保在复杂的基板堆迭中实现亚微米级精度和层间对准。

推动 PCB 应用对先进 IC基板需求的最终用途是什么？

众多产业正在经历数位转型和产品创新，这推动了对积体电路基板的需求。在家用电子电器，智慧型手机、平板电脑和穿戴式装置依赖基板来承载微型逻辑晶片和储存晶片，需要超薄、高导热效率的基板来支援USB4、LPDDR5和Wi-Fi 7等高速介面。在运算领域，伺服器、资料中心和高效能运算系统正在将积体电路基板部署在多晶片模组中，以支援人工智慧工作负载、云端运算和复杂的资料分析，挑战电气性能和温度控管的极限。

随着汽车电子元件数量的不断增加，尤其是电动车、自动驾驶系统、车载资讯娱乐系统等的兴起，汽车电子产业正成为重要的驱动力。积体电路基板是电控系统的关键元件，这些元件对高可靠性和耐热性至关重要。同样，在通讯领域，先进的基板也用于 5G基地台、光学模组和高频射频设备，这些零件对讯号完整性和高速资料处理至关重要。在工业自动化和医疗电子领域，积体电路基板在整合精密仪器、成像系统和感测器方面也发挥关键作用。

PCB 中 IC基板市场的成长受到多种因素的推动…

PCB IC基板市场的成长受到多种因素的驱动，这些因素与半导体封装的演进、高速资料需求以及先进电子系统的普及有关。其中，向异构整合和基于晶片组的架构的转变需要复杂的互连解决方案。人工智慧处理器、图形加速器和高频宽记忆体的需求激增，也推动了对支援高 I/O 数量、低讯号损耗和出色散热性能的基板的需求。

材料创新也是一个关键驱动因素，基板製造商越来越多地采用ABF和其他先进的电介质来支援更精细的几何形状和多层堆迭。同时，东亚领导企业在供应链上的投资和产能扩张，确保了扩充性，以满足半导体和先进封装需求的激增。 5G的推出、汽车电气化以及边缘运算的成长，都在强化IC基板在下一代PCB组件中的作用。最后，随着设备功能越来越强大、外形规格越来越小，IC基板正逐渐成为在电子价值链各个环节提供效能、功率效率和整合度的战略赋能器。

部分

类型（FC BGA、FC CSP）、应用程式（平板电脑、智慧型手机、笔记型电脑、穿戴式装置、其他应用）

受访公司范例（值得关注的36家公司）

  • ASE Technology Holding Co., Ltd.
  • AT&S（Austria Technologie & Systemtechnik AG）
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • KCE Electronics Public Company Limited
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • LG Innotek Co., Ltd.
  • Nan Ya PCB Corporation
  • Samsung Electro-Mechanics Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Toppan Inc.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口（成品和原始OEM）来预测其竞争地位的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手，包括人为提高销货成本、盈利下降、供应链重组以及其他微观和宏观市场动态。

全球产业分析师密切关注来自全球顶尖首席经济学家（14,949位）、智库（62家）以及贸易和产业协会（171家）的专家的意见，以评估其对生态系统的影响并应对新的市场现实。我们追踪了来自每个主要国家的专家和经济学家对关税及其对本国影响的看法。

全球产业分析师预计，这场动盪将在未来2-3个月内逐渐平息，新的世界秩序将更加清晰地建立。全球产业分析师正在即时追踪这些事态发展。

2025年4月：谈判阶段

在4月的报告中，我们将探讨关税对全球整体市场的影响，并提供区域市场调整。我们的预测是基于历史数据和不断变化的市场影响因素。

2025年7月：最终关税调整

在各国宣布最终重置后，客户将在 7 月收到免费更新，最终更新将包含明确的关税影响分析。

相互和双边贸易及关税影响分析：

美国<>中国<>墨西哥<>加拿大<>欧盟<>日本<>印度<>其他176个国家

领先的产业经济学家：全球产业分析师知识库追踪了 14,949 位经济学家，其中包括来自民族国家、智库、贸易和产业协会、大型企业以及各领域专家的最具影响力的首席经济学家，他们共用了这场前所未有的全球经济状况模式转移的影响。我们超过 16,491 份报告大多遵循基于里程碑的两阶段发布计划。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 西班牙
  • 俄罗斯
  • 其他欧洲国家
  • 亚太地区
  • 澳洲
  • 印度
  • 韩国
  • 其他亚太地区
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲
  • 中东
  • 伊朗
  • 以色列
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 其他中东地区
  • 非洲

第四章 竞赛

简介目录
Product Code: MCP35209

Global IC Substrates in PCBs Market to Reach US$17.5 Billion by 2030

The global market for IC Substrates in PCBs estimated at US$8.7 Billion in the year 2024, is expected to reach US$17.5 Billion by 2030, growing at a CAGR of 12.3% over the analysis period 2024-2030. FC BGA, one of the segments analyzed in the report, is expected to record a 10.7% CAGR and reach US$10.9 Billion by the end of the analysis period. Growth in the FC CSP segment is estimated at 15.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.4 Billion While China is Forecast to Grow at 16.3% CAGR

The IC Substrates in PCBs market in the U.S. is estimated at US$2.4 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.6 Billion by the year 2030 trailing a CAGR of 16.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.1% and 10.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 9.7% CAGR.

Global IC Substrates in PCBs Market - Key Trends & Drivers Summarized

Why Are IC Substrates Becoming the Backbone of Next-Generation PCB Design?

Integrated Circuit (IC) substrates are increasingly critical in printed circuit boards (PCBs), serving as the essential interface between semiconductor chips and the broader circuit assembly. These substrates provide mechanical support and enable high-density electrical interconnections, making them indispensable for chip packaging in advanced computing, consumer electronics, telecommunications, and automotive electronics. Unlike traditional PCBs, IC substrates are designed to handle the demands of high-performance chips, including miniaturization, heat dissipation, signal integrity, and multi-layer interconnect routing. As a result, they are rapidly replacing lead frames and ceramic packages in many semiconductor applications.

The rising adoption of high-performance computing (HPC), 5G infrastructure, and system-in-package (SiP) architectures has positioned IC substrates as a foundational element of modern electronics design. Semiconductor packaging has evolved from being a passive enclosure to an active component of system performance, with IC substrates enabling vertical stacking, power delivery, and signal transmission at increasingly smaller geometries. This shift is driven by consumer and industrial demand for faster, thinner, and more energy-efficient devices, all of which depend on sophisticated substrate technology that integrates seamlessly into multilayer PCB environments.

What Technological Innovations Are Reshaping IC Substrate Capabilities in PCB Systems?

The IC substrates market is experiencing a wave of innovation in material science, miniaturization, and manufacturing precision. One major trend is the transition from traditional FR4 to high-performance build-up substrates using BT resin, ABF (Ajinomoto Build-up Film), and epoxy-based materials. These enable finer line/space geometries, higher I/O densities, and lower dielectric loss, which are essential for high-speed signal transmission in processors and memory devices. ABF substrates, in particular, are becoming the de facto standard in packaging advanced nodes such as CPUs, GPUs, and AI accelerators due to their superior performance and reliability.

Advancements in high-density interconnect (HDI) and embedded trace substrate (ETS) technologies are further enhancing the role of IC substrates in PCB assemblies. These allow for higher layer counts, ultra-fine pitch wiring, and increased miniaturization-all without compromising electrical performance. Flip-chip packaging, fan-out wafer-level packaging (FOWLP), and chiplet integration are also reshaping substrate design by demanding multi-die and multi-functional support within a single package. To meet these requirements, manufacturers are investing in advanced laser drilling, photolithography, and inspection systems that ensure sub-micron precision and inter-layer alignment across complex substrate stacks.

Which End-Use Sectors Are Driving Demand for Advanced IC Substrates in PCB Applications?

The demand for IC substrates is being fueled by a broad spectrum of industries undergoing digital transformation and product innovation. In consumer electronics, smartphones, tablets, and wearables rely on IC substrates for their miniaturized logic and memory chips, demanding ultra-thin, thermally efficient substrates that support high-speed interfaces like USB4, LPDDR5, and Wi-Fi 7. In the computing sector, servers, data centers, and HPC systems are deploying IC substrates in multi-chip modules that power AI workloads, cloud computing, and complex data analytics-pushing the limits of electrical performance and thermal management.

The automotive electronics segment is emerging as a major growth driver due to the increasing electronic content in vehicles, particularly with the rise of EVs, autonomous driving systems, and in-vehicle infotainment. IC substrates are critical in electronic control units (ECUs), battery management systems (BMS), and radar/lidar modules, where high-reliability and heat resistance are essential. Likewise, the telecom sector is leveraging advanced substrates in 5G base stations, optical modules, and high-frequency RF devices, where signal integrity and high-speed data processing are paramount. Even in industrial automation and medical electronics, IC substrates are playing a crucial role in precision instrumentation, imaging systems, and sensor integration.

The Growth in the IC Substrates in PCBs Market Is Driven by Several Factors…

The growth in the IC substrates in PCBs market is driven by several factors related to semiconductor packaging evolution, high-speed data requirements, and the proliferation of advanced electronic systems. Chief among these is the ongoing transition to heterogeneous integration and chiplet-based architectures, which require complex interconnect solutions that IC substrates are uniquely positioned to deliver. The surge in demand for AI processors, graphics accelerators, and high-bandwidth memory has also intensified the need for substrates that support high I/O counts, minimal signal loss, and superior heat dissipation.

Material innovation is another key driver, with substrate manufacturers increasingly adopting ABF and other advanced dielectrics to support finer geometries and multilayer stacking. At the same time, supply chain investments and capacity expansions by major players in East Asia are ensuring scalability to meet demand surges in semiconductors and advanced packaging. The rollout of 5G, the electrification of vehicles, and the growth of edge computing are all reinforcing the role of IC substrates in next-gen PCB assemblies. Finally, as device functionality increases while form factors shrink, IC substrates are emerging as strategic enablers of performance, power efficiency, and integration in every layer of the electronics value chain.

SCOPE OF STUDY:

The report analyzes the IC Substrates in PCBs market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (FC BGA, FC CSP); Application (Tablet PC, Smart Phones, Laptops, Wearable Devices, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 36 Featured) -

  • ASE Technology Holding Co., Ltd.
  • AT&S (Austria Technologie & Systemtechnik AG)
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • KCE Electronics Public Company Limited
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • LG Innotek Co., Ltd.
  • Nan Ya PCB Corporation
  • Samsung Electro-Mechanics Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Toppan Inc.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • IC Substrates in PCBs - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for High-Performance Semiconductors Fuels Growth of IC Substrates in Advanced PCB Assemblies
    • Miniaturization of Electronic Devices Drives Adoption of High-Density Interconnect (HDI) and IC Substrate-Based PCB Designs
    • Surge in AI, 5G, and High-Speed Computing Applications Boosts Use of Substrate-Like PCBs (SLPs) for Signal Integrity
    • Increased Complexity of System-in-Package (SiP) and Multi-Chip Modules Expands Demand for Advanced Substrate Materials
    • OEM Focus on Thermal Management and Electrical Performance Enhances Use of IC Substrates With Low Dk/Df Properties
    • Expansion of Automotive Electronics and ADAS Applications Elevates Need for Rigid, High-Reliability IC Substrate Layers
    • Growth in Consumer Electronics and Wearables Supports Volume Production of Miniaturized, Multi-Layer IC Substrate PCBs
    • Technological Innovations in Organic Substrates and Build-Up Layers Improve Functionality in High-I/O Density Packages
    • Rise in Chiplet and 2.5D/3D Packaging Architectures Drives Integration of IC Substrates Into PCB Interposer Structures
    • Global Semiconductor Supply Chain Realignment Encourages Investment in Domestic Substrate Fabrication Facilities
    • Rising Demand for High-Speed Memory and GPU Modules Propels Innovation in BT Resin-Based and ABF Substrate Materials
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World IC Substrates in PCBs Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for IC Substrates in PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for FC BGA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for FC BGA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for FC BGA by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for FC CSP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for FC CSP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for FC CSP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Tablet PC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Tablet PC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Tablet PC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Smart Phones by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Smart Phones by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Smart Phones by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Laptops by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Laptops by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Laptops by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: USA 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 29: USA Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 30: USA Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: USA 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 32: Canada Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: Canada 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 35: Canada Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Canada Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: Canada 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 38: Japan Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: Japan 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 41: Japan Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: Japan Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: Japan 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 44: China Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: China 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 47: China Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: China Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: China 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 50: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for IC Substrates in PCBs by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: Europe 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: Europe 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 59: France Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: France Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: France 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 62: France Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: France Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: France 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 65: Germany Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: Germany 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 68: Germany Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Germany Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: Germany 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 71: Italy Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: Italy 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 74: Italy Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Italy Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Italy 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 77: UK Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: UK 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 80: UK Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: UK Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: UK 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SPAIN
    • TABLE 83: Spain Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Spain Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Spain 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 86: Spain Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Spain Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: Spain 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • RUSSIA
    • TABLE 89: Russia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Russia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: Russia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 92: Russia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Russia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: Russia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Rest of Europe 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Rest of Europe 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for IC Substrates in PCBs by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2015, 2025 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Asia-Pacific Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • AUSTRALIA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 110: Australia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Australia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Australia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 113: Australia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Australia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: Australia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • INDIA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 116: India Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: India Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: India 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 119: India Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: India Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: India 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SOUTH KOREA
    • TABLE 122: South Korea Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: South Korea Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: South Korea 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 125: South Korea Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: South Korea Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: South Korea 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 128: Rest of Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Asia-Pacific Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: Rest of Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 131: Rest of Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Rest of Asia-Pacific Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: Rest of Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • LATIN AMERICA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 134: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 135: Latin America Historic Review for IC Substrates in PCBs by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: Latin America 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2015, 2025 & 2030
    • TABLE 137: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Latin America Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Latin America 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 140: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Latin America Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Latin America 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ARGENTINA
    • TABLE 143: Argentina Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Argentina Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Argentina 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 146: Argentina Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Argentina Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Argentina 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • BRAZIL
    • TABLE 149: Brazil Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Brazil Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 151: Brazil 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 152: Brazil Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 153: Brazil Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 154: Brazil 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • MEXICO
    • TABLE 155: Mexico Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 156: Mexico Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 157: Mexico 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 158: Mexico Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 159: Mexico Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 160: Mexico 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 161: Rest of Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 162: Rest of Latin America Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 163: Rest of Latin America 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 164: Rest of Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 165: Rest of Latin America Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 166: Rest of Latin America 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • MIDDLE EAST
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 167: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 168: Middle East Historic Review for IC Substrates in PCBs by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 169: Middle East 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2015, 2025 & 2030
    • TABLE 170: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 171: Middle East Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 172: Middle East 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 173: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 174: Middle East Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 175: Middle East 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • IRAN
    • TABLE 176: Iran Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 177: Iran Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 178: Iran 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 179: Iran Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 180: Iran Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 181: Iran 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ISRAEL
    • TABLE 182: Israel Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 183: Israel Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 184: Israel 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 185: Israel Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 186: Israel Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 187: Israel 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SAUDI ARABIA
    • TABLE 188: Saudi Arabia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 189: Saudi Arabia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 190: Saudi Arabia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 191: Saudi Arabia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 192: Saudi Arabia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 193: Saudi Arabia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 194: UAE Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 195: UAE Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 196: UAE 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 197: UAE Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 198: UAE Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 199: UAE 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 200: Rest of Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 201: Rest of Middle East Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 202: Rest of Middle East 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 203: Rest of Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 204: Rest of Middle East Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 205: Rest of Middle East 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • AFRICA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 206: Africa Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 207: Africa Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 208: Africa 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 209: Africa Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 210: Africa Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 211: Africa 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION